VS-90EPF12L-M3, VS-90APF12L-M3
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Vishay Semiconductors
Fast Soft Recovery Rectifier Diode, 90 A
FEATURES
• Glass passivated pellet chip junction
• Low forward voltage drop and short reverse
recovery time
2
1
1
• Designed
and
JEDEC®-JESD 47
2
3
3
TO-247AD 2L
Base cathode
2
1
Cathode
3
Anode
VS-90EPF12L-M3
Base cathode
2
1
These devices are intended for use in output rectification
and freewheeling in inverters, choppers and converters as
well as in input rectification where severe restrictions on
conducted EMI should be met.
DESCRIPTION
VS-90APF12L-M3
The VS-90EPF12L-M3, VS-90APF12L-M3 soft recovery
rectifier series has been optimized for combined short
reverse recovery time and low forward voltage drop.
PRIMARY CHARACTERISTICS
90 A
VR
1200 V
VF at IF
1.38 V
IFSM
1000 A
trr
90 ns
to
APPLICATIONS
3
Anode
IF(AV)
according
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TO-247AD 3L
Anode
qualified
The glass passivation ensures stable reliable operation in
the most severe temperature and power cycling conditions.
TJ max.
150 °C
Package
TO-247AD 2L, TO-247AD 3L
Circuit configuration
Single
Snap factor
0.5
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
TEST CONDITIONS
VRRM
IF(AV)
Sinusoidal waveform
VALUES
UNITS
1200
V
90
100
IFSM
A
trr
1 A, - 100 A/μs
90
VF
40 A, TJ = 25 °C
1.2
V
-40 to +150
°C
VRSM, MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
IRRM
AT 150 °C
mA
TJ
ns
VOLTAGE RATINGS
PART NUMBER
VRRM, MAXIMUM PEAK
REVERSE VOLTAGE
V
VS-90EPF12L-M3
1200
1300
17
VS-90APF12L-M3
1200
1300
17
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VS-90EPF12L-M3, VS-90APF12L-M3
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average forward current
IF(AV)
Maximum peak one cycle
non-repetitive surge current
IFSM
Maximum I2t for fusing
I2t
Maximum I2t for fusing
I2t
TEST CONDITIONS
VALUES
TC = 106 °C, 180° conduction half sine wave
UNITS
90
A
10 ms sine pulse, rated VRRM applied
850
10 ms sine pulse, no voltage reapplied
1000
10 ms sine pulse, rated VRRM applied
3610
10 ms sine pulse, no voltage reapplied
5100
t = 0.1 ms to 10 ms, no voltage reapplied
A2s
51 000
A2s
VALUES
UNITS
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum forward voltage drop
Forward slope resistance
VFM
rt
Threshold voltage
VF(TO)
Maximum reverse leakage current
IRM
TEST CONDITIONS
90 A, TJ = 25 °C
TJ = 150 °C
TJ = 25 °C
V
4.03
m
0.87
V
0.1
VR = Rated VRRM
TJ = 150 °C
1.38
mA
17
RECOVERY CHARACTERISTICS
PARAMETER
SYMBOL
Reverse recovery time
trr
Reverse recovery current
Irr
Reverse recovery charge
Qrr
Snap factor
TEST CONDITIONS
IF at 80 Apk
25 A/μs
25 °C
S
VALUES
UNITS
480
ns
7.1
A
2.1
μC
IFM
trr
t
dir
dt
0.5
Qrr
IRM(REC)
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
Maximum thermal resistance,
junction to case
RthJC
Maximum thermal resistance,
junction to ambient
RthJA
Typical thermal resistance,
case to heatsink
RthCS
DC operation
Marking device
UNITS
-40 to +150
°C
0.2
°C/W
40
Mounting surface, smooth and greased
0.25
6
g
0.21
oz.
minimum
6 (5)
maximum
12 (10)
kgf · cm
(lbf · in)
Approximate weight
Mounting torque
VALUES
Case style TO-247AD 2L
90EPF12L
Case style TO-247AD 3L
90APF12L
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VS-90EPF12L-M3, VS-90APF12L-M3
Vishay Semiconductors
150
RthJC (DC) = 0.2 °C/W
140
130
Conduction
angle
120
110
30°
100
60°
90°
90
120°
180°
80
0
20
40
60
80
100
Max. Average On-state Power Loss (W)
Maximum Allowable Case Temperature (°C)
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220
180°
120°
90°
60°
30°
200
180
160
140
120
RMS limit
100
80
Conduction angle
60
40
TJ = 150 °C
20
0
0
30
90
120
150
Fig. 4 - Forward Power Loss Characteristics
Fig. 1 - Current Rating Characteristics
550
150
RthJC (DC) = 0.2 °C/W
Peak Half Sine Wave
Forward Current (A)
140
130
Conduction
angle
120
110
At any rated load condition and with
rated VRRM applied following surge.
Initial TJ = 150 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
500
30°
60°
100
450
400
350
300
250
200
90°
150
90
120°
DC°
180°
100
80
0
20
40
60
80
100
120
140
1
160
10
100
Average On-state Current (A)
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Fig. 2 - Current Rating Characteristics
Fig. 5 - Maximum Non-Repetitive Surge Current
1100
180
180°
120°
90°
60°
30°
160
140
120
100
1000
Peak Half Sine Wave
Forward Current (A)
Maximum Allowable Case Temperature (°C)
60
Average On-state Current (A)
Average On-state Current (A)
Max. Average On-state Power Loss (W)
DC
RMS limit
80
Conduction angle
60
40
800
700
600
500
400
300
200
TJ = 150 °C
20
900
Maximum non-repetitive surge current
versus pulse train duration.
Initial TJ = 150 °C
No voltage reapplied
Rated VRRM reapplied
100
0
0
20
40
60
80
Average On-state Current (A)
Fig. 3 - Forward Power Loss Characteristics
100
0
0.01
0.1
1
10
Pulse Train Duration (s)
Fig. 6 - Maximum Non-Repetitive Surge Current
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VS-90EPF12L-M3, VS-90APF12L-M3
Instantaneous Forward Current (A)
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Vishay Semiconductors
1000
100
TJ = 25 °C
TJ = 150 °C
10
1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Instantaneous Forward Voltage (V)
Fig. 7 - Forward Voltage Drop Characteristics
800
12 000
TJ = 25 °C
Qrr - Typical Reverse
Recovery Charge (nC)
trr - Typical Reverse
Recovery Time (ns)
700
600
500
IFM = 80 A
400
300
IFM = 40 A
IFM = 20 A
200
IFM = 10 A
TJ = 25 °C
10 000
IFM = 80 A
8000
IFM = 40 A
6000
IFM = 20 A
4000
IFM = 10 A
2000
100
IFM = 1 A
IFM = 1 A
0
0
0
40
80
120
160
200
0
dI/dt - Rate of Fall of Forward Current (A/µs)
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 8 - Recovery Time Characteristics, TJ = 25 °C
Fig. 10 - Recovery Charge Characteristics, TJ = 25 °C
1800
25 000
1600
TJ = 150 °C
Qrr - Typical Reverse
Recovery Charge (nC)
trr - Typical Reverse
Recovery Time (ns)
40
1400
IFM = 80 A
IFM = 40 A
IFM = 20 A
IFM = 10 A
IFM = 1 A
1200
1000
800
600
400
IFM = 80 A
TJ = 150 °C
20 000
15 000
IFM = 40 A
IFM = 20 A
10 000
IFM = 10 A
5000
IFM = 1 A
200
0
0
0
40
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 9 - Recovery Time Characteristics, TJ = 150 °C
0
40
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 11 - Recovery Charge Characteristics, TJ = 150 °C
Revision: 06-Jul-2018
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-90EPF12L-M3, VS-90APF12L-M3
www.vishay.com
Vishay Semiconductors
60
45
IFM = 80 A
TJ = 25 °C
35
30
IFM = 40 A
25
IFM = 20 A
20
15
IFM = 10 A
10
IFM = 80 A
TJ = 150 °C
50
Irr - Typical Reverse
Recovery Current (A)
Irr - Typical Reverse
Recovery Current (A)
40
IFM = 40 A
40
IFM = 20 A
30
IFM = 10 A
20
10
5
IFM = 1 A
IFM = 1 A
0
0
0
40
80
120
160
200
0
40
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 12 - Recovery Current Characteristics, TJ = 25 °C
Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
ZthJC - Transient Thermal Impedance (°C/W)
dI/dt - Rate of Fall of Forward Current (A/µs)
1
0.5
0.1
0.33
0.25
0.17
0.08
Single pulse
0.01
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Fig. 14 - Thermal Impedance ZthJC Characteristics
Revision: 06-Jul-2018
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VS-90EPF12L-M3, VS-90APF12L-M3
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Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
90
A
P
F
12
L
-M3
1
2
3
4
5
6
7
8
1
- Vishay Semiconductors product
2
- Current rating (90 = 90 A)
3
- Circuit configuration:
E = single, 2 pins
A = single, 3 pins
4
- Package:
P = TO-247AD
5
- Type of silicon:
6
- Voltage code x 100 = VRRM
7
- L = long lead
8
- Environmental digit:
F = fast recovery
12 = 1200 V
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER TUBES
MINIMUM ORDER QUANTITY
VS-90EPF12L-M3
25
500
PACKAGING DESCRIPTION
Antistatic plastic tubes
VS-90APF12L-M3
25
500
Antistatic plastic tubes
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
TO-247AD 2L
www.vishay.com/doc?95536
TO-247AD 3L
www.vishay.com/doc?95626
TO-247AD 2L
www.vishay.com/doc?95648
TO-247AD 3L
www.vishay.com/doc?95007
Revision: 06-Jul-2018
Document Number: 95654
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Outline Dimensions
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Vishay Semiconductors
TO-247AD 2L
DIMENSIONS in millimeters and inches
A
A
(3)
(6) F P
E
B
(2) R/2
A2
S
(Datum B)
Ø K M D BM
F P1
A
D2
Q
2xR
(2)
D1 (4)
D
1, 2
4
D
3
Thermal pad
(5) L1
C
L
See view B
(4)
E1
A
0.01 M D B M
View A - A
C
2 x b2
2xb
2x e
A1
0.10 M C A M
(b1, b3)
Plating
Base metal
D D
(c)
c1
C
C
(b, b2)
(4)
Section C - C, D - D
SYMBOL
MILLIMETERS
View B
INCHES
MIN.
MAX.
MIN.
MAX.
A
4.65
5.31
0.183
0.209
A1
2.21
2.59
0.087
0.102
NOTES
SYMBOL
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
E
15.29
15.87
0.602
0.625
E1
13.46
-
0.53
-
A2
1.50
2.49
0.059
0.098
e
5.46 BSC
b
0.99
1.40
0.039
0.055
ØK
0.254
b1
0.99
1.35
0.039
0.053
L
19.81
20.32
0.780
0.800
b2
1.65
2.39
0.065
0.094
L1
3.71
4.29
0.146
0.169
b3
1.65
2.34
0.065
0.092
ØP
3.56
3.66
0.14
0.144
c
0.38
0.89
0.015
0.035
Ø P1
-
6.98
-
0.275
NOTES
3
0.215 BSC
0.010
c1
0.38
0.84
0.015
0.033
Q
5.31
5.69
0.209
0.224
D
19.71
20.70
0.776
0.815
3
R
4.52
5.49
0.178
0.216
D1
13.08
-
0.515
-
4
S
D2
0.51
1.35
0.020
0.053
5.51 BSC
0.217 BSC
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4
Revision: 28-May-2018
Document Number: 95536
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Outline Dimensions
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Vishay Semiconductors
TO-247AD 3L
DIMENSIONS in millimeters and inches
A
A
(3)
(6) Φ P
E
B
(2) R/2
A2
S
(Datum B)
Ø K M DBM
Φ P1
A
D2
Q
2xR
(2)
D1 (4)
D
1
4
D
3
2
Thermal pad
(5) L1
C
L
(4)
E1
A
0.01 M D B M
View A - A
See view B
2 x b2
3xb
C
2x e
b4
A1
0.10 M C A M
(b1, b3, b5)
Plating
Base metal
D DE
(c)
c1
E
C
C
(b, b2, b4)
(4)
Section C - C, D - D, E - E
SYMBOL
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.50
2.49
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.34
2.59
3.43
2.59
3.38
0.38
0.89
0.38
0.84
19.71
20.70
13.08
-
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.059
0.098
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.092
0.102
0.135
0.102
0.133
0.015
0.035
0.015
0.033
0.776
0.815
0.515
-
View B
NOTES
3
4
SYMBOL
D2
E
E1
e
ØK
L
L1
ØP
Ø P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.30
15.29
15.87
13.46
5.46 BSC
0.254
19.81
20.32
3.71
4.29
3.56
3.66
6.98
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.051
0.602
0.625
0.53
0.215 BSC
0.010
0.780
0.800
0.146
0.169
0.14
0.144
0.275
0.209
0.224
0.178
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4
Revision: 06-Mar-2020
Document Number: 95626
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Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
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