VS-E5PH6006L-N3
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Vishay Semiconductors
Hyperfast Rectifier, 60 A FRED Pt® G5
FEATURES
Base cathode
• Hyperfast and optimized Qrr
2
• Best in class forward voltage drop and switching
losses trade off
2
• Optimized for high speed operation
1
• 175 °C maximum operating junction temperature
3
TO-247AD 2L
3
Anode
1
Cathode
• Polyimide passivation
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
3D 3D
DESCRIPTION / APPLICATIONS
3D Models
Featuring a unique combination of low conduction and
switching losses, this rectifier is the right choice for soft
switched and resonant converters, as well as medium
frequency hard switching converters. This device is
specifically designed to improve efficiency of high speed
LLC output rectification stages of EV / HEV battery charging
stations and high frequency stages of UPS applications.
PRIMARY CHARACTERISTICS
IF(AV) per leg
60 A
VR
600 V
VF at IF at 125 °C
1.2 V
trr (typ.)
29
IFSM
500
TJ max.
175 °C
Package
TO-247AD 2L
Circuit configuration
Single
MECHANICAL DATA
Case: TO-247AD 2L
Molding compound meets UL 94 V-0 flammability rating
Terminal: matte tin plated leads, solderable per J-STD-002
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
600
V
Repetitive peak reverse voltage
VRRM
Average rectified forward current
IF(AV)
TC = 110 °C, D = 0.50
60
Non-repetitive peak surge current
IFSM
TC = 25 °C, tp = 10 ms, sine wave
500
Repetitive peak forward current
IFRM
TC = 110 °C, D = 0.50, f = 20 kHz
120
Operating junction and storage temperature
TJ, TStg
A
-55 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage, blocking voltage
SYMBOL
VBR, VR
Forward voltage
VF
Reverse leakage current
IR
Junction capacitance
CT
Series inductance
LS
TEST CONDITIONS
IR = 100 μA
MIN.
TYP.
MAX.
600
-
-
IF = 60 A
-
1.4
1.7
IF = 60 A, TJ = 125 °C
-
1.2
-
UNITS
V
VR = VR rated
-
-
25
TJ = 125 °C, VR = VR rated
-
-
500
VR = 200 V
-
65
-
pF
Measured to lead 5 mm from package body
-
8
-
nH
μA
Revision: 16-Jul-2021
Document Number: 96755
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
trr
Peak recovery current
Qrr
Reverse recovery time
trr
Peak recovery current
IRRM
Reverse recovery charge
MIN.
TYP.
MAX.
-
29
-
TJ = 25 °C
-
49
-
TJ = 125 °C
-
74
-
-
21
-
-
43
-
TJ = 25 °C
IRRM
Reverse recovery charge
TEST CONDITIONS
IF = 1.0 A, dIF/dt = 100 A/μs, VR = 30 V
TJ = 125 °C
TJ = 25 °C
-
640
-
TJ = 125 °C
-
1979
-
TJ = 25 °C
-
54
-
TJ = 125 °C
-
82
-
-
22
-
-
47
-
TJ = 25 °C
TJ = 125 °C
Qrr
IF = 40 A
dIF/dt = 1000 A/μs
VR = 400 V
IF = 60 A
dIF/dt = 1000 A/μs
VR = 400 V
UNITS
ns
A
nC
ns
A
TJ = 25 °C
-
790
-
TJ = 125 °C
-
2385
-
MIN.
TYP.
MAX.
UNITS
-
-
0.63
°C/W
-
5.5
-
g
-
0.2
-
oz.
6
(5.0)
-
12
(10)
kgf · cm
(lbf · in)
-55
-
175
°C
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Thermal resistance, junction-to-case
TEST CONDITIONS
RthJC
Weight
Mounting torque
Maximum junction and storage temperature range
TJ, TStg
Case style TO-247AD 2L
100
E5PH6006L
10000
IR - Reverse Current (μA)
IF - Instantaneous Forward Current (A)
Marking device
10
TJ = 175°C
1
TJ = 125°C
TJ = 25°C
0.1
1000
TJ = 175 °C
100
TJ = 125 °C
10
1
TJ = 25 °C
0.1
0.01
0.001
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
VF - Forward Voltage Drop (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
0
100
200
300
400
500
600
VR - Reverse Voltage (V)
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
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Allowable Solder Pad Temperature (°C)
Vishay Semiconductors
CT - Junction Capacitance (pF)
1000
100
10
0
100
200
300
400
500
600
180
170
160
150
DC
140
130
Square wave (D = 0.50)
rated VR applied
120
110
100
0
VR - Reverse Voltage (V)
10
20
30
40
50
60
70
IF(AV) - Average Forward Current (A)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Fig. 4 - Maximum Allowable Case Temperature vs.
Average Forward Current
140
RMS limit
Average Power Loss (W)
120
100
80
D = 0.01
D = 0.05
D = 0.10
D = 0.20
D = 0.50
DC
60
40
20
0
0
20
40
60
80
100
IF(AV) - Average Forward Current (A)
Fig. 5 - Average Power Loss vs. Average Forward Current
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
0.50
0.20
0.10
0.05
0.02
0.01
0.01
DC
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 6 - Thermal Impedance ZthJC Characteristics
Revision: 16-Jul-2021
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Vishay Semiconductors
200
300
TJ = 125 °C, VR = 400 V
IF = 60 A, VR = 400 V, low dI/dt
175
250
IF = 120 A
200
125 °C
IF = 60 A
trr (ns)
trr (ns)
150
125
100
150
25 °C
100
IF = 30 A
75
In this dI/dt range curves are not dependent
from applied IF switching current, from 0.5 to
2 times IF(AV) rating
50
50
0
100
1000
0
20
40
60
80
100
dIF/dt (A/μs)
dIF/dt (A/μs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 10 - Typical Reverse Recovery Time vs. dIF/dt
4000
1000
In this dI/dt range curves are not dependent
from applied IF switching current, from 0.5 to
2 times IF(AV) rating
TJ = 125 °C
3600
VR = 400 V
800
IF = 120 A
3200
Qrr (nC)
Qrr (nC)
125 °C
2800
IF = 60 A
2400
2000
600
400
IF = 60 A, VR = 400 V, low dI/dt
1600
200
IF = 30 A
1200
800
25 °C
0
100
0
1000
20
40
60
80
100
dIF/dt (A/μs)
dIF/dt (A/μs)
Fig. 8 - Typical Reverse Recovery Charge vs. dIF/dt
Fig. 11 - Typical Reverse Recovery Charge vs. dIF/dt
65
12
60
TJ = 125 °C
55
VR = 400 V
In this dI/dt range curves are not dependent
from applied IF switching current, from 0.5 to
2 times IF(AV) rating
IF = 120 A
10
50
IF = 60 A
IF = 60 A, VR = 400 V, low dI/dt
8
40
Irr (A)
Irr (A)
45
35
30
25
4
IF = 30 A
20
125 °C
6
15
2
25 °C
10
5
0
100
1000
0
20
40
60
80
100
dIF/dt (A/μs)
dIF/dt (A/μs)
Fig. 9 - Typical Reverse Recovery Current vs. dIF/dt
Fig. 12 - Typical Reverse Recovery Current vs. dIF/dt
Revision: 16-Jul-2021
Document Number: 96755
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(3)
trr
ta
IF
tb
t0
t10 %
0
0.1 IRRM
(2)
Qrr (4)
IRRM
di(rec)M/dt (5)
(1) diF/dt
Fig. 13 - Reverse Recovery Waveform and Definitions
Notes
(1) di /dt - rate of change of current through zero crossing
F
(2) I
RRM - peak reverse recovery current
(3) t - reverse recovery time measured from t , crossing point of negative going I , to point t
rr
0
F
10%, 0.1 IRRM
(4) Q - area under curve defined by t and t
rr
0
10 %
t 10 %
Q rr =
I t dt
t0
(5)
di(rec)M/dt - peak rate of change of current during tb portion of trr
ORDERING INFORMATION TABLE
Device code
VS-
E
5
P
H
60
06
L
-N3
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
3
-
Circuit configuration
E = single diode
5 = Fred generation 5
4
-
5
-
Package:
P = TO-247 package
H = hyperfast recovery
6
-
Current rating (60 = 60 A)
7
-
Voltage rating (06 = 600 V)
8
-
Package: L = long lead (TO-247AD)
9
-
Environmental digit:
-N3 = halogen-free, RoHS-compliant, and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER TUBE
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-E5PH6006L-N3
25
500
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95536
Part marking information
www.vishay.com/doc?95648
Revision: 16-Jul-2021
Document Number: 96755
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Outline Dimensions
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Vishay Semiconductors
TO-247AD 2L
DIMENSIONS in millimeters and inches
A
A
(3)
(6) F P
E
B
(2) R/2
A2
S
(Datum B)
Ø K M D BM
F P1
A
D2
Q
2xR
(2)
D1 (4)
D
1, 2
4
D
3
Thermal pad
(5) L1
C
L
See view B
(4)
E1
A
0.01 M D B M
View A - A
C
2 x b2
2xb
2x e
A1
0.10 M C A M
(b1, b3)
Plating
Base metal
D D
(c)
c1
C
C
(b, b2)
(4)
Section C - C, D - D
SYMBOL
MILLIMETERS
View B
INCHES
MIN.
MAX.
MIN.
MAX.
A
4.65
5.31
0.183
0.209
A1
2.21
2.59
0.087
0.102
NOTES
SYMBOL
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
E
15.29
15.87
0.602
0.625
E1
13.46
-
0.53
-
A2
1.50
2.49
0.059
0.098
e
5.46 BSC
b
0.99
1.40
0.039
0.055
ØK
0.254
b1
0.99
1.35
0.039
0.053
L
19.81
20.32
0.780
0.800
b2
1.65
2.39
0.065
0.094
L1
3.71
4.29
0.146
0.169
b3
1.65
2.34
0.065
0.092
ØP
3.56
3.66
0.14
0.144
c
0.38
0.89
0.015
0.035
Ø P1
-
6.98
-
0.275
NOTES
3
0.215 BSC
0.010
c1
0.38
0.84
0.015
0.033
Q
5.31
5.69
0.209
0.224
D
19.71
20.70
0.776
0.815
3
R
4.52
5.49
0.178
0.216
D1
13.08
-
0.515
-
4
S
D2
0.51
1.35
0.020
0.053
5.51 BSC
0.217 BSC
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4
Revision: 28-May-2018
Document Number: 95536
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Revision: 09-Jul-2021
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Document Number: 91000