VS-E5PX3012LHN3
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Vishay Semiconductors
Hyperfast Rectifier, 30 A FRED Pt® G5
FEATURES
Base cathode
• Hyperfast and optimized Qrr
2
• Best in class forward voltage drop and switching
losses trade off
2
• Optimized for high speed operation
1
• 175 °C maximum operating junction temperature
3
TO-247AD 2L
3
Anode
1
Cathode
• Polyimide passivation
• AEC-Q101 qualified, meets JESD 201 class 2 whisker test
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
3D 3D
3D Models
DESCRIPTION / APPLICATIONS
Application
Notes
Featuring a unique combination of low conduction and
switching losses, this rectifier is the right choice for high
frequency converters, both soft switched / resonant.
Specifically designed to improve efficiency of PFC and
output rectification stages of EV / HEV battery charging
stations, booster stage of solar inverters and UPS
applications, these devices are perfectly matched to
operate with MOSFETs or high speed IGBTs.
PRIMARY CHARACTERISTICS
IF(AV)
30 A
VR
1200 V
VF at IF at 125 °C
2.1 V
trr
26 ns
TJ max.
175 °C
Package
TO-247AD 2L
Circuit configuration
Single
MECHANICAL DATA
Case: TO-247AD 2L
Molding compound meets UL 94 V-0 flammability rating
Terminals: matte tin plated leads, solderable per
J-STD-002
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
1200
V
Repetitive peak reverse voltage
VRRM
Average rectified forward current
IF(AV)
TC = 101 °C, D = 0.50
30
Non-repetitive peak surge current
IFSM
TC = 45 °C, tp = 10 ms, sine wave
190
Repetitive peak forward current
IFRM
TC = 101 °C, D = 0.50, f = 20 kHz
60
Operating junction and storage temperature
TJ, TStg
A
-55 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage, blocking voltage
Forward voltage
SYMBOL
VBR,
VR
VF
TEST CONDITIONS
MIN.
TYP.
MAX.
1200
-
-
IF = 30 A
-
2.6
3.3
IR = 100 μA
IF = 30 A, TJ = 125 °C
-
2.1
-
VR = VR rated
-
-
50
TJ = 125 °C, VR = VR rated
-
-
500
UNITS
V
Reverse leakage current
IR
Junction capacitance
CT
VR = 200 V
-
17
-
pF
Series inductance
LS
Measured to lead 5 mm from package body
-
8
-
nH
μA
Revision: 18-May-2022
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
trr
Peak recovery current
IRRM
Reverse recovery charge
Qrr
Reverse recovery time
trr
Peak recovery current
IRRM
Reverse recovery charge
Qrr
MIN.
TYP.
MAX.
IF = 1.0 A, dIF/dt = 100 A/μs, VR = 30 V
TEST CONDITIONS
-
26
-
TJ = 25 °C
-
100
-
TJ = 125 °C
-
150
-
-
12
-
-
22
-
IF = 20 A
dIF/dt = 600 A/μs
VR = 400 V
TJ = 25 °C
TJ = 125 °C
TJ = 25 °C
-
530
-
TJ = 125 °C
-
1550
-
TJ = 25 °C
-
80
-
TJ = 125 °C
-
120
-
-
22
-
-
37
-
IF = 30 A
dIF/dt = 1000 A/μs
VR = 800 V
TJ = 25 °C
TJ = 125 °C
UNITS
ns
A
nC
ns
A
TJ = 25 °C
-
900
-
TJ = 125 °C
-
2300
-
MIN.
TYP.
MAX.
UNITS
-
-
0.8
°C/W
-
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Thermal resistance, junction-to-case
TEST CONDITIONS
RthJC
Weight
Mounting torque
Maximum junction and storage
temperature range
TJ, TStg
-
g
-
12
(10)
kgf · cm
(lbf · in)
-55
-
175
°C
Case style: TO-247AD 2L
E5PX3012LH
1000
100
IR - Reverse Current (μA)
IF - Instantaneous Forward Current (A)
Marking device
5.5
6.0
(5.0)
TJ = 175 °C
10
TJ = 125 °C
1
TJ = 25 °C
TJ = -40 °C
TJ = 175 °C
100
TJ = 125 °C
10
TJ = 25 °C
1
0.1
0.1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VF - Forward Voltage Drop (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
0
200
400
600
800
1000
1200
VR - Reverse Voltage (V)
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
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Allowable Solder Pad Temperature (°C)
CT - Junction Capacitance (pF)
1000
100
10
1
0
200
400
600
800
1000
1200
180
160
DC
140
120
100
Square wave (D = 0.50)
rated VR applied
80
60
0
VR - Reverse Voltage (V)
5
10
15
20
25
30
35
IF(AV) - Average Forward Current (A)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Fig. 4 - Maximum Allowable Case Temperature vs.
Average Forward Current
120
Average Power Loss (W)
RMS limit
100
80
D = 0.10
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
DC
60
40
20
0
0
10
20
30
40
50
IF(AV) - Average Forward Current (A)
Fig. 5 - Forward Power Loss Characteristics, Per Leg
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
0.01
0.001
0.00001
0.50
0.20
0.10
0.05
0.02
0.01
DC
0.0001
0.001
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 6 - Thermal Impedance ZthJC - Characteristics
Revision: 18-May-2022
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200
2600
TJ = 125 °C
2400
175
30 A, 800 V
150
20 A, 400 V
125
Qrr (nC)
trr (ns)
2200
30 A, 800 V
2000
20 A, 400 V
1800
1600
100
1400
TJ = 125 °C
75
1200
200
400
600
800
1000
1200
200
400
600
800
1000
1200
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 8 - Typical Reverse Recovery Charge vs. dIF/dt
45
TJ = 125 °C
40
IF = 20 A
35
VR = 400 V
Irr (A)
30
25
IF = 30 A
VR = 800 V
20
15
10
5
200
400
600
800
1000
1200
dIF/dt (A/µs)
Fig. 9 - Typical Reverse Recovery Current vs. dIF/dt
Revision: 18-May-2022
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(3)
trr
ta
IF
0
tb
t0
t10 %
0.1 IRRM
(2)
IRRM
Qrr (4)
di(rec)M/dt (5)
(1) diF/dt
Fig. 10 - Reverse Recovery Waveform and Definitions
Notes
(1) di /dt - rate of change of current through zero crossing
F
(2) I
RRM - peak reverse recovery current
(3) t - reverse recovery time measured from t , crossing point of negative going I , to point t
rr
0
F
10%, 0.1 IRRM
(4) Q - area under curve defined by t and t
rr
0
10 %
t 10 %
Q rr =
I ( t ) dt
t0
(5)
di(rec)M/dt - peak rate of change of current during tb portion of trr
Revision: 18-May-2022
Document Number: 96767
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ORDERING INFORMATION TABLE
Device code
VS-
E
5
P
X
30
12
L
H
N3
1
2
3
4
5
6
7
8
9
10
1
-
Vishay Semiconductors product
2
-
Circuit configuration:
E = single diode, 2 pins
3
-
FRED Pt Gen 5
4
-
P = TO-247 package
5
-
Process type:
X = hyperfast recovery
6
-
Current rating (30 = 30 A)
7
-
Voltage rating (12 = 1200 V)
8
-
L = long lead
9
-
H = AEC-Q101 qualified
10
-
Environmental digit:
N3 = halogen-free, RoHS-compliant, and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
VS-E5PX3012LHN3
QUANTITY PER TUBE
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
25
500
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95536
Part marking information
www.vishay.com/doc?95648
Spice model
www.vishay.com/doc?96684
Revision: 18-May-2022
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Outline Dimensions
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TO-247AD 2L
DIMENSIONS in millimeters and inches
A
A
(3)
(6) F P
E
B
(2) R/2
A2
S
(Datum B)
Ø K M D BM
F P1
A
D2
Q
2xR
(2)
D1 (4)
D
1, 2
4
D
3
Thermal pad
(5) L1
C
L
See view B
(4)
E1
A
0.01 M D B M
View A - A
C
2 x b2
2xb
2x e
A1
0.10 M C A M
(b1, b3)
Plating
Base metal
D D
(c)
c1
C
C
(b, b2)
(4)
Section C - C, D - D
SYMBOL
MILLIMETERS
View B
INCHES
MIN.
MAX.
MIN.
MAX.
A
4.65
5.31
0.183
0.209
A1
2.21
2.59
0.087
0.102
NOTES
SYMBOL
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
E
15.29
15.87
0.602
0.625
E1
13.46
-
0.53
-
A2
1.50
2.49
0.059
0.098
e
5.46 BSC
b
0.99
1.40
0.039
0.055
ØK
0.254
b1
0.99
1.35
0.039
0.053
L
19.81
20.32
0.780
0.800
b2
1.65
2.39
0.065
0.094
L1
3.71
4.29
0.146
0.169
b3
1.65
2.34
0.065
0.092
ØP
3.56
3.66
0.14
0.144
c
0.38
0.89
0.015
0.035
Ø P1
-
6.98
-
0.275
NOTES
3
0.215 BSC
0.010
c1
0.38
0.84
0.015
0.033
Q
5.31
5.69
0.209
0.224
D
19.71
20.70
0.776
0.815
3
R
4.52
5.49
0.178
0.216
D1
13.08
-
0.515
-
4
S
D2
0.51
1.35
0.020
0.053
5.51 BSC
0.217 BSC
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4
Revision: 28-May-2018
Document Number: 95536
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