VS-EPH6007L-N3
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Vishay Semiconductors
Hyperfast Rectifier, 60 A FRED Pt®
FEATURES
Base cathode
• Low forward voltage drop
2
• Hyperfast soft recovery time
• 175 °C operating junction temperature
2
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
1
3
Anode
1
Cathode
3
VS-EPH6007L-N3
TO-247AD 2L
DESCRIPTION / APPLICATIONS
Hyperfast recovery rectifiers designed with optimized
performance of forward voltage drop, hyperfast recovery
time, and soft recovery.
PRIMARY CHARACTERISTICS
IF(AV)
60 A
VR
650 V
The planar structure and the platinum doped life time control
guarantee the best overall performance, ruggedness and
reliability characteristics.
VF at IF
1.4 V
trr typ.
65 ns
TJ max.
175 °C
Package
TO-247AD 2L
Circuit configuration
Single
These devices are intended for use in PFC Boost stage in
the AC/DC section of SMPS, inverters or as freewheeling
diodes.
The extremely optimized stored charge and low recovery
current minimize the switching losses and reduce over
dissipation in the switching element and snubbers.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
MAX.
UNITS
650
V
Repetitive peak reverse voltage
VRRM
Average rectified forward current
IF(AV)
TC = 98 °C (d = 0.50)
60
Non-repetitive peak surge current
IFSM
TC = 25 °C, tp = 8.3 ms; half sine wave
520
Operating junction and storage temperatures
TJ, TStg
A
-55 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
Forward voltage
SYMBOL
VBR,
VR
VF
TEST CONDITIONS
IR = 100 μA
IF = 60 A
MIN.
TYP.
MAX.
650
-
-
-
1.8
2.2
IF = 60 A, TJ = 150 °C
-
1.4
1.8
VR = VR rated
-
0.02
30
TJ = 150 °C, VR = VR rated
-
-
300
UNITS
V
μA
Reverse leakage current
IR
Junction capacitance
CT
VR = 650 V
-
37
-
pF
Series inductance
LS
Measured lead to lead 5 mm from package body
-
8.0
-
nH
Revision: 15-May-2018
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Vishay Semiconductors
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
-
44
-
TJ = 25 °C
-
65
-
TJ = 125 °C
-
94
-
-
21
-
-
40
-
IF = 1 A, dIF/dt = 100 A/μs, VR = 30 V
Reverse recovery time
Peak recovery current
trr
IRRM
IF = 60 A
TJ = 25 °C
dIF/dt = 1000 A/μs
TJ = 125 °C
VR = 400 V
UNITS
ns
A
TJ = 25 °C
-
720
-
TJ = 125 °C
-
2300
-
MIN.
TYP.
MAX.
UNITS
TJ, TStg
-55
-
175
°C
Thermal resistance,
junction to case
RthJC
-
-
0.65
°C/W
Thermal resistance,
case to heatsink
RthCS
-
0.5
-
-
5.5
-
g
-
0.2
-
oz.
1.2
(10)
-
2.4
(20)
kgf · cm
(lbf · in)
Reverse recovery charge
Qrr
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction and storage
temperature range
SYMBOL
TEST CONDITIONS
Mounting surface, flat, smooth, and greased
Weight
Mounting torque
Marking device
Case style TO-247 2L
EPH6007L
Revision: 15-May-2018
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VS-EPH6007L-N3
Vishay Semiconductors
100
1000
175 °C
IR - Reverse Current (μA)
IF - Instantaneous Forward Current (A)
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TJ = 175 °C
10
1
TJ = 150°C
100
150 °C
10
1
0.1
25 °C
0.01
TJ = 25 °C
0.1
0.001
0
0.5
1.0
1.5
2.0
2.5
0
100
200
300
400
500
600
700
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
CT - Junction Capacitance (pF)
1000
100
10
0
100
200
300
400
500
600
700
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
0.50
0.20
0.10
0.05
0.02
0.01
0.01
DC
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
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Vishay Semiconductors
170
160
IF = 60 A, TJ = 125 °C
150
160
140
trr (ns)
Allowable Case Temperature (°C)
180
DC
140
130
120
110
120
100
Square wave (D = 0.50)
Rated VR applied
90
100
IF = 60 A, TJ = 25 °C
80
See note
70
(1)
80
60
0
10
20
30
40
50
60
70
100
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/μs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
2400
2200
RMS limit
140
2000
IF = 60 A, TJ = 125 °C
1800
120
1600
100
Qrr (nC)
Average Power Loss (W)
160
D = 0.02
D = 0.05
D = 0.1
D = 0.2
D = 0.5
DC
80
60
40
1400
1200
1000
800
IF = 60 A, TJ = 25 °C
600
400
20
200
0
0
0
20
40
60
80
100
100
1000
dIF/dt (A/μs)
IF(AV) - Average Forward Current (A)
Fig. 6 - Forward Power Loss Characteristics
Fig. 8 - Typical Stored Charge vs. dIF/dt
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 9 - Reverse Recovery Waveform and Definitions
Revision: 15-May-2018
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VS-EPH6007L-N3
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ORDERING INFORMATION TABLE
Device code
VS-
E
P
H
60
07
L
-N3
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
E = single diode
3
-
P = TO-247
4
-
H = hyperfast recovery time
5
-
Current code (60 = 60 A)
6
-
Voltage code (07 = 650 V)
7
-
L = long lead
8
-
Environmental digit:
-N3 = halogen-free, RoHS-compliant and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER TUBE
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-EPH6007L-N3
25
500
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95536
Part marking information
www.vishay.com/doc?95648
Revision: 15-May-2018
Document Number: 96451
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Outline Dimensions
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Vishay Semiconductors
TO-247AD 2L
DIMENSIONS in millimeters and inches
A
A
(3)
(6) F P
E
B
(2) R/2
A2
S
(Datum B)
Ø K M D BM
F P1
A
D2
Q
2xR
(2)
D1 (4)
D
1, 2
4
D
3
Thermal pad
(5) L1
C
L
See view B
(4)
E1
A
0.01 M D B M
View A - A
C
2 x b2
2xb
2x e
A1
0.10 M C A M
(b1, b3)
Plating
Base metal
D D
(c)
c1
C
C
(b, b2)
(4)
Section C - C, D - D
SYMBOL
MILLIMETERS
View B
INCHES
MIN.
MAX.
MIN.
MAX.
A
4.65
5.31
0.183
0.209
A1
2.21
2.59
0.087
0.102
NOTES
SYMBOL
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
E
15.29
15.87
0.602
0.625
E1
13.46
-
0.53
-
A2
1.50
2.49
0.059
0.098
e
5.46 BSC
b
0.99
1.40
0.039
0.055
ØK
0.254
b1
0.99
1.35
0.039
0.053
L
19.81
20.32
0.780
0.800
b2
1.65
2.39
0.065
0.094
L1
3.71
4.29
0.146
0.169
b3
1.65
2.34
0.065
0.092
ØP
3.56
3.66
0.14
0.144
c
0.38
0.89
0.015
0.035
Ø P1
-
6.98
-
0.275
NOTES
3
0.215 BSC
0.010
c1
0.38
0.84
0.015
0.033
Q
5.31
5.69
0.209
0.224
D
19.71
20.70
0.776
0.815
3
R
4.52
5.49
0.178
0.216
D1
13.08
-
0.515
-
4
S
D2
0.51
1.35
0.020
0.053
5.51 BSC
0.217 BSC
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4
Revision: 28-May-2018
Document Number: 95536
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