VS-ETX1506-M3
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Vishay Semiconductors
Hyperfast Rectifier, 15 A FRED Pt®
FEATURES
Base
cathode
2
2
• Hyperfast recovery time, extremely low Qrr
• Low forward voltage drop
• 175 °C operating junction temperature
• Low leakage current
1
3
1
Cathode
• True 2 pin package
3
Anode
• Designed and qualified according to JEDEC®-JESD 47
TO-220AC 2L
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
IF(AV)
15 A
VR
600 V
VF at IF
1.55 V
trr (typ.)
18 ns
TJ max.
175 °C
Package
TO-220AC 2L
Circuit configuration
Single
DESCRIPTION / APPLICATIONS
State of the art hyperfast recovery rectifiers designed with
optimized performance of forward voltage drop, hyperfast
recovery time, and soft recovery.
The planar structure and the platinum doped life time control
guarantee the best overall performance, ruggedness and
reliability characteristics.
These devices are intended for use in PFC boost stage in the
AC/DC section of SMPS, inverters or as freewheeling
diodes.
The extremely optimized stored charge and low recovery
current minimize the switching losses and reduce over
dissipation in the switching element and snubbers.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
600
V
Peak repetitive reverse voltage
VRRM
Average rectified forward current in DC
IF(AV)
TC = 141 °C
15
Non-repetitive peak surge current
IFSM
TJ = 25 °C
120
Operating junction and storage temperatures
TJ, TStg
A
-65 to +175
°C
MIN.
TYP.
MAX.
UNITS
600
-
-
IF = 15 A
-
2.5
3.4
IF = 15 A, TJ = 150 °C
-
1.55
2
VR = VR rated
-
0.02
36
TJ = 150 °C, VR = VR rated
-
40
250
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
SYMBOL
VBR,
VR
TEST CONDITIONS
IR = 100 μA
V
Forward voltage
VF
Reverse leakage current
IR
Junction capacitance
CT
VR = 600 V
-
12
-
pF
Series inductance
LS
Measured lead to lead 5 mm from package body
-
8
-
nH
μA
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
Reverse recovery time
SYMBOL
trr
MIN.
TYP.
MAX.
IF = 1 A, dIF/dt = 100 A/μs, VR = 30 V
TEST CONDITIONS
-
17
23
IF = 15 A, dIF/dt = 100 A/μs, VR = 30 V
-
18
30
TJ = 25 °C
-
20
-
TJ = 125 °C
Peak recovery current
Reverse recovery charge
IRRM
Qrr
Reverse recovery time
trr
Peak recovery current
IRRM
Reverse recovery charge
TJ = 25 °C
TJ = 125 °C
IF = 15 A,
dIF/dt = 200 A/μs,
VR = 390 V
-
45
-
-
2.7
-
-
5.5
-
UNITS
ns
A
TJ = 25 °C
-
26
-
TJ = 125 °C
-
130
-
-
32
-
-
17
-
A
-
290
-
nC
MIN.
TYP.
MAX.
UNITS
-65
-
175
°C
-
1.2
1.4
-
3.7
4.3
TJ = 125 °C
Qrr
IF = 15 A,
dIF/dt = 800 A/μs,
VR = 390 V
nC
ns
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction and storage
temperature range
SYMBOL
TEST CONDITIONS
TJ, TStg
Thermal resistance,
junction-to-case
RthJC
Thermal resistance,
junction to ambient
RthJA
Typical socket mount
-
-
70
Typical thermal resistance,
case to heatsink
RthCS
Mounting surface, flat, smooth, and greased
-
0.5
-
-
2
-
g
-
0.07
-
oz.
6
(5)
-
12
(10)
kgf · cm
(lbf · in)
Weight
Mounting torque
Marking device
Case style TO-220AC 2L
°C/W
ETX1506
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1000
100
175°C
Reverse Current - IR (µA)
100
125°C
10
100°C
1
75°C
0.1
50°C
25°C
0.01
0.001
100
200
300
400
500
600
Reverse Voltage - VR (V)
10
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
100
Tj = 150°C
Junction Capacitance - CT (pF)
Instantaneous Forward Current - IF (A)
Tj = 175°C
150°C
Tj = 25°C
10
1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1
0
Forward Voltage Drop - VF (V)
100
200
300
400
500
600
Reverse Voltage - VR (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage
Thermal Impedance ZthJC (°C/W)
10
D = 0.5
1
D = 0.2
D = 0.1
D = 0.05
0.1
D = 0.02
Single Pulse
(Thermal Resistance)
D = 0.01
0.01
1E-05
1E-04
1E-03
1E-02
1E-01
1E+00
t1, Rectangular Pulse Duration (Seconds)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
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55
175
50
170
If = 15 A, 125°C
45
165
40
160
155
DC
150
145
trr ( ns )
Allowable Case Temperature (°C)
180
140
35
30
25
If = 15 A, 25°C
135
0
20
2
4
6
8 10 12 14 16
Average Forward Current - IF(AV)(A)
15
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
typical value
10
100
40
Fig. 7 - Typical Reverse Recovery vs. dIF/dt
RMS Limit
35
30
350
25
D = 0.01
D = 0.02
D = 0.05
D = 0.1
D = 0.2
D = 0.5
DC
20
15
10
5
0
0
2 4 6 8 10 12 14 16 18 20 22
Average Forward Current - IF(AV) (A)
Fig. 6 - Forward Power Loss Characteristics
300
250
Qrr ( nC )
Average Power Loss ( Watts )
1000
di F /dt (A/µs )
200
If = 15 A, 125°C
150
100
50
If = 15 A, 25°C
typical value
0
100
1000
di F /dt (A/µs )
Fig. 8 - Typical Stored Charge vs. dIF/dt
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(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(4) Qrr - area under curve defined by trr
and IRRM
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
Qrr =
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 9 - Reverse Recovery Waveform and Definitions
ORDERING INFORMATION TABLE
Device code
VS-
E
T
X
15
06
-M3
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Circuit configuration:
3
-
T = 2L TO-220AC
4
-
X = hyperfast recovery time
5
-
Current code: 15 = 15 A
E = single
6
-
Voltage code: 06 = 600 V
7
-
Environmental digit:
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
VS-ETX1506-M3
BASE QUANTITY
PACKAGING DESCRIPTION
50
Antistatic plastic tubes
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96156
Part marking information
www.vishay.com/doc?95391
Revision: 14-Jan-2022
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Outline Dimensions
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Vishay Semiconductors
2L TO-220AC
DIMENSIONS in millimeters and inches
A
0.014 M B A M
(6)
E
A
ØP
Q
B
A
(6)
(E)
A1
Thermal pad
1
(H1)
H1
C
D2
(6) D
2
D
D
L1 (2)
C
(6)
c
2xb
D1
2 x b2
Detail B
Detail B
A2
L
E1 (6)
C
(b, b2)
Base metal
A
c1 (4)
c
2x e
Plating
View A - A
e1
b1, b3
(4)
Section C - C and D - D
0.015 M B A M
Lead tip
Conforms to JEDEC® outline TO-220AC
SYMBOL
A
A1
A2
b
b1
b2
b3
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.25
4.65
1.14
1.40
2.50
2.92
0.69
1.01
0.38
0.97
1.20
1.73
1.14
1.73
0.36
0.61
0.36
0.56
14.85
15.35
8.38
9.02
INCHES
MIN.
MAX.
0.167
0.183
0.045
0.055
0.098
0.115
0.027
0.040
0.015
0.038
0.047
0.068
0.045
0.068
0.014
0.024
0.014
0.022
0.585
0.604
0.330
0.355
NOTES
4
4
4
3
SYMBOL
D2
E
E1
e
e1
H1
L
L1
ØP
Q
MILLIMETERS
MIN.
MAX.
11.68
13.30
10.11
10.51
6.86
8.89
2.41
2.67
4.88
5.28
6.09
6.48
13.52
14.02
3.32
3.82
3.54
3.91
2.60
3.00
INCHES
MIN.
MAX.
0.460
0.524
0.398
0.414
0.270
0.350
0.095
0.105
0.192
0.208
0.240
0.255
0.532
0.552
0.131
0.150
0.139
0.154
0.102
0.118
NOTES
6, 7
3, 6
6
6
2
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4) Dimension b1, b3, and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2, and E1
(7) Outline conforms to JEDEC® TO-220, except D2
Revision: 13-Jun-2019
Document Number: 96156
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