VS-GA100NA60UP
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Vishay Semiconductors
Insulated Gate Bipolar Transistor
(Warp 2 Speed IGBT), 100 A
FEATURES
• Ultrafast: Optimized for minimum saturation
voltage and speed 0 to 40 kHz in hard
switching, > 200 kHz in resonant mode
• Very low conduction and switching losses
• Fully isolated package (2500 VAC/RMS)
• Very low internal inductance ( 5 nH typical)
• Industry standard outline
• UL approved file E78996
• Compliant to RoHS Directive 2002/95/EC
• Designed and qualified for industrial market
SOT-227
BENEFITS
• Designed for increased operating efficiency in power
conversion: PFC, UPS, SMPS, welding, induction heating
• Lower overall losses available at frequencies 20 kHz
• Easy to assemble and parallel
• Direct mounting to heatsink
• Lower EMI, requires less snubbing
• Plug in compatible with other SOT-227 packages
PRODUCT SUMMARY
VCES
600 V
IC DC
100 A
VCE(on) at 100 A, 25 °C
1.8 V
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Collector to emitter breakdown voltage
Continuous collector current
SYMBOL
VCES
ICM
Clamped inductive load current
ILM
Gate to emitter voltage
VGE
RMS isolation voltage
VISOL
Operating junction and storage
temperature range
Mounting torque
TC = 25 °C
IC
Pulsed collector current
Maximum power dissipation
TEST CONDITIONS
MAX.
UNITS
600
V
100
TC = 100 °C
50
A
200
Repetitive rating: VGE = 20 V; pulse width limited
by maximum junction temperature (fig. 20)
200
Any terminal to case, t = 1 minute
2500
TC = 25 °C
250
TC = 100 °C
100
± 20
PD
TJ, TStg
6 to 32 or M3 screw
V
W
- 55 to + 150
°C
12
(1.3)
Ibf · in
(N · m)
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TYP.
MAX.
Junction to case, IGBT
RthJC
-
0.50
Thermal resistance, junction to case, diode
RthJC
-
1.0
Case to sink, flat, greased surface
RthCS
0.05
-
30
-
Weight of module
Revision: 01-Feb-12
UNITS
°C/W
g
Document Number: 94543
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Collector to emitter breakdown voltage
Temperature coeffecient of
breakdown voltage
SYMBOL
V(BR)CES
TEST CONDITIONS
VGE = 0 V, IC = 250 μA
V(BR)CESTJ
VGE = 0 V, IC = 1.0 mA
VCE(on)
VGE = 15 V, IC = 100 A
VGE = 15 V, IC = 50 A
Collector to emitter saturation voltage
See fig. 1, 4
VGE = 15 V, IC = 50 A, TJ = 150 °C
MIN.
TYP.
MAX.
UNITS
600
-
-
V
-
0.36
-
V/°C
2.1
-
1.49
-
1.80
-
-
1.47
-
V
VGE(th)
VCE = VGE, IC = 250 μA
3.0
-
6.0
Temperature coefficient of
threshold voltage
VGE(th)/ TJ
VCE = VGE, IC = 250 μA
-
- 7.6
-
Forward transconductance
gfe
VCE = 100 V, IC = 50 A
34
52
-
S
VGE = 0 V, VCE = 600 V
-
-
250
μA
VGE = 0 V, VCE = 600 V, TJ = 150 °C
-
-
1.3
mA
Gate threshold voltage
Zero gate voltage collector current
ICES
Diode forward voltage drop
VFM
Gate to emitter leakage current
IGES
IC = 50 A
See fig. 12
IC = 50 A, TJ = 150 °C
VGE = ± 20 V
mV/°C
-
1.3
1.6
-
1.16
1.3
-
-
± 100
nA
MIN.
TYP.
MAX.
UNITS
-
430
640
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Total gate charge (turn-on)
Qg
Gate emitter charge (turn-on)
Qge
Gate collector charge (turn-on)
Qgc
Turn-on delay time
Rise time
Turn-off delay time
Fall time
-
48
72
-
130
190
td(on)
-
57
-
tr
-
80
-
-
240
-
-
120
-
-
0.41
-
-
2.51
-
-
2.92
4.4
-
57
-
-
80
-
-
380
-
td(off)
tf
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Ets
Turn-on delay time
td(on)
Rise time
Turn-off delay time
Fall time
Total switching loss
Internal emitter inductance
tr
td(off)
tf
Ets
See fig. 7
TJ = 25 °C
IC = 60 A, VCC = 480 V
VGE = 15 V, Rg = 5.0
energy losses include “tail” and
diode reverse recovery
TJ = 150 °C
IC = 60 A, VCC = 480 V
VGE = 15 V, Rg = 5.0
energy losses include “tail” and
diode reverse recovery
LE
Input capacitance
Cies
Output capacitance
Coes
Reverse transfer capacitance
Cres
Diode reverse recovery time
trr
Diode peak reverse recovery current
Irr
Diode reverse recovery charge
Qrr
Diode peak rate of fall recovery
during tb
dI(rec)M/dt
Revision: 01-Feb-12
TEST CONDITIONS
IC = 50 A
VCC = 400 V
VGE = 15 V
VGE = 0 V
VCC = 30 V
f = 1.0 MHz
TJ = 25 °C
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
See fig. 6
See fig. 13
See fig. 14
See fig. 15
See fig. 16
IF = 50 A
VR = 200 V
dI/dt = 200 A/μs
nC
ns
mJ
ns
-
170
-
-
4.78
-
mJ
nH
-
2.0
-
-
7400
-
-
730
-
-
90
-
-
90
140
-
120
180
-
7.3
11
-
11
16
-
360
550
-
780
1200
-
370
-
-
220
-
pF
ns
A
nC
A/μs
Document Number: 94543
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VS-GA100NA60UP
Vishay Semiconductors
1000
Maximum DC Collector Current (A)
IC - Collector-to-Emitter Current (A)
www.vishay.com
°C
TJJ = 25 °C
TJJ = 150 °°C
C
100
10
VVGE
= 15V
15 V
GE =
20
20μs
μs PULSE
Pulse Width
WIDTH
1
0.0
1.0
2.0
3.0
4.0
100
80
60
40
20
0
25
5.0
50
1000
TJ = 150 °C
100
TJ = 25 °C
1
6.0
7.0
8.0
125
150
Fig. 3 - Maximum Collector Current vs.
Case Temperature
VCE - Collector-to-Emitter Voltage (V)
IC - Collector-to-Emitter Current (A)
Fig. 1 - Typical Output Characteristics
5.0
100
TC - Case Temperature (°C)
VCE - Collector-to-Emitter Voltage (V)
10
75
9.0
2.5
VGE = 15 V
80 μs Pulse width
2.0
IC = 100 A
IC = 50 A
1.5
IC = 25 A
1.0
- 60 - 40 - 20 0
20 40 60 80 100 120 140 160
TJ - Junction Temperature (°C)
VGE - Gate-to-Emitter Voltage (V)
Fig. 4 - Typical Collector to Emitter Voltage vs.
Junction Temperature
Fig. 2 - Typical Transfer Characteristics
ZthJC - Thermal Response
1
D = 0.50
0.1
0.01
D = 0.20
PDM
D = 0.10
D = 0.05
D = 0.02
D = 0.01
t1
t2
Single pulse
(thermal response)
0.001
0.00001
0.0001
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
0.001
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 5 - Maximum Effective Transient Thermal Impedance, Junction to Case
Revision: 01-Feb-12
Document Number: 94543
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VS-GA100NA60UP
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Vishay Semiconductors
14 000
100
C - Capacitance (pF)
12 000
= 0 V, f = 1 MHz
= Cg e + Cg c , Cce shorted
= Cg c
= Cce + Cg c
Total Switching Loss (mJ)
V GE
Cies
Cres
Coes
10 000
C ies
8000
6000
C oes
4000
2000
0
C res
1
10
R G = 5.0 Ω
VGE = 15 V
VCC = 480 V
I C = 120 A
10
I C = 60 A
I C = 30 A
1
0.1
- 60 - 40 - 20 0
100
VCE - Collector-to-Emitter Voltage (V)
TJ - Junction Temperature (°C)
Fig. 9 - Typical Switching Losses vs.
Junction Temperature
Fig. 6 - Typical Capacitance vs.
Collector to Emitter Voltage
12
V CC = 400 V
I C = 50 A
Total Switching Loss (mJ)
VGE - Gate-to-Emitter Voltage (V)
20
16
12
8
4
RG = 5.0 Ω
TJ = 150 °C
VGE = 15 V
VCC = 480 V
10
8
6
4
2
0
0
0
100
200
300
400
20
500
QG - Total Gate Charge (nC)
IC - Collector-to-Emitter Current (A)
VCC = 480 V
VGE = 15 V
TJ = 25 °C
IC = 60 A
6
4
2
0
10
20
30
40
50
RG - Gate Resistance (Ω)
Fig. 8 - Typical Switching Losses vs.
Gate Resistance
Revision: 01-Feb-12
60
80
100
Fig. 10 - Typical Switching Losses vs.
Collector to Emitter Current
10
8
40
IC - Collector Current (A)
Fig. 7 - Typical Gate Charge vs.
Gate to Emitter Voltage
Total Switching Loss (mJ)
20 40 60 80 100 120 140 160
1000
VGE = 20 V
T J = 125 °C
100
10
Safe operating area
1
1
10
100
1000
VCE - Collector-to-Emitter Voltage (V)
Fig. 11 - Turn-Off SOA
Document Number: 94543
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VS-GA100NA60UP
Vishay Semiconductors
1000
4000
3000
VR = 200 V
TJ = 125 °C
TJ = 25 °C
100
Qrr (nC)
IF - Instantaneous Forward Current (A)
www.vishay.com
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
2000
IF = 100 A
IF = 50 A
IF = 25 A
10
1000
0
1
0.0
0.4
0.8
1.2
1.6
100
2.0
1000
dIF/dt (A/μs)
VFM - Forward Voltage Drop (V)
Fig. 12 - Typical Forward Voltage Drop vs.
Instantaneous Forward Current
150
10 000
IF = 100 A
IF = 50 A
IF = 25 A
dIRECM/dt (A/μs)
120
trr (nC)
90
60
30
0
Fig. 15 - Typical Stored Charge vs. dIF/dt
VR = 200 V
TJ = 125 °C
TJ = 25 °C
100
1000
dIF/dt (A/μs)
IF = 100 A
IF = 50 A
IF = 25 A
VR = 200 V
TJ = 125 °C
TJ = 25 °C
1000
100
100
1000
dIF/dt (A/μs)
Fig. 13 - Typical Reverse Recovery vs. dIF/dt
Fig. 16 - Typical dI(rec)M/dt vs. dIF/dt
100
IRR (A)
IF = 100 A
IF = 50 A
IF = 25 A
10
VR = 200 V
TJ = 125 °C
TJ = 25 °C
1
100
1000
dIF/dt (A/μs)
Fig. 14 - Typical Recovery Current vs. dIF/dt
Revision: 01-Feb-12
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Vishay Semiconductors
Same type
device
as
D.U.T.
Qrr =
tx
10 % VCC
430 µF
80 %
of VCE
trr
IC
∫
trr
IC dt
tx
10 % Irr
VCC
D.U.T.
Vpk
Irr
Diode recovery
waveforms
Fig. 17a - Test Circuit for Measurement of ILM, Eon, Eoff(diode), trr, Qrr,
Irr, td(on), tr, td(off), tf
Erec =
Diode reverse
recovery energy
90%
t4
Vd IC dt
t3
t4
10%
Vge
VC
t3
∫
Fig. 1 - Test Waveforms for Circuit of Fig. 17a,
Defining Erec, trr, Qrr, Irr
90%
td(off)
10%
IC 5%
VG Gate signal
device under test
tf
tr
t d(on)
t=5μs
E on
E off
Current D.U.T.
E ts = (Eon +Eoff )
Fig. 17b - Test Waveforms for Circuit of Fig. 17a,
Defining Eoff, td(off), tf
Voltage in D.U.T.
Current in D1
Gate voltage D.U.T.
10 % + VG
+ VG
D.U.T. voltage
and current
Vce
VCC
10 %
IC
90 % IC
tr
td(on)
t1
t2
Fig. 17e - Macro Waveforms for Figure 17a's Test Circuit
Ipk
IC
5 % VCE
∫
Eon =
t1
t0
t2
VCE IC dt
t1
t2
Fig. 17c - Test Waveforms for Circuit of Fig. 17a,
Defining Eon, td(on), tr
Revision: 01-Feb-12
Document Number: 94543
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Vishay Semiconductors
L
50 V
RL =
D.U.T.
1000 V
VC*
0 - 480 V
480 V
4 x IC at 25 °C
6000 µF
100 V
Fig. 18b - Pulsed Collector Current Test Circuit
Fig. 18a - Clamped Inductive Load Test Circuit
ORDERING INFORMATION TABLE
Device code
VS-
G
A
100
N
A
60
U
P
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Device:
G = IGBT
3
-
Silicon technology:
A = Generation 4 IGBT, Generation 2 HEXFRED®
4
-
Current rating (100 = 100 A)
5
-
N = High side chopper
6
-
SOT-227
7
-
Voltage rating (60 = 600 V)
8
-
U = Ultrafast with matching diode
9
-
None = Standard production
P = Lead (Pb)-free
CIRCUIT CONFIGURATION
3
2
1
4
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95036
Packaging information
www.vishay.com/doc?95037
Revision: 01-Feb-12
Document Number: 94543
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Outline Dimensions
Vishay Semiconductors
SOT-227
DIMENSIONS in millimeters (inches)
38.30 (1.508)
37.80 (1.488)
Chamfer
2.00 (0.079) x 45°
4 x M4 nuts
Ø 4.40 (0.173)
Ø 4.20 (0.165)
-A3
4
6.25 (0.246)
12.50 (0.492)
25.70 (1.012)
25.20 (0.992)
-B-
1
2
R full
7.50 (0.295)
15.00 (0.590)
30.20 (1.189)
29.80 (1.173)
8.10 (0.319)
4x
7.70 (0.303)
2.10 (0.082)
1.90 (0.075)
0.25 (0.010) M C A M B M
2.10 (0.082)
1.90 (0.075)
-C-
12.30 (0.484)
11.80 (0.464)
0.12 (0.005)
Notes
• Dimensioning and tolerancing per ANSI Y14.5M-1982
• Controlling dimension: millimeter
Document Number: 95036
Revision: 28-Aug-07
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
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