GA200SA60SP
Vishay Semiconductors
Insulated Gate Bipolar Transistor
Ultralow VCE(on), 342 A
FEATURES
• Standard: Optimized for minimum saturation
voltage and low speed up to 5 kHz
• Lowest conduction losses available
• Fully isolated package (2500 VAC)
• Very low internal inductance (5 nH typical)
• Industry standard outline
SOT-227
• UL approved file E78996
• Compliant to RoHS directive 2002/95/EC
• Designed and qualified for industrial level
PRODUCT SUMMARY
VCES
600 V
VCE(on) (typical) at 200 A, 25 °C
1.33 V
IC at TC = 97 °C (1)
200 A
BENEFITS
• Designed for increased operating efficiency in power
conversion: UPS, SMPS, TIG welding, induction heating
Note
(1) Maximum I
RMS current admitted 100 A to do not exceed the
maximum temperature of terminals
• Easy to assemble and parallel
• Direct mounting to heatsink
• Plug-in compatible with other SOT-227 packages
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Collector to emitter breakdown voltage
Continuous collector current
TEST CONDITIONS
VCES
IC (1)
MAX.
UNITS
600
V
TC = 25 °C
342
TC = 97 °C
200
400
400
Pulsed collector current
ICM
Repetitive rating; VGE = 20 V, pulse width limited
by maximum junction temperature
See fig. 15
Clamped Inductive load current
ILM
VCC = 80 % (VCES), VGE = 20 V,
L = 10 μH, Rg = 2.0 ,
See fig. 14
Gate to emitter voltage
VGE
± 20
V
155
mJ
V
Reverse voltage avalanche energy
EARV
Repetitive rating; pulse width limited by
maximum junction temperature
RMS isolation voltage
VISOL
Any terminal to case, t = 1 minute
2500
TC = 25 °C
781
TC = 100 °C
312
Maximum power dissipation
Operating junction and storage
temperature range
Mounting torque
PD
TJ, TStg
A
W
- 55 to + 150
°C
12 (1.3)
lbf in (N m)
6-32 or M3 screw
Note
(1) Maximum I
RMS current admitted 100 A to do not exceed the maximum temperature of terminals
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TYP.
MAX.
Junction to case
RthJC
-
0.16
Case to sink, flat, greased surface
RthCS
0.05
-
30
-
Weight of module
Document Number: 94363
Revision: 22-Jul-10
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UNITS
°C/W
g
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1
GA200SA60SP
Vishay Semiconductors
Insulated Gate Bipolar Transistor
Ultralow VCE(on), 342 A
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Collector to emitter breakdown voltage
V(BR)CES
Emitter to collector breakdown voltage
V(BR)ECS (1)
Temperature coeff. of breakdown voltage
Collector to emitter saturation voltage
Gate threshold voltage
V(BR)CES/TJ
VCE(on)
VGE(th)
Temperature coeff. of threshold voltage
VGE(th)/TJ
(2)
Forward transconductance
gfe
Zero gate voltage collector current
ICES
Gate to emitter leakage current
IGES
TEST CONDITIONS
MIN.
TYP.
MAX.
VGE = 0 V, IC = 250 μA
600
-
-
VGE = 0 V, IC = 1.0 A
18
-
-
VGE = 0 V, IC = 1.0 mA
-
0.62
-
IC = 100 A
-
1.10
1.3
IC = 200 A
VGE = 15 V
See fig. 2, 5
UNITS
V
V/°C
-
1.33
-
IC = 100 A, TJ = 150 °C
-
1.02
-
VCE = VGE, IC = 250 μA
3.0
-
6.0
-
- 10
-
mV/°C
VCE = 100 V, IC = 100 A
90
150
-
S
VGE = 0 V, VCE = 600 V
-
-
1.0
VGE = 0 V, VCE = 10 V, TJ = 150 °C
-
-
10
VGE = ± 20 V
-
-
± 250
nA
MIN.
TYP.
MAX.
UNITS
VCE = VGE, IC = 2 mA
V
mA
Notes
(1) Pulse width 80 μs; duty factor 0.1 %
(2) Pulse width 5.0 μs, single shot
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
Total gate charge (turn-on)
Qg
IC = 100 A
-
770
1200
Gate emitter charge (turn-on)
Qge
VCC = 400 V
-
100
150
Gate collector charge (turn-on)
Qgc
VGE = 15 V; See fig. 8
-
260
380
Turn-on delay time
td(on)
-
78
-
-
56
-
VCC = 480 V
-
890
1300
tf
VGE = 15 V
-
390
580
Turn-on switching loss
Eon
Rg = 2.0
-
0.98
-
Turn-off switching loss
Eoff
Energy losses include “tail”
-
17.4
-
-
18.4
25.5
TJ = 150 °C
-
72
-
tr
IC = 100 A, VCC = 480 V
-
60
-
td(off)
VGE = 15 V, Rg = 2.0
-
1500
-
Rise time
tr
Turn-off delay time
td(off)
Fall time
Total switching loss
Ets
Turn-on delay time
td(on)
Rise time
Turn-off delay time
TJ = 25 °C
IC = 100 A
See fig. 9, 10, 13
nC
ns
mJ
ns
Energy losses include “tail”
-
660
-
Total switching loss
Ets
See fig. 10, 11, 13
-
35.7
-
mJ
Internal emitter inductance
LE
Between lead, and center of
the die contact
-
5.0
-
nH
VGE = 0 V
VCC = 30 V
f = 1.0 MHz; See fig. 7
-
16 250
-
-
1040
-
-
190
-
Fall time
tf
Input capacitance
Cies
Output capacitance
Coes
Reverse transfer capacitance
Cres
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pF
Document Number: 94363
Revision: 22-Jul-10
GA200SA60SP
Insulated Gate Bipolar Transistor
Ultralow VCE(on), 342 A
Vishay Semiconductors
250
For both:
Triangular wave:
Duty cycle: 50 %
I
TJ = 125 °C
Tsink = 90 °C
Clamp voltage:
Gate drive as specified
80 % of rated
Power dissipation = 140 W
Load Current (A)
200
150
Square wave:
60 % of rated
voltage
100
I
50
Ideal diodes
0
0.1
1
10
100
f - Frequency (kHz)
1000
TC - Case Temperature (°C)
160
TJ = 150 °C
100
TJ = 25 °C
10
VGE = 15 V
20 µs pulse width
1
0.5
1.0
1.5
2.0
140
120
DC
100
80
60
40
20
0
2.5
0
50
100
150
200
250
300
350
VCE - Collector to Emitter Voltage (V)
Maximum DC Collector Current (A)
Fig. 2 - Typical Output Characteristics
Fig. 4 - Maximum Collector Current vs. Case Temperature
VCE - Collector to Emitter Voltage (V)
IC - Collector to Emitter Current (A)
IC - Collector to Emitter Current (A)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of Fundamental)
1000
TJ = 150 °C
TJ = 25 °C
100
VCC = 50 V
5 µs pulse width
10
5
6
7
3
VGE = 15 V
80 µs pulse width
IC = 400 A
2
IC = 200 A
IC = 100 A
1
- 60 - 40 - 20 0
20 40 60 80 100 120 140 160
VGE - Gate to Emitter Voltage (V)
TJ - Junction Temperature (°C)
Fig. 3 - Typical Transfer Characteristics
Fig. 5 - Typical Collector to Emitter Voltage vs.
Junction Temperature
Document Number: 94363
Revision: 22-Jul-10
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3
GA200SA60SP
Insulated Gate Bipolar Transistor
Ultralow VCE(on), 342 A
Vishay Semiconductors
ZthJC - Thermal Response
1
0.1
D = 0.75
D = 0.50
D = 0.25
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.01
Single pulse
(thermal resistance)
0.001
0.0001
0.001
0.01
0.1
1
10
100
t1 - Rectangular Pulse Duration (s)
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction to Case
25
VGE = 0 V, f = 1 MHz
Cies = Cge + Cgc, Cce shorted
Cres = Cgc
Coes = Cce + Cgc
24 000
Cies
18 000
Coes
12 000
6000
Cres
Total Switching Losses (mJ)
C - Capacitance (pF)
30 000
0
23
22
21
20
19
18
1
10
100
0
10
20
30
40
50
VCE - Collector to Emitter Voltage (V)
Rg - Gate Resistance (Ω)
Fig. 7 - Typical Capacitance vs.
Collector to Emitter Voltage
Fig. 9 - Typical Switching Losses vs. Gate Resistance
1000
20
VCC = 400 V
IC = 100 A
Total Switching Losses (mJ)
VGE - Gate to Emitter Voltage (V)
VCC = 480 V
VGE = 15 V
TJ = 25 °C
IC = 200 A
24
16
12
8
4
0
0
200
400
600
800
RG = 2.0 Ω
VGE = 15 V
VCC = 480 V
IC = 350 A
100
IC = 200 A
IC = 100 A
10
- 60 - 40 - 20 0
20 40 60 80 100 120 140 160
QG - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Fig. 8 - Typical Gate Charge vs. Gate to Emitter Voltage
Fig. 10 - Typical Switching Losses vs.
Junction Temperature
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Document Number: 94363
Revision: 22-Jul-10
GA200SA60SP
Insulated Gate Bipolar Transistor
Ultralow VCE(on), 342 A
Vishay Semiconductors
Total Switching Losses (mJ)
160
RG = 2.0 Ω
TJ = 150 °C
VCC = 480 V
VGE = 15 V
120
L
D.U.T.
VC*
50 V
80
1000 V
1
2
40
* Driver same type as D.U.T.; VC = 80 % of VCE (max)
0
100
150
200
250
300
Note: Due to the 50 V power supply, pulse width and inductor
will increase to obtain rated Id
350
IC - Collector Current (A)
Fig. 11 - Typical Switching Losses vs. Collector Current
Fig. 13a - Clamped Inductive Load Test Circuit
IC - Collector Current (A)
1000
VGE = 20 V
TJ = 125 °C
100
RL =
0 V to 480 V
480 V
4 x IC at 25 °C
480 µF
960 V
10
Safe operating area
1
1
10
100
1000
VCE - Collector to Emitter Voltage (V)
Fig. 12 - Turn-Off SOA
Fig. 13b - Pulsed Collector Current Test Circuit
IC
L
Driver*
D.U.T.
VC
50 V
1000 V
1
2
3
* Driver same type as D.U.T., VC = 480 V
Fig. 14a - Switching Lost Test Circuit
Document Number: 94363
Revision: 22-Jul-10
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5
GA200SA60SP
Insulated Gate Bipolar Transistor
Ultralow VCE(on), 342 A
Vishay Semiconductors
1
2
90 %
10 %
3
VC
90 %
td (off)
10 %
5%
IC
tf
tr
td (on)
t = 5 µs
Eoff
Eon
Ets = (Eon + Eoff)
Fig. 14b - Switching Loss Waveforms
ORDERING INFORMATION TABLE
Device code
G
A
200
S
A
60
S
P
1
2
3
4
5
6
7
8
1
-
Insulated Gate Bipolar Transistor (IGBT)
2
-
Generation 4, IGBT silicon, DBC construction
3
-
Current rating (200 = 200 A)
4
-
Single switch, no diode
5
-
SOT-227
6
-
Voltage rating (60 = 600 V)
7
-
Speed/type (S = Standard speed)
8
-
None = Standard production
P = Lead (Pb)-free
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Document Number: 94363
Revision: 22-Jul-10
GA200SA60SP
Insulated Gate Bipolar Transistor
Ultralow VCE(on), 342 A
Vishay Semiconductors
CIRCUIT CONFIGURATION
3 (C)
Lead assignment
E
2 (G)
C
4
3
1
2
E
G
1, 4 (E)
N-channel
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95036
Packaging information
www.vishay.com/doc?95037
Document Number: 94363
Revision: 22-Jul-10
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www.vishay.com
7
Outline Dimensions
Vishay Semiconductors
SOT-227
DIMENSIONS in millimeters (inches)
38.30 (1.508)
37.80 (1.488)
Chamfer
2.00 (0.079) x 45°
4 x M4 nuts
Ø 4.40 (0.173)
Ø 4.20 (0.165)
-A3
4
6.25 (0.246)
12.50 (0.492)
25.70 (1.012)
25.20 (0.992)
-B-
1
2
R full
7.50 (0.295)
15.00 (0.590)
30.20 (1.189)
29.80 (1.173)
8.10 (0.319)
4x
7.70 (0.303)
2.10 (0.082)
1.90 (0.075)
0.25 (0.010) M C A M B M
2.10 (0.082)
1.90 (0.075)
-C-
12.30 (0.484)
11.80 (0.464)
0.12 (0.005)
Notes
• Dimensioning and tolerancing per ANSI Y14.5M-1982
• Controlling dimension: millimeter
Document Number: 95036
Revision: 28-Aug-07
For technical questions, contact: indmodules@vishay.com
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Revision: 02-Oct-12
1
Document Number: 91000