VS-GT80DA120U
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Vishay Semiconductors
Insulated Gate Bipolar Transistor
(Trench IGBT), 80 A
FEATURES
• Trench IGBT technology
• Positive VCE(on) temperature coefficient
• Square RBSOA
• 10 μs short circuit capability
• HEXFRED® low Qrr, low switching energy
• TJ maximum = 150 °C
• Fully isolated package
SOT-227
• Very low internal inductance ( 5 nH typical)
• Industry standard outline
• UL approved file E78996
PRIMARY CHARACTERISTICS
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
VCES
1200 V
IC DC
80 A at 104 °C
VCE(on) typical at 80 A, 25 °C
2.0 V
Speed
8 kHz to 30 kHz
BENEFITS
• Designed for increased operating efficiency in power
conversion: UPS, SMPS, welding, induction heating
Package
SOT-227
Circuit configuration
Single switch with AP diode
• Easy to assemble and parallel
• Direct mounting to heatsink
• Plug-in compatible with other SOT-227 packages
• Low EMI, requires less snubbing
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Collector to emitter voltage
Continuous collector current
SYMBOL
VCES
IC
Pulsed collector current
ICM
Clamped inductive load current
ILM
Diode continuous forward current
IF
Single pulse forward current
IFSM
Gate to emitter voltage
VGE
Power dissipation, IGBT
PD
Power dissipation, diode
PD
Isolation voltage
TEST CONDITIONS
VISOL
TC = 25 °C
TC = 90 °C
MAX.
UNITS
1200
V
139
93
170
250
TC = 25 °C
A
98
TC = 90 °C
61
10 ms sine or 6 ms rectangular pulse, TJ = 25 °C
350
± 20
TC = 25 °C
658
TC = 90 °C
316
TC = 25 °C
403
TC = 90 °C
194
Any terminal to case, t = 1 min
2500
V
W
V
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Collector to emitter breakdown voltage
VBR(CES)
Collector to emitter voltage
VCE(on)
Gate threshold voltage
VGE(th)
Temperature coefficient of threshold voltage
VGE(th)/TJ
Collector to emitter leakage current
ICES
Forward voltage drop
VFM
Gate to emitter leakage current
IGES
MIN.
TYP.
MAX.
VGE = 0 V, IC = 2.6 mA
TEST CONDITIONS
1200
-
-
UNITS
VGE = 15 V, IC = 80 A
-
2.0
2.55
VGE = 15 V, IC = 80 A, TJ = 125 °C
-
2.4
-
VGE = 15 V, IC = 80 A, TJ = 150 °C
-
2.5
-
4.75
5.7
7.0
VCE = VGE, IC = 2.6 mA (25 °C to 125 °C)
-
-12
-
VGE = 0 V, VCE = 1200 V
-
1.0
100
μA
VGE = 0 V, VCE = 1200 V, TJ = 125 °C
-
0.9
-
mA
IF = 80 A, VGE = 0 V
-
2.9
3.5
IF = 80 A, VGE = 0 V, TJ = 125 °C
-
3.1
-
IF = 80 A, VGE = 0 V, TJ = 150 °C
-
3.1
-
VGE = ± 20 V
-
-
± 220
nA
MIN.
TYP.
MAX.
UNITS
-
570
-
-
4400
-
-
235
-
VCE = VGE, IC = 2.6 mA
V
mV/°C
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Total gate charge (turn-on)
Qg
Input capacitance
Cies
Reverse transfer capacitance
Cres
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on switching loss
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on delay time
td(on)
Rise time
Turn-off delay time
Fall time
Reverse bias safe operating area
tr
VCE = 25 V, VGE = 0 V, f = 1 MHz
IC = 80 A, VCC = 600 V, VGE = 15 V,
Rg = 1.0 L = 500 μH,
TJ = 25 °C
IC = 80 A, VCC = 600 V, VGE = 15 V,
Rg = 1.0 L = 500 μH, TJ = 125 °C
Energy losses
include tail and
diode recovery
Diode used
HFA16PB120
td(off)
tf
RBSOA
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Diode reverse recovery time
Diode peak reverse current
Irr
Diode recovery charge
Qrr
Short circuit safe operating area
TEST CONDITIONS
VGE = -15 V, VGE = ± 15 V
-
3.0
-
-
3.2
-
-
6.2
-
-
3.9
-
-
5.5
-
-
9.4
-
-
134
-
-
65
-
-
281
-
-
155
-
TJ = 150 °C, IC = 250 A, Rg = 1.0 VGE = 15 V to 0 V,
VCC = 800 V, VP = 1200 V, L = 500 μH
pF
mJ
mJ
ns
Fullsquare
-
179
-
ns
-
11.5
-
A
Qrr
-
1029
-
nC
trr
-
275
-
ns
-
17.8
-
A
-
2451
-
nC
SCSOA
IF = 50 A, dIF/dt = 200 A/μs, VR = 400 V
IF = 50 A, dIF/dt = 200 A/μs,
Vrr = 400 V, TJ = 125 °C
VGE = 15 V, VCC = 800 V, VCE max.= 1200 V, TJ = 150 °C
10
μs
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Junction and storage temperature range
Junction to case
Case to heatsink
IGBT
Diode
TEST CONDITIONS
TJ, TStg
RthJC
RthCS
Case style
TYP.
MAX.
UNITS
-40
-
150
°C
-
-
0.19
-
-
0.31
Flat, greased surface
-
0.1
-
-
30
-
g
Torque to terminal
-
-
1.1 (9.7)
Nm (lbf. in)
Torque to heatsink
-
-
1.3 (11.5))
Nm (lbf. in)
Weight
Mounting torque
MIN.
°C/W
SOT-227
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160
4.0
140
3.6
120
VGE = 15 V
120 A
3.2
TJ = 150 °C
TJ = 25 °C
80
VCE (V)
IC (A)
100
2.8
80 A
2.4
60
2.0
TJ = 125 °C
40
40 A
1.6
20
0
1.2
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
20
4.0
40
60
80
100
120
140
160
VCE (V)
TJ (°C)
Fig. 1 - Typical IGBT Output Characteristics, VGE = 15 V
Fig. 4 - Collector to Emitter Voltage vs. Junction Temperature
160
80
140
70
120
60
VCE = 20 V
50
VGE = 18 V
IC (A)
IC (A)
100
VGE = 15 V
80
60
TJ = 125 °C
40
30
VGE = 12 V
TJ = 25 °C
40
20
VGE = 9 V
20
10
0
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
5
6
7
8
10
11
12
VGE (V)
VCE (V)
Fig. 2 - Typical IGBT Output Characteristics, TJ = 125 °C
Fig. 5 - Typical IGBT Transfer Characteristics
180
7.0
160
6.5
140
TJ = 25 °C
6.0
120
100
VGEth (V)
Allowable Case Temperature (°C)
9
DC
80
60
5.5
5.0
TJ = 125 °C
4.5
4.0
40
3.5
20
3.0
0
0
20
40
60
80
100
120
140
160
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
IC - Continuous Collector Current (A)
IC (mA)
Fig. 3 - Maximum IGBT Continuous Collector Current vs.
Case Temperature
Fig. 6 - Typical IGBT Gate Threshold Voltage
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6
10
TJ = 150 °C
5
1
Eoff
4
0.1
Energy (mJ)
ICES (mA)
TJ = 125 °C
0.01
TJ = 25 °C
0.001
3
2
Eon
1
0.0001
0
100 200 300 400 500 600 700 800 900 1000 1100 1200
0
10
20
30
VCES (V)
40
50
60
70
80
90 100
IC (A)
Fig. 10 - Typical IGBT Energy Loss vs IC
TJ = 125 °C, VCC = 600 V, Rg = 1.0 , VGE = 15 V, L = 500 μH
Fig. 7 - Typical IGBT Zero Gate Voltage Collector Current
120
1000
Switching Time (ns)
100
IF (A)
80
TJ = 25 °C
60
TJ = 150 °C
40
TJ = 125 °C
20
0
td(off)
td(on)
100
tr
10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
20
40
60
80
VFM (V)
IC (A)
Fig. 8 - Typical Diode Forward Characteristics
Fig. 11 - Typical IGBT Switching Time vs. IC
TJ = 125 °C, VCC = 600 V, Rg = 1.0 , VGE = 15 V, L = 500 μH
180
9
160
8
Eon
140
7
120
DC
100
80
60
Energy (mJ)
Allowable Case Temperature (°C)
tf
6
5
Eoff
4
40
3
20
0
2
0
10 20 30 40 50 60 70 80 90 100 110
0
2
4
6
8
10
12
IF - Continuous Forward Current (A)
Rg (Ω)
Fig. 9 - Maximum Diode Continuous Forward Current vs.
Case Temperature
Fig. 12 - Typical IGBT Energy Loss vs. Rg
TJ = 125 °C, VCC = 600 V, IC = 80 A, VGE = 15 V, L = 500 μH
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30
1000
Irr (A)
Switching Time (ns)
20
tf
td(on)
100
TJ = 125 °C
25
td(off)
15
tr
TJ = 25 °C
10
5
10
0
0
2
4
6
8
10
12
100
200
Rg (Ω)
300
500
dIF/dt (A/μs)
Fig. 13 - Typical IGBT Switching Time vs. Rg
TJ = 125 °C, VCC = 600 V, IC = 80 A, VGE = 15 V, L = 500 μH
Fig. 15 - Typical Diode Reverse Recovery Current vs. dIF/dt
Vrr = 400 V, IF = 50 A
400
3000
350
2500
TJ = 125 °C
300
2000
TJ = 125 °C
Qrr (nC)
250
trr (ns)
400
200
150
1500
1000
TJ = 25 °C
TJ = 25 °C
100
500
50
0
0
100
200
300
400
500
100
200
300
400
500
dIF/dt (A/μs)
Fig. 14 - Typical Diode Reverse Recovery Time vs. dIF/dt
Vrr = 400 V, IF = 50 A
Fig. 16 - Typical Diode Reverse Recovery Charge vs. dIF/dt
Vrr = 400 V, IF = 50 A
C
E(
on
)
1000
by
V
tp
d
100
m
ite
tp
tp
Li
ICE - Collector-Emitter Current (A)
dIF/dt (A/μs)
10
1
=
=
6m
=
1m
10
0μ
s
s
s
TA = 25 °C
TJ = 150 °C
VGE = 15 V
Single pulse
0.1
1
10
100
1000
VCE - Collector-Emitter Voltage (V)
Fig. 17 - IGBT Safe Operating Area
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ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
0.50
0.20
0.10
0.05
0.02
0.01
DC
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 18 - Maximum Thermal Impedance ZthJC Characteristics (IGBT)
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
0.50
0.20
0.10
0.05
0.02
0.01
DC
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 19 - Maximum Thermal Impedance ZthJC Characteristics (Diode)
IC - Collector Curent (A)
300
250
200
150
100
50
0
1
10
100
1000
VCE (V)
Fig. 20 - IGBT Reverse Bias SOA
VGE = 15 V, TJ = 150 °C
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L
R=
D.U.T.
VCC
ICM
VC (1)
50 V
1000 V
1
D.U.T.
+
-V
CC
2
Rg
Note:
(1)
Driver same type as D.U.T.; VC = 80 % of VCE max.
Due to the 50 V power supply, pulse width, and inductor
will increase to obtain ID
Fig. 21 - Clamped Inductive Load Test Circuit
Fig. 22 - Pulsed Collector Current Test Circuit
Diode clamp /
D.U.T.
L
- +
-5 V
+
VCC
D.U.T. /
driver
Rg
Fig. 23 - Switching Loss Test Circuit
1
2
90 %
10 %
3
VC
90 %
td(off)
10 %
IC
5%
tf
tr
td(on)
t = 5 µs
Eoff
Eon
Ets = (Eon + Eoff)
Fig. 24 - Switching Loss Waveforms Test Circuit
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ORDERING INFORMATION TABLE
Device code
VS-
G
T
80
D
A
120
U
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Insulated gate bipolar transistor (IGBT)
3
-
Trench IGBT technology
4
-
Current rating (80 = 80 A)
5
-
Circuit configuration (D = single switch with antiparallel diode)
6
-
Package indicator (A = SOT-227)
7
-
Voltage rating (120 = 1200 V)
8
-
Speed / type (U = ultrafast)
CIRCUIT CONFIGURATION
CIRCUIT
CIRCUIT CONFIGURATION
CODE
CIRCUIT DRAWING
3 (C)
Single switch with
AP diode
Lead Assignment
4
3
1
2
D
2 (G)
1, 4 (E)
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95423
Packaging information
www.vishay.com/doc?95425
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Outline Dimensions
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Vishay Semiconductors
SOT-227 Generation 2
DIMENSIONS in millimeters (inches)
37.80 (1.488)
38.30 (1.508)
Ø 4.10 (0.161)
Ø 4.30 (0.169)
-A-
4 x M4 nuts
6.25 (0.246)
6.50 (0.256)
12.50 (0.492)
13.00 (0.512)
7.45 (0.293)
7.60 (0.299)
14.90 (0.587)
15.20 (0.598)
24.70 (0.972)
25.70 (1.012)
R full 2.07 (0.081)
2.12 (0.083)
29.80 (1.173)
30.50 (1.200)
31.50 (1.240)
32.10 (1.264)
4x
1.90 (0.075)
2.20 (0.087)
7.70 (0.303)
8.30 (0.327)
0.25 (0.010) M C A M B M
4.10 (0.161)
4.50 (0.177)
5.33 (0.210)
5.96 (0.234)
11.60 (0.457)
12.30 (0.484)
24.70 (0.972)
25.50 (1.004)
Note
• Controlling dimension: millimeter
Document Number: 95423
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Revision: 19-May-2020
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
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Revision: 01-Jan-2023
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