VS-GT80DA60U
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Vishay Semiconductors
Insulated Gate Bipolar Transistor
(Trench IGBT), 600 V, 80 A
FEATURES
• High speed trench gate field-stop IGBT positive
temperature coefficient
• TJ maximum = 175 °C
• FRED Pt® anti-parallel diodes with ultrasoft
reverse recovery
• Fully isolated package
• Very low internal inductance (≤ 5 nH typical)
SOT-227
• Industry standard outline
• UL approved file E78996
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
VCES
600 V
IC DC
80 A at TC = 97 °C
VCE(on) typical at 80 A, 25 °C
1.83 V
BENEFITS
• Designed for increased operating efficiency in power
conversion: UPS, SMPS, welding, induction heating
IF (DC)
56 A at TC = 100 °C
Speed
8 kHz to 30 kHz
Package
SOT-227
Circuit configuration
Single switch with AP diode
• Easy to assemble and safe paralleling
• Direct mounting to heatsink
• Plug-in compatible with other SOT-227 packages
• Lower conduction losses and switching losses
• Low EMI, requires less snubbing
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Collector to emitter voltage
Continuous collector current
Pulsed collector current
Diode continuous forward current
SYMBOL
IC
IF
VGE
Power dissipation, IGBT
PD
Isolation voltage
TC = 25 °C
TC = 90 °C
ICM
Gate-to-emitter voltage
Power dissipation, diode
TEST CONDITIONS
VCES
PD
VISOL
MAX.
UNITS
600
V
123
85
315
TC = 25 °C
TC = 90 °C
A
85
60
± 20
TC = 25 °C
454
TC = 90 °C
258
TC = 25 °C
238
TC = 90 °C
135
Any terminal to case, t = 1 min
2500
V
W
V
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Document Number: 95884
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Collector to emitter breakdown voltage
Collector to emitter voltage
Gate threshold voltage
Temperature coefficient of threshold
voltage
Collector to emitter leakage current
Forward voltage drop, diode
Gate to emitter leakage current
SYMBOL
VBR(CES)
VCE(on)
VGE(th)
ΔVGE(th)/ΔTJ
ICES
VFM
IGES
MIN.
TYP.
MAX.
VGE = 0 V, IC = 2.0 mA
TEST CONDITIONS
600
-
-
VGE = 15 V, IC = 80 A
-
1.83
2.45
VGE = 15 V, IC = 80 A, TJ = 125 °C
-
2.12
-
VGE = 15 V, IC = 80 A, TJ = 150°C
-
2.2
-
4.6
5.6
7.5
VCE = VGE, IC = 1.0 mA (25 °C to 150 °C)
-
-18.8
-
VGE = 0 V, VCE = 600 V
-
0.2
100
VCE = VGE, IC = 1.0 mA
UNITS
V
mV/°C
VGE = 0 V, VCE = 600 V, TJ = 125 °C
-
51
-
VGE = 0 V, VCE = 600 V, TJ = 150 °C
-
259
-
μA
IF = 80 A, VGE = 0 V
-
1.92
3.15
IF = 80 A, VGE = 0 V, TJ = 125 °C
-
1.61
-
IF = 80 A, VGE = 0 V, TJ = 150 °C
-
1.54
-
VGE = ± 20 V
-
-
± 250
nA
MIN.
TYP.
MAX.
UNITS
-
10 800
-
-
390
-
-
220
-
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
Total gate charge (turn-on)
Qg
Gate to emitter charge (turn-on)
Qge
Gate to collector charge (turn-on)
Qgc
TEST CONDITIONS
VGE = 0 V, VCE = 25 V, f = 1.0 MHz
IC = 80 A, VCC = 480 V, VGE = 15 V
-
448
-
-
76
-
-
184
-
Turn-on switching loss
Eon
-
1.95
-
Turn-off switching loss
Eoff
-
1.25
-
Total switching loss
Etot
-
3.2
-
Turn-on delay time
td(on)
-
120
-
-
90
-
-
442
-
Rise time
Turn-off delay time
Fall time
Turn-on switching loss
tr
td(off)
Energy losses
include tail and
diode
recovery.
tf
Eon
Turn-off switching loss
Eoff
Total switching loss
Etot
Turn-on delay time
td(on)
Rise time
IC = 80 A, VCC = 300 V,
VGE = 15 V, Rg = 27 Ω,
L = 500 μH, TJ = 25 °C
tr
IC = 80 A, VCC = 300 V,
VGE = 15 V, Rg = 27 Ω,
L = 500 μH, TJ = 125 °C
-
35
-
-
2.3
-
-
1.43
-
-
3.73
-
-
124
-
pF
nC
mJ
ns
mJ
-
94
-
td(off)
-
455
-
Fall time
tf
-
43
-
Diode reverse recovery time
trr
-
69
-
Diode peak reverse current
Irr
-
4.9
-
A
Diode recovery charge
Qrr
-
169
-
nC
-
139
-
ns
-
12.2
-
A
-
856
-
nC
Turn-off delay time
Diode reverse recovery time
trr
Diode peak reverse current
Irr
Diode recovery charge
Qrr
IF = 50 A, dIF/dt = 200 A/μs, VR = 200 V
IF = 50 A, dIF/dt = 200 A/μs,
VR = 200 V, TJ = 125 °C
ns
ns
Revision: 13-Dec-2023
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THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Junction temperature range
Storage temperature range
IGBT
Junction-to-case
Diode
Case-to-heatsink
MIN.
TYP.
MAX.
UNITS
TJ
TEST CONDITIONS
-40
-
175
°C
TStg
-40
-
150
°C
-
-
0.33
RthJC
RthCS
-
-
0.63
Flat, greased surface
-
0.1
-
-
30
-
g
Torque to terminal
-
-
1.1 (9.7)
Nm (lbf. in)
-
-
1.3 (11.5)
Nm (lbf. in)
Weight
Mounting torque
Torque to heatsink
Case style
SOT-227
180
140
120
IC (A)
100
TJ = 175 °C
80
TJ = 25 °C
TJ = 150 °C
60
TJ = 125 °C
40
20
0
0
0.5
1.0
1.5
2.0
2.5
3.0
Allowable Case Temperature (°C)
160
160
140
120
100
DC
80
60
40
20
0
0
3.5
20
40
60
80
100
120
140
VCE (V)
IC - Continuous Collector Current (A)
Fig. 1 - Typical IGBT Output Characteristics, VGE = 15 V
Fig. 3 - Maximum IGBT Continuous Collector Current vs.
Case Temperature
160
3.3
VGE = 12 V
VGE = 15 V
VGE = 18 V
140
VGE = 15V
3.1
2.9
120
160 A
2.7
100
VGE = 9 V
VCE (V)
IC (A)
°C/W
80
60
2.5
2.3
80 A
2.1
40
1.9
20
40 A
1.7
0
1.5
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
20
40
60
80
100
120
140
160
180
VCE (V)
TJ (°C)
Fig. 2 - Typical IGBT Output Characteristics, TJ = 125 °C
Fig. 4 - Collector to Emitter Voltage vs. Junction Temperature
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10
80
VCE = 20 V
70
TJ = 175 °C
1
60
0.1
40
ICES (mA)
50
IC (A)
TJ = 150 °C
TJ = 150 °C
TJ = 125 °C
30
TJ = 125 °C
0.01
0.001
20
TJ = 25 °C
TJ = 25 °C
10
0.0001
0.00001
0
5
5.3
5.6
5.9
6.2
6.5
6.8
7.1
0
7.4
100
200
300
Fig. 5 - Typical IGBT Transfer Characteristics
600
700
Fig. 8 - Typical IGBT Zero Gate Voltage Collector Current
7.0
160
6.5
140
6.0
TJ = 25 °C
TJ = 175 °C
120
5.5
100
5.0
TJ = 125 °C
4.5
IF (A)
VGEth (V)
500
VCES (V)
VGE (V)
TJ = 150 °C
80
TJ = 125 °C
60
4.0
40
TJ = 150 °C
3.5
TJ = 25 °C
20
3.0
0
2.5
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
0
0.5
1.0
1.5
2.0
2.5
3.0
IC (mA)
VFM (V)
Fig. 6 - Typical IGBT Gate Threshold Voltage
Fig. 9 - Typical Diode Forward Characteristics
180
db
yV
CE
(on
)
Allowable Case Temperature (°C)
1000
tp
Lim
tp
10
tp
1
=1
00
ite
100
IC (A)
400
=1
=6
μs
ms
ms
TC = 25 °C
TJ = 175 °C
VGE = 15 V
Single pulse
0.1
1
10
100
VCE (V)
Fig. 7 - IGBT Safe Operating Area
1000
160
140
120
DC
100
80
60
40
20
0
0
10
20
30
40
50
60
70
80
90 100
IF - Continuous Forward Current (A)
Fig. 10 - Maximum Diode Continuous Forward Current vs.
Case Temperature
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VS-GT80DA60U
2.6
2.4
2.2
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
Vishay Semiconductors
10000
Switching Time (ns)
Energy (mJ)
www.vishay.com
Eon
Eoff
td(off)
1000
td(on)
tr
100
tf
10
10
20
30
40
50
60
70
80
90
25
30
35
IC (A)
td(on)
trr (ns)
Switching Time (ns)
td(off)
100
tf
tr
10
30
40
50
55
60
65
70
Fig. 14 - Typical IGBT Switching Time vs. Rg
TJ = 125 °C, VCC = 300 V, IC = 80 A, VGE = 15 V, L = 500 μH
1000
20
45
Rg (Ω)
Fig. 11 - Typical IGBT Energy Loss vs. IC
TJ = 125 °C, VCC = 300 V, Rg = 27 Ω, VGE = 15 V, L = 500 μH
10
40
50
60
70
80
170
160
150
140
130
120
110
100
90
80
70
60
50
40
TJ = 125 °C
TJ = 25 °C
100
90
200
300
400
IC (A)
dIF/dt (A/μs)
Fig. 12 - Typical IGBT Switching Time vs. IC
TJ = 125 °C, VCC = 300 V, Rg = 27 Ω, VGE = 15 V, L = 500 μH
Fig. 15 - Typical trr Diode vs. dIF/dt
Vrr = 200 V, IF = 50 A
500
24
5.5
22
5
20
4.5
Eon
18
3.5
3
Irr (A)
Energy (mJ)
TJ = 125 °C
16
4
Eoff
14
12
10
8
2.5
TJ = 25 °C
6
2
4
1.5
2
0
1
25
30
35
40
45
50
55
60
65
70
100
200
300
400
Rg (Ω)
dIF/dt (A/μs)
Fig. 13 - Typical IGBT Energy Loss vs. Rg
TJ = 125 °C, VCC = 300 V, IC = 80 A, VGE = 15 V, L = 500 μH
Fig. 16 - Typical Irr Diode vs. dIF/dt
Vrr = 200 V, IF = 50 A
500
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Qrr (nC)
Vishay Semiconductors
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
TJ = 125 °C
TJ = 25 °C
100
200
300
400
500
dIF/dt (A/μs)
Fig. 17 - Typical Diode Reverse Recovery Charge vs. dIF/dt
Vrr = 200 V, IF = 50 A
ZthJC - Thermal Impedance
Junction-to-Case (°C/W)
1
0.1
0.50
0.20
0.10
0.05
0.02
0.01
DC
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 18 - Maximum Thermal Impedance ZthJC Characteristics, IGBT
ZthJC - Thermal Impedance
Junction-to-Case (°C/W)
1
0.1
0.50
0.20
0.10
0.05
0.02
0.01
DC
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
t1 - Rectangular Pulse Duration (s)
Fig. 19 - Maximum Thermal Impedance ZthJC Characteristics, Diode
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ORDERING INFORMATION TABLE
Device code
VS-
G
T
80
D
A
60
U
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Insulated gate bipolar transistor (IGBT)
3
-
T = trench IGBT
4
-
Current rating (80 = 80 A)
5
-
Circuit configuration (D = single switch with antiparallel diode)
6
-
Package indicator (A = SOT-227)
7
-
Voltage rating (60 = 600 V)
8
-
Speed / type (U = ultrafast IGBT)
CIRCUIT CONFIGURATION
CIRCUIT
CIRCUIT
CONFIGURATION CODE
CIRCUIT DRAWING
3 (C)
Single switch
with AP diode
D
Lead Assignment
4
3
1
2
2 (G)
1, 4 (E)
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95423
Packaging information
www.vishay.com/doc?95425
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Outline Dimensions
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Vishay Semiconductors
SOT-227 Generation 2
DIMENSIONS in millimeters (inches)
37.80 (1.488)
38.30 (1.508)
Ø 4.10 (0.161)
Ø 4.30 (0.169)
-A-
4 x M4 nuts
6.25 (0.246)
6.50 (0.256)
12.50 (0.492)
13.00 (0.512)
7.45 (0.293)
7.60 (0.299)
14.90 (0.587)
15.20 (0.598)
24.70 (0.972)
25.70 (1.012)
R full 2.07 (0.081)
2.12 (0.083)
29.80 (1.173)
30.50 (1.200)
31.50 (1.240)
32.10 (1.264)
4x
1.90 (0.075)
2.20 (0.087)
7.70 (0.303)
8.30 (0.327)
0.25 (0.010) M C A M B M
4.10 (0.161)
4.50 (0.177)
5.33 (0.210)
5.96 (0.234)
11.60 (0.457)
12.30 (0.484)
24.70 (0.972)
25.50 (1.004)
Note
• Controlling dimension: millimeter
Document Number: 95423
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Revision: 19-May-2020
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Revision: 01-Jan-2023
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Document Number: 91000