VS-HFA16TB120-M3
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Vishay Semiconductors
HEXFRED®
Ultrafast Soft Recovery Diode, 16 A
FEATURES
2
• Ultrafast and ultrasoft recovery
• Very low IRRM and Qrr
• Designed and qualified according to
JEDEC®-JESD 47
1
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
3
2L TO-220AC
Base
cathode
2
BENEFITS
• Reduced RFI and EMI
• Reduced power loss in diode and switching transistor
• Higher frequency operation
1
Cathode
• Reduced snubbing
3
Anode
• Reduced parts count
DESCRIPTION
VS-HFA16TB120... is a state of the art ultrafast recovery
diode. Employing the latest in epitaxial construction and
advanced processing techniques it features a superb
combination of characteristics which result in performance
which is unsurpassed by any rectifier previously available.
With basic ratings of 1200 V and 16 A continuous current,
the VS-HFA16TB120... is especially well suited for use as
the companion diode for IGBTs and MOSFETs. In addition
to ultrafast recovery time, the HEXFRED® product line
features extremely low values of peak recovery current
(IRRM) and does not exhibit any tendency to “snap-off”
during the tb portion of recovery. The HEXFRED features
combine to offer designers a rectifier with lower noise and
significantly lower switching losses in both the diode and the
switching transistor. These HEXFRED advantages can help
to significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED VS-HFA16TB120... is ideally
suited for applications in power supplies and power
conversion systems (such as inverters), motor drives, and
many other similar applications where high speed, high
efficiency is needed.
PRIMARY CHARACTERISTICS
IF(AV)
16 A
VR
1200 V
VF at IF
2.3 V
trr typ.
30 ns
TJ max.
150 °C
Package
2L TO-220AC
Circuit configuration
Single
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Cathode to anode voltage
VR
Maximum continuous forward current
IF
TEST CONDITIONS
TC = 100 °C
VALUES
UNITS
1200
V
16
Single pulse forward current
IFSM
190
Maximum repetitive forward current
IFRM
64
Maximum power dissipation
Operating junction and storage temperature range
PD
TJ, TStg
TC = 25 °C
151
TC = 100 °C
60
-55 to +150
A
W
°C
Revision: 23-Nov-17
Document Number: 96192
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VS-HFA16TB120-M3
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
Cathode to anode
breakdown voltage
VBR
IR = 100 μA
Maximum forward voltage
VFM
IF = 32 A
IF = 16 A
See fig. 1
MIN.
TYP.
MAX.
1200
-
-
-
2.5
3.0
-
3.2
3.93
2.7
UNITS
V
IF = 16 A, TJ = 125 °C
-
2.3
VR = VR rated
-
0.75
20
-
375
2000
-
27
40
pF
-
8.0
-
nH
MIN.
TYP.
MAX.
UNITS
Maximum reverse
leakage current
IRM
Junction capacitance
CT
VR = 200 V
Series inductance
LS
Measured lead to lead 5 mm from package body
TJ = 125 °C, VR = 0.8 x VR rated
See fig. 2
See fig. 3
μA
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
Reverse recovery time
See fig. 5 and 10
Peak recovery current
See fig. 6
Reverse recovery charge
See fig. 7
Peak rate of fall of
recovery current during tb
See fig. 8
SYMBOL
TEST CONDITIONS
trr
IF = 1.0 A, diF/dt = 200 A/μs, VR = 30 V
-
30
-
trr1
TJ = 25 °C
-
90
135
trr2
TJ = 125 °C
-
164
245
IRRM1
TJ = 25 °C
-
5.8
10
IRRM2
TJ = 125 °C
-
8.3
15
-
260
675
-
680
1838
IF = 16 A
diF/dt = 200 A/μs
VR = 200 V
ns
A
Qrr1
TJ = 25 °C
Qrr2
TJ = 125 °C
di(rec)M/dt1
TJ = 25 °C
-
120
-
di(rec)M/dt2
TJ = 125 °C
-
76
-
MIN.
TYP.
MAX.
UNITS
-
-
300
°C
-
-
0.83
nC
A/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Tlead
Thermal resistance,
junction to case
RthJC
Thermal resistance,
junction to ambient
RthJA
Typical socket mount
-
-
80
Thermal resistance,
case to heatsink
RthCS
Mounting surface, flat, smooth, and greased
-
0.50
-
-
2.0
-
g
-
0.07
-
oz.
6.0
(5.0)
-
12
(10)
kgf · cm
(lbf · in)
0.063" from case (1.6 mm) for 10 s
Weight
Mounting torque
Marking device
Case style 2L TO-220AC
K/W
HFA16TB120
Revision: 23-Nov-17
Document Number: 96192
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VS-HFA16TB120-M3
Vishay Semiconductors
1000
100
TJ = 150 °C
IR - Reverse Current (µA)
IF - Instantaneous Forward Current (A)
www.vishay.com
10
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
1
100
TJ = 125 °C
10
1
TJ = 25 °C
0.1
0.01
0.1
0
2
4
6
0
8
VFM - Forward Voltage Drop (V)
94060_01
200
400
800
600
1000
1200
VR - Reverse Voltage (V)
94060_02
Fig. 1 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage
CT - Junction Capacitance (pF)
1000
100
TJ = 25 °C
10
1
1
94060_03
10
100
10 000
1000
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
ZthJC - Thermal Response
1
0.1
Single pulse
(thermal response)
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
PDM
t1
t2
Notes:
1. Duty factor D = t1/t2
2. Peak T J = PDM x ZthJC + T C
0.01
0.00001
94060_04
0.0001
0.001
0.01
0.1
1
10
100
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Revision: 23-Nov-17
Document Number: 96192
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VS-HFA16TB120-M3
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Vishay Semiconductors
1600
270
VR = 200 V
TJ = 125 °C
TJ = 25 °C
1400
220
1200
170
Qrr (nC)
trr (ns)
IF = 16 A
IF = 8 A
120
800
600
400
70
20
100
VR = 200 V
TJ = 125 °C
TJ = 25 °C
200
0
100
1000
1000
diF/dt (A/µs)
diF/dt (A/µs)
Fig. 5 - Typical Reverse Recovery Time vs. diF/dt (Per Leg)
Fig. 7 - Typical Stored Charge vs. diF/dt (Per Leg)
94060_05
30
10 000
VR = 200 V
TJ = 125 °C
TJ = 25 °C
20
di(rec)M/dt (A/µs)
25
IRR (A)
IF = 16 A
IF = 8 A
1000
IF = 16 A
IF = 8 A
15
10
VR = 200 V
TJ = 125 °C
TJ = 25 °C
1000
IF = 16 A
IF = 8 A
100
5
0
100
10
100
1000
1000
diF/dt (A/µs)
diF/dt (A/µs)
Fig. 6 - Typical Recovery Current vs. diF/dt (Per Leg
Fig. 8 - Typical di(rec)M/dt vs. diF/dt (Per Leg)
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 9 - Reverse Recovery Waveform and Definitions
Revision: 23-Nov-17
Document Number: 96192
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VS-HFA16TB120-M3
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
HF
A
16
TB
120
-M3
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
HEXFRED® family
3
-
Electron irradiated
4
-
Current rating (16 = 16 A)
4
5
-
Package:
TB = 2L TO-220AC
4
6
-
Voltage rating (120 = 1200 V)
7
-
Environmental digit:
-M3 = halogen-free, RoHS-compliant, and termination lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
VS-HFA16TB120-M3
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
50
1000
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96156
Part marking information
www.vishay.com/doc?95391
Revision: 23-Nov-17
Document Number: 96192
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Outline Dimensions
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Vishay Semiconductors
2L TO-220AC
DIMENSIONS in millimeters and inches
A
0.014 M B A M
(6)
E
A
ØP
Q
B
A
(6)
(E)
A1
Thermal pad
1
(H1)
H1
C
D2
(6) D
2
D
D
L1 (2)
C
(6)
c
2xb
D1
2 x b2
Detail B
Detail B
A2
L
E1 (6)
C
(b, b2)
Base metal
A
c1 (4)
c
2x e
Plating
View A - A
e1
b1, b3
(4)
Section C - C and D - D
0.015 M B A M
Lead tip
Conforms to JEDEC® outline TO-220AC
SYMBOL
A
A1
A2
b
b1
b2
b3
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.25
4.65
1.14
1.40
2.50
2.92
0.69
1.01
0.38
0.97
1.20
1.73
1.14
1.73
0.36
0.61
0.36
0.56
14.85
15.35
8.38
9.02
INCHES
MIN.
MAX.
0.167
0.183
0.045
0.055
0.098
0.115
0.027
0.040
0.015
0.038
0.047
0.068
0.045
0.068
0.014
0.024
0.014
0.022
0.585
0.604
0.330
0.355
NOTES
4
4
4
3
SYMBOL
D2
E
E1
e
e1
H1
L
L1
ØP
Q
MILLIMETERS
MIN.
MAX.
11.68
13.30
10.11
10.51
6.86
8.89
2.41
2.67
4.88
5.28
6.09
6.48
13.52
14.02
3.32
3.82
3.54
3.91
2.60
3.00
INCHES
MIN.
MAX.
0.460
0.524
0.398
0.414
0.270
0.350
0.095
0.105
0.192
0.208
0.240
0.255
0.532
0.552
0.131
0.150
0.139
0.154
0.102
0.118
NOTES
6, 7
3, 6
6
6
2
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4) Dimension b1, b3, and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2, and E1
(7) Outline conforms to JEDEC® TO-220, except D2
Revision: 13-Jun-2019
Document Number: 96156
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