VS-HFA90NH40PbF
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Vishay Semiconductors
HEXFRED®
Ultrafast Soft Recovery Diode, 210 A
FEATURES
• Very low Qrr and trr
Lug terminal
anode
• Designed and qualified for industrial level
• UL approved file E222165
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Base
cathode
HALF-PAK (D-67)
BENEFITS
• Reduced RFI and EMI
• Reduced snubbing
PRIMARY CHARACTERISTICS
IF (maximum)
210 A
DESCRIPTION
VR
400 V
IF(DC) at TC
106 A at 100 °C
Package
HALF-PAK (D-67)
Circuit configuration
Single diode
HEXFRED® diodes are optimized to reduce losses and
EMI/RFI in high frequency power conditioning systems. An
extensive characterization of the recovery behavior for
different values of current, temperature and dIF/dt simplifies
the calculations of losses in the operating conditions. The
softness of the recovery eliminates the need for a snubber in
most applications. These devices are ideally suited for
power converters, motors drives and other applications
where switching losses are significant portion of the total
losses.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Cathode to anode voltage
SYMBOL
TEST CONDITIONS
VALUES
UNITS
400
V
VR
TC = 25 °C
210
Continuous forward current
IF
TC = 100 °C
106
Single pulse forward current
IFSM
Limited by junction temperature
600
Non-repetitive avalanche energy
EAS
L = 100 μH, duty cycle limited by maximum TJ
1.4
TC = 25 °C
329
TC = 100 °C
132
Maximum power dissipation
Operating junction and storage
temperature range
PD
TJ, TStg
A
mJ
W
-55 to +150
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
Cathode to anode breakdown
voltage
VBR
IR = 100 μA
Maximum forward voltage
VFM
IF = 180 A
Maximum reverse leakage current
IRM
TJ = 125 °C, VR = 400 V
See fig. 2
Junction capacitance
CT
VR = 200 V
See fig. 3
Series inductance
LS
From top of terminal hole to mounting plane
IF = 90 A
See fig. 1
IF = 90 A, TJ = 125 °C
MIN.
TYP.
MAX.
400
-
-
UNITS
-
1.06
1.45
-
1.2
1.67
-
0.96
1.23
-
0.6
2
-
180
260
pF
-
7.0
-
nH
V
mA
Revision: 11-Jan-18
Document Number: 94044
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
See fig. 5
trr
Peak recovery current
See fig. 6
IRRM
Reverse recovery charge
See fig. 7
TEST CONDITIONS
TYP.
MAX.
-
90
140
TJ = 125 °C
-
158
240
-
9
17
-
15
30
-
420
1100
-
1200
3200
TJ = 25 °C
IF = 90 A
dIF/dt = 200 A/μs
VR = 200 V
TJ = 125 °C
TJ = 25 °C
Qrr
Peak rate of recovery current
See fig. 8
MIN.
TJ = 25 °C
TJ = 125 °C
dI(rec)M/dt
TJ = 25 °C
-
370
-
TJ = 125 °C
-
270
-
UNITS
ns
A
nC
A/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
VALUES
UNITS
-55 to 150
°C
Maximum thermal resistance,
junction to case
RthJC
DC operation
See fig. 4
0.38
Typical thermal resistance,
case to heatsink
RthCS
Mounting surface, flat, smooth, and greased
0.05
°C/W
Approximate weight
minimum
Mounting torque
Terminal torque
Non-lubricated threads
3 (26.5)
4 (35.4)
minimum
3.4 (30)
maximum
N m
(lbf in)
5 (44.2)
HALF-PAK (D-67)
10 000
1000
TJ = 150 °C
IR - Reverse Current (µA)
IF - Instantaneous Forward Current (A)
g
oz.
maximum
Case style
100
10
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
1000
TJ = 125 °C
100
10
1
0.1
0.01
TJ = 25 °C
0.001
0.0001
1
94044_01
30
1.06
0.0
0.5
1.0
1.5
2.0
2.5
100
3.0
VFM - Forward Voltage Drop (V)
Fig. 1 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current
94044_02
200
300
400
VR - Reverse Voltage (V)
Fig. 2 - Typical Reverse Current vs. Reverse Voltage
Revision: 11-Jan-18
Document Number: 94044
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Vishay Semiconductors
100
200 A, 125 °C
90 A, 125 °C
40 A, 125 °C
TJ = 25 °C
Irrm (A)
CT - Junction Capacitance (pF)
10 000
1000
100
10
1
100
1
100
1000
VR - Reverse Voltage (V)
94044_03
dIF/dt (A/µs)
Fig. 6 - Typical Recovery Current vs. dIF/dt
160
4500
140
4000
3500
120
3000
Qrr (nC)
100
DC
80
60
2500
2000
200 A, 125 °C
90 A, 125 °C
40 A, 125 °C
200 A, 25 °C
90 A, 25 °C
40 A, 25 °C
1500
40
1000
20
500
0
0
94044_04
50
100
150
200
0
100
250
IF (AV) - DC Forward Current (A)
1000
dIF/dt (A/µs)
94044_07
Fig. 4 - Maximum Allowable Case Temperature vs.
DC Forward Current
Fig. 7 - Typical Stored Charge vs. dIF/dt
240
10 000
160
dI(rec)M/dt (A/µs)
200 A, 125 °C
90 A, 125 °C
40 A, 125 °C
200 A, 25 °C
90 A, 25 °C
40 A, 25 °C
200
trr (ns)
1000
94044_06
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Maximum Allowable Case Temperature (°C)
200 A, 25 °C
90 A, 25 °C
40 A, 25 °C
10
120
1000
200 A, 125 °C
90 A, 125 °C
40 A, 125 °C
200 A, 25 °C
90 A, 25 °C
40 A, 25 °C
80
40
100
94044_05
1000
dIF/dt (A/µs)
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt
100
100
94044_08
1000
dIF/dt (A/µs)
Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt
Revision: 11-Jan-18
Document Number: 94044
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-HFA90NH40PbF
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Vishay Semiconductors
ZthJC - Thermal Response
1
0.1
0.01
0.001
0.00001
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
Single pulse
(thermal response)
0.0001
0.001
0.01
1
0.1
10
t1 - Rectangular Pulse Duration (s)
94044_09
Fig. 9 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg)
VR = 200 V
0.01 Ω
L = 70 μH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 10 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 11 - Reverse Recovery Waveform and Definitions
Revision: 11-Jan-18
Document Number: 94044
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-HFA90NH40PbF
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Vishay Semiconductors
L = 100 µH
IL(PK)
High-speed
switch
D.U.T.
Freewheel
diode
Rg = 25 Ω
Current
monitor
+
Decay
time
Vd = 50 V
V(AVAL)
VR(RATED)
Fig. 12 - Avalanche Test Circuit and Waveforms
ORDERING INFORMATION TABLE
Device code
VS-
HFA
90
N
H
40
PbF
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
HEXFRED® family
3
-
Average current rating
4
-
N = not isolated
5
-
H = HALF-PAK (D-67)
6
-
Voltage rating (400 V)
7
-
Lead (Pb)-free
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95020
Revision: 11-Jan-18
Document Number: 94044
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
Vishay Semiconductors
D-67 HALF-PAK
DIMENSIONS in millimeters (inches)
24.4 (0.96)
13 (0.51)
17.5 (0.69)
16.5 (0.65)
5 (0.20)
4 (0.16)
30 ± 0.05
(1.2 ± 0.002)
5 (0.196) + 45°
Ø 7.3 ± 0.1 (0.29 ± 0.0039)
21 (0.82)
20 (0.78)
Ø 4.3
(Ø 0.169
- 0.1
0.0
- 0.004
)
0.000
¼" - 20 UNC
40 MAX. (1.58)
Document Number: 95020
Revision: 20-May-09
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