VS-MBR20...CTHN3 Series
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Vishay Semiconductors
High Performance Schottky Rectifier, 2 x 10 A
FEATURES
Base 2
common
cathode
• 150 °C TJ operation
• Low forward voltage drop
• High frequency operation
Anode
TO-220AB
• High purity, high temperature epoxy
encapsulation for enhanced mechanical
strength and moisture resistance
Anode
2
1 Common 3
cathode
• Guard ring for enhanced ruggedness and long
term reliability
PRODUCT SUMMARY
• AEC-Q101 qualified meets JESD 201 class 2 whisker test
IF(AV)
2 x 10 A
VR
35 V, 45 V
VF at IF
0.57 V
IRM max.
15 mA at 125 °C
TJ max.
150 °C
EAS
8 mJ
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Package
TO-220AB
Diode variation
Common cathode
DESCRIPTION
This center tap Schottky rectifier has been optimized for low
reverse leakage at high temperature. The proprietary barrier
technology allows for reliable operation up to 150 °C
junction temperature. Typical applications are in switching
power supplies, converters, freewheeling diodes, and
reverse battery protection.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
IF(AV)
VALUES
UNITS
20
A
35/45
V
Rectangular waveform (per device)
VRRM
IFRM
TC = 135 °C (per leg)
IFSM
tp = 5 μs sine
VF
10 Apk, TJ = 125 °C
TJ
Range
20
A
1060
0.57
V
-65 to 150
°C
VS-MBR2035CTHN3
VS-MBR2045CTHN3
UNITS
35
45
V
VOLTAGE RATINGS
PARAMETER
SYMBOL
Maximum DC reverse voltage
Maximum working peak reverse voltage
VR
VRWM
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Maximum average
forward current
SYMBOL
per leg
per device
Peak repetitive forward current per leg
TEST CONDITIONS
TC = 135 °C, rated VR
IFRM
Rated VR, square wave, 20 kHz, TC = 135 °C
IFSM
UNITS
10
IF(AV)
5 μs sine or 3 μs rect. pulse
Non-repetitive peak surge current
VALUES
20
Following any rated load
condition and with rated VRRM
applied
Surge applied at rated load condition half wave,
single phase, 60 Hz
20
1060
A
150
Repetitive avalanche current per leg
IAR
Current decaying linearly to zero in 1 μs
Frequency limited by TJ maximum VA = 1.5 x VR typical
2
Non-repetitive avalanche energy per leg
EAS
TJ = 25 °C, IAS = 2 A, L = 4 mH
8
mJ
Revision: 05-Mar-14
Document Number: 94960
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VS-MBR20...CTHN3 Series
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Vishay Semiconductors
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
20 A
Maximum forward voltage drop
VFM (1)
TJ = 25 °C
10 A
TJ = 125 °C
20 A
Maximum instantaneous reverse current
IRM (1)
Threshold voltage
VF(TO)
Forward slope resistance
rt
Maximum junction capacitance
CT
Typical series inductance
LS
Maximum voltage rate of change
dV/dt
TJ = 25 °C
Rated DC voltage
TJ = 125 °C
TJ = TJ maximum
VALUES
UNITS
0.84
0.57
V
0.72
0.1
15
mA
0.354
V
17.6
m
VR = 5 VDC (test signal range 100 kHz to 1 MHz) 25 °C
600
pF
Measured from top of terminal to mounting plane
8.0
nH
10 000
V/μs
VALUES
UNITS
Rated VR
Note
(1) Pulse width < 300 μs, duty cycle < 2 %
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum junction temperature range
TJ
-65 to 150
Maximum storage temperature range
TStg
-65 to 175
Maximum thermal resistance,
junction to case per leg
RthJC
DC operation
2.0
Typical thermal resistance,
case to heatsink
RthCS
Mounting surface, smooth and greased
(only for TO-220)
0.50
Approximate weight
Mounting torque
Marking device
minimum
maximum
Non-lubricated threads
Case style TO-220AB
°C
°C/W
2
g
0.07
oz.
6 (5)
kgf · cm
(lbf·in)
12 (10)
MBR2035CTH
MBR2045CTH
Revision: 05-Mar-14
Document Number: 94960
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-MBR20...CTHN3 Series
Vishay Semiconductors
100
100
IR - Reverse Current (mA)
IF - Instantaneous Forward Current (A)
www.vishay.com
10
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
1
0.2
TJ = 150 °C
10
TJ = 125 °C
1
TJ = 100 °C
TJ = 75 °C
0.1
TJ = 50 °C
0.01
TJ = 25 °C
0.001
0.0001
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
1.8
5
10
15
20
25
30
35
40
45
VFM - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Maximum Forward Voltage Drop Characteristics (Per Leg)
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
(Per Leg)
CT - Junction Capacitance (pF)
1000
TJ = 25 °C
100
0
10
20
30
40
50
VR - Reverse Voltage (V)
ZthJC - Thermal Impedance (°C/W)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg)
10
1
0.1
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
0.001
PDM
D = 0.75
D = 0.50
D = 0.33
D = 0.25
D = 0.20
0.01
t1
t2
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
0.1
1
10
100
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg)
Revision: 05-Mar-14
Document Number: 94960
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VS-MBR20...CTHN3 Series
www.vishay.com
Vishay Semiconductors
10
145
Average Power Loss (W)
Allowable Case Temperature (°C)
150
140
DC
135
Square wave (D = 0.50)
Rated VR applied
130
125
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
8
6
RMS limit
4
DC
2
See note (1)
0
120
0
3
6
9
12
2
0
15
4
6
8
10
12
14
16
IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current (Per Leg)
Fig. 6 - Forward Power Loss Characteristics (Per Leg)
IFSM - Non-Repetitive Surge Current (A)
IF(AV) - Average Forward Current (A)
1000
At any rated load condition
and with rated VRRM applied
following surge
100
10
100
1000
10 000
tp - Square Wave Pulse Duration (µs)
Fig. 7 - Maximum Non-Repetitive Surge Current (Per Leg)
Note
(1) Formula used: T = T - (Pd + Pd
C
J
REV) x RthJC;
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated VR
Revision: 05-Mar-14
Document Number: 94960
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-MBR20...CTHN3 Series
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS- MBR
1
2
20
45
CT
H
N3
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Schottky MBR series
3
-
Current rating (20 = 20 A)
4
-
Voltage ratings
5
-
CT = Essential part number
6
-
H = AEC-Q101 qualified
7
-
Environmental digit
35 = 35 V
45 = 45 V
N3 = Halogen-free, RoHS-compliant, and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-MBR2035CTHN3
50
1000
Antistatic plastic tube
VS-MBR2045CTHN3
50
1000
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
SPICE model
www.vishay.com/doc?95222
TO-220AB-N3
www.vishay.com/doc?95028
www.vishay.com/doc?95295
Revision: 05-Mar-14
Document Number: 94960
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
TO-220AB
DIMENSIONS in millimeters and inches
A
(6)
E
E2
ØP
0.014 M B A M
(7)
A
B
Seating
plane
A
Thermal pad
(E)
A1
1
Q
(6)
D
(H1)
H1
(7)
C
D2 (6)
(6) D
2 3
D
L1 (2)
C
Detail B
D1
3xb
1
2
3
3 x b2
Detail B
C
E1 (6)
L
(b, b2)
Base metal
View A - A
c
Plating
c1 (4)
c
A
2x e
A2
e1
b1, b3
(4)
Section C - C and D - D
0.015 M B A M
Lead tip
Conforms to JEDEC® outline TO-220AB
SYMBOL
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
A
4.25
4.65
0.167
0.183
A1
1.14
1.40
0.045
0.055
NOTES
SYMBOL
MILLIMETERS
INCHES
NOTES
MIN.
MAX.
MIN.
MAX.
D2
11.68
12.88
0.460
0.507
6
E
10.11
10.51
0.398
0.414
3, 6
A2
2.56
2.92
0.101
0.115
E1
6.86
8.89
0.270
0.350
6
b
0.69
1.01
0.027
0.040
E2
-
0.76
-
0.030
7
b1
0.38
0.97
0.015
0.038
4
e
2.41
2.67
0.095
0.105
b2
1.20
1.73
0.047
0.068
e1
4.88
5.28
0.192
0.208
b3
1.14
1.73
0.045
0.068
4
H1
5.84
6.86
0.230
0.270
c
0.36
0.61
0.014
0.024
L
13.52
14.02
0.532
0.552
c1
0.36
0.56
0.014
0.022
4
L1
3.32
3.82
0.131
0.150
D
14.85
15.25
0.585
0.600
3
ØP
3.54
3.73
0.139
0.147
D1
8.38
9.02
0.330
0.355
Q
2.60
3.00
0.102
0.118
6, 7
2
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1 and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4) Dimension b1, b3 and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2 and E1
(7) Dimensions E2 x H1 define a zone where stamping and singulation irregularities are allowed
(8) Outline conforms to JEDEC® TO-220, except A2 (maximum) and D2 (minimum) where dimensions are derived from the actual package
outline
Revision: 06-Mar-2020
Document Number: 95222
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2023
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Document Number: 91000