VS-SD300C..C Series
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Vishay Semiconductors
Standard Recovery Diodes,
(Hockey PUK Version), 650 A
FEATURES
• Wide current range
• High voltage ratings up to 3200 V
• High surge current capabilities
• Diffused junction
• Hockey PUK version
• Case style A-PUK (DO-200AA)
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
A-PUK (DO-200AA)
TYPICAL APPLICATIONS
• Converters
PRIMARY CHARACTERISTICS
• Power supplies
IF(AV)
650 A
Package
A-PUK (DO-200AA)
Circuit configuration
Single
• Machine tool controls
• High power drives
• Medium traction applications
MAJOR RATINGS AND CHARACTERISTICS
PARAMETER
TEST CONDITIONS
IF(AV)
SD300C..C
25 to 32
650
540
A
55
55
°C
1150
995
A
25
25
°C
50 Hz
6050
6050
60 Hz
6335
6335
50 Hz
183
183
60 Hz
167
167
Range
400 to 2000
2500 to 3200
V
-40 to +180
-40 to +150
°C
Ths
IF(RMS)
Ths
IFSM
I2t
VRRM
UNITS
04 to 20
TJ
A
kA2s
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE NUMBER
VS-SD300C..C
VOLTAGE
CODE
VRRM, MAXIMUM REPETITIVE PEAK
REVERSE VOLTAGE
V
VRSM, MAXIMUM
NON-REPETITIVE PEAK REVERSE
VOLTAGE
V
04
400
500
08
800
900
12
1200
1300
16
1600
1700
20
2000
2100
25
2500
2600
28
2800
2900
32
3200
3300
IRRM MAXIMUM
AT TJ = TJ MAXIMUM
mA
15
Revision: 11-Jan-18
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VS-SD300C..C Series
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Vishay Semiconductors
FORWARD CONDUCTION
PARAMETER
SYMBOL
Maximum average forward current
at heatsink temperature
Maximum RMS forward current
995
6050
I2t
t = 8.3 ms
t = 10 ms
t = 8.3 ms
No voltage
reapplied
100 % VRRM
reapplied
No voltage
reapplied
Sinusoidal half wave,
initial TJ = TJ maximum
100 % VRRM
reapplied
t = 0.1 to 10 ms, no voltage reapplied
A
55 (85)
6050
t = 10 ms
Maximum I2t for fusing
55 (85)
1150
t = 10 ms
UNITS
650 (380) 540 (250)
t = 10 ms
t = 8.3 ms
I2t
25 to 32
25 °C heatsink temperature double side cooled
t = 8.3 ms
IFSM
Maximum I2t for fusing
04 to 20
180° conduction, half sine wave
Double side (single side) cooled
IF(AV)
IF(RMS)
Maximum peak, one-cycle forward,
non-repetitive surge current
SD300C..C
TEST CONDITIONS
6335
6335
5090
5090
5330
5330
183
183
167
167
129
129
118
118
1830
1830
Low level value of threshold voltage
VF(TO)1
(16.7 % x x IF(AV) < I < x IF(AV)), TJ = TJ maximum
0.95
0.95
High level value of threshold voltage
VF(TO)2
(I > x IF(AV)), TJ = TJ maximum
1.00
1.00
Low level values of forward
slope resistance
rf1
(16.7 % x x IF(AV) < I < x IF(AV)), TJ = TJ maximum
0.75
0.75
High level values of forward
slope resistance
rf2
(I > x IF(AV)), TJ = TJ maximum
0.72
0.72
VFM
Ipk = 1500 A, TJ = TJ maximum;
tp = 10 ms sinusoidal wave
2.08
2.08
°C
A
kA2s
kA2s
V
mW
Maximum forward voltage drop
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum operating temperature range
Maximum storage temperature range
Maximum thermal resistance,
junction to heatsink
SD300C..C
TEST CONDITIONS
04 to 20
25 to 32
TJ
-40 to 180 -40 to 150
TStg
-55 to 200
RthJ-hs
DC operation single side cooled
0.163
DC operation double side cooled
0.073
Mounting force, ± 10 %
Approximate weight
Case style
See dimensions - link at the end of datasheet
UNITS
°C
K/W
4900 (500)
N (kg)
70
g
A-PUK (DO-200AA)
RthJ-hs CONDUCTION
CONDUCTION ANGLE
180°
SINUSOIDAL CONDUCTION
RECTANGULAR CONDUCTION
SINGLE SIDE
DOUBLE SIDE
SINGLE SIDE
DOUBLE SIDE
0.017
0.017
0.011
0.012
120°
0.020
0.020
0.020
0.020
90°
0.025
0.025
0.027
0.027
60°
0.036
0.036
0.038
0.038
30°
0.064
0.062
0.065
0.062
TEST CONDITIONS
UNITS
TJ = TJ maximum
K/W
Note
• The table above shows the increment of thermal resistance RthJ-hs when devices operate at different conduction angles than DC
Revision: 11-Jan-18
Document Number: 93544
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VS-SD300C..C Series
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SD 3 0 0 C ..C Se rie s (4 0 0 V t o 2 0 0 0 V )
(S in g le Sid e C o o le d )
R th J-hs (D C ) = 0 .1 6 3 K /W
160
140
120
C o nduc tio n A ng le
100
3 0°
80
60°
90°
120 °
60
1 80°
40
0
5 0 1 0 0 1 5 0 20 0 25 0 3 00 35 0 4 0 0 4 50
M a x im u m A llo w a b le H e a t sin k T em p e ra t u re (° C )
1 80
180
M a xim u m A llo w a ble H e a ts in k T e m p e r a tu re (°C )
Vishay Semiconductors
S D 3 0 0 C ..C S e r ie s (4 0 0 V t o 2 0 0 0 V )
(D o u b le S id e C o o le d )
R thJ-h s (D C ) = 0 .0 7 3 K /W
1 60
1 40
1 20
Co n duc tio n Pe rio d
1 00
80
30 °
60°
60
90 °
120 °
40
DC
20
0
20 0
40 0
6 00
8 00
1 00 0
1 20 0
A v e ra g e F o rw a rd C u rr e n t (A )
Fig. 1 - Current Ratings Characteristics
Fig. 4 - Current Ratings Characteristics
18 0
150
SD 3 0 0 C ..C Se rie s (4 0 0 V t o 2 0 0 0 V )
( Sin g le S id e C o o le d )
R thJ-h s (D C ) = 0 .1 6 3 K / W
16 0
14 0
12 0
C o ndu ctio n Pe riod
10 0
80
60
30 ° 60°
90 °
40
1 2 0°
1 8 0°
20
0
100
200
3 00
40 0
DC
500
60 0
70 0
Maxim um Allowable Heatsink Tem perature (°C)
M a xim u m A llo w a b le H e a tsin k T e m p e r a tu re (°C )
A v e ra g e F o r w a rd C u rre n t (A )
SD 300C..C Series (2500V to 3200V)
(Single Side Cooled )
R thJ- hs (DC) = 0.163 K/W
140
130
120
110
100
Co n duc tio n A ng le
90
80
30°
60°
70
90°
60
120°
180°
50
40
0
A v e ra g e F o rw a rd C urr e n t (A )
50
100 150 200 250 300 350 400
Average Forward Current (A)
Fig. 2 - Current Ratings Characteristics
Fig. 5 - Current Ratings Characteristics
180
150
140
130
120
110
100
90
80
70
60
50
40
30
20
SD 300C..C Series (400V to 2000V )
(Double Side Cooled)
R thJ-h s (DC) = 0.073 K/W
160
140
120
100
Co n duc tio n An g le
80
30°
60°
90°
60
120°
180°
40
20
0
200
400
600
Average Forward Current (A)
Fig. 3 - Current Ratings Characteristics
800
Maxim um Allowable Heatsink Tem perature (°C)
Maximum Allowable Heatsink Temperature (°C)
180 °
SD300C..C Series (2500V to 3200V )
( Single Side Cooled)
Rth J-hs (DC) = 0.163 K/W
C o nd uct io n P erio d
90°
30°
0
100
60°
200
120°
300
180°
DC
400
500
600
Average Forward Current (A)
Fig. 6 - Current Ratings Characteristics
Revision: 11-Jan-18
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VS-SD300C..C Series
Vishay Semiconductors
25 0 0
150
140
130
120
110
100
90
80
70
60
50
40
30
20
SD300C..C Series (2500V to 3200V)
(Double Side Cooled)
Rth J-h s (DC) = 0.073 K/W
C o nduc tio n A ng le
30°
60°
90°
120°
180°
0
100
200
300
400
500
600
M a x im um A v e ra g e F o rw a rd Po w e r Lo ss (W )
Maximum Allow able Heatsin k Tem perature (°C)
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DC
1 8 0°
1 2 0°
90°
60°
30°
20 0 0
15 0 0
R M S Lim it
10 0 0
C o nduc tio n Pe rio d
500
S D 3 0 0 C ..C S e r ie s
TJ = TJ m a x .
0
0
700
200
Average Forward Current ( A)
60 0 0
SD 3 0 0 C ..C S e rie s (2 5 0 0 V t o 3 2 0 0 V )
(D o u b le Sid e C o o le d )
R th J-hs (D C ) = 0 .0 7 3 K / W
C o ndu ct io n Pe rio d
30°
60°
9 0°
120 °
1 8 0°
DC
0
20 0
400
60 0
800
1 0 00
Fig. 8 - Current Ratings Characteristics
1200
RMS Lim it
1000
800
600
C o nd uctio n A ng le
400
SD300C..C Series
TJ = TJ m ax.
200
0
0
200
400
600
1 20 0
45 0 0
40 0 0
35 0 0
30 0 0
25 0 0
20 0 0
S D 3 0 0 C ..C S e rie s
15 0 0
10
100
Fig. 11 - Maximum Non-Repetitive Surge Current
Single and Double Side Cooled
800
Average Forward Curren t (A)
Fig. 9 - Forward Power Loss Characteristics
P e a k H a lf Sin e W a v e Fo rw a rd C urr e n t (A )
M aximum Average Forward Power L oss (W)
50 0 0
7000
1400
1 0 00
A t A n y R a te d Lo a d C o n d it io n A n d W ith
R a t e d V RR MA p p lie d Fo llo w in g Su rg e .
In it ia l TJ = TJ m a x.
@ 6 0 H z 0 .0 0 8 3 s
@ 5 0 H z 0 .0 1 0 0 s
55 0 0
1
1800
180°
120°
90°
60°
30°
8 00
N um be r O f E qual A m plitud e Half C y cle Cu rren t Pulse s (N )
A v e ra g e F o rw a rd C u rre n t (A )
1600
600
Fig. 10 - Forward Power Loss Characteristics
P e a k H a lf S in e W a v e Fo rw a rd C u rre n t (A )
M a x im um A llo w a b le H e a t sin k T e m p e ra tu re (°C )
Fig. 7 - Current Ratings Characteristics
150
140
130
120
110
100
90
80
70
60
50
40
30
20
40 0
A v e ra g e F o rw a rd C u rre n t (A )
6000
5000
M a x im u m N o n R e p e t it iv e Su rg e C u rre n t
V e rsu s P u lse T ra in D ura t io n .
In it ia l TJ = TJ m a x .
N o V o lt a g e R e a pp lie d
R a t e d V RRMR e a p p lie d
4000
3000
2000
SD 3 0 0 C ..C S e rie s
1000
0.01
0.1
1
P u lse T ra in D u ra t io n (s)
Fig. 12 - Maximum Non-Repetitive Surge Current
Single and Double Side Cooled
Revision: 11-Jan-18
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VS-SD300C..C Series
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In stant aneous Forward Current (A)
10000
TJ = 25°C
TJ = TJ
m ax.
1000
SD300C..C Series
100
0.5
1
1.5
2
2.5
3
3. 5
4
4.5
5
Instantaneous Forwa rd V oltag e (V)
Fig. 13 - Forward Voltage Drop Characteristics
Tra n sie n t T h e rm a l Im p e d a n c e Z th J-hs (K / W )
1
St e a d y St at e V a lue
R thJ-hs = 0 .1 6 3 K /W
( Sing le Sid e C o o le d )
0 .1
R thJ-hs = 0 .0 7 3 K /W
( D o u ble Sid e C o o le d )
( D C O p e ra t io n )
0 .0 1
SD 3 0 0 C ..C Se rie s
0 .0 0 1
0.0 01
0 .01
0. 1
1
10
Sq u a re W a v e Pu lse D u rat io n ( s)
Fig. 14 - Thermal Impedance ZthJC Characteristics
ORDERING INFORMATION TABLE
Device code
VS-
SD
30
0
C
32
C
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Diode
3
-
Essential part number
4
-
0 = standard recovery
5
-
C = ceramic PUK
6
-
Voltage code x 100 = VRRM (see Voltage Ratings table)
7
-
C = PUK case A-PUK (DO-200AA)
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95248
Revision: 11-Jan-18
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Outline Dimensions
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Vishay Semiconductors
DO-200AA
42 (1.65) DIA. MAX.
DIMENSIONS in millimeters (inches)
3.5 (0.14) ± 0.1 (0.004) DIA. NOM. x
1.8 (0.07) deep MIN. both ends
19 (0.75) DIA. MAX.
2 places
0.3 (0.01) MIN.
both ends
13.7 (0.54)
14.4 (0.57)
C
A
38 (1.50) DIA. MAX.
Note:
A = Anode
C = Cathode
Quote between upper and lower pole pieces has to be considered after
application of mounting force (see Thermal and Mechanical Specifications)
Revision: 17-Apr-2019
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