VS-UFH60BA65
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Vishay Semiconductors
Insulated Single Phase Hyperfast Bridge
(Power Modules), 60 A
FEATURES
• Hyperfast and soft recovery characteristic
• Electrically isolated base plate
• Simplified mechanical designs, rapid assembly
• High operation junction temperature (TJ max. = 175 °C)
• Designed and qualified for industrial and consumer level
• UL approved file E78996
SOT-227
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
DESCRIPTION
VRRM
650 V
IO at TC = 123 °C
60 A
trr
63 ns
Type
Modules - Bridge, Hyperfast
Package
SOT-227
Circuit configuration
Single phase bridge
The semiconductor in the SOT-227 package is isolated from
the copper base plate, allowing for common heatsinks and
compact assemblies to be built.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
CHARACTERISTICS
IO
IFSM
I2t
VALUES
UNITS
60
A
TC
123
°C
50 Hz
360
60 Hz
377
50 Hz
648
60 Hz
589
A2s
650
V
-55 to +175
°C
VRRM
TJ
A
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE NUMBER
UFH60BA65
VOLTAGE
CODE
VRRM, MAXIMUM REPETITIVE
PEAK REVERSE VOLTAGE
V
VRSM, MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
IRRM MAXIMUM
AT TJ MAXIMUM
mA
65
650
700
2
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
650
-
-
IF = 60 A
-
1.7
2.35
VR = 650 V
-
1.0
100
VR = 650 V, TJ = 150 °C
-
250
-
2500
-
-
Cathode to anode breakdown voltage
VBR
IR = 250 μA
Forward voltage, per diode
VFM
Reverse leakage current, per leg
IRM
RMS isolation voltage base plate
VISOL
f = 50 Hz, any terminal to case, t = 1 min
UNITS
V
μA
V
Revision: 25-Apr-2018
Document Number: 96135
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VS-UFH60BA65
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Vishay Semiconductors
FORWARD CONDUCTION
PARAMETER
SYMBOL
Maximum DC output current
at case temperature
IO
TEST CONDITIONS
t = 10 ms
Maximum peak, one-cycle
non-repetitive forward current
IFSM
Maximum I2t for fusing
I2t
Maximum I2t for fusing
I2t
Low level of threshold voltage, per leg
VF(T0)1
Low level value of forward slope resistance
rf1
High level of threshold voltage, per leg
VF(T0)2
High level value of forward slope resistance
rf2
Maximum forward voltage, per diode
VFM
VALUES
Resistive or inductive load
A
123
°C
No voltage
reapplied
360
t = 10 ms
100 % VRRM
303
t = 8.3 ms
reapplied
t = 10 ms
t = 8.3 ms
No voltage
reapplied
t = 10 ms
100 % VRRM
458
t = 8.3 ms
reapplied
417
t = 8.3 ms
UNITS
60
377
Initial TJ = 25 °C
A
317
648
589
I2t for time tx = I2t x tx0.1 tx 10 ms, VRRM = 0 V
A2s
kA2s
6.4
(16.7 % x x IF(AV)) < I < x IF(AV), TJ = TJ maximum
16.49
V
0.88
m
(I > x IF(AV)), TJ = TJ maximum
15.87
V
1.16
m
IF = 60 A
2.35
V
RECOVERY CHARACTERISTICS
PARAMETER
Typical reverse recovery time, per diode
Typical reverse recovery current, per diode
Typical reverse recovery charge, per diode
Typical junction capacitance
SYMBOL
trr
Irr
Qrr
CT
TEST CONDITIONS
VALUES
UNITS
TJ = 25 °C, IF = 50 A, VR = 200 V,
dIF/dt = 200 A/μs
63
TJ = 125 °C, IF = 50 A, VR = 200 V,
dIF/dt = 200 A/μs
134
TJ = 25 °C, IF = 50 A, VR = 200 V,
dIF/dt = 200 A/μs
4.1
TJ = 125 °C, IF = 50 A, VR = 200 V,
dIF/dt = 200 A/μs
11.4
TJ = 25 °C, IF = 50 A, VR = 200 V,
dIF/dt = 200 A/μs
130
TJ = 125 °C, IF = 50 A, VR = 200 V,
dIF/dt = 200 A/μs
765
VR = 650 V
77
pF
ns
IFM
A
trr
t
dIR
dt
Qrr
IRM(REC)
nC
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
MIN.
TYP.
MAX.
UNITS
TJ, TStg
-55
-
175
°C
Thermal resistance junction to case
RthJC
-
-
0.91
Thermal resistance case to heatsink
RthCS
-
0.1
-
-
30
-
Junction and storage temperature range
SYMBOL
TEST CONDITIONS
Flat, greased surface
Weight
Mounting torque
Case style
°C/W
g
Torque to terminal
-
-
1.1 (9.7)
Nm (lbf.in)
Torque to heatsink
-
-
1.3 (11.5)
Nm (lbf.in)
SOT-227
Revision: 25-Apr-2018
Document Number: 96135
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-UFH60BA65
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Vishay Semiconductors
300
250
200
IF (A)
TJ = 175 °C
150
TJ = 25 °C
TJ = 150 °C
100
TJ = 125 °C
50
Average Power Loss (W)
250
0
180°
Sine
150
100
0.5
1.0
1.5
2.0
2.5
50
0
3.0
10
20
30
40
50
60
Average Forward Current (A)
Fig. 1 - Typical Forward Voltage Characteristics
Fig. 4 - Forward Power Loss Characteristics
TJ = 175 °C
0.1
TJ = 150 °C
TJ = 125 °C
0.01
0.001
0.0001
TJ = 25 °C
0.00001
50
150
250
350
450
550
650
VR - Reverse Voltage (V)
Maximum Allowable Case Temperature (°C)
Instantaneous Forward Voltage (V)
1
180
160
180 °C
Rect
140
180 °C
Sine
120
100
80
60
40
20
0
0
25
50
75
100
125
IF(AV) - Average Forward Current (A)
Fig. 5 - Current Rating Characteristics (A)
Fig. 2 - Typical Reverse Current vs. Reverse Voltage (Per Diode)
1000
25
VR = 200 V
IF = 50 A
20
TJ = 125 °C
15
Irr (A)
CT - Junction Capacitance (pF)
180°
Rect
0
0
IR - Reverse Current (mA)
200
100
TJ = 25 °C
10
5
TJ = 25 °C
10
0
10
100
1000
100
200
300
400
500
VR - Reverse Voltage (V)
dIF/dt (A/μs)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
(Per Diode)
Fig. 6 - Typical Reverse Recovery Current vs. dIF/dt
Revision: 25-Apr-2018
Document Number: 96135
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-UFH60BA65
Vishay Semiconductors
1200
160
150
140
130
120
110
100
90
80
70
60
50
40
30
VR = 200 V
IF = 50 A
VR = 200 V
IF = 50 A
1100
1000
900
800
TJ = 125 °C
Qrr (nC)
trr (ns)
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700
TJ = 125 °C
600
500
400
TJ = 25 °C
TJ = 25 °C
300
200
100
0
100
200
300
400
500
100
200
300
400
500
dIF/dt (A/μs)
dIF/dt (A/μs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 8 - Reverse Recovery Charge vs. dIF/dt
ZthJC - Thermal Impedance
Junction to Case (°C/W)
1
0.1
0.75
0.50
0.33
0.25
0.10
0.05
DC
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 9 - Typical Reverse Recovery Current vs. dIF/dt (Per Diode)
Revision: 25-Apr-2018
Document Number: 96135
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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-UFH60BA65
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Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
UF
H
60
B
A
65
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Ultra fast rectifier
3
-
Hyper fast FRED Pt® diffused
4
-
Current rating (60 = 60 A)
5
-
Circuit configuration:
B = Single phase bridge
6
-
Package indicator:
A = SOT-227, standard insulated base
7
-
Voltage rating (65 = 650 V)
CIRCUIT CONFIGURATION
CIRCUIT
CIRCUIT
CONFIGURATION
CODE
CIRCUIT DRAWING
Lead Assignment
3 (-)
(AC) 4
Single phase bridge
4
3
1
2
B
(+) 1
2 (AC)
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95423
Packaging information
www.vishay.com/doc?95425
Revision: 25-Apr-2018
Document Number: 96135
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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
SOT-227 Generation 2
DIMENSIONS in millimeters (inches)
37.80 (1.488)
38.30 (1.508)
Ø 4.10 (0.161)
Ø 4.30 (0.169)
-A-
4 x M4 nuts
6.25 (0.246)
6.50 (0.256)
12.50 (0.492)
13.00 (0.512)
7.45 (0.293)
7.60 (0.299)
14.90 (0.587)
15.20 (0.598)
24.70 (0.972)
25.70 (1.012)
R full 2.07 (0.081)
2.12 (0.083)
29.80 (1.173)
30.50 (1.200)
31.50 (1.240)
32.10 (1.264)
4x
1.90 (0.075)
2.20 (0.087)
7.70 (0.303)
8.30 (0.327)
0.25 (0.010) M C A M B M
4.10 (0.161)
4.50 (0.177)
5.33 (0.210)
5.96 (0.234)
11.60 (0.457)
12.30 (0.484)
24.70 (0.972)
25.50 (1.004)
Note
• Controlling dimension: millimeter
Document Number: 95423
1
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 19-May-2020
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Revision: 09-Jul-2021
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Document Number: 91000