VSMG2720-GS08

End of Life July-2021 - Alternative Device: VSMY3850X01 VSMG2720 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 830 nm, GaAlAs Double Hetero FEATURES • Package type: surface-mount • Package form: PLCC-2 • Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75 • Peak wavelength: λp = 830 nm • High reliability • High radiant power • High radiant intensity • Angle of half intensity: ϕ = ± 60° 948553 • Low forward voltage • Suitable for high pulse current operation • High modulation band width: fc = 24 MHz • Good spectral matching with Si photodetectors DESCRIPTION • Floor life: 168 h, MSL 3, acc. J-STD-020 VSMG2720 is an infrared, 830 nm emitting diode in GaAlAs double hetero (DH) technology with high radiant power and high speed, molded in a PLCC-2 package for surface mounting (SMD). A 19" chip provides outstanding low forward voltage and radiant intensity even at 1 A pulse current. • Lead (Pb)-free reflow soldering • AEC-Q101 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • High speed IR data transmission • High power emitter for low space applications • High performance transmissive or reflective sensors PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (°) λp (nm) tr (ns) 14 ± 60 830 15 VSMG2720 Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMG2720-GS08 Tape and reel MOQ: 7500 pcs, 1500 pcs/reel PLCC-2 VSMG2720-GS18 Tape and reel MOQ: 8000 pcs, 8000 pcs/reel PLCC-2 Note • MOQ: minimum order quantity Rev. 1.4, 15-Jul-2020 Document Number: 81597 1 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 End of Life July-2021 - Alternative Device: VSMY3850X01 VSMG2720 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage IF 100 mA Peak forward current Forward current tp/T = 0.5, tp = 100 μs IFM 200 mA Surge forward current tp = 100 μs IFSM 1 A PV 160 mW °C Power dissipation Junction temperature Tj 100 Operating temperature range Tamb -40 to +85 °C Storage temperature range Tstg -40 to +100 °C According to Fig. 8, J-STD-020 Tsd 260 °C J-STD-051, soldered on PCB RthJA 250 K/W Soldering temperature Thermal resistance junction-to-ambient 120 160 IF - Forward Current (mA) PV - Power Dissipation (mW) 180 140 120 100 RthJA = 250 K/W 80 60 40 100 80 60 RthJA = 250 K/W 40 20 20 0 0 0 10 21343 20 30 40 50 60 70 80 90 100 0 Tamb - Ambient Temperature (°C) 10 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 21344 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 20 30 40 Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. IF = 100 mA, tp = 20 ms VF - 1.45 1.6 V IF = 1 A, tp = 100 μs VF - 2.1 - V Temperature coefficient of VF IF = 1 mA TKVF - -1.8 - mV/K Reverse current VR = 5 V IR - - 10 μA VR = 0 V, f = 1 MHz, E = 0 Cj - 125 - pF IF = 100 mA, tp = 20 ms Ie 8 14 24 mW/sr IF = 1 A, tp = 100 μs Ie - 135 - mW/sr IF = 100 mA, tp = 20 ms φe - 45 - mW IF = 100 mA TKφe - -0.35 - %/K ϕ - ± 60 - ° Peak wavelength IF = 100 mA λp - 830 - nm Spectral bandwidth IF = 100 mA Δλ - 40 - nm Temperature coefficient of λp IF = 100 mA TKλp - 0.25 - nm/K Rise time IF = 100 mA tr - 15 - ns Fall time IF = 100 mA tf - 15 - ns IDC = 70 mA, IAC = 30 mA pp fc - 24 - MHz d - 0.67 - mm Forward voltage Junction capacitance Radiant intensity Radiant power Temperature coefficient of φe Angle of half intensity Cut-off frequency Virtual source diameter Rev. 1.4, 15-Jul-2020 UNIT Document Number: 81597 2 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 End of Life July-2021 - Alternative Device: VSMY3850X01 VSMG2720 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1.25 Tamb < 50 °C tp/T = 0.01 1000 Φe, rel - Relative Radiant Power IF - Forward Current (mA) 0.02 0.05 0.1 0.2 0.5 100 0.01 0.1 1 10 0.75 0.5 0.25 0 740 100 tp - Pulse Duration (ms) 16031 1.0 Fig. 3 - Pulse Forward Current vs. Pulse Duration 900 800 λ- Wavelength (nm) 16972_1 Fig. 6 - Relative Radiant Power vs. Wavelength 0° 10° 20° 1 0.1 0.01 40° 1.0 0.9 50° 0.8 60° 70° 0.7  - Angular Displacement 30° Ie, rel - Relative Radiant Intensity IF - Forward Current (A) 10 80° 0.001 0 0.5 1 1.5 2 2.5 3 3.5 0.6 4 0.4 0.2 0 948013-4 VF - Forward Voltage (V) 21009 Fig. 4 - Forward Current vs. Forward Voltage Fig. 7 - Relative Radiant Intensity vs. Angular Displacement Ie - Radiant Intensity (mW/sr) 1000 100 10 1 tp = 1 µs, tp/T = 0.001 0.1 21629 1 10 100 1000 IF - Forward Pulse Current (mA) Fig. 5 - Radiant Intensity vs. Forward Current Rev. 1.4, 15-Jul-2020 Document Number: 81597 3 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 End of Life July-2021 - Alternative Device: VSMY3850X01 VSMG2720 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 0.9 1.75 ± 0.1 3.5 ± 0.2 0.8 technical drawings according to DIN specifications C A 2.2 2.8 ± 0.15 Pin identification Drawing-No.: 6.541-5067.01-4 Issue: 7; 12.03.14 Ø 2.4 3 + 0.15 Mounting Pad Layout Area covered with solderresist 4 2.6 (2.8) 1.2 1.6 (1.9) 4 Dimensions: reflow and vapor phase (wave soldering) DRYPACK SOLDER PROFILE Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Axis Title 10000 300 Max. 260 °C 255 °C 240 °C 217 °C 2nd line Temperature (°C) 250 245 °C FLOOR LIFE 1000 200 1st line 2nd line Max. 30 s 150 Max. 120 s 100 Max. 100 s Max. ramp down 6 °C/s 100 DRYING Max. ramp up 3 °C/s 50 10 0 0 50 19841-1 100 Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 3, acc. to J-STD-020. 150 200 250 300 Time (s) In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 for Preconditioning acc. to JEDEC®, Level 3 Rev. 1.4, 15-Jul-2020 Document Number: 81597 4 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 End of Life July-2021 - Alternative Device: VSMY3850X01 VSMG2720 www.vishay.com Vishay Semiconductors TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. The tape leader is at least 160 mm and is followed by a carrier tape leader with at least 40 empty compartements. The tape leader may include the carrier tape as long as the cover tape is not connected to the carrier tape. The least component is followed by a carrier tape trailer with a least 75 empty compartements and sealed with cover tape. 10.0 9.0 Adhesive tape 120° 4.5 3.5 Blister tape 2.5 1.5 Component cavity Identification Label: Vishay type group tape code production code quantity 94 8670 Fig. 9 - Blister Tape 2.2 2.0 3.5 3.1 13.00 12.75 63.5 60.5 14.4 max. 180 178 94 8665 Fig. 12 - Dimensions of Reel-GS08 5.75 5.25 3.6 3.4 4.0 3.6 8.3 7.7 1.85 1.65 1.6 1.4 4.1 3.9 4.1 3.9 10.4 8.4 120° 4.5 3.5 0.25 2.5 1.5 2.05 1.95 13.00 12.75 94 8668 Fig. 10 - Tape Dimensions in mm for PLCC-2 MISSING DEVICES A maximum of 0.5 % of the total number of components per reel may be missing, exclusively missing components at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap is followed by six consecutive components. Identification Label: Vishay type group tape code production code quantity 62.5 60.0 321 329 14.4 max. 18857 Fig. 13 - Dimensions of Reel-GS18 COVER TAPE REMOVAL FORCE De-reeling direction 94 8158 The removal force lies between 0.1 N and 1.0 N at a removal speed of 5 mm/s. In order to prevent components from popping out of the blisters, the cover tape must be pulled off at an angle of 180° with regard to the feed direction. > 160 mm Tape leader 40 empty compartments min. 75 empty compartments Carrier leader Carrier trailer Fig. 11 - Beginning and End of Reel Rev. 1.4, 15-Jul-2020 Document Number: 81597 5 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2022 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2022 1 Document Number: 91000