End of Life July-2021 - Alternative Device: VSMY3850X01
VSMG3700
www.vishay.com
Vishay Semiconductors
High Speed Infrared Emitting Diode, 850 nm,
GaAlAs Double Hetero
FEATURES
• Package type: surface-mount
• Package form: PLCC-2
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
• Peak wavelength: λp = 850 nm
• High reliability
• High radiant power
• High radiant intensity
948553
• Angle of half intensity: ϕ = ± 60°
• Low forward voltage
• Suitable for high pulse current operation
• High modulation band width: fc = 18 MHz
DESCRIPTION
• Good spectral matching with Si photodetectors
VSMG3700 is an infrared, 850 nm emitting diode in GaAlAs
double hetero (DH) technology with high radiant power and
high speed, molded in a PLCC-2 package for surface
mounting (SMD).
• Floor life: 168 h, MSL 3, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Infrared radiation source for operation with CMOS
cameras (illumination)
• High speed IR data transmission
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
ϕ (°)
λp (nm)
tr (ns)
10
± 60
850
20
VSMG3700
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VSMG3700-GS08
Tape and reel
MOQ: 7500 pcs, 1500 pcs/reel
PLCC-2
VSMG3700-GS18
Tape and reel
MOQ: 8000 pcs, 8000 pcs/reel
PLCC-2
Note
• MOQ: minimum order quantity
Rev. 1.6, 15-Jul-2020
Document Number: 81471
1
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
End of Life July-2021 - Alternative Device: VSMY3850X01
VSMG3700
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
VR
5
V
Reverse voltage
IF
100
mA
Peak forward current
Forward current
tp/T = 0.5, tp = 100 μs
IFM
200
mA
Surge forward current
tp = 100 μs
IFSM
1.5
A
PV
180
mW
°C
Power dissipation
Junction temperature
Tj
100
Operating temperature range
Tamb
-40 to +85
°C
Storage temperature range
Tstg
-40 to +100
°C
According to Fig. 8, J-STD-020
Tsd
260
°C
J-STD-051, soldered on PCB
RthJA
250
K/W
Soldering temperature
Thermal resistance junction-to-ambient
120
200
IF - Forward Current (mA)
PV - Power Dissipation (mW)
180
160
140
120
100
RthJA = 250 K/W
80
60
40
100
80
60
RthJA = 250 K/W
40
20
20
0
0
0
10
21339
20
30
40
50
60
70 80
0
90 100
Tamb - Ambient Temperature (°C)
10
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
20 30 40
50 60 70 80
90 100
Tamb - Ambient Temperature (°C)
21340
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Forward voltage
Temperature coefficient of VF
Reverse current
Junction capacitance
Radiant intensity
Radiant power
Temperature coefficient of φe
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
IF = 100 mA, tp = 20 ms
VF
-
1.5
1.8
V
IF = 1 A, tp = 100 μs
VF
-
2.3
-
V
IF = 1 mA
TKVF
-
-1.8
-
mV/K
μA
VR = 5 V
IR
-
-
10
VR = 0 V, f = 1 MHz, E = 0
Cj
-
125
-
pF
IF = 100 mA, tp = 20 ms
Ie
6
10
22
mW/sr
IF = 1 A, tp = 100 μs
Ie
-
100
-
mW/sr
IF = 100 mA, tp = 20 ms
φe
-
40
-
mW
IF = 100 mA
TKφe
-
-0.35
-
%/K
ϕ
-
± 60
-
°
λp
-
850
-
nm
Angle of half intensity
Peak wavelength
IF = 100 mA
Spectral bandwidth
IF = 100 mA
Δλ
-
40
-
nm
Temperature coefficient of λp
IF = 100 mA
TKλp
-
0.25
-
nm/K
Rise time
IF = 100 mA
tr
-
20
-
ns
Fall time
IF = 100 mA
tf
-
13
-
ns
IDC = 70 mA, IAC = 30 mA pp
fc
-
18
-
MHz
d
-
0.44
-
mm
Cut-off frequency
Virtual source diameter
Rev. 1.6, 15-Jul-2020
Document Number: 81471
2
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
End of Life July-2021 - Alternative Device: VSMY3850X01
VSMG3700
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1.25
10 000
0.01
1000
0.02
0.05
100
0.2
0.5
DC
0.1
10
1
0.01
0.75
0.5
0.25
0
0.1
1
10
100
tp - Pulse Length (ms)
95 9985
1.0
800
Fig. 3 - Pulse Forward Current vs. Pulse Duration
850
Fig. 6 - Relative Radiant Power vs. Wavelength
0°
1000
10°
20°
30°
Ie, rel - Relative Radiant Intensity
IF - Forward Current (mA)
900
λ- Wavelength (nm)
16972
100
tp = 100 µs
tp/T = 0.001
10
40°
1.0
0.9
50°
0.8
60°
70°
0.7
M - Angular Displacement
IF - Forward Current (mA)
tp/T = 0.005
Φe, rel - Relative Radiant Power
Tamb < 60 °C
80°
1
0
1
2
3
0.6
4
0.4
0.2
0
948013-4
VF - Forward Voltage (V)
18873_1
Fig. 4 - Forward Current vs. Forward Voltage
Fig. 7 - Relative Radiant Intensity vs. Angular Displacement
Ie - Radiant Intensity (mW/sr)
100
10
tp = 1 µs
1
0.1
1
18874
10
100
1000
IF - Forward Pulse Current (mA)
Fig. 5 - Radiant Intensity vs. Forward Current
Rev. 1.6, 15-Jul-2020
Document Number: 81471
3
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
End of Life July-2021 - Alternative Device: VSMY3850X01
VSMG3700
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
0.9
1.75 ± 0.1
3.5 ± 0.2
0.8
technical drawings
according to DIN
specifications
C
2.2
2.8 ± 0.15
Pin identification
A
Drawing-No.: 6.541-5067.01-4
Issue: 7; 12.03.14
Ø 2.4
3 + 0.15
Mounting Pad Layout
Area covered
with solderresist
4
2.6 (2.8)
1.2
1.6 (1.9)
4
Dimensions: reflow and vapor phase (wave soldering)
DRYPACK
SOLDER PROFILE
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
Axis Title
10000
300
Max. 260 °C
255 °C
240 °C
217 °C
2nd line
Temperature (°C)
250
245 °C
FLOOR LIFE
1000
200
1st line
2nd line
Max. 30 s
150
Max. 120 s
100
Max. 100 s
Max. ramp down 6 °C/s
100
DRYING
Max. ramp up 3 °C/s
50
10
0
0
50
19841-1
100
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 3, acc. to J-STD-020.
150
200
250
300
Time (s)
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
Rev. 1.6, 15-Jul-2020
Document Number: 81471
4
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
End of Life July-2021 - Alternative Device: VSMY3850X01
VSMG3700
www.vishay.com
Vishay Semiconductors
TAPE AND REEL
PLCC-2 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
10.0
9.0
120°
4.5
3.5
13.00
12.75
2.5
1.5
63.5
60.5
Adhesive tape
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
Blister tape
Component cavity
14.4 max.
180
178
94 8665
Fig. 12 - Dimensions of Reel-GS08
94 8670
Fig. 9 - Blister Tape
10.4
8.4
120°
2.2
2.0
3.5
3.1
4.5
3.5
5.75
5.25
3.6
3.4
8.3
7.7
1.85
1.65
1.6
1.4
4.1
3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Fig. 10 - Tape Dimensions in mm for PLCC-2
13.00
12.75
2.5
1.5
4.0
3.6
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
62.5
60.0
321
329
14.4 max.
18857
Fig. 13 - Dimensions of Reel-GS18
MISSING DEVICES
A maximum of 0.5 % of the total number of components per
reel may be missing, exclusively missing components at the
beginning and at the end of the reel. A maximum of three
consecutive components may be missing, provided this gap
is followed by six consecutive components.
De-reeling direction
COVER TAPE REMOVAL FORCE
The removal force lies between 0.1 N and 1.0 N at a removal
speed of 5 mm/s. In order to prevent components from
popping out of the blisters, the cover tape must be pulled off
at an angle of 180° with regard to the feed direction.
94 8158
> 160 mm
Tape leader
40 empty
compartments
min. 75 empty
compartments
Carrier leader
Carrier trailer
Fig. 11 - Beginning and End of Reel
The tape leader is at least 160 mm and is followed by a
carrier tape leader with at least 40 empty compartments.
The tape leader may include the carrier tape as long as the
cover tape is not connected to the carrier tape. The least
component is followed by a carrier tape trailer with a least
75 empty compartments and sealed with cover tape.
Rev. 1.6, 15-Jul-2020
Document Number: 81471
5
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
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Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and
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or for that of subsequent links.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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© 2022 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 01-Jan-2022
1
Document Number: 91000
