VSMY14940

VSMY14940 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology FEATURES • Package type: surface-mount • Package form: side view • Dimensions (L x W x H in mm): 3.0 x 2.51 x 1.2 • Peak wavelength: λp = 940 nm • High reliability • High radiant power • Very high radiant intensity • Angle of half intensity: ϕ = ± 9° • Suitable for high pulse current operation DESCRIPTION As part of the SurfLightTM portfolio, the VSMY14940 is an infrared, 940 nm, side looking emitting diode based on GaAlAs surface emitter chip technology with extreme high radiant intensities, high optical power and high speed, molded in clear, untinted PCB based package (with lens) for surface mounting (SMD). • Floor life: 168 h, MSL 3, according to J-STD-020 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Emitter for remote control (38 kHz) • Learning remote control • Photointerrupters • Optical switch PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λp (nm) tr (ns) 90 ±9 940 5 VSMY14940 Note • Test condition see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY14940 Tape and reel MOQ: 1500 pcs, 1500 pcs/reel Side view Note • MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER SYMBOL VALUE Reverse voltage VR 5 V Forward current IF 70 mA Surge forward current TEST CONDITION tp = 100 μs Power dissipation Junction temperature UNIT IFSM 0.7 A PV 119 mW °C Tj 100 Operating temperature range Tamb -40 to +85 °C Storage temperature range Tstg -55 to +100 °C According to Fig. 10, J-STD-020 Tsd 260 °C J-STD-051, soldered on PCB RthJA 390 K/W Soldering temperature Thermal resistance junction-to-ambient Rev. 1.6, 22-Sep-17 Document Number: 84209 1 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY14940 Vishay Semiconductors 140 80 120 70 IF - Forward Current (mA) PV - Power Dissipation (mW) www.vishay.com 100 80 60 RthJA = 390 K/W 40 20 60 50 40 30 RthJA = 390 K/W 20 10 0 0 0 10 20 30 40 50 60 70 80 0 90 100 10 Tamb - Ambient Temperature (°C) 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. IF = 20 mA, tp = 20 ms VF 1.1 1.3 1.5 V IF = 70 mA, tp = 20 ms VF - 1.5 - V IF = 0.7 A, tp = 100 μs VF - 3.0 - V IF = 20 mA TKVF - -0.9 - mV/K VR = 0 V, f = 1 MHz, E = 0 mW/cm2 CJ - 30 - pF IF = 20 mA, tp = 20 ms Ie 15 25 - mW/sr IF = 70 mA, tp = 20 ms Ie - 90 - mW/sr IF = 0.7 A, tp = 100 μs Ie - 560 - mW/sr Ee = 1 mW/cm2, λ = 950 nm, VR = 5 V Ira - 0.5 - μA IF = 70 mA, tp = 20 ms φe - 40 - mW IF = 70 mA TKφe - -0.21 - %/K ϕ - ±9 - deg Peak wavelength IF = 70 mA λp 920 940 960 nm Spectral bandwidth IF = 70 mA Δλ - 55 - nm Temperature coefficient of λp IF = 70 mA TKλp - 0.28 - nm/K Rise time IF = 70 mA, 10 % to 90 % tr - 5 - ns Fall time IF = 70 mA, 10 % to 90 % tf - 6 - ns Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity Reverse light current Radiant power Temperature coefficient of radiant power IR Angle of half intensity Rev. 1.6, 22-Sep-17 Not designed for reverse operation UNIT nA Document Number: 84209 2 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY14940 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Ie,rel - Relative Radiant Intensity (%) IF - Forward Current (mA) 1000 tp = 100 μs 100 10 1 1.0 1.4 1.8 2.2 2.6 1000 tp = 100 μs 100 10 1 3.0 1 VF - Forward Voltage (V) IF = 70 mA tP = 20 ms 1.45 1.40 1.35 1.30 20 40 60 80 120 IF = 70 mA tp = 20 ms 110 100 90 80 100 -60 -40 -20 Tamb - Ambient Temperature (°C) IF = 70 mA tp = 20 ms 105 100 95 90 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 5 - Relative Forward Voltage vs. Ambient Temperature Rev. 1.6, 22-Sep-17 20 40 60 80 100 Fig. 7 - Relative Radiant Intensity vs. Ambient Temperature Ie, rel - Relative Radiant Intensity (%) VF, rel - Relative Forward Voltage (%) 110 0 0 Tamb - Ambient Temperature (°C) Fig. 4 - Forward Voltage vs. Ambient Temperature -60 -40 -20 1000 Fig. 6 - Relative Radiant Intensity vs. Forward Current Ie, rel - Relative Radiant Intensity (%) VF - Forward Voltage (V) 1.50 0 100 IF - Forward Current (mA) Fig. 3 - Forward Current vs. Forward Voltage -60 -40 -20 10 100 IF = 70 mA 80 60 40 20 0 800 850 900 950 1000 1050 λ - Wavelength (nm) Fig. 8 - Relative Radiant Intensity vs. Wavelength Document Number: 84209 3 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY14940 www.vishay.com 10° DRYPACK 20° 30° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° 0.4 0.6 0.2 ϕ - Angular Displacement Ie, rel - Relative Radiant Intensity 0° Vishay Semiconductors Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 3, according to J-STD-020. DRYING 0 Fig. 9 - Relative Radiant Intensity vs. Angular Displacement In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. SOLDER PROFILE Temperature 10 s max. 217 °C 200 °C 255 °C to 260 °C 3 °C/s max. 6 °C/s max. 150 °C 3 °C/s max. 60 s to 120 s 60 s max. Time Fig. 10 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 Rev. 1.6, 22-Sep-17 Document Number: 84209 4 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY14940 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY14940 Molding body (lens) 1.20 1.00 1.20 Cathode mask 1.60 Soldering terminal 3.00 + 1.00 - Polarity 1.90 2.51 1.10 Not indicated tolerances ± 0.1 mm Recommended Solder Pad 1.40 1.80 0.90 Rev. 1.6, 22-Sep-17 0.90 Document Number: 84209 5 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY14940 www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY14940 4.00 ± 0.10 2.00 ± 0.05 Ø 1.50 ± 0.10 4.00 ± 0.10 1.75 ± 0.10 8.00 3.50 ± 0.05 + 0.30 - 0.10 Cathode mask Ø 1.00 0.25 ± 0.02 1.8 + 0.25 R0.50 3.30 Anode mask 1.40 ± 0.10 Rev. 1.6, 22-Sep-17 Document Number: 84209 6 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2019 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2019 1 Document Number: 91000