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VSMY1850

VSMY1850

  • 厂商:

    TFUNK(威世)

  • 封装:

    0805

  • 描述:

    EMITTER IR 850NM 100MA 0805

  • 数据手册
  • 价格&库存
VSMY1850 数据手册
VSMY1850 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 850 nm, Surface Emitter Technology FEATURES • Package type: surface mount • Package form: 0805 • Dimensions (L x W x H in mm): 2 x 1.25 x 0.85 • Peak wavelength: λp = 850 nm • High reliability • High radiant power • High radiant intensity • High speed • Angle of half sensitivity: ϕ = ± 60° • Suitable for high pulse current operation 21531 • 0805 standard surface-mountable package • Floor life: 168 h, MSL 3, according to J-STD-020 • Lead (Pb)-free reflow soldering DESCRIPTION • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 As part of the SurfLightTM portfolio, the VSMY1850 is an infrared, 850 nm emitting diode based on GaAlAs surface emitter chip technology with high radiant intensity, high optical power and high speed, molded in clear, untinted 0805 plastic package for surface mounting (SMD). APPLICATIONS • IrDA compatible data transmission • Miniature light barrier • Photointerrupters • Optical switch • Emitter source for proximity sensors • IR touch panels • IR Flash • IR illumination • 3D TV PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λp (nm) tr (ns) 10 ± 60 850 10 VSMY1850 Note • Test conditions see table “Basic Characteristics“ ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY1850 Tape and reel MOQ: 3000 pcs, 3000 pcs/reel 0805 Note • MOQ: minimum order quantity Rev. 1.5, 30-Jun-16 Document Number: 83397 1 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY1850 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current IF 100 mA Peak forward current tp/T = 0.5, tp = 100 μs IFM 200 mA Surge forward current tp = 100 μs IFSM 1 A PV 190 mW °C Power dissipation Junction temperature Tj 100 Operating temperature range Tamb -40 to +85 °C Storage temperature range Tstg -40 to +100 °C According to Fig. 7, J-STD-020 Tsd 260 °C JESD 51 RthJA 270 K/W Soldering temperature Thermal resistance junction / ambient 120 100 IF - Forward Current (mA) PV - Power Dissipation (mW) 200 160 120 RthJA = 270 K/W 80 40 80 60 RthJA = 270 K/W 40 20 0 0 0 22108 20 40 60 80 0 100 Tamb - Ambient Temperature (°C) 20 Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 40 60 80 100 Tamb - Ambient Temperature (°C) 22109 Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT IF = 100 mA, tp = 20 ms VF - 1.65 1.9 V IF = 1 A, tp = 100 μs VF - 2.9 - V IF = 1 mA TKVF - -1.4 - mV/K IF = 10 mA TKVF - -1.18 - mV/K Reverse current Junction capacitance IR VR = 0 V, f = 1 MHz, E = 0 mW/cm2 Not designed for reverse operation 125 - pF 5 10 15 mW/sr - 85 - mW/sr φe - 50 - mW IF = 100 mA TKφe - -0.35 - %/K ϕ - ± 60 - deg Peak wavelength IF = 100 mA λp 840 850 870 nm Spectral bandwidth IF = 30 mA Δλ - 30 - nm Temperature coefficient of λp IF = 30 mA TKλp - 0.25 - nm/K Rise time IF = 100 mA, 20 % to 80 % tr - 10 - ns Fall time IF = 100 mA, 20 % to 80 % tf - 10 - ns d - 0.5 - mm Radiant intensity Radiant power Temperature coefficient of radiant power CJ - IF = 100 mA, tp = 20 ms Ie IF = 1 A, tp = 100 μs Ie IF = 100 mA, tp = 20 ms μA Angle of half intensity Virtual source diameter Rev. 1.5, 30-Jun-16 Document Number: 83397 2 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY1850 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 10 Φe, rel - Relative Radiant Power 1 1 0.1 0.01 IF = 30 mA 0.75 0.5 0.25 0.001 0 0.5 1 1.5 2 2.5 3 VF - Forward Voltage (V) 22097 0 650 3.5 750 Fig. 3 - Forward Current vs. Forward Voltage 850 Fig. 5 - Relative Radiant Power vs. Wavelength 0° 10° 20° 30° Ie, rel - Relative Radiant Intensity Ie - Radiant Intensity (mW/sr) 1000 100 tp = 100 µs 10 1 0.1 0.001 0.01 0.1 1 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° 0.6 0.4 0.2 0 948013-1 IF - Forward Current (A) 22110 Fig. 4 - Radiant Intensity vs. Forward Current REFLOW SOLDER PROFILE max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 Time between soldering and removing from MBB must not exceed the time indicated in J-STD-020: max. 30 s 150 max. 100 s max. 120 s Moisture sensitivity: level 3 100 max. ramp down 6 °C/s 0 19841 50 100 150 200 250 300 Time (s) Fig. 7 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 Rev. 1.5, 30-Jun-16 Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % max. ramp up 3 °C/s 0 Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE 200 50 Fig. 6 - Relative Radiant Intensity vs. Angular Displacement DRYPACK 300 Temperature (°C) 950 λ - Wavelength (nm) 21776-1 ϕ - Angular Displacement IF - Forward Current (A) tp = 100 µs DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. Document Number: 83397 3 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY1850 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters Cathode Bottom view Anode 1 technical drawings specifications according to DIN Not indicated tolerances ± 0.1 Side View 0.35 0.85 2 0.6 0.6 Top View 1.25 Recommended solder pad footprint 1 0.625 1 1.2 0.82 0.6 Drawing-No.: 6.541-5083.01-4 Issue: 2; 10.09.2013 Rev. 1.5, 30-Jun-16 Document Number: 83397 4 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY1850 www.vishay.com Vishay Semiconductors BLISTER TAPE DIMENSIONS in millimeters 4 Ø 1.55 ± 0.05 0.2 ± 0.05 2 ± 0.05 8 2.24 3.5 ± 0.05 1.75 Anode 0.94 Cathode 1.45 4 Ø 1.1 + 0.1 Not indicated tolerances ±0.1 Reel off direction Drawing-No.: 9.700-5352.01-4 Issue: 1; 13.04.10 technical drawings according to DIN specifications 22112 REEL DIMENSIONS in millimeters 8.4 +2.5 Ø 177.8 max. Ø 55 min. 8.4 +0.15 Z Form of the leave open of the wheel is supplier specific. 14.4 max. Ø 20.2 min. 1.5 min. Ø 13 - 0.2 + 0.5 Z 2:1 Drawing-No.: 9.800-5096.01-4 Issue: 2; 26.04.10 20875 Rev. 1.5, 30-Jun-16 technical drawings according to DIN specifications Document Number: 83397 5 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer's technical experts. Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein. Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of the corporation, organization or individual associated with the third-party website. Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website or for that of subsequent links. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2022 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2022 1 Document Number: 91000
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