VSMY2940RG

VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology VSMY2940RG VSMY2940G FEATURES • Package type: surface-mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8 • Peak wavelength: λp = 940 nm • High reliability • High radiant power • Very high radiant intensity DESCRIPTION As part of the SurfLightTM portfolio, the VSMY2940 series are infrared, 940 nm emitting diodes based on GaAlAs surface emitter chip technology with extreme high radiant intensities, high optical power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). APPLICATIONS • Angle of half intensity: ϕ = ± 10° • Suitable for high pulse current operation • Terminal configurations: gullwing or reverse gullwing • Package matches with detector VEMD2000X01 series • Floor life: 4 weeks, MSL 2a, according to J-STD-020 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 • Miniature light barrier • Photointerrupters • Optical switch • Emitter source for proximity sensors PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λP (nm) tr (ns) VSMY2940RG 145 ± 10 940 10 VSMY2940G 145 ± 10 940 10 Note • Test conditions see table “Basic Characteristics“ ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY2940RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing VSMY2940G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing Note • MOQ: minimum order quantity Rev. 1.1, 08-Dec-17 Document Number: 84221 1 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage IF 100 mA Peak forward current Forward current tp/T = 0.5, tp = 100 μs IFM 200 mA Surge forward current tp = 100 μs IFSM 1 A PV 180 mW Power dissipation Junction temperature Operating temperature range Tj 100 °C Tamb -40 to +85 °C Storage temperature range Soldering temperature Thermal resistance junction-to-ambient Tstg -40 to +100 °C According to Fig. 10, J-STD-020 Tsd 260 °C J-STD-051, soldered on PCB RthJA 250 K/W 100 180 160 IF - Forward Current (mA) PV - Power Dissipation (mW) 200 RthJA = 250 K/W 140 120 100 80 60 40 80 RthJA = 250 K/W 60 40 20 20 0 0 0 20 40 60 80 0 100 20 40 60 80 100 Tamb - Ambient Temperature (°C) Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT IF = 100 mA, tp = 20 ms VF - 1.4 1.8 V IF = 1 A, tp = 100 μs VF - 2.5 - V IF = 100 mA TKVF - -0.7 - mV/K Reverse current Junction capacitance Radiant intensity IR Not designed for reverse operation μA VR = 0 V, f = 1 MHz, E = 0 mW/cm2 CJ - 55 - pF IF = 100 mA, tp = 20 ms Ie 75 145 215 mW/sr IF = 1 A, tp = 100 μs Ie - 1000 - mW/sr IF = 100 mA, tp = 20 ms φe - 55 - mW IF = 100 mA TKφe - -0.2 - %/K ϕ - ± 10 - deg Peak wavelength IF = 100 mA λp 920 940 960 nm Spectral bandwidth IF = 100 mA Δλ - 50 - nm Temperature coefficient of λp IF = 100 mA TKλp - 0.25 - nm/K Rise time IF = 100 mA, 10 % to 90 % tr - 10 - ns Fall time IF = 100 mA, 10 % to 90 % tf - 10 - ns Radiant power Temperature coefficient of radiant power Angle of half intensity Rev. 1.1, 08-Dec-17 Document Number: 84221 2 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Ie, rel - Relative Radiant Intensity (%) 1000 100 10 1 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 115 IF = 100 mA tp = 20 ms 110 105 100 95 90 85 2.6 -60 -40 -20 VF - Forward Voltage (V) 20 60 80 100 Fig. 6 - Relative Radiant Intensity vs. Ambient Temperature Ie, rel - Relative Radiant Intensity 110 IF = 100 mA tp = 20 ms 105 100 95 90 100% IF = 100 mA 80% 60% 40% 20% 0% -60 -40 -20 0 20 40 60 80 100 800 850 900 950 1000 1050 λ - Wavelength (nm) Tamb - Ambient Temperature (°C) Fig. 4 - Relative Forward Voltage vs. Ambient Temperature Fig. 7 - Relative Radiant Intensity vs. Wavelength 0° Ie, rel - Relative Radiant Intensity 10 Ie,rel - Relative Radiant Intensity (Ie / Ie(100 mA)) 40 Tamb - Ambient Temperature (°C) Fig. 3 - Forward Current vs. Forward Voltage VF, rel - Relative Forward Voltage (%) 0 tp = 100 μs 1 0.1 10° 20° 30° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° ϕ - Angular Displacement IF - Forward Current (mA) tp = 100 μs 0.01 1 10 100 1000 0.6 0.4 0.2 0 IF - Forward Current (mA) Fig. 5 - Relative Radiant Intensity vs. Forward Current Rev. 1.1, 08-Dec-17 Fig. 8 - Relative Radiant Intensity vs. Angular Displacement Document Number: 84221 3 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors SOLDER PROFILE DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Axis Title 10000 300 Max. 260 °C 255 °C 240 °C 217 °C 2nd line Temperature (°C) 250 245 °C FLOOR LIFE 1000 200 1st line 2nd line Max. 30 s 150 Max. 120 s 100 Max. 100 s Max. ramp down 6 °C/s 100 Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 2a, according to J-STD-020. Max. ramp up 3 °C/s 50 DRYING 10 0 0 50 100 150 200 250 300 Time (s) 19841-1 Fig. 9 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020 Rev. 1.1, 08-Dec-17 In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. Document Number: 84221 4 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY2940RG Ø 1.8 ± 0.1 0.3 1.6 Z 0.19 2.77 ± 0.2 0.05 ± 0.1 0.4 2.2 2.2 5.8 ± 0.2 exposed copper 1.1 ± 0.1 Z 20:1 0.254 2.3 ± 0.2 0.4 0.5 2.3 ± 0.2 0.75 anode pin ID 1.7 cathode solder pad proposal acc. IPC 7351 technical drawings according to DIN specifications Not indicated tolerances ± 0.1 Ø 2.3 ± 0.1 6.7 Drawing-No.: 6.544-5391.03-4 Issue: 2; 19.09.14 Rev. 1.1, 08-Dec-17 Document Number: 84221 5 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY2940G Ø 1.8 0.19 1.6 X 0.05 2.77 ± 0.2 0.3 0.4 2.2 2.2 4.2 ± 0.2 X 20:1 exposed copper 0.6 0.75 anode pin ID solder pad proposal acc. IPC 7351 0.254 2.3 ± 0.2 0.4 0.5 2.3 ± 0.2 cathode technical drawings according to DIN specifications Not indicated tolerances ± 0.1 2.45 5.15 Drawing-No.: 6.544-5383.03-4 Issue: 2; 19.09.14 Rev. 1.1, 08-Dec-17 Document Number: 84221 6 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2940RG Reel X unreel direction Ø 13 ± 0.5 Ø 330 ± 1 .5 ±0 Ø 62 ± 0.5 2.5 tape position coming out from reel 6000 pcs/reel technical drawings according to DIN specifications label posted here 12.4 ± 1.5 Leader and trailer tape empty (160 mm min.) parts mounted direction of pulling out Ø 1.55 ± 0.05 I 3.05 ± 0.1 4 ± 0.1 X 2:1 4 ± 0.1 2 ± 0.05 12 ± 0.3 Lead I Lead II Device VEMT2000 Collector Emitter VEMT2500 VEMD2000 VEMD2500 Cathode Anode VSMB2000 VSMG2000 VSMF2890RG VSMY2850RG Anode Cathode VSMY2940RG 5.5 ± 0.05 Terminal position in tape 1.75 ± 0.1 empty (400 mm min.) II Drawing-No.: 9.800-5100.01-4 Issue: 4; 19.09.14 Rev. 1.1, 08-Dec-17 Document Number: 84221 7 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2940G Reel X unreel direction Ø 13 ± 0.5 Ø 330 ± 1 .5 ±0 Ø 62 ± 0.5 2.5 tape position coming out from reel 6000 pcs/reel technical drawings according to DIN specifications label posted here 12.4 ± 1.5 Leader and trailer tape empty (160 mm min.) parts mounted direction of pulling out Ø 1.55 ± 0.05 Lead I Lead II Cathode Anode Collector Emitter Anode Cathode I 3.05 ± 0.1 4 ± 0.1 X 2:1 4 ± 0.1 2 ± 0.05 12 ± 0.3 Device VSMB2020 VSMG2020 VEMD2020 VEMD2520 VSMF2890G VEMT2020 VEMT2520 VSMY2850G VSMY2940G 5.5 ± 0.05 Terminal position in tape 1.75 ± 0.1 empty (400 mm min.) II Drawing-No.: 9.800-5091.01-4 Issue: 5; 19.09.14 Rev. 1.1, 08-Dec-17 Document Number: 84221 8 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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