VSMY294310G

VSMY294310RG, VSMY294310G www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology VSMY294310RG FEATURES VSMY294310G • Package type: surface mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.55 • Peak wavelength: λp = 940 nm • High reliability • High radiant power • Very high radiant intensity • Angle of half intensity: ϕ = ± 25° DESCRIPTION • Suitable for high pulse current operation SurfLightTM As part of the portfolio, the VSMY294310 series are infrared, 940 nm emitting diodes based on GaAlAs surface emitter chip technology with extreme high radiant intensities, high optical power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). • Terminal configurations: gullwing or reverse gullwing • Package matches with detector VEMD2503X01 series • Floor life: 4 weeks, MSL 2a, acc. J-STD-020 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Miniature light barrier • Photointerrupters • Optical switch • Emitter source for proximity sensors • IR illumination PRODUCT SUMMARY Ie (mW/sr) ϕ (deg) λp (nm) VSMY294310RG 25 ± 25 940 10 VSMY294310G 25 ± 25 940 10 COMPONENT tr (ns) Note • Test conditions see table “Basic Characteristics“ ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY294310RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing VSMY294310G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing Note • MOQ: minimum order quantity Rev. 1.0, 13-Oct-15 Document Number: 84338 1 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY294310RG, VSMY294310G www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V mA Reverse voltage Forward current Surge forward current tp = 100 μs IF 70 IFSM 1 A PV 140 mW Power dissipation Junction temperature Operating temperature range Tj 100 °C Tamb -40 to +85 °C °C Storage temperature range Soldering temperature Thermal resistance junction/ambient Tstg -40 to +100 Acc. figure 7, J-STD-020 Tsd 260 °C J-STD-051, soldered on PCB RthJA 250 K/W 80 IF - Forward Current (mA) PV - Power Dissipation (mW) 140 120 100 80 RthJA = 250 K/W 60 40 20 0 70 60 50 40 30 RthJA = 250 K/W 20 10 0 0 20 40 60 80 100 0 20 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT IF = 70 mA, tp = 20 ms VF - 1.5 2.0 V IF = 1 A, tp = 100 μs VF - 2.5 - V IF = 20 mA TKVF - -1.7 - mV/K VR = 0 V, f = 1 MHz, E = 0 mW/cm2 CJ - IF = 70 mA, tp = 20 ms Ie IF = 1 A, tp = 100 μs Ie IF = 70 mA, tp = 20 ms Reverse current Junction capacitance IR not designed for reverse operation μA 5 - 12 25 45 mW/sr - 260 - mW/sr φe - 40 - mW IF = 70 mA TKφe - -0.2 - %/K ϕ - ± 25 - deg Peak wavelength IF = 20 mA λp 920 940 960 nm Spectral bandwidth IF = 20 mA Δλ - 35 - nm Temperature coefficient of λp IF = 20 mA TKλp - 0.25 - nm/K Rise time IF = 70 mA, 20 % to 80 % tr - 10 - ns Fall time IF = 70 mA, 20 % to 80 % tf - 10 - ns Radiant intensity Radiant power Temperature coefficient of radiant power Angle of half intensity Rev. 1.0, 13-Oct-15 pF Document Number: 84338 2 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY294310RG, VSMY294310G www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1000 1000 100 10 1 1.0 tp = 100 μs Ie - Radiant Intensity (mW/sr) IF - Forward Current (mA) tp = 100 µs 100 10 1 0.1 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 1 2.8 VF - Forward Voltage (V) Ie, rel - Relative Radiant Intensity (%) 110 IF = 20 mA VF - Forward Voltage (V) 1000 Fig. 6 - Radiant Intensity vs. Forward Current 1.50 1.45 1.40 1.35 1.30 1.25 1.20 - 60 - 40 - 20 0 20 40 60 80 IF = 20 mA 105 100 95 90 85 80 - 60 - 40 - 20 100 Tamb - Ambient Temperature (°C) 0 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 4 - Forward Voltage vs. Ambient Temperature Fig. 7 - Relative Radiant Intensity vs. Ambient Temperature 115 100 Ie, rel - Relative Radiant Intensity (%) VF, rel - Relative Forward Voltage (%) 100 IF - Forward Current (mA) Fig. 3 - Forward Current vs. Forward Voltage IF = 20 mA 110 105 100 95 90 - 60 - 40 - 20 0 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 5 - Relative Forward Voltage vs. Ambient Temperature Rev. 1.0, 13-Oct-15 10 IF = 20 mA 90 80 70 60 50 40 30 20 10 0 800 850 900 950 1000 1050 λ - Wavelength (nm) Fig. 8 - Relative Radiant Intensity vs. Wavelength Document Number: 84338 3 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY294310RG, VSMY294310G www.vishay.com Vishay Semiconductors DRYPACK 0° 10° 20° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 ϕ - Angular Displacement Ie rel - Relative Radiant Intensity 30° Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020. 80° 0.6 0.4 0.2 DRYING 0 22688 Fig. 9 - Relative Radiant Intensity vs. Angular Displacement In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. SOLDER PROFILE 300 Temperature (°C) max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp down 6 °C/s 50 max. ramp up 3 °C/s 0 0 19841 50 100 150 200 250 300 Time (s) Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 Rev. 1.0, 13-Oct-15 Document Number: 84338 4 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY294310RG, VSMY294310G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY294310RG 0.4 0.3 0.05 ± 0.1 Ø 1.8 1.6 2.55 Z 2.2 2.22 5.8 0.8 Exposed copper Z (20 : 1) 2.3 0.4 0.5 2.3 Anode Cathode 0.75 Pin ID 1.7 Solder pad proposal acc. IPC 7351 Technical drawings according to DIN specifications Not indicated tolerances ± 0.2 Ø 2.3 ± 0.1 6.7 Drawing-No.: 6.544-5409.03-4 Issue: 3; 02.10.15 Rev. 1.0, 13-Oct-15 Document Number: 84338 5 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY294310RG, VSMY294310G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY294310G 0.4 0.3 Ø 1.8 0.05 ± 0.1 1.6 2.55 X 2.22 2.2 4.2 Exposed copper X (20 : 1) 2.3 0.4 0.5 2.3 0.6 Anode Cathode 0.75 Pin ID Technical drawings according to DIN specifications Solder pad proposal acc. IPC 7351 Not indicated tolerances ± 0.2 2.45 5.15 Drawing-No.: 6.544-5408.03-4 Issue: 3; 02.10.15 Rev. 1.0, 13-Oct-15 Document Number: 84338 6 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY294310RG, VSMY294310G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY294310RG X Reel Unreel direction ±0 Ø 62 ± 0.5 2 .5 Ø 13 ± 0.5 Ø 330 ± 1 .5 Tape position coming out from reel 6000 pcs / reel Label posted here Technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape Empty (160 mm min.) Parts mounted Direction of pulling out 4 ± 0.1 Ø 1.55 ± 0.05 Terminal position in tape Device I Lead I Lead II Cathode Anode Collector Emitter Anode Cathode 2 ± 0.05 X (2 : 1) 1.75 ± 0.1 Empty (400 mm min.) VSMF2893RGX01 + 0.3 - 0.1 VSMB2943RGX01 VSMY2853RG VSMY2943RG VSMY294310RG 3.05 ± 0.1 4 ± 0.1 5.5 ± 0.05 VEMT2x03X01 12 VEMD2x03X01 II Drawing-No.: 9.800-5100.02-4 Issue: 3; 02.10.15 Rev. 1.0, 13-Oct-15 Document Number: 84338 7 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY294310RG, VSMY294310G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY294310G X Reel Unreel direction ±0 Ø 62 ± 0.5 2 .5 Ø 13 ± 0.5 Ø 330 ± 1 .5 Tape position coming out from reel 6000 pcs / reel Technical drawings according to DIN specifications Label posted here 12.4 ± 1.5 Leader and trailer tape Empty (160 mm min.) Parts mounted Direction of pulling out Terminal position in tape Device Ø 1.55 ± 0.05 Lead I Lead II Cathode Anode Collector Emitter Anode Cathode I 4 ± 0.1 2 ± 0.05 X (2 : 1) 1.75 ± 0.1 Empty (400 mm min.) VSMB2943GX01 VSMF2893GX01 12 VEMT2x23X01 + 0.3 - 0.1 VEMD2x23X01 VSMY2943G VSMY294310G 3.05 ± 0.1 Drawing-No.: 9.800-5091.21-4 Issue: 3; 02.10.15 Rev. 1.0, 13-Oct-15 4 ± 0.1 5.5 ± 0.05 VSMY2853G II Document Number: 84338 8 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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