VSMY385010-GS08

VSMY385010 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 850 nm, Surface Emitter Technology FEATURES • • • • • • • • • • • 948553 DESCRIPTION Package type: surface mount Package form: PLCC-2 Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75 Peak wavelength: p = 850 nm High reliability High radiant power High radiant intensity Angle of half intensity:  = ± 60° Floor life: 168 h, MSL 3, acc. J-STD-020 Lead (Pb)-free reflow soldering Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 RELEASED FOR APPLICATIONS As part of the SurfLightTM portfolio, the VSMY385010 is an infrared, 850 nm emitting diode based on surface emitter technology with high radiant intensity, high optical power and high speed, molded in a PLCC-2 package for surface mounting (SMD). Infrared radiation source for operation with CMOS cameras (illumination) • High speed IR data transmission • IR touch panels • 3D gaming • Light curtain PRODUCT SUMMARY COMPONENT Ie (mW/sr)  (deg) p (nm) tr (ns) VSMY385010 9 ± 60 850 10 Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY385010-GS08 Tape and reel MOQ: 7500 pcs, 1500 pcs/reel PLCC-2 VSMY385010-GS18 Tape and reel MOQ: 8000 pcs, 8000 pcs/reel PLCC-2 Note • MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION Reverse voltage Forward current Pulse peak forward current Surge forward current V IF 70 mA 140 mA tp = 100 μs IFSM 1 A PV 140 mW Operating temperature range Storage temperature range Rev. 1.0, 27-May-15 UNIT 5 IFM Junction temperature Thermal resistance junction/ambient VALUE VR tp/T = 0.5, tp  100 μs Power dissipation Soldering temperature SYMBOL Tj 100 °C Tamb -40 to +85 °C Tstg -40 to +85 °C acc. figure 7, J-STD-020 Tsd 260 °C J-STD-051, soldered on PCB RthJA 250 K/W Document Number: 84294 1 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY385010 www.vishay.com Vishay Semiconductors 80 IF - Forward Current (mA) PV - Power Dissipation (mW) 140 120 100 80 60 RthJA = 250 K/W 40 20 0 70 60 50 40 30 RthJA = 250 K/W 20 10 0 0 20 40 60 80 100 0 Tamb - Ambient Temperature (°C) 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage TEST CONDITION SYMBOL TYP. MAX. UNIT IF = 70 mA, tp = 20 ms VF 1.6 2.0 V IF = 1 A, tp = 100 μs VF 2.9 V IF = 70 mA TKVF -1.5 mV/K IR not designed for reverse operation μA VR = 0 V, f = 1 MHz, E = 0 Cj 125 IF = 70 mA, tp = 20 ms Ie Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity Radiant power MIN. 5.5 pF 9 16 mW/sr IF = 1 A, tp = 100 μs Ie 130 IF = 70 mA, tp = 20 ms e 40 mW IF = 70 mA TKe -0.25 %/K  ± 60 deg Temperature coefficient of e Angle of half intensity mW/sr Peak wavelength IF = 50 mA p Spectral bandwidth IF = 50 mA  35 nm Temperature coefficient of p IF = 70 mA TKp 0.26 nm/K Rise time IF = 70 mA tr 10 ns Fall time IF = 70 mA tf 10 ns 840 850 870 nm BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) VF, rel - Relative Forward Voltage (%) IF - Forward Current (mA) 1000 tp = 20 ms 100 10 1.2 1.4 1.6 1.8 2.0 VF - Forward Voltage (V) Fig. 3 - Forward Current vs. Forward Voltage Rev. 1.0, 27-May-15 115 IF = 70 mA tp = 20 ms 110 105 100 95 90 -50 -25 0 25 50 75 100 125 Tamb - Ambient Temperature (°C) Fig. 4 - Relative Forward Voltage vs. Ambient Temperature Document Number: 84294 2 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY385010 www.vishay.com Vishay Semiconductors Ie, rel - Relative Radiant Intensity (%) tp = 20 ms 10 1 10 100 100 90 IF = 70 mA 80 70 60 50 40 30 20 10 0 1000 750 800 850 900 Fig. 5 - Radiant Intensity vs. Forward Current 1050 Fig. 7 - Relative Radiant Intensity vs. Wavelength 0° 10° Ie, rel - Relative Radiant Intensity 150 140 IF = 70 mA tp = 20 ms 130 1000 λ - Wavelength (nm) IF - Forward Current (mA) Ie, rel - Relative Radiant Intensity (%) 950 120 110 100 90 80 70 60 20° 30° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° ϕ - Angular Displacement Ie - Radiant Intensity (mW/sr) 100 50 -50 -25 0 25 50 75 100 125 Tamb - Ambient Temperature (°C) Fig. 6 - Relative Radiant Intensity vs. Ambient Temperature Rev. 1.0, 27-May-15 0.6 0.4 0.2 0 λ - Wavelength (nm) Fig. 8 - Relative Radiant Intensity vs. Angular Displacement Document Number: 84294 3 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY385010 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 0.9 1.75±0.1 3.5±0.2 0.8 A C Technical drawings according to DIN specifications 2.2 2.8±0.15 Pin identification Dimensions in mm Ø2.4 Drawing-No.: 6.541-5067.02-4 Issue: 5; 23.09.13 +0.15 3 Mounting Pad Layout Area covered with solderresist 4 2.6 (2.8) 1.2 1.6 (1.9) 4 Dimensions: Reflow and vapor phase (wave soldering) SOLDER PROFILE Fig. 9 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 300 Temperature (°C) max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp down 6 °C/s 50 max. ramp up 3 °C/s 0 0 19841 Rev. 1.0, 27-May-15 50 100 150 200 250 300 Time (s) Document Number: 84294 4 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY385010 www.vishay.com Vishay Semiconductors DRYPACK is followed by six consecutive components. Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. De-reeling direction 94 8158 FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h > 160 mm Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 3, according to J-STD-020. Tape leader DRYING 40 empty compartments min. 75 empty compartments Carrier leader Carrier trailer Fig. 12 - Beginning and End of Reel In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. The tape leader is at least 160 mm and is followed by a carrier tape leader with at least 40 empty compartments. The tape leader may include the carrier tape as long as the cover tape is not connected to the carrier tape. The least component is followed by a carrier tape trailer with a least 75 empty compartments and sealed with cover tape. 10.0 9.0 120° 4.5 3.5 Adhesive tape 2.5 1.5 Blister tape Component cavity 94 8670 Identification Label: Vishay type group tape code production code quantity Fig. 10 - Blister Tape 3.5 3.1 4.1 3.9 4.5 3.5 4.0 3.6 2.5 1.5 8.3 7.7 0.25 2.05 1.95 94 8668 Fig. 11 - Tape Dimensions in mm for PLCC-2 MISSING DEVICES A maximum of 0.5 % of the total number of components per reel may be missing, exclusively missing components at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap Rev. 1.0, 27-May-15 94 8665 10.4 8.4 120° 1.85 1.65 4.1 3.9 14.4 max. 180 178 Fig. 13 - Dimensions of Reel-GS08 5.75 5.25 1.6 1.4 63.5 60.5 2.2 2.0 3.6 3.4 13.00 12.75 Identification Label: Vishay type group tape code production code quantity 13.00 12.75 62.5 60.0 321 329 14.4 max. 18857 Fig. 14 - Dimensions of Reel-GS18 COVER TAPE REMOVAL FORCE The removal force lies between 0.1 N and 1.0 N at a removal Document Number: 84294 5 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY385010 www.vishay.com Vishay Semiconductors speed of 5 mm/s. In order to prevent components from popping out of the blisters, the cover tape must be pulled off at an angle of 180° with regard to the feed direction. Rev. 1.0, 27-May-15 Document Number: 84294 6 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2022 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2022 1 Document Number: 91000