VSS8D3M10
www.vishay.com
Vishay General Semiconductor
Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifier
FEATURES
eSMP® Series
• Low-profile package
Available
• Meets MSL level 1, per
LF maximum peak of 260 °C
J-STD-020,
• AEC-Q101 qualified available
- Automotive ordering code: base P/NHM3
• Compatible to SOD-128 package case outline
Top View
Bottom View
SlimSMAW (DO-221AD)
Cathode
Anode
DESIGN SUPPORT TOOLS
click logo to get started
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
For use in high frequency inverters, freewheeling, DC/DC
converters, and polarity protection in commercial, industrial,
and automotive applications.
MECHANICAL DATA
Models
Available
PRIMARY CHARACTERISTICS
IF(AV)
3A
VRRM
100 V
Case: SlimSMAW (DO-221AD)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
Base P/NHM3 - halogen-free, RoHS-compliant, and
AEC-Q101 qualified
IFSM
60 A
VF at IF = 3 A (125 °C)
0.58 V
Terminals: matte tin plated
J-STD-002 and JESD 22-B102
H3 and HM3 suffix meets JESD 201 class 2 whisker test
TJ max.
175 °C
Package
SlimSMAW (DO-221AD)
Circuit configuration
Single
leads,
solderable
per
Polarity: color band denotes cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
VSS8D3M10
Device marking code
Maximum repetitive peak reverse voltage
Maximum average forward rectified current (fig.1)
UNIT
3M10
VRRM
100
IF (1)
3
IF (2)
2.1
Peak forward surge current 10 ms single half sine-wave superimposed on rated load
IFSM
60
Operating junction temperature range
TJ (3)
-40 to +175
Storage temperature range
TSTG
-55 to +175
V
A
A
°C
Notes
(1) Mounted on 30 mm x 30 mm AL PCB pad area
(2) Free air, mounted on recommended copper pad area
(3) The heat generated must be less than the thermal conductivity from junction-to-ambient: dP /dT < 1/R
D
J
JA
Revision: 29-Oct-2018
Document Number: 87413
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSS8D3M10
www.vishay.com
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
IF = 1.5 A
IF = 3 A
Instantaneous forward voltage
IF = 1.5 A
IF = 3 A
VR = 70 V
Reverse current
VR = 100 V
Typical junction capacitance
SYMBOL
TA = 25 °C
VF (1)
TA = 125 °C
TYP.
MAX.
0.55
-
0.67
0.75
0.48
-
0.58
0.66
TA = 25 °C
0.01
-
TA = 125 °C
0.7
-
-
0.2
1.5
4
340
-
TA = 25 °C
IR (2)
TA = 125 °C
4.0 V, 1 MHz
CJ
UNIT
V
mA
pF
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: pulse width 5 ms
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise specified)
PARAMETER
Typical thermal resistance
SYMBOL
TYP.
MAX.
RJA (1)(2)
120
150
RJM (3)
12
15
UNIT
°C/W
Notes
(1) The heat generated must be less than the thermal conductivity from junction-to-ambient: dP /dT < 1/R
D
J
JA
(2) Thermal resistance junction-to-ambient to follow JEDEC® 51-2A, device mounted on FR4 PCB, 2 oz., standard footprint
(3) Thermal resistance junction-to-mount to follow JEDEC 51-14 transient dual interface test method (TDIM)
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
VSS8D3M10-M3/H
0.033
VSS8D3M10-M3/I
VSS8D3M10HM3/H (1)
VSS8D3M10HM3/I
(1)
PREFERRED PACKAGE CODE BASE QUANTITY
DELIVERY MODE
H
3500
7" diameter plastic tape and reel
0.033
I
14 000
13" diameter plastic tape and reel
0.033
H
3500
7" diameter plastic tape and reel
0.033
I
14 000
13" diameter plastic tape and reel
Note
(1) AEC-Q101 qualified
Revision: 29-Oct-2018
Document Number: 87413
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSS8D3M10
www.vishay.com
Vishay General Semiconductor
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
Axis Title
Axis Title
10000
1000
2
100
1
50
75
1
1000
0.1
TJ = 100 °C
0.01
0.001
100
125
150
TJ = 25 °C
TJ = -40 °C
10
20
40
60
80
100
Mount Temperature (°C)
Percent of Rated Peak Reverse Voltage (%)
Fig. 1 - Maximum Forward Current Derating Curve
Fig. 4 - Typical Reverse Leakage Characteristics
Axis Title
Axis Title
10000
1000
10000
D = 0.3
1000
D = 1.0
1.5
D = 0.2
D = 0.8
1.0
D = 0.1
100
D = 0.5
T
0.5
D = tp/T
10
0.5
1
1.5
2
2.5
100
100
tp
0
0
1000
1st line
2nd line
2.0
2nd line
Junction Capacitance (pF)
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
1st line
2nd line
2nd line
Average Power Loss (W)
100
0.0001
175
2.5
3
3.5
10
10
0.1
4
1
10
100
Average Forward Current (A)
Reverse Voltage (V)
Fig. 2 - Forward Power Loss Characteristics
Fig. 5 - Typical Junction Capacitance
Axis Title
Axis Title
TJ = 150 °C
1st line
2nd line
1000
TJ = 125 °C
TJ = 100 °C
100
TJ = 25 °C
TJ = -40 °C
10
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
2nd line
Transient Thermal Impedance (°C/W)
TJ = 175 °C
1
10000
1000
10000
Junction-to-ambient
100
1000
10
100
1st line
2nd line
10
2nd line
Instantaneous Forward Current (A)
TJ = 150 °C
TJ = 125 °C
0.000001
10
0
25
10
0.00001
TM measured at cathode
terminal mount typical values
0
TJ = 175 °C
1st line
2nd line
3
Instantaneous Reverse Current (mA)
2nd line
RthJM = 12.0 °C/W
RthJA = 120 °C/W
10000
100
1st line
2nd line
2nd line
Average Forward Rectified Current (A)
4
1
0.01
10
0.1
1
10
100
Instantaneous Forward Voltage (V)
t - Pulse Duration (s)
Fig. 3 - Typical Instantaneous Forward Characteristics
Fig. 6 - Typical Transient Thermal Impedance
Revision: 29-Oct-2018
Document Number: 87413
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSS8D3M10
www.vishay.com
Vishay General Semiconductor
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
SlimSMAW (DO-221AD)
Cathode band
0.106 (2.70)
0.075 (1.90)
0.063 (1.60)
0.091 (2.30)
0.032 (0.81)
0.014 (0.36)
0.158 (4.00)
0.142 (3.60)
0.024 (0.60)
0.012 (0.30)
0.197 (5.00)
0.173 (4.40)
0.043 (1.10)
0.035 (0.90)
0.083 (2.10) min.
0.009 (0.22)
0.004 (0.10)
0.055 (1.40) min.
0.118 (3.00) max.
0.055 (1.40) min.
0.228 (5.80) ref.
Mounting pad layout
Revision: 29-Oct-2018
Document Number: 87413
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2023
1
Document Number: 91000