VSSAF522-M3/I

VSSAF522 www.vishay.com Vishay General Semiconductor Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifier FEATURES eSMP® Series • Very low profile - typical height of 0.95 mm Available • Trench MOS Schottky technology • Low power losses, high efficiency • Low forward voltage drop Top View Bottom View SlimSMA (DO-221AC) Cathode • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified available - Automotive ordering code: base P/NHM3 Anode LINKS TO ADDITIONAL RESOURCES 3D 3D • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS For use in high frequency inverters, freewheeling, DC/DC converters, and polarity protection in commercial, industrial, and automotive applications. 3D Models PRIMARY CHARACTERISTICS IF(AV) 5.0 A VRRM 200 V IFSM 90 A VF at IF = 5.0 A (125 °C) 0.69 V TJ max. 175 °C Package SlimSMA (DO-221AC) Circuit configuration Single MECHANICAL DATA Case: SlimSMA (DO-221AC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3_X - halogen-free, RoHS-compliant, and AEC-Q101 qualified (“_X” denotes revision code e.g. A, B,.....) Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 and HM3 suffix meets JESD 201 class 2 whisker test Polarity: color band denotes cathode end MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL Device marking code Maximum repetitive peak reverse voltage Maximum average forward rectified current VSSAF522 UNIT V522 VRRM IF(AV) (1) 200 2 V A IF(AV) (2) 5.0 Peak forward surge current 10 ms single half sine-wave superimposed on rated load IFSM 90 A Operating junction temperature range TJ (3) -40 to +175 °C Storage temperature range TSTG -55 to +175 °C Notes (1) Free air, mounted on recommended copper pad area (2) Mounted on 30 mm x 30 mm pad areas aluminum PCB (3) The heat generated must be less than the thermal conductivity from junction-to-ambient: dP /dT < 1/R D J θJA Revision: 21-Apr-2023 Document Number: 87453 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSSAF522 www.vishay.com Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS IF = 2.5 A IF = 5.0 A Instantaneous forward voltage IF = 2.5 A IF = 5.0 A VR = 160 V Reverse current VR = 200 V Typical junction capacitance SYMBOL TYP. TA = 25 °C VF (1) TA = 125 °C MAX. 0.76 - 0.82 0.90 0.61 - 0.69 0.77 TA = 25 °C 0.001 - TA = 125 °C 0.3 - - 0.05 0.7 3 240 - TA = 25 °C IR (2) TA = 125 °C 4.0 V, 1 MHz CJ UNIT V mA pF Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width ≤ 40 ms THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise specified) PARAMETER Typical thermal resistance SYMBOL VSSAF522 RθJA (1)(2) 115 RθJM (3) 12 UNIT °C/W Notes (1) The heat generated must be less than thermal conductivity from junction-to-ambient: dP /dT < 1/R D J θJA (2) Free air, mounted on recommended copper pad area; thermal resistance R θJA - junction-to-ambient (3) Mounted on 30 mm x 30 mm aluminum PCB; thermal resistance R θJM - junction-to-mount ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE VSSAF522-M3/H 0.032 H 3500 7" diameter plastic tape and reel VSSAF522-M3/I 0.032 I 14 000 13" diameter plastic tape and reel VSSAF522HM3_A/H (1) 0.032 H 3500 7" diameter plastic tape and reel 0.032 I 14 000 13" diameter plastic tape and reel VSSAF522HM3_A/I (1) Note (1) AEC-Q101 qualified Revision: 21-Apr-2023 Document Number: 87453 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSSAF522 www.vishay.com Vishay General Semiconductor RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) Axis Title Axis Title 10000 TM measured at cathode terminal mount typical values 1000 3 RthJA = 115 °C/W 100 2 1 10 0 0 25 50 75 100 125 150 10 TJ = 175 °C 1 TJ = 150 °C 0.1 TJ = 125 °C 0.01 TJ = 100 °C 0.001 TJ = 25 °C 0.00001 TJ = -40 °C 10 0.000001 20 40 60 80 100 Mount Temperature (°C) Percent of Rated Peak Reverse Voltage (%) Fig. 1 - Maximum Forward Current Derating Curve Fig. 4 - Typical Reverse Leakage Characteristics Axis Title Axis Title 1000 10000 4.5 10000 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p 3.5 1000 D = 0.3 3.0 D = 1.0 D = 0.2 2.5 2.0 D = 0.1 100 1.5 T 1.0 0.5 D = tp/T 1000 1st line 2nd line D = 0.5 2nd line Junction Capacitance (pF) D = 0.8 4.0 1st line 2nd line 2nd line Average Power Loss (W) 100 0.0001 175 5.0 100 100 tp 10 0 10 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 0.1 1 10 100 10 1000 Average Forward Current (A) Reverse Voltage (V) Fig. 2 - Forward Power Loss Characteristics Fig. 5 - Typical Junction Capacitance Axis Title Axis Title 10000 TJ = 150 °C 1st line 2nd line 1000 TJ = 125 °C 1 TJ = 100 °C 100 TJ = 25 °C TJ = -40 °C 10 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Junction to ambient 100 1000 10 100 1st line 2nd line TJ = 175 °C 10 10000 1000 2nd line Transient Thermal Impedance (°C/W) 100 2nd line Instantaneous Forward Current (A) 1000 1st line 2nd line 5 2nd line Instantaneous Reverse Current (mA) RthJM = 12 °C/W 4 10000 100 1st line 2nd line 2nd line Average Forward Rectified Current (A) 6 1 0.01 10 0.1 1 10 100 Instantaneous Forward Voltage (V) t - Pulse Duration (s) Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 6 - Typical Transient Thermal Impedance Revision: 21-Apr-2023 Document Number: 87453 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSSAF522 www.vishay.com Vishay General Semiconductor Axis Title 10000 Epoxy printed circuit board FR4 copper thickness = 70 µm 100 1000 80 1st line 2nd line 2nd line Thermal Resistance (°C/W) 120 60 100 40 20 S (cm2) 10 0 0 1 2 3 4 5 6 7 8 9 Copper Pad Areas (cm2) Fig. 7 - Thermal Resistance Junction to Ambient vs. Copper Pad Area PACKAGE OUTLINE DIMENSIONS in inches (millimeters) SlimSMA (DO-221AC) Cathode Band 0.057 (1.45) 0.049 (1.25) 0.106 (2.70) 0.098 (2.50) 0.171 (4.35) 0.163 (4.15) 0.211 (5.35) 0.199 (5.05) 0.047 (1.20) 0.030 (0.75) Typ.: 0.019 (0.48) Mounting Pad Layout 0.039 (1.00) 0.035 (0.90) 0.060 (1.52) MIN. 0.012 (0.30) 0.006 (0.15) 0.047 (1.20) MIN. 0.123 (3.12) MAX. 0.217 (5.52) REF. 0.047 (1.20) MIN. Revision: 21-Apr-2023 Document Number: 87453 4 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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ALL RIGHTS RESERVED Revision: 01-Jan-2023 1 Document Number: 91000