SK33

TIGER ELECTRONIC CO.,LTD SK32 THRU SK310 Features • • • • • • • • • • Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates Compliant. See ordering information) For Surface Mount Applications High Current Capability With Low Forward Voltage High Temp Soldering: 260 °C for 10 Seconds At Terminals Epoxy meets UL 94 V-0 flammability rating Moisture Sensitivity Level 1 Operating Temperature: -55 °C to +150°C Storage Temperature: -55°C to +150°C Maximum Thermal Resistance :10°C/W Junction To Lead Maximum Thermal Resistance :55°C/W Junction To Ambiemt Device Marking SK32 SK33 SK34 SK35 SK36 SK38 SK310 Maximum Recurrent Peak Reverse Voltage 20V 30V 40V 50V 60V 80V 100V IF(AV) IFSM Maximum RMS Voltage 14V 21V 28V 35V 42V 56V 70V Maximum DC Blocking Voltage 20V 30V 40V 50V 60V 80V 100V 3 Amp Schottky Rectifier 20 to 100 Volts DO-214AB (SMC) (LEAD FRAME) A Maximum Ratings MCC Catalog Number SK32 SK33 SK34 SK35 SK36 SK38 SK310 B C F H D G E Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current Peak Forward Surge Current Maximum Instantaneous Forward Voltage SK32-34 SK35-36 SK38-310 3.0A TL = 100°C 8.3ms, half sine DIM A B C D E F G H DIMENSIONS INCHES MIN .260 .220 .006 .030 .305 .079 .108 .002 MM MIN 6.60 5.59 0.15 0.76 7.75 2.00 2.75 0.050 100A MAX .280 .245 .012 .060 .320 .103 .128 .008 MAX 7.11 6.22 0.31 1 ..52 8.13 2.62 3.25 0.203 NOTE VF .50V .75V .85V IFM = 3.0A; TJ = 25°C* SUGGESTED SOLDER PAD LAYOUT 0.190 Maximum DC Reverse Current At Rated DC Blocking Voltage Typical Junction Capacitance IR CJ .5mA 20mA 250pF TJ = 25°C TJ = 100°C 0.125” Measured at 1.0MHz, VR=4.0V 0.070” *Pulse test: Pulse width 200 µsec, Duty cycle 2% Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7. www.mccsemi.com Revision: B 1 of 4 2011/07/04 SK32 thru SK310 Figure 1 Typical Forward Characteristics 100 60 40 20 SK32-SK34 10 6 4 2 Amps 1 .5 .6 .4 .2 .1 .06 .04 .02 .01 .2 .4 .6 .8 Volts Instantaneous Forward Current - Amperesversus Instantaneous Forward Voltage - Volts 1.0 1.2 1.4 25°C 0 Single Phase, Half Wave 60Hz Resistive or Inductive Load 40 60 80 100 °C Average Forward Rectified Current - Amperes versus Lead Temperature - °C 120 140 160 1.5 Amps 1.0 SK35-36 SK38-SK310 2.0 2.5 3.0 TM Micro Commercial Components Figure 2 Forward Derating Curve Figure 3 Junction Ca pacitance 100 600 400 200 pF 100 60 40 20 10 .1 .2 .4 1 Volts 2 4 10 20 40 100 200 400 1000 TJ =25°C Junction Capacitance - pF versus Reverse Voltage - Volts www.mccsemi.com Revision: B 2 of 4 2011/07/04 SK32 thru SK310 Figure 4 Typical Reverse Characteristics 10 6 4 2 1 .6 .4 .2 mAmps .1 0 .06 .04 .02 .01 .006 .004 .002 .001 20 40 60 80 Volts Instantaneous Reverse Leakage Current - MicroAmperesversus Percent Of Rated Peak Reverse Voltage - Volts 100 120 140 SK32-34 SK35-310 1 2 4 6 8 10 Cycles Peak Forward Surge Current - Amperesversus Number Of Cycles At 60Hz - Cycles 20 40 60 80 100 75°C Amps 25°C 75 50 25 100°C Figure 5 Peak Forward Surge Current 150 125 100 TM Micro Commercial Components Figure 6 Thermal Impedance Characteristics Transient Thermal Impedance [ºC/W] 100 10 1 0.1 0.01 0.1 1 10 Pulse Duration [s] 100 www.mccsemi.com Revision: B 3 of 4 2011/07/04 Ordering Information : Device Part Number-TP Packing Tape&Reel: 3Kpcs/Reel ***IMPORTANT NOTICE* ** Revision: B 2011/07/04