XBP06V4E2HR-G

XBP06V4E2HR-G is Discontinued. XBP06V4E2HR-G ETR2902-005 Transient Voltage Suppressor (TVS) ■GENERAL DESCRIPTION ■APPLICATIONS Two elements in USP-3 package (Anode Common) ESD protection High ESD Ta=25℃ SYMBOL RATINGS UNITS Peak Pulse Power (*1) Ppk 70 W Power Dissipation Pd Junction Temperature Storage Temperature Range ESD Durability (*3)(*4) Contact Discharge 120 1000(*2) 1.2±0.08 mW Tj 150 ℃ Tstg -55～+150 ℃ Vpp 30 kV 1pin INDENT 0.6MAX PARAMETER ■PACKAGING INFORMATION 1.2±0.08 ■ABSOLUTE MAXIMUM RATINGS (*1): tp=8/20μs (*2): This is a reference data taken by using the test board. (*3): Test Condition IEC61000-4-2 Standard (*4): Criterion： No damage to device elements (0.6) 0.2±0.1 ■MARKING RULE 0.3±0.05 2 1 ① ② ③ (R0.1) (R0.05) ④⑤：Lot Number ■PIN CONFIGURATION 1 3 3 1.0±0.1 3 3 Cathode 2. Cathode 3. Anode (unit : mm) USP-3 Package 2 1. 0.2±0.05 ④ ⑤ (0.05) 0.7±0.1 ①②③：BP1(Product Number) ■PRODUCT NAME PRODUCT NAME PACKAGE ORDER UNIT XBP06V4E2HR-G USP-3 3,000/Reel * BOTTOM VIEW * The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. ■ ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL TEST CONDITION Ta=25℃ MIN. LIMITS TYP. MAX. UNITS Breakdown Voltage VBR IR =5mA 6.4 6.8 7.2 V Leakage Current IRM VRM=5V - - 1.0 μA Forward Voltage VF IF=10mA - - 1.25 V Inter-Terminal Capacity Ct VR=0V, f=1MHz - 40 - pF 1/4 XBP06V4E2HR-G XBP06V4E2HR-G is Discontinued. ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Reverse Current vs. Breakdown Voltage (2) Reverse Current vs. Reverse Voltage 100 1 Reverse Current　IR (uA) Reverse Current　IR (mA) 10 75℃ 1 25℃ Ta=125℃ 0.1 -25℃ 0.01 0.001 0.1 0.01 -25℃ 0.001 5.5 6.0 6.5 7.0 7.5 8.0 0 1 Breakdown Voltage　VBR (V) 3 4 5 6 (4) Reverse Current vs. Operating Temperature 10 8.0 7.5 Reverse Current　IR (uA) Breakdown Voltage　VBR (V) 2 Reverse Voltage　VR (V) (3) Breakdown Voltage vs. Operating Temperature IR=5mA 7.0 6.5 6.0 1 VR=5.25V 0.1 5V 0.01 3V 5.5 5.0 -50 0 50 100 150 0.001 -50 0 50 100 150 Operating Temperature　Ta (℃) Operating Temperature　Ta (℃) (5) Inter-Terminal Capacity vs. Reverse Voltage (6) Forward Current vs. Forward Voltage 100 100 f=1MHz 90 80 Forward Current　IF (mA) Inter-Terminal Capacity　Ct (pF) 25℃ 0.0001 5.0 70 60 50 40 30 Ta=25℃ 20 Ta=125℃ 10 75℃ 1 25℃ -25℃ 0.1 10 0.01 0 0 1 2 3 4 Reverse Voltage　VR (V) 2/4 75℃ Ta=125℃ 5 6 0 0.2 0.4 0.6 0.8 Forward Voltage　VF (V) 1 1.2 XBP06V4E2HR-G XBP06V4E2HR-G is Discontinued. ■PACKAGING INFORMATION ● 　 USP-3 Power Dissipation Power dissipation data for the USP-3 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area in top and back faces. 　 Package heat-sink is tied to the copper traces. Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 　 　 Evaluation Board (Unit: mm) Power Dissipation vs. Ambient temperature 　　　　　 Board Mount (Tj max = 150℃) Ambient Temperature (℃) Power Dissipation Pd (mW) 25 1000 150 0 Thermal Resistance (℃/W) 125.00 Pd-Ta特性グラフ Pd vs. Ta Power Dissipation: Pd (mW) 許容損失Pd（mW） 2. 1200 1000 800 600 400 200 0 25 50 75 100 125 150 周囲温度Ta（℃） Ambient Temperature: Ta (℃) 3/4 XBP06V4E2HR-G XBP06V4E2HR-G is Discontinued. 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 4/4