XBP15SRV05W-G
Low Capacitance TVS Diode Array
■FEATURES
Terminal Capacitance
ESD Protection
Environmentally Friendly
ETR29020-002
■APPLICATIONS
: 1.2pF (Line-to-GND)
: 10kV Contact (IEC61000-4-2)
: EU RoHS Compliant, Pb Free
●USB 2.0, Firewire
●Video Graphics Card
●DVI
●Ethernet 10/100/1000
■APPLICATION CIRCUIT
VBUS
D+
DGND
USB 2.0
Controller
1
6
2
5
3
4
VBUS
D+
DGND
■PRODUCT NAME
PRODUCT NAME
PACKAGE
ORDER UNIT
XBP15SRV05W-G *
SOT-26P
3,000pcs/Reel
* The “-G” suffix denotes Halogen and Antimony free as well as being fully
EU RoHS compliant.
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XBP15SRV05W-G
■PIN CONFIGURATION
I/O 1
1
6
I/O 4
GND
2
5
NF
I/O 2
3
4
I/O 3
SOT-26P
(Top View)
■PIN ASSIGNMENT
PIN NUMBER
SOT-26P
PIN NAME
1
I/O 1
ESD protection
2
GND
Ground
3
I/O 2
ESD protection
4
I/O 3
ESD protection
5
NF
6
I/O 4
FUNCTION
No Function
(The NF pin should be floated.)
ESD protection
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNIT
Junction Temperature
Tj
125
℃
Storage Temperature
Tstg
-55 to +150
℃
IEC61000-4-2 (ESD) Air
VESD_A
±15
kV
IEC61000-4-2 (ESD) Contact
VESD_C
±10
kV
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XBP15SRV05W-G
■ELECTRICAL CHARACTERISTICS
Ta=25℃
PARAMETER
SYMBOL
Stand-Off Voltage
Breakdown Voltage
TEST CONDITIONS
VRWM
MIN.
TYP.
MAX.
UNIT
-
-
5
V
VBR
IR=1mA, I/O pin to Pin2
6
-
-
V
Leakage Current
IR
VR=5V, I/O pin to Pin2
-
-
5
μA
Clamping Voltage (8/20μs)
VC
IPP=3A, I/O pin to Pin2
-
-
10
V
-
1.0
1.2
pF
-
0.5
0.6
pF
Ct
Terminal Capacitance
Ct
VR=0V, f=1MHz
Between I/O pin to Pin2
VR=0V, f=1MHz
Between I/O pins
■NOTES ON USE
1. Please use this IC within the absolute maximum ratings.
Even within the ratings, in case of high load use continuously such as high temperature, high voltage, high current and thermal stress may
cause reliability degradation of the IC.
2. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems.
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XBP15SRV05W-G
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Clamping Voltage vs. Peak Pulse Current
(2) Terminal Capacitance vs. Reverse Voltage (I/O to Pin2)
(3) Reverse Current vs. Reverse Voltage
(4) Transmission Line Pulse (TLP) Measurement
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XBP15SRV05W-G
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
OUTLINE / LAND PATTERN
SOT-26P
SOT-26P PKG
■MARKING
①
②
①②:
Control Number
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XBP15SRV05W-G
1.
The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2.
The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3.
Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4.
The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5.
Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6.
Our products are not designed to be Radiation-resistant.
7.
Please use the product listed in this datasheet within the specified ranges.
8.
We assume no responsibility for damage or loss due to abnormal use.
9.
All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
6/6
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