XBS304F11R-G

XBS304F11R-G ETR16028-001 Schottky Barrier Diode, 3A, 40V Type ■FEATURES Low Forward voltage Environmentally Friendly ■APPLICATIONS ●Rectification ●Protection against reverse connection of battery : EU RoHS Compliant ■ PACKAGING INFORMATION ■PRODUCT NAME PRODUCT NAME PACKAGE ORDER UNIT XBS304F11R-G * SMA-PG 1,800/Reel ●SMA-PG Unit : inch (mm) * The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. * The high-melting solder paste (lead-containing) is used as attachment. ■MARKING ①②③④⑤⑥⑦⑧: Control Number ■ABSOLUTE MAXIMUM RATINGS PARAMETER Ta=25℃ SYMBOL RATINGS UNITS Repetitive Peak Reverse Voltage VRM 40 V Reverse Voltage (DC) VR 40 V IF(AV) 3 A IFSM 50 A Junction Temperature Tj 125 ℃ Storage Temperature Tstg -55 to +150 ℃ Forward Current (Average) at Ta=75℃ Non Continuous Forward Surge Current (8.3 ms single half-sine wave) Ta=25℃ ■ELECTRICAL CHARACTERISTICS LIMITS PARAMETER Forward Voltage SYMBOL TEST CONDITIONS UNITS MIN. TYP. MAX. IF=1A - - 0.35 VF2 IF=3A - - 0.45 V IR1 VR=20V 1 mA IR2 VR=40V 2 mA VF１ V Reverse Current 1/5 XBS304F11R-G ■ TYPICAL PERFORMANCE CHARACTERISTICS (1) Forward Current vs. Forward Voltage (2) Reverse Current vs. Reverse Voltage 100 10 Ta=100℃ Reverse Current: IR (mA) Ta=125℃ Forward Current: IF (A) 1 75℃ 25℃ 0.1 -25℃ 0.01 0.001 10 75℃ 1 25℃ 0.1 0.01 0.001 0 0.2 0.4 0 0.6 20 30 40 Reverse Voltage: VR (V) Forward Voltage: VF (V) (3) Terminal Capacitance vs. Reverse Voltage (4) Average Forward Current vs. Operating Temperature 1000 5 Average Forward Current: IF(AVE) (A) Terminal Capacitance: Ct (pF) 10 800 600 400 200 4 3 2 1 0 0 0 10 20 30 40 Reverse Voltage: VR (V) 0 50 100 150 Operating Temperature: Ta (℃) ■NOTES ON USE 1. Please use this IC within the absolute maximum ratings. Even within the ratings, in case of high load use continuously such as high temperature, high voltage, high current and thermal stress may cause reliability degradation of the IC. 2. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 2/5 XBS304F11R-G ■REFERENCE PATTERN LAYOUT ●SMA-PG Unit : inch (mm) 3/5 XBS304F11R-G ■TAPING SPECIFICATIONS ●SMA-PG Note: 1. There shall be leader of 230mm minimum which may consist of carrier and or cover tape follower by a minimum of 160mm of carrier tape sealded with cover tape. 2. There shall be minimum of 160mm of empty component pockets sealded with cover tape. SYMBOL 4/5 mm d 1.55 ± 0.05 D 178.0 ± 2.0 D1 min. 50.0 D2 13.0 ± 0.2 E 1.75 ± 0.10 F 5.50 ± 0.10 P 4.00 ± 0.10 P0 4.00 ± 0.10 P1 2.00 ± 0.10 W 12.0 ± 0.3 W1 13.4 ± 1.0 XBS304F11R-G 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 5/5