◆CMOS ◆Highly Accurate:±1% (VDF=2.6V~5.0V) ±2% (VDF=0.8V~6.0V) ◆Low Power Consumption: 0.7μA (VIN=1.5V)
■APPLICATIONS
●Microprocessor reset circuitry ●Memory battery back-up circuits ●Power-on reset circuits ●Power failure detection ●System battery life and charge voltage monitors
■GENERAL DESCRIPTION
The XC61C series are highly precise, low power consumption voltage detectors, manufactured using CMOS and laser trimming technologies. Detect voltage is extremely accurate with minimal temperature drift. Both CMOS and N-channel open drain output configurations are available.
■FEATURES
Highly Accurate : ± 2% (Low Voltage VD: 0.8V~1.5V) (Standard Voltage VD: 1.6V~6.0V) ± 1% (Standard Voltage VD: 2.6V~5.0V) Low Power Consumption : 0.7μA (TYP.) [VIN=1.5V] Detect Voltage Range :0.8V ~ 6.0V in 100mV increments Operating Voltage Range :0.7V ~ 6.0V (Low Voltage) 0.7V～10.0V (Standard Voltage) Detect Voltage Temperature Characteristics : ±100ppm/℃ (TYP.) @Ta=25 OC Output Configuration : N-channel open drain or CMOS Ultra Small Packages : SSOT-24 (150mW) SOT-23 (250mW) SOT-25 (250mW) SOT-89 (500mW) TO-92 (300mW) USP-6B (100mW) USP-6C (100mW) USP-4 (120mW)
■TYPICAL APPLICATION CIRCUITS
■TYPICAL PERFORMANCE CHARACTERISTICS
XC61C ETR0201_004
1/19
XC61C Series
■PIN CONFIGURATION
NC 6 VIN 5 NC 4 1 VSS 2 NC 3 VOUT
USP-6C (BOTTOM VIEW) VSS VOUT 2 1 USP-4 SOT-25 (TOP VIEW) （BOTTOM VIEW） 3 NC
4 VIN
*Please use the circuit without connecting the heat dissipation pad. If the pad needs to be connected to other pins, it should be connected to the VIN pin.
■PIN ASSIGNMENT
PIN NUMBER SSOT-24 SOT-23 SOT-25 SOT-89 TO-92 (T) TO-92 (L) USP-6B USP-6C 2 4 1 3 3 2 1 2 3 1 4, 5 2 3 1 2 3 1 1 2 3 5 1 3 2,4,6 5 1 3 2,4,6 USP-4 4 2 1 3 PIN NAME VIN VSS VOUT NC FUNCTION Supply Voltage t I t Ground Output No Connection
■PRODUCT CLASSIFICATION
●Ordering Information
XC61C①②③④⑤⑥⑦ DESIGNATOR ① ②③ ④ ⑤ DESCRIPTION Output Configuration Detect Voltage Output Delay Detect Accuracy SYMBOL C N 08 ~ 60 0 1 2 N M P S T L D E G R L H B DESCRIPTION : CMOS output : N-ch open drain output : e.g.0.9V → ②0, ③9 : e.g.1.5V → ②1, ③5 : No delay : Within ±1% : Within ±2% : SSOT-24 (SC-82) : SOT-23 : SOT-89 : SOT-25 : TO-92 (Standard) : TO-92 (Custom pin configuration) : USP-6B : USP-6C : USP-4 : Embossed tape, standard feed : Embossed tape, reverse feed : Paper type (TO-92) : Bag (TO-92)
⑥
Package
⑦
Device Orientation
2/19
XC61C
Series
■PACKAGING INFORMATION
●SSOT-24 (SC-82)
●SOT-23
●SOT-25
3/19
XC61C Series
■PACKAGING INFORMATION (Continued)
●SOT-89
●TO-92
4/19
XC61C
Series
■PACKAGING INFORMATION (Continued)
●USP-6C
●USP-4
* Soldering fillet surface is not formed because the sides of the pins are plated.
5/19
XC61C Series
■MARKING RULE
● SSOT-24, SOT-23, SOT-25, SOT-89, USP-4
4
① ②
3
④
① Represents integer of detect voltage and CMOS Output (XC61CC series) MARK A B C D E F H CONFIGURATION CMOS CMOS CMOS CMOS CMOS CMOS CMOS VOLTAGE (V) 0.X 1.X 2.X 3.X 4.X 5.X 6.X
1
2
3
① ② ③④
N-Channel Open Drain Output (XC61CN series) MARK K L M N P R S CONFIGURATION N-ch N-ch N-ch N-ch N-ch N-ch N-ch VOLTAGE (V) 0.X 1.X 2.X 3.X 4.X 5.X 6.X
1
2
5
① ②
4
③④
②Represents decimal number of detect voltage MARK 0 1 2 3 4 VOLTAGE (V) X.0 X.1 X.2 X.3 X.4 MARK 5 6 7 8 9 VOLTAGE (V) X.5 X.6 X.7 X.8 X.9
1
2
SOT-25
3
(TOP VIEW)
②
④
③Represents delay time (Except for SSOT-24)
MARK DELAY TIME No Delay Time PRODUCT SERIES XC61Cxxx0xxx
3
①
③
1
2
3
④Represents production lot number Based on the internal standard. (G, I, J, O, Q, W excepted)
USP-4 (TOP VIEW)
6/19
XC61C
Series
■MARKING RULE (Continued)
●TO-92
①Represents output configuration MARK C N OUTPUT CONFIGURATION CMOS N-ch
②, ③Represents detect voltage (ex.) MARK ② 3 5 ③ 3 0 VOLTAGE (V) 3.3 5.0
④Represents delay time MARK DELAY TIME 0 MARK 1 2 No delay DETECT VOLTAGE ACCURACY Within ± 1% (Semi-custom) Within ± 2% ⑤Represents detect voltage accuracy
⑥Represents a least significant digit of production year MARK 5 6 PRODUCTION YEAR 2005 2006
⑦Represents production lot number 0 to 9, A to Z repeated. (G, I, J, O, Q, W excepted) * No character inversion used.
●USP-6B, USP-6C
①, ②Represents product series MARK ① 1 ② C PRODUCT SERIES XC61Cxxx0xDx
③Represents output configuration MARK
USP-6B (TOP VIEW)
OUTPUT CONFIGURATION CMOS N-ch
PRODUCT SERIES XC61CCxx0xDx XC61CNxx0xDx
C N
④, ⑤Represents detect voltage (ex.) MARK ④ 3
USP-6C (TOP VIEW)
⑤ 3 0
VOLTAGE (V) 3.3 5.0
PRODUCT SERIES XC61Cx330xDx XC61Cx500xDx
5
⑥Represents production lot number 0 to 9, A to Z repeated (G, I, J, O, Q, W excepted) Note: No character inversion used.
7/19
XC61C Series
■BLOCK DIAGRAMS
(1) CMOS Output (2) N-ch Open Drain Output
■ABSOLUTE MAXIMUM RATINGS
Ta = 25OC
PARAMETER Input Voltage Output Current CMOS Output Voltage N-ch Open Drain Output *1 VOUT N-ch Open Drain Output *2 SSOT-24 SOT-23 SOT-25 SOT-89 Power Dissipation TO-92 USP-6B USP-6C USP-4 Operating Temperature Range Storage Temperature Range *1: Low voltage: VDF(T)=0.8V~1.5V *2: Standard voltage: VDF(T)=1.6V~6.0V *1 *2 SYMBOL VIN IOUT RATINGS 9.0 12.0 50 VSS -0.3 ~ VIN +0.3 VSS -0.3 ~ 9.0 VSS -0.3 ~ 12.0 150 250 250 500 300 100 100 120 -40～+85 -40～+125 V UNITS V mA
Pd
mW
Topr Tstg
O O
C C
8/19
XC61C
Series
■ELECTRICAL CHARACTERISTICS
VDF (T) = 0.8V to 6.0V ± 2% VDF (T) = 2.6V to 5.0V ± 1% PARAMETER Detect Voltage SYMBOL VDF MIN. VDF(T) x 0.98 VDF(T) VDF(T)=2.6V~5.0V *2 x 0.99 VDF x 0.02 VIN = 1.5V VIN = 2.0V VIN = 3.0V VIN = 4.0V VIN = 5.0V VDF(T) = 0.8V to 1.5V 0.7 VDF(T) = 1.6V to 6.0V 0.7 VIN = 0.7V 0.10 N-ch VDS = 0.5V 0.85 VIN = 1.0V VIN = 6.0V CMOS, P-ch VDS = 2.1V VIN = 1.0V 1.0 VIN = 2.0V 3.0 N-ch VDS = 0.5V VIN = 3.0V 5.0 VIN = 4.0V 6.0 7.0 VIN = 5.0V CMOS, P-ch VDS = 2.1V VIN = 8.0V VIN=6.0V, VOUT=6.0V*1 CMOS VIN=10.0V, VOUT=10.0V*2 N-ch Open Drain -40℃ ≦ Topr ≦ 85℃ Inverts from VDR to VOUT CONDITIONS VDF(T)=0.8V~1.5V *1 VDF(T)=1.6V~6.0V *2 TYP. VDF(T) VDF(T) VDF x 0.05 0.7 0.8 0.9 1.0 1.1 0.80 2.70 -7.5 2.2 7.7 10.1 11.5 13.0 -10.0 10 10 ±100 0.03 MAX. VDF(T) x 1.02 VDF(T) x 1.01 VDF x 0.08 2.3 2.7 3.0 3.2 3.6 6.0 10.0 -1.5 -2.0 100 0.20 Ta=25℃ UNITS CIRCUITS V V V 1 1 1
Hysteresis Range
VHYS
Supply Current
ISS
μA
2
Operating Voltage *1 Operating Voltage *2 Output Current *1
VIN
V
1 3 4
IOUT Output Current *2
mA 3
4 nA ppm/ ℃ ms 3 5
Leak Current
Ileak
Temperature ΔVDF Characteristics ΔTopr･VDF Delay Time tDLY (VDR→VOUT inversion)
NOTE: *1: Low Voltage: VDF(T)=0.8V~1.5V *2: Standard Voltage: VDF(T)=1.6V~6.0V VDF (T): Setting detect voltage Release Voltage: VDR = VDF + VHYS
9/19
XC61C Series
■OPERATIONAL EXPLANATION
(Especially prepared for CMOS output products)
① When input voltage (VIN) rises above detect voltage (VDF), output voltage (VOUT) will be equal to VIN. (A condition of high impedance exists with N-ch open drain output configurations.) ② When input voltage (VIN) falls below detect voltage (VDF), output voltage (VOUT) will be equal to the ground voltage (VSS) level. ③ When input voltage (VIN) falls to a level below that of the minimum operating voltage (VMIN), output will become unstable. In this condition, VIN will equal the pulled-up output (should output be pulled-up.) ④ When input voltage (VIN) rises above the ground voltage (VSS) level, output will be unstable at levels below the minimum operating voltage (VMIN). Between the VMIN and detect release voltage (VDR) levels, the ground voltage (VSS) level will be maintained. ⑤ When input voltage (VIN) rises above detect release voltage (VDR), output voltage (VOUT) will be equal to VIN. (A condition of high impedance exists with N-ch open drain output configurations.) ⑥ The difference between VDR and VDF represents the hysteresis range.
●Timing Chart
10/19
XC61C
Series
■NOTES ON USE
1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device. 2. When a resistor is connected between the VIN pin and the input with CMOS output configurations, oscillation may occur as a result of voltage drops at RIN if load current (IOUT) exists. (refer to the Oscillation Description (1) below) 3. When a resistor is connected between the VIN pin and the input with CMOS output configurations, irrespective of N-ch output configurations, oscillation may occur as a result of through current at the time of voltage release even if load current (IOUT) does not exist. (refer to the Oscillation Description (2) below ) 4. With a resistor connected between the VIN pin and the input, detect and release voltage will rise as a result of the IC's supply current flowing through the VIN pin. 5. In order to stabilize the IC's operations, please ensure that VIN pin's input frequency's rise and fall times are more than several µ sec / V. 6. Please use N-ch open drains configuration, when a resistor RIN is connected between the VIN pin and power source. In such cases, please ensure that RIN is less than 10kΩ and that C is more than 0.1µF.
●Oscillation Description
(1) Output current oscillation with the CMOS output configuration When the voltage applied at IN rises, release operations commence and the detector's output voltage increases. Load current (IOUT) will flow at RL. Because a voltage drop (RIN x IOUT) is produced at the RIN resistor, located between the input (IN) and the VIN pin, the load current will flow via the IC's VIN pin. The voltage drop will also lead to a fall in the voltage level at the VIN pin. When the VIN pin voltage level falls below the detect voltage level, detect operations will commence. Following detect operations, load current flow will cease and since voltage drop at RIN will disappear, the voltage level at the VIN pin will rise and release operations will begin over again. Oscillation may occur with this " release - detect - release " repetition. Further, this condition will also appear via means of a similar mechanism during detect operations. (2) Oscillation as a result of through current Since the XC61C series are CMOS IC S, through current will flow when the IC's internal circuit switching operates (during release and detect operations). Consequently, oscillation is liable to occur as a result of drops in voltage at the through current's resistor (RIN) during release voltage operations. (refer to Figure 3) Since hysteresis exists during detect operations, oscillation is unlikely to occur.
11/19
XC61C Series
100kΩ*
12/19
XC61C
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
●Low Voltage
13/19
XC61C Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
●Low Voltage (Continued)
(4) N-ch Driver Output Current vs. VDS ＸＣ６１ＣＣ０９０２ (０.９Ｖ)
1.4 1.4 Ta=25℃
ＸＣ６１ＣＣ１１０２(１.１Ｖ)
3.0 Ta=25℃
ＸＣ６１ＣＣ１１０２(１.１Ｖ)
Ta=25℃
Output Current: IOUT (mA)
Output Current: IOUT (mA)
Output Current: IOUT (mA)
1.2 1.0 0.8 0.6 0.4 0.2 0 0
1.2 1.0 0.8 0.6 0.4 0.2 0 0
VIN =0.8V
VIN =0.8V
2.5 2.0 1.5 1.0 0.5 0
VIN =1.0V
0.7V
0.7V
0.2
0.4
0.6
0.8
1.0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
VDS (V)
VDS (V)
VDS (V)
ＸＣ６１ＣＣ１５０２(１.５Ｖ)
1.4 8.0 Ta=25℃ VIN =0.8V
ＸＣ６１ＣＣ１５０２(１.５Ｖ)
Ta=25℃
Output Current: IOUT (mA)
Output Current: IOUT (mA)
1.2 1.0 0.8 0.6 0.4 0.2 0 0
VIN =1.4V 6.0 1.2V
4.0
0.7V
2.0
1.0V
0.2
0.4
0.6
0.8
1.0
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
VDS (V)
VDS (V)
(5) N-ch Driver Output Current vs. Input Voltage ＸＣ６１ＣＣ０９０２ (０.９Ｖ) ＸＣ６１ＣＣ１１０２ (１.１Ｖ)
2.5 5.0 10
ＸＣ６１ＣＣ１５０２(１.５Ｖ)
Output Current: IOUT (mA)
VDS=0.5V 8 6 4 2 0 Ta=-40℃ 25℃
Output Current: IOUT (mA)
2.0 1.5 1.0 0.5 0
Output Current: IOUT (mA)
VDS=0.5V
VDS=0.5V 4.0
Ta=-40℃ 25℃
3.0 2.0 80℃ 1.0 0
Ta=85℃ 25℃ -40℃ 0 0.2 0.4 0.6 0.8 1.0
85℃
0
0.2
0.4
0.6
0.8
1.0
1.2
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
Input Voltage: VIN (V)
(6) P-ch Driver Output Current vs. Input Voltage ＸＣ６１ＣＣ０９０２ (０.９Ｖ)
12 12 Ta= 25℃ VDS=2.1V Ta= 25℃
ＸＣ６１ＣＣ１１０２ (１.１Ｖ)
12 VDS=2.1V 1.5V 1.0V 0.5V
ＸＣ６１ＣＣ１５０２ (１.５Ｖ)
Output Current: IOUT (mA)
10 8 6 4 2 0 Ta= 25℃ VDS=2.1V 1.5V 1.0V 0.5V
Output Current: IOUT (mA)
8 6 4 2 0
1.5V 1.0V 0.5V
Output Current: IOUT (mA)
10
10 8 6 4 2 0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
Input Voltage: VIN (V)
14/19
XC61C
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
●Standard Voltage
(1) Supply Current vs. Input Voltage ＸＣ６１ＣＣ１８０２ (１.８Ｖ）
3.5 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 2 4 6 -40℃ 8 10 25℃ Ta=85℃ 3.0 2.5 2.0 1.5 1.0 0.5 0 0 2 4 6 -40℃ 8 10 25℃ Ta=85℃
ＸＣ６１ＣＣ２７０２ (２.７Ｖ)
Supply Current: ISS (μA)
Input Voltage: VIN (V)
Supply Current: ISS (μA)
Input Voltage: VIN (V)
ＸＣ６１ＣＣ３６０２ (３.６Ｖ)
3.5 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 2 4 6 8 10 -40℃ 25℃ Ta=85℃ 3.0 2.5 2.0 1.5 1.0 0.5 0
ＸＣ６１ＣＣ４５０２ (４.５Ｖ)
Supply Current: ISS (μA)
Supply Current: ISS (μA)
25℃
Ta=85℃
-40℃
0
2
4
6
8
10
Input Voltage: VIN (V)
Input Voltage: VIN (V)
(2) Detect, Release Voltage vs. Ambient Temperature ＸＣ６１ＣＣ１８０２ (１.８Ｖ)
Detect, Release Voltage: VDF, VDR (V) Detect, Release Voltage: VDF, VDR (V)
1.90 2.80 VDR 2.75
ＸＣ６１ＣＣ２７０２ (２.７Ｖ)
1.85
VDR
1.80 VDF
2.70 VDF
1.75 -50
-25
0
25
50
75
100
2.65 -50
-25
0
25
50
75
100
Ambient Temperature : Ta (℃)
Ambient Temperature : Ta (℃)
ＸＣ６１ＣＣ３６０２ (３.６Ｖ)
3.8 4.7
ＸＣ６１ＣＣ４５０２ (４.５Ｖ)
Detect, Release Voltage: VDF, VDR (V)
VDR 4.6
Detect, Release Voltage: VDF, VDR (V)
VDR 3.7
3.6 VDF 3.5 -50
4.5 VDF
-25
0
25
50
75
100
4.4 -50
-25
0
25
50
75
100
Ambient Temperature : Ta (℃)
Ambient Temperature : Ta (℃)
15/19
XC61C Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
●Standard Voltage (Continued)
(3) Output Voltage vs. Input Voltage ＸＣ６１ＣＮ１８０２ （１.８V)
2 3
ＸＣ６１ＣＮ２７０２ （２.７Ｖ)
Output Voltage: VOUT (V)
Ta=25℃ 2
Output Voltage: VOUT (V)
Ta=25℃
1
1
0
0
1
2
0
0
1
2
3
Input Voltage: VIN (V)
Input Voltage: VIN (V)
ＸＣ６１ＣＮ３６０２ (３.６V)
4 5
ＸＣ６１ＣＮ４５０２ (４.５V)
Output Voltage: VOUT (V)
Ta=25℃ 4 3 2 1 0
Output Voltage: VOUT (V)
Ta=25℃ 3
2
1
0
0
1
2
3
4
0
1
2
3
4
5
Input Voltage: VIN (V) Note : The N-channel open drain pull up resistance value is 100k Ω. . open drain pull up resistance value is 100k Ω
Input Voltage: VIN (V)
(4) N-ch Driver Output Current vs. VDS ＸＣ６１ＣＣ１８０２ (１.８Ｖ)
10 Ta=25℃ VIN =1.5V 30 Ta=25℃
ＸＣ６１ＣＣ２７０２ (２.７V)
Output Current: I OUT (mA)
25 20 2.0V 15 10 1.5V 5 1.0V 0 0 0.5 1.0 1.5 2.0 2.5 3.0 VIN =2.5V
Output Current: I OUT (mA)
8 6 4 1.0V 2 0
0
0.5
1.0
1.5
2.0
VDS (V)
VDS (V)
80 ＸＣ６１ＣＣ４５０２ (４.５V) Ta=25℃ 80 70 Ta=25℃ VIN =4.0V 70 60 VIN =4.0V 60 3.5V 50 3.5V 50 40 3.0V 40 3.0V 30 2.5V 30 2.5V 20 20 2.0V 2.0V 10 1.5V 10 1.5V 0 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VDS (V) VDS (V)
ＸＣ６１ＣＣ３６０２ (３.６Ｖ)
40
XC61CC4502 (4.5V品 )
Output Current: I OUT (mA)
30 2.5V 20 2.0V 10 1.5V 0 0 0.5 1.0 1.5 2.0 2.5 3.0
VDS (V)
16/19
Output Current: I OUT (mA)
Ta=25℃
VIN =3.0V
XC61C
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
●Standard Voltage (Continued)
(4) N-ch Driver Output Current vs. VDS ＸＣ６１ＣＣ１８０２ (１.８V)
1000 Ta=25℃ VIN =0.8V 1000
ＸＣ６１ＣＣ２７０２ （２.７V)
Output Current: IOUT (μA)
Ta=25℃ 800 600 400 200 0 VIN =0.8V
Output Current: IOUT (μA)
800 600 0.7V 400 200 0
0.7V
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
VDS (V)
VDS (V)
ＸＣ６１ＣＣ３６０２ (３.６V)
1000 Ta=25℃ 1000
ＸＣ６１ＣＣ４５０２ (４.５V)
Ta=25℃
Output Current: IOUT (μA)
Output Current: IOUT (μA)
800 600 400 200 0
VIN =0.8V
800 600 400 200 0
VIN =0.8V
0.7V
0.7V
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
VDS (V)
VDS (V)
(5) N-ch Driver Output Current vs. Input Voltage ＸＣ６１ＣＣ１８０２ (１.８V)
15 VDS=0.5V 25
ＸＣ６１ＣＣ２７０２ (２.７V)
VDS=0.5V
Output Current: IOUT (mA)
Output Current: IOUT (mA)
Ta=-40℃
Ta=-40℃
20 25℃ 15 10 85℃ 5 0
10
25℃
5 85℃ 0
0
0.5
1.0
1.5
2.0
0
0.5
1.0
1.5
2.0
2.5
3.0
Input Voltage: VIN (V)
Input Voltage: VIN (V)
ＸＣ６１ＣＣ３６０２ (３.６V)
30 VDS=0.5V 40
ＸＣ６１ＣＣ４５０２ (４.５V)
VDS=0.5V
Output Current: IOUT (mA)
25 20 15 10 5 0
Output Current: IOUT (mA)
Ta=-40℃ 25℃
Ta=-40℃ 25℃
30
20 85℃
85℃
10
0
1
2
3
4
0
0
1
2
3
4
5
Input Voltage: VIN (V)
Input Voltage: VIN (V)
17/19
XC61C Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
●Standard Voltage (Continued)
(6) P-ch Driver Output Current vs. Input Voltage ＸＣ６１ＣＣ１８０２ (１.８V)
15 VDS=2.1V 15 VDS=2.1V
ＸＣ６１ＣＣ２７０２ (２.７V)
Output Current: IOUT (mA)
Output Current: IOUT (mA)
10
1.5V
1.5V 10 1.0V 5
1.0V 5
0.5V
0.5V
0 0 2 4 6 8 10
0 0 2 4 6 8 10
Input Voltage: VIN (V)
Input Voltage: VIN (V)
ＸＣ６１ＣＣ３６０２ (３.６V)
15 VDS=2.1V 15
ＸＣ６１ＣＣ４５０２ (４.５V)
VDS=2.1V
Output Current: IOUT (mA)
Output Current: IOUT (mA)
10
1.5V 1.0V
10
1.5V
1.0V 5
5
0.5V
0.5V
0 0 2 4 6 8 10
0 0 2 4 6 8 10
Input Voltage: VIN (V)
Input Voltage: VIN (V)
18/19
XC61C
Series
1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this catalog is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this catalog. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this catalog. 4. The products in this catalog are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this catalog within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this catalog may be copied or reproduced without the prior permission of Torex Semiconductor Ltd.
19/19
