XC6201P302MR-G

XC6201 Series ETR0301-007 Positive Voltage Regulators ■GENERAL DESCRIPTION The XC6201 series are highly precise, low power consumption, positive voltage regulators manufactured using CMOS and laser trimming technologies. The series provides large currents with a significantly small dropout voltage. The XC6201 consists of a current limiter circuit, a driver transistor, a precision reference voltage and an error amplifier. Output voltage is selectable in 0.1V steps between 1.3V ~ 6.0V. SOT-25, SOT-89 and USP-6B packages are available. ■APPLICATIONS ■FEATURES ●Smart phones / Mobile phones Maximum Output Current : 250mA (TYP.) ●Portable game consoles Dropout Voltage : 0.16V @ 100mA ●Digital still cameras / Camcorders : 0.40V @ 200mA Maximum Operating Voltage ●Digital audio equipment : 10V Output Voltage Range : 1.3V ~ 6.0V (0.1V increments) ●Reference voltage sources Fixed Voltage Accuracy : ±1% (VOUT(T)>2.0V) ±2% ●Multi-function power supplies Low Power Consumption : 2.0μA (TYP.) Operating Ambient Temperature : -40℃ ~ 85℃ Packages : SOT-25, SOT-89 Environmentally Friendly USP-6B : EU RoHS Compliant, Pb Free Tantalum or Ceramic Capacitor compatible ■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE CHARACTERISTICS ●Supply Current vs. Input Voltage XC6201P332 1/27 XC6201 Series ■BLOCK DIAGRAM ■PRODUCT CLASSIFICATION ●Ordering Information X C 6 2 0 1 P ③④⑤⑥⑦-⑧(*1) ① ② DESIGNATOR ITEM SYMBOL ① Product Number 01 - ② Type of Regulator P 3-pin regulator ③④ Output Voltage 13～60 ⑤ Output Voltage Accuracy ⑥⑦-⑧ (*1) e.g. 30:3.0V 50:5.0V 1 ±1% 2 ±2% MR Packages (Order Unit) DESCRIPTION SOT-25 (3,000pcs/Reel) MR-G SOT-25 (3,000pcs/Reel) PR SOT-89 (1,000pcs/Reel) PR-G SOT-89 (1,000pcs/Reel) DR USP-6B (3,000pcs/Reel) DR-G USP-6B (3,000pcs/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. * +1% accuracy can be set at VOUT(T) > 2.0V. 2/27 XC6201 Series ■PIN CONFIGURATION NC VIN VSS NC VOUT NC *The dissipation pad for the USP-6B package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VSS (No.5) pin. ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTION 3 VOUT Output 2 5 VSS Ground 3 1 VIN Power Input － 2,4,6 NC No Connection SOT-25 SOT-89 USP-6B 5 1 2 1 3, 4 ■ABSOLUTE MAXIMUM RATINGS Ta = 25℃ PARAMETER SYMBOL RATINGS UNITS Input Voltage Output Current Output Voltage SOT-25 Power SOT-89 Dissipation USP-6B Operating Temperature Storage Temperature VIN IOUT VOUT 12.0 500 VSS-0.3～VIN+0.3 250 500 120 -40～+85 -55～+125 V mA V Pd Topr Tstg mW ℃ ℃ 3/27 XC6201 Series ■ELECTRICAL CHARACTERISTICS XC6201P132 VOUT(T)=1.3V (*1) PARAMETER Ta=25℃ SYMBOL Output Voltage VOUT(E) (*2) Maximum Output Current IOUTmax Load Regulation △VOUT Dropout Voltage (*3) Supply Current Line Regulation Input Voltage Output Voltage Temperature Characteristics XC6201P182 Vdif1 Vdif2 ISS △VOUT △VIN･△VOUT VIN △VOUT △Topr･△VOUT MIN. TYP. MAX. UNITS CIRCUIT 1.274 1.300 1.326 V ② 60 - - mA ② - 10 30 mV ② - 200 500 2.0 600 810 5.0 mV ② μA ① - 0.2 0.3 ％/V ② 1.8 - 10 V - IOUT=40mA -40℃≦Topr≦85℃ - ±100 - ppm/℃ ② CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT 1.764 1.800 1.836 V ② 80 - - mA ② - 10 30 mV ② - 200 450 2.0 370 710 5.0 mV ② μA ① - 0.2 0.3 %/V ② 1.8 - 10 V - - ±100 - ppm/℃ ② Ta=25℃ SYMBOL Output Voltage VOUT(E) (*2) Maximum Output Current IOUTmax Load Regulation △VOUT Dropout Voltage (*3) Supply Current Line Regulation Input Voltage Output Voltage Temperature Characteristics Vdif1 Vdif2 ISS △VOUT △VIN･△VOUT VIN △VOUT △Topr･△VOUT VIN=2.8V IOUT=40mA VIN=2.8V VOUT(E)≧1.62V VIN=2.8V 1mA≦IOUT≦40mA IOUT=40mA IOUT=80mA VIN=2.8V IOUT=40mA 2.8V≦VIN≦10.0V IOUT=40mA -40℃≦Topr≦85℃ VOUT(T)=2.7V (*1) Ta=25℃ PARAMETER SYMBOL Output Voltage VOUT(E) (*2) Maximum Output Current IOUTmax Load Regulation △VOUT Dropout Voltage (*3) Supply Current Line Regulation Input Voltage Output Voltage Temperature Characteristics 4/27 VIN=2.3V IOUT=10mA VIN=2.3V VOUT(E)≧1.17V VIN=2.3V 1mA≦IOUT≦30mA IOUT=30mA IOUT=60mA VIN=2.3V IOUT=10mA 2.3V≦VIN≦10.0V VOUT(T)=1.8V (*1) PARAMETER XC6201P272 CONDITIONS Vdif1 Vdif2 ISS △VOUT △VIN･△VOUT VIN △VOUT △Topr･△VOUT CONDITIONS VIN=3.7V IOUT=40mA VIN=3.7V VOUT(E)≧2.43V VIN=3.7V 1mA≦IOUT≦60mA IOUT=60mA IOUT=120mA VIN=3.7V IOUT=40mA 3.7V≦VIN≦10.0V IOUT=40mA -40℃≦Topr≦85℃ MIN. TYP. MAX. UNITS CIRCUIT 2.646 2.700 2.754 V ② 100 - - mA ② - 15 40 mV ② - 200 450 2.0 370 710 5.0 mV ② μA ① - 0.2 0.3 ％/V ② 1.8 - 10 V - - ±100 - ppm/℃ ② XC6201 Series ■ELECTRICAL CHARACTERISTICS (Continued) XC6201P332 VOUT(T)=3.3V (*1) Ta=25℃ PARAMETER SYMBOL Output Voltage VOUT(E) (*2) Maximum Output Current IOUTmax Load Regulation △VOUT Dropout Voltage (*3) Supply Current Line Regulation Input Voltage Output Voltage Temperature Characteristics XC6201P502 Vdif1 Vdif2 ISS △VOUT △VIN･△VOUT VIN △VOUT △Topr･△VOUT CONDITIONS VIN=4.3V IOUT=40mA VIN=4.3V VOUT(E)≧2.97V VIN=4.3V 1mA≦IOUT≦80mA IOUT=80mA IOUT=160mA VIN=4.3V IOUT=40mA 4.3V≦VIN≦10.0V MIN. TYP. MAX. UNITS CIRCUIT 3.234 3.300 3.366 V ② 150 - - mA ② - 20 50 mV ② - 200 450 2.0 360 700 5.0 mV ② μA ① - 0.2 0.3 ％/V ② 1.8 - 10 V - IOUT=40mA -40℃≦Topr≦85℃ - ±100 - ppm/℃ ② CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT 4.900 5.000 5.100 V ② 200 - - mA ② - 30 70 mV ② - 160 400 2.0 340 600 6.0 mV ② μA ① - 0.2 0.3 ％/V ② 1.8 - 10 V - - ±100 - ppm/℃ ② VOUT(T)=5.0V (*1) Ta=25℃ PARAMETER SYMBOL Output Voltage VOUT(E) (*2) Maximum Output Current IOUTmax Load Regulation △VOUT Dropout Voltage (*3) Supply Current Line Regulation Input Voltage Output Voltage Temperature Characteristics Vdif1 Vdif2 ISS △VOUT △VIN･△VOUT VIN △VOUT △Topr･△VOUT VIN=6.0V IOUT=40mA VIN=6.0V VOUT(E)≧4.57V VIN=6.0V 1mA≦IOUT≦100mA IOUT=100mA IOUT=200mA VIN=6.0V IOUT=40mA 6.0V≦VIN≦10.0V IOUT=40mA -40℃≦Topr≦85℃ NOTE: *1: VOUT(T) = Nominal output voltage. *2: VOUT(E) = Effective output voltage (i.e. the output voltage when “VOUT(T)+1.0V” is provided while maintaining a certain IOUT value). *3: Vdif = (VIN1- VOUT1) VIN1 :An Input Voltage when VOUT1 appears as the input voltage is gradually decreased. VOUT1 : A voltage equal to 98% of the output voltage when a stabilized (VOUT(T) + 1.0V) is input. 5/27 XC6201 Series ■TEST CIRCUITS Circuit ① : Supply Current Circuit ② : Output Voltage, Oscillation, Line Regulation, Dropout Voltage, Load Regulation 6/27 XC6201 Series ■OPERATIONAL EXPLANATION (Tantalum) (Tantalum) With the XC6201 series regulator, in order to ensure the stabilized output voltage, we suggest that an output capacitor (CL) of 1μF or more be connected between the output pin (VOUT) and the VSS pin. For using low ESR capacitor (e.g. ceramic capacitors), please make sure that the output voltage is more than 1.7V. When the output voltage is from 1.3V to 1.6V, the output capacitor should be a tantalum capacitor with a capacitance of 2.2μF. We also suggest an input capacitor (CIN) should be connected between the VIN and the VSS in order to stabilize input power source. OUTPUT VOLTAGE CIN CL (TANTALUM) CL (LOW ESR) 1.3V～1.6V ≧1.0μF ≧2.2μF － 1.7V～6.0V ≧1.0μF ≧1.0μF ≧1.0μF VIN=1.8V~10V,VOUT=1.7~6.0V CIN=1.0μF(Ceramic),CL=1.0μF(ceramic) 7/27 XC6201 Series ■ NOTE ON USE 1. Please use this IC within the stated absolute maximum ratings. The IC is liable to malfunction should the ratings be exceeded. When a voltage higher than the VIN flows to the VOUT like when using two power supplies, please connect a Schottky barrier diode between the VOUT and the VIN and do not exceed the VOUT rating. 2. An oscillation may occur by the impedance between a power supply and the input of the IC. Where the impedance is 10Ωor more, please use an input capacitor (CIN) of at least 1μF. In case of high output current, operation can be stabilized by increasing the input capacitor value. Also an oscillation may occur if the input capacitor value is smaller than the input impedance when the output capacitance (CL) is large. In such cases, operations can be stabilized by either increasing the input capacitor value or reducing the output capacitor value. 3. Please ensure that output current (IOUT) is less than Pd / (VIN - VOUT) and do not exceed the rated power dissipation value (Pd) of the package. 8/27 XC6201 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Output Voltage vs. Output Current 9/27 XC6201 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (2) Output Voltage vs. Input Voltage XC6201P132 XC6201P182 XC6201P272 10/27 XC6201P132 XC6201P182 XC6201P272 XC6201 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (2) Output Voltage vs. Input Voltage (Continued) XC6201P332 XC6201P502 XC6201P332 XC6201P502 11/27 XC6201 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Dropout Voltage vs. Output Current XC6201P132 XC6201P182 XC6201P272 XC6201P332 XC6201P502 12/27 XC6201 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (4) Supply Current vs. Input Voltage XC6201P132 XC6201P132 XC6201P182 13/27 XC6201 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (4) Supply Current vs. Input Voltage (Continued) XC6201P332 14/27 XC6201 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (5) Output Voltage vs. Ambient Temperature 15/27 XC6201 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) Supply Current vs. Ambient Temperature 16/27 XC6201 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) Input Transient Response XC6201P132 XC6201P182 Time (1ms/div) Time (1ms/div) XC6201P272 XC6201P332 Time (1ms/div) Time (1ms/div) XC6201P502 Time (1ms/div) 17/27 XC6201 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Load Transient Response XC6201P132 Time (2ms/div) XC6201P272 Time (2ms/div) XC6201P502 Time (2ms/div) 18/27 XC6201P182 Time (2ms/div) XC6201P332 Time (2ms/div) XC6201 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Ripple Rejection Rate XC6201P132 XC6201P272 XC6201P182 XC6201P332 XC6201P502 XC6201P502 (10) Output Noise Density XC6201P302 19/27 XC6201 Series ■PACKAGING INFORMATION ●SOT-25 ●SOT-25 Reference Pattern Layout Unit : mm 2.9±0.2 0.7 +0.1 0.4 -0.05 5 4 2 0.2MIN 3 0.15 (0.95) 2.4 1 2.8±0.2 1.6 +0.2 -0.1 0～0.1 +0.1 -0.05 1.3MAX 1.1±0.1 1.0 1.9±0.2 0.95 Unit : mm ●SOT-89 Reference Pattern Layout 0.8 0.8 1.5 20/27 0.8 1.5 1.45 0.85 1.2 1.4 4.4 ●SOT-89 0.95 XC6201 Series ■PACKAGING INFORMATION (Continued) ●USP-6B Unit : mm ●USP-6B Reference Pattern Layout ●USP-6B Reference Metal Mask Design 21/27 XC6201 Series ● SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition 40.0 Condition： Mount on a board Ambient ： Natural convection 28.9 Soldering： Lead (Pb) free Board： Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material： Glass Epoxy (FR-4) Thickness ： 1.6mm Through-hole： 4 x 0.8 Diameter 1.4 2.54 Evaluation Board (Unit：mm) 2.Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃ ) Ambient Temperature（℃） Power Dissipation Pd（ mW ） 25 600 85 240 Thermal Resistance (℃/ W ) 166.67 Power Dissipation Pd (mW) Pd vs. Ta 700 600 500 400 300 200 100 0 25 45 65 85 Ambient Temperature Ta (℃) 22/27 105 125 XC6201 Series ●　SOT-89 Power Dissipation Power dissipation data for the SOT-89 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition： Mount on a board Ambient ： Natural convection Soldering： Lead (Pb) free Board： Dimensions 40 x 40 mm (1600 mm2 in one side) area In top and back faces 40.0 28.9 Copper (Cu) traces occupy 50% of the board Package heat-sink is tied to the copper traces Material： Glass Epoxy (FR-4) Thickness ： 1.6mm 2.5 Through-hole： 5 x 0.8 Diameter Evaluation Board (Unit： mm) 2.Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃ ) Ambient Temperature（℃） Power Dissipation Pd（ mW ） 25 1000 85 400 Thermal Resistance (℃/ W ) 100.00 Pd vs Ta Power Dissipation Pd (mW 1200 1000 800 600 400 200 0 25 45 65 85 105 125 Ambient Temperature Ta (℃) 23/27 XC6201 Series ●　USP- 6 B Powe r Dissipation Power dissipation data for theUSP-6B is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition： Mount on a board Ambient ： Natural convection Soldering： Lead (Pb) free Board： Dimensions 40 x 40 mm Copper (Cu) traces occupy 50% of the board 40.0 28.9 (1600 mm2 in one side) area In top and back faces Package heat-sink is tied to the copper traces Material： Glass Epoxy (FR-4) Thickness ： 1.6mm 2.5 Through-hole： 4 x 0.8 Diameter Evaluation Board (Unit：mm) 2.Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃ ) Ambient Temperature（℃） Power Dissipation Pd（ mW ） Thermal Resistance (℃/ W ) 25 85 1000 400 100.00 Pd vs. Ta Power Dissipation Pd (mW) 1200 1000 800 600 400 200 0 25 45 65 85 Ambient Temperature Ta (℃) 24/27 105 125 XC6201 Series ■MARKING RULE ●SOT-89, SOT-25 ② ④ ① ③ ① represents the product series MARK PRODUCT SERIES 1 XC6201xxxxxx ② represents type of regulator 1 2 3 SOT-89 (TOP VIEW) 5 MARK Voltage= 0.1 ~ 3.0V 5 8 PRODUCT SERIES Voltage= 3.1 ~ 6.0V 6 9 XC6201Pxxxxx XC6201TxxxPx 4 ③ represents output voltage ① 1 ② ③ ④ 2 SOT-25 (TOP VIEW) 3 MARK OUTPUT VOLTAGE (V) MARK OUTPUT VOLTAGE (V) 0 － 3.1 － F 1.6 4.6 － 1 － 3.2 － H 1.7 4.7 － 2 － 3.3 － K 1.8 4.8 － 3 － 3.4 － L 1.9 4.9 － 4 － 3.5 － M 2.0 5.0 － 5 － 3.6 － N 2.1 5.1 － 6 － 3.7 － P 2.2 5.2 － 7 － 3.8 － R 2.3 5.3 － 8 － 3.9 － S 2.4 5.4 － 9 － 4.0 － T 2.5 5.5 － A － 4.1 － U 2.6 5.6 － B 4.2 － V 2.7 5.7 － C － 1.3 4.3 － X 2.8 5.8 － D 1.4 4.4 － Y 2.9 5.9 － E 1.5 4.5 － Z 3.0 6.0 － ④ represents assembly lot number 0 to 9, A to Z repeated (G, I, J, O, Q, W excluded) 25/27 XC6201 Series ■MARKING RULE (Continued) ●USP-6B ①② represents product series ③ represents type of regulator USP-6B (TOP VIEW) MARK TYPE PRODUCT SERIES P 3pin Regulator XC6201PxxxDx T VIN=7V(Rated) XC6201TxxxDx ④⑤ represents output voltage MARK VOLTAGE (V) PRODUCT SERIES 3 3.3 XC6201x33xDx 0 5.0 XC6201x50xDx ④ ⑤ 3 5 ⑥ represents assembly lot number 0 to 9, A to Z repeated (G, I, J, O, Q, W excluded) Note: No character inversion used. 26/27 XC6201 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 27/27