XC6351A035MR-G

XC6351A Series ETR08001-004c Charge Pump Voltage Inverter IC ■ GENERAL DESCRIPTION The XC6351A series are charge pump voltage inverter ICs that have 4 MOSFETs built in. Since highly efficient negative voltages can be generated with only 2 external capacitors connected, GaAs bias power supplies & OpAmp's negative power supplies etc., can be easily accommodated on a standard PCB. A mini-molded, SOT-26 and USP-6B packages provides for space saving and makes high density mounting possible. Low power consumption and high efficiency make this series perfect for use with battery operated applications. Since the IC's operations stop when output is shutdown via the CE (chip enable) function, total power consumption reduction is possible in applications which use this IC. ■APPLICATIONS ■FEATURES ●Negative power supplies Operating Voltage Range ●Power supplies for Opamp ●Cellular and portable phones Oscillation Frequency ●Various battery powered systems : 120kHz : 35kHz (custom) Low Supply Current : 310μA (TYP.) : 100μA (35kHz custom TYP.) ●Miniature LCD panels ●PDAs : 1.2V ~ 5.0V High Efficiency : 90% (TYP.) ( RL = 2kΩ) Stand-by Current : 2.0μA (MAX.) CE(Chip Enable) Function Operating Ambient Temperature : -30°C ~ 80°C Packages : SOT-26 ,USP-6B Environmentally Friendly : EU RoHS Compliant, Pb Free ■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE CHARACTERISTICS 1/9 XC6351A Series ■BLOCK DIAGRAM C1+ C1- P1 V IN N2 N3 N4 V OUT Chip Enable CE/ Oscillator Buffer Note: 1. In operation, the following conditions will be repeated alternately: P1 & N3 ON: N2 & N4 OFF P1 & N3 OFF: N2 & N4 ON 2. In standby mode, P1, N3 & N4 will be ON and N2 will be OFF. The output pin VOUT will be connected to GND. GND ■PRODUCT CLASSIFICATION ●Ordering Information XC6351A ①②③④⑤-⑥(*1) DESIGNATOR DESCRIPTION ①②③ Oscillation Frequency ④⑤-⑥ (*1) SYMBOL 120 120kHz 035 35kHz (custom) MR-G DR-G Packages Taping Type DESCRIPTION SOT-26 (3,000pcs/Reel) USP-6B (3,000pcs/Reel) The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully EU RoHS compliant. ■PIN CONFIGURATION GND C1- CE VIN C1+ VOUT ■PIN ASSIGNMENT PIN NUMBER SOT-26 USP-6B 1 6 2 5 3 4 4 3 5 2 6 1 SYMBOL GND CE/ C1+ VOUT VIN C1- ; FUNCTION Ground Chip Enable (Low Active) External Capacitor +Pin Reverse Output Power Supply External Capacitor -Pin ■PIN FUNCTIOS ASSIGNMENT 2/9 CE/PIN STATUS H L Stand-by Active *The dissipation pad for the USP-6B package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VIN (No. 2) pin. XC6351A Series ■ABSOLUTE MAXIMUM RATINGS PARAMETER VIN Input Voltage VOUT Pin Voltage C1+ Pin Voltage C1- Pin Voltage CE/ Pin Voltage VOUT Pin Current SYMBOL VIN VOUT C1+ C1CE/ IOUT SOT-26 Power Dissipation Pd USP-6B Operating Temperature Range Storage Temperature Range Topr Tstg RATINGS 6.0 -6.0 ~ 0.3 -0.3 ~ VIN + 0.3 VOUT - 0.3 ~ 0.3 -0.3 ~ VIN + 0.3 50 150 (IC only) 600 (40mm x 40mm Standard board ) (*1) 100 (IC only) 1000 (40mm x 40mm Standard board ) (*1) -30 ~ 80 -40 ~ 125 Ta = 25℃ UNITS V V V V V mA mW ℃ ℃ Each rating voltage is based on the GND. (*1) This is a reference data taken by using the test board. Please see the power dissipation page for the mounting condition. ■ELECTRICAL CHARACTERISTICS fosc＝120kHz, Ta=25℃ PARAMETER Supply Current SYMBOL IDD CONDITIONS MIN. - TYP. 310 Operating Voltage Range VIN RL＝5kΩ 1.2 - Oscillation Frequency fOSC 75 120 MAX. 520 UNITS μA CIRCUIT 1 5.0 V 2 192 kHz 1 Power Transition Efficiency EFFI RL＝2kΩ - 90 - % 2 Voltage Transition Efficiency VEFFI RL＝∞ 95 - - % 2 Output Impedance ROUT RL＝5kΩ - 45 90 Ω 2 Stand -by Current ISTB CE/＝VIN - - 2.0 μA 3 CE/ 'H' Level Voltage VCEH 0.9 - - V 3 CE/ 'L' Level Voltage VCEL - - 0.25 V 3 Measuring Conditions: Unless otherwise stated, VIN = 5.0V, CE/ = 0V fosc＝35kHz, Ta=25℃ PARAMETER Supply Current SYMBOL IDD CONDITIONS MIN. - TYP. 100 MAX. 170 Operating Voltage Range VIN RL＝5kΩ Oscillation Frequency fOSC UNITS μA CIRCUIT 1 1.2 - 21 35 5.0 V 2 56 kHz 1 Power Transition Efficiency EFFI RL＝2kΩ - 90 - % 2 Voltage Transition Efficiency VEFFI RL＝∞ 95 - - % 2 Output Impedance ROUT RL＝5kΩ - 45 90 Ω 2 Stand -by Current ISTB CE/＝VIN - - 2.0 μA 3 CE/ 'H' Level Voltage VCEH 0.9 - - V 3 CE/ 'L' Level Voltage VCEL - - 0.25 V 3 Measuring Conditions: Unless otherwise stated, VIN = 5.0V, CE/ = 0V 3/9 XC6351A Series ■TEST CIRCUITS External components: CIN = 1μF (ceramic capacitor) C1 = C2 = 1μF (ceramic capacitor)* * With the custom 35kHz frequency, C1 = C2 = 3.3μF 4/9 XC6351A Series ■ TYPICAL APPLICATION CIRCUIT ●Standard Circuit External components: CIN = 1μF (ceramic capacitor) C1 = C2 = 1μF (ceramic capacitor)* * With the custom 35kHz frequency, C1 = C2 = 3.3 μF ■ NOTES ON USE 1. Please use the IC & external components: within the specified electrical characteristics range and ensure that absolute maximum ratings are not exceeded. 2. For C1 & C2, please use a capacitor with as small an ESR value as possible. 3. In order to reduce impedance between the IC's input pin and the power supply, we recommend that a capacitor (CIN) be connected to the input side. 4. If an external power supply is applied to the output pin in order to have VOUT connected to GND during standby, large current flows through the IC are a possibility. Further, do not use a capacitor at C2 that has a large capacitance value. 5/9 XC6351A Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Output Voltage vs. Output Current (2) Efficiency vs. Output Current 6/9 (4) Oscillation Frequency vs. Input Voltage fosc fosc (3) Oscillation Frequency vs. Ambient Temperature XC6351A Series ■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLINE / LAND PATTERN THERMAL CHARACTERISTICS SOT-26 SOT-26 PKG SOT-26 Power Dissipation USP-6B USP-6B PKG USP-6B Power Dissipation 7/9 XC6351A Series ■MARKING RULE ① represents product series ●SOT-26 MARK PRODUCT SERIES A XC6351AxxxMx-G ②,③ represents oscillation frequency MARK SOT-26 (TOP VIEW) ② ③ 0 1 3 2 OSCILLATION FREQUENCY PRODUCT SERIES 35kHz 120kHz XC6351A035MR-G XC6351A120MR-G ④ represents production lot number 0 to 9, A to Z repeated (G, I, J, O, Q, W excluded) ①,②,③ represents product series ●USP-6B MARK 1 ④ ① 6 2 ⑤ ② 5 ⑥ ③ 3 4 ① ② ③ 5 1 A PRODUCT SERIES XC6351AxxxDR-G ④,⑤ represents oscillation frequency MARK ④ ⑤ OSCILLATION FREQUENCY PRODUCT SERIES 0 1 3 2 35kHz 120kHz XC6351A035DR-G XC6351A120DR-G ⑥ represents production lot number 0 to 9,A to Z repeated (G, I, J, O, Q, W excluded) Note: No character inversion used. 8/9 XC6351A Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 9/9