XC8102_1

XC8102 Series Load Switch with Low On-Resistance ETR2502-006a ■GENERAL DESCRIPTION The XC8102 series is a low ON resistance load switch IC with ON/OFF control and output current protection which integrates a P-channel MOSFET. By connecting the XC8102 to the output pin of a step-down DC/DC converter, the CE pin controls ON/OFF for each distribution switch to deliver power per requirements and maximize total power efficiency. As a result, the XC8102 helps to extend battery life and product operation time. The series contains a current limit and protection circuit so these are not required externally unlike discrete circuit solutions where MOSFETs and resistors are used. When a low signal is input to the CE pin, the series enters stand-by mode. Even where a load capacitor is connected to the output pin during stand-by, the electric charge stored at the load capacitor is discharged through the internal switch. As a result, the VOUT pin voltage falls quickly to the VSS level. The series contains over current protection with fold-back current circuitry which operates as over current protection and short circuit protection for the output pin. ■APPLICATIONS ● Mobile phones, Smart phones ● Digital still cameras, Digital video cameras ● Portable game consoles ● Portable equipment ■FEATURES On Resistance : 0.28Ω@ VIN=6.0V (TYP.) : 0.31Ω@ VIN=4.0V (TYP.) : 0.35Ω@ VIN=2.9V (TYP.) : 0.52Ω@ VIN=1.8V (TYP.) : 0.60Ω@ VIN=1.5V (TYP.) : 0.80Ω@ VIN=1.2V (TYP.) : 1.2V∼6.0V : 3.0μA@ VIN=1.2V : 3.6μA@ VIN=2.9V : 4.0μA@ VIN=6.0V : 0.1μA :Current limit(Output Current) 480mA (TYP.) (1.8≦VIN≦6.0V) : Short-circuit Protection, Short current= 30mA (TYP.) : High Active Enable Input Voltage Range Power Consumption Stand-by Current Protection Circuit ON/OFF Function High-Speed Discharge Function Operating Temperature Range : -40℃∼+85℃ Packages : USP-4,SSOT-24, SOT-25 USPN-4 Environmentally Friendly : EU RoHS Compliant, Pb Free ■TYPICAL APPLICATION CIRCUIT VIN VOUT DC/DC OUT 2.1V ■ TYPICAL PERFORMANCE CHARACTERISTICS ●On Resistance vs. Input Voltage XC8102AA01M/XC8102AA01G VIN=CE IOUT=50mA CIN=None,CL=None 1.0 VIN CE CIN ON/OFF Control VOUT IN Step Down Li-ion 3.6V XC8102 VSS CL CPU DC/DC XC9235 XC8102 CE CIN ON/OFF Control CPU ON Resistance : RON (Ω VIN VOUT VSS CL IN 0.8 0.6 0.4 0.2 0.0 Ta=85℃ 　 25℃ 　　 - 40℃ VIN CE CIN ON/OFF Control VOUT IN XC8102 VSS CL CPU 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage : VIN (V) 1/19 XC8102 Series ■PIN CONFIGURATION *The heat dissipation pad of the USP-4 package is recommended to solder as shown in the recommended mount pattern and metal mask pattern for mounting strength. The heat dissipation pad should be electrically opened or connected to the VSS (No. 2) pin. ■PIN ASSIGNMENT PIN NUMBER USP-4 4 1 2 3 − SOT-25 1 5 2 3 4 SSOT-24 4 3 2 1 − USPN-4 4 1 2 3 PIN NAME VIN VOUT VSS CE NC FUNCTIONS Power Input Output Ground ON/OFF Control No Connection ■PRODUCT CLASSIFICATION ●Ordering Information XC8102①②③④⑤⑥-⑦(*1) DESIGNATOR ① ② ③④ DESCRIPTION CE pin logic CL Discharge Function Internal Standard Number SYMBOL A A 01 GR-G ⑤⑥-⑦ Packages Taping Type (*2) MR-G NR-G 7R-G (*1) (*2) DESCRIPTION CE High active Output capacitor (CL) auto-discharge function integrated Fixed USP-4 SOT-25 SSOT-24 USPN-4 The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or representative. (Standard orientation: ⑤R-⑦, Reverse orientation: ⑤L-⑦) 2/19 XC8102 Series ■FUNCTION CHART SERIES XC8102AA01 CE High Low IC OPERATIONAL STATUS ON/OFF ON OFF ■BLOCK DIAGRAM ●XC8102AA Series VIN VOUT GATE CONTROL Current Limit Rdischg CE ON/OFF Control each circuit CE/ VSS XC8102AAシリーズ * Diodes inside the circuit are an ESD protection diode and a parasitic diode. ■ABSOLUTE MAXIMUM RATINGS PARAMETER Input Voltage Output Current Output Voltage CE Input Voltage USP-4 SSOT-24 Power Dissipation SOT-25 USPN-4 Operating Temperature Range Storage Temperature Range SYMBOL VIN IOUT VOUT VCE Pd RATINGS VSS-0.3∼+6.5 850* VSS-0.3∼VIN VSS-0.3∼+6.5 120 150 250 100 -40∼+85 -55∼+125 UNITS V mA V V mW o o Topr Tstg C C * Please make sure that IOUT is less than Pd/ (VIN-VOUT) 3/19 XC8102 Series ■ELECTRICAL CHARACTERISTICS ●XC8102AA Series PARAMETER Input Voltage SYMBOL VIN VIN =6.0V, VCE=VIN VIN =4.0V, VCE=VIN On Resistance (SSOT-24/USPN-4) RON VIN =2.9V, VCE=VIN VIN =1.8V, VCE=VIN VIN =1.5V, VCE=VIN VIN =1.2V, VCE=VIN VIN =6.0V, VCE=VIN VIN =4.0V, VCE=VIN On Resistance (SOT-25/USP-4) RON VIN =2.9V, VCE=VIN VIN =1.8V, VCE=VIN VIN =1.5V, VCE=VIN VIN =1.2V, VCE=VIN VIN =6.0V, VCE=VIN, VOUT=OPEN VIN =4.0V, VCE=VIN, VOUT=OPEN Supply Current IDD VIN =2.9V, VCE=VIN, VOUT=OPEN VIN =1.8V, VCE=VIN, VOUT=OPEN VIN =1.5V, VCE=VIN, VOUT=OPEN VIN =1.2V, VCE=VIN, VOUT=OPEN Stand-by Current Switch Leakage Current ISTBY ILEAK VIN =6.0V, VCE=VSS, VOUT=OPEN VIN =6.0V, VCE=VSS, VOUT=0V VIN≧2.9V, VOUT = VIN -0.8V Current Limit ILIM 1.8V≦VIN＜2.9V, VOUT = VIN -0.6V 1.5V≦VIN＜1.8V, VOUT =1.2V 1.2V≦VIN＜1.5V, VOUT =1.0V Short Circuit Current CE High Level Voltage CE Low Level Voltage CE High Level Current CE Low Level Current CL Auto-Discharge Resistance Turn On Time Turn Off Time NOTE: *1: Time to reach 90% of VOUT after VCE entering the VCEH threshold. *2: Time to fall to 10% of VOUT after VCE entering the VCEL threshold. (*1) (*2) Ta=25℃ CONDITIONS MIN. 1.2 400 400 200 90 1.1 VCE=VIN VCE=VSS VIN=4.0V, VOUT=4.0V, VCE=VSS VIN =4.0V, VCE=0.3V→1.2V, RL=80Ω, without CIN, CL VIN =4.0V, VCE=1.2V→0.3V, RL=80Ω, without CIN, CL -0.1 -0.1 380 TYP. 0.28 0.31 0.35 0.52 0.60 0.80 0.35 0.38 0.43 0.59 0.67 0.87 4.0 3.8 3.6 3.4 3.2 3.0 0.01 0.01 480 480 30 480 8.5 3.0 MAX. 6.0 0.425 0.475 0.475 0.625 0.80 1.60 0.475 0.525 0.525 0.675 0.85 1.65 7.0 6.5 6.3 5.7 5.5 4.9 0.10 0.10 75 6.0 0.3 0.1 0.1 570 18 7.5 mA V V μA μA Ω μs μs ① ③ ③ ③ ③ ④ ⑤ ⑤ mA ① μA μA ② ② μA ② Ω ① Ω ① UNITS V CIRCUITS - ISHORT VCEH VCEL ICEH ICEL RDCHG tDLY(ON) tDLY(OFF) VCE=VIN, VOUT=0V 4/19 XC8102 Series ■TEST CIRCUITS Circuit ① VIN VOUT A IOUT Ishort V CE VSS V Circuit ② Circuit ③ 5/19 XC8102 Series ■TEST CIRCUITS (Continued) Circuit ④ Circuit ⑤ The measurement point of wave form The measurement point of wave form RL 6/19 XC8102 Series ■OPERATIONAL EXPLANATION The XC8102 enables an output P-channel MOSFET switch and the IC internal circuitry to turn off by the signal to the CE pin. In the shutdown mode, the VOUT pin will be pulled down to the VSS by the CL auto-discharge function. The output voltage becomes unstable when the CE pin is opened. If the input voltage to the CE pin is within the specified threshold voltages, the logic is fixed and the XC8102 will operate normally. However, supply current may increase as a result of the shoot-through current of internal circuitry when the medium level voltage is input to the CE pin. ＜Input/Output Capacitor＞ The XC8102 works well without an input and output capacitors. Also, an output capacitor of the power source can be used as an input capacitor of the XC8102 and a bypass capacitor of the driving IC can be used as an output capacitor of the XC8102. The XC8102AA contains a CL auto-discharge resistor and an N-channel transistor between the VOUT pin and the VSS pin. The device quickly discharge the electric charge in the output capacitor (CL) when a low signal to the CE pin is input to turn off a whole IC circuit. The CL auto-discharge resistance is set at 480Ω (VOUT=4.0V TYP. @ VIN=4.0). Discharge time of the output capacitor (CL) is determined by a CL auto-discharge resistor value (Rdischg) and an output capacitor value. Time constant τ is defined as (τ = C x Rdischg). Output voltage after starting discharge can be calculated by the following formula. V = VOUT x e –t/τ, or t=τIn (VOUT / V) V: Output voltage after starting discharge, VOUT: Output voltage, t : Discharge time, τ: Output discharge resistor value Rdischg×Output capacitor (CL) value C The XC8102 series contains a constant current limiter and fold-back current circuitry. The constant current limiter operates to limit output current and the fold-back current circuitry operates as short circuit protection for the output pin. When the load current reaches the limit current, the constant current limiter operates and the output voltage drops. The output voltage further, then the fold-back current circuitry operates to decrease the output current. When the output pin is short-circuited to the ground, the output current drops and maintains a flow about 30mA. ■NOTES ON USE 1. 2. 3. 4. Please use this IC within the stated absolute maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device. The X8102 goes into an undefined operation when the CE pin is left open. The CE pin shall be tied to low or high level. VOUT pin voltage should not be applied beyond the VIN pin voltage. The IC may get damage due to the reverse current toward the VIN pin. Current limit function is integrated. However, power dissipation may be beyond the limit before starting a fold-back current protection when used in high temperature. For the power dissipation of each package, please refer to the graphs of Package Power vs. Operating Temperature in page 15 to 18. 7/19 XC8102 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) ON Resistance vs. Input Voltage XC8102AA01N/XC8102AA017 VIN=CE IOUT=50mA CIN=None,CL=None 1.0 ON Resistance : RON ( Ω 0.8 0.6 0.4 0.2 0.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage : VIN (V) ON Resistance : RON ( Ω Ta=85℃ 　 25℃ 　　 - 40℃ 1.0 0.8 0.6 0.4 0.2 0.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage : VIN (V) Ta=85℃ 　 25℃ 　　 - 40℃ XC8102AA01M/XC8102AA01G VIN=CE IOUT=50mA CIN=None,CL=None (2) ON Resistance vs. Ambient Temperature XC8102AA01M/XC8102AA01G VIN=CE IOUT=50mA CIN=None,CL=None 1.0 ON Resistance : RON ( Ω 0.8 0.6 0.4 0.2 6.0V 0.0 -50 -25 0 25 50 75 100 Ambient Temp : Ta ( ℃) 4.0V 2.9V ON Resistance : RON ( Ω VIN=1.2V 1.5V 1.0 VIN=1.2V 0.8 0.6 0.4 0.2 6.0V 0.0 -50 -25 0 25 50 75 100 Ambient Temp : Ta (℃) 4.0V 1.5V 1.8V XC8102AA01N/XC8102AA017 VIN=CE IOUT=50mA CIN=None,CL=None 1.8V 2.9V (3) Supply Current vs. Input Voltage (4) Supply Current vs. Ambient Temperature XC8102AA01 VIN=CE CIN=None,CL=None 5.0 Supply Current : IDD (uA) 4.0 3.0 2.0 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage : VIN (V) Ta=85℃ 　　 25℃ 　　 -40℃ Supply Current : IDD (uA) 5.0 4.0 3.0 2.0 1.0 0.0 -50 -25 0 XC8102AA01 VIN=CE CIN=None,CL=None VIN=1.2V 　　　 1.5V 　　　 1.8V 　　　 2.9V 　　　 4.0V 　　　 6.0V 25 50 75 100 Ambient Temp : Ta ( ℃) 8/19 XC8102 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (5) Output Voltage vs. Output Current XC8102AA01M/XC8102AA01G VIN=CE=1.2V CIN=None,CL=None 5.0 Output Voltage : VOUT (V) Output Voltage : VOUT (V) 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Ta=85℃ 　　 25℃ 　　 - 40℃ 5.0 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Ta=85℃ 　　 25℃ 　　 -40℃ XC8102AA01M/XC8102AA01G VIN=CE=1.5V CIN=None,CL=None XC8102AA01M/XC8102AA01G VIN=CE=1.8V CIN=None,CL=None 5.0 Output Voltage : VOUT (V) 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) Ta=85℃ 　　 25℃ 　　 -40℃ 5.0 4.0 3.0 2.0 1.0 0.0 0 100 XC8102AA01M/XC8102AA01G VIN=CE=2.9V CIN=None,CL=None Ta=85℃ 　　 25℃ 　　 - 40℃ 200 300 400 500 600 Output Current : IOUT (mA) XC8102AA01M/XC8102AA01G VIN=CE=4.0V CIN=None,CL=None 10.0 8.0 6.0 4.0 2.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) Output Voltage : VOUT (V) Ta=85℃ 　　 25℃ 　　 - 40℃ 10.0 8.0 6.0 4.0 2.0 0.0 0 100 XC8102AA01M/XC8102AA01G VIN=CE=6.0V CIN=None,CL=None Ta=85℃ 　　 25℃ 　　 - 40℃ 200 300 400 500 600 Output Current : IOUT (mA) 9/19 XC8102 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (5) Output Voltage vs. Output Current XC8102AA01N/XC8102AA017 VIN=CE=1.2V CIN=None,CL=None 5.0 Output Voltage : VOUT (V) Output Voltage : VOUT (V) 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Ta=85℃ 　　 25℃ 　　 -40℃ 5.0 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Ta=85℃ 　　 25℃ 　　 - 40℃ XC8102AA01N/XC8102AA017 VIN=CE=1.5V CIN=None,CL=None XC8102AA01N/XC8102AA017 VIN=CE=1.8V CIN=None,CL=None 5.0 Output Voltage : VOUT (V) 4.0 3.0 2.0 1.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) Ta=85℃ 　　 25℃ 　　 - 40℃ 5.0 4.0 3.0 2.0 1.0 0.0 0 100 XC8102AA01N/XC8102AA017 VIN=CE=2.9V CIN=None,CL=None Ta=85℃ 　　 25℃ 　　 -40℃ 200 300 400 500 600 Output Current : IOUT (mA) XC8102AA01N/XC8102AA017 VIN=CE=4.0V CIN=None,CL=None 10.0 8.0 6.0 4.0 2.0 0.0 0 100 200 300 400 500 600 Output Current : IOUT (mA) Output Voltage : VOUT (V) Output Voltage : VOUT (V) Ta=85℃ 　　 25℃ 　　 -40℃ 10.0 8.0 6.0 4.0 2.0 0.0 0 100 XC8102AA01N/XC8102AA017 VIN=CE=6.0V CIN=None,CL=None Ta=85℃ 　　 25℃ 　　 - 40℃ 200 300 400 500 600 Output Current : IOUT (mA) 10/19 XC8102 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) CE Threshold Voltage vs. Ambient Temperature (7) CL Discharge Resistance vs. Ambient Temperature XC8102AA01 VIN=6.0V CIN=None,CL=None 1.0 CE High Level Voltage : VCEH (V) 0.9 VCEH 0.8 0.7 0.6 0.5 0.4 -50 -25 0 25 50 75 100 Ambient Temp : Ta (℃) VCEL Discharge Resistance : Rdischg (Ω) 3000 2500 2000 1500 1000 500 VIN=4.0V 0 -50 -25 0 25 50 75 100 Ambient Temp : Ta (℃) VIN=6.0V VIN=1.5V VIN=1.2V VIN=2.9V XC8102AA01 VIN=VOUT CE=VSS CIN=None,CL=None VIN=1.8V (8) Output Turn-on Time with CE XC8102AA01 VIN=1.2V CE=0.3V →1.2V tr=tf=5μs , IOUT=50mA CIN=None , CL=None XC8102AA01 VIN=1.5V CE=0.3V →1.2V tr=tf=5μs , IOUT=50mA CIN=None , CL=None 1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10μs/div 6.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 5.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10μs/div 6.0 Output Voltage :VOUT (V) Output Voltage :VOUT (V) 5.0 CE Input Voltage 4.0 3.0 CE Input Voltage 4.0 3.0 Output Voltage 2.0 1.0 0.0 -1.0 Output Voltage 2.0 1.0 0.0 -1.0 XC8102AA01 VIN=1.8V CE=0.3V →1.2V tr=tf=5μs , IOUT=50mA CIN=None , CL=None XC8102AA01 VIN=2.9V CE=0.3V →1.2V tr=tf=5μs , IOUT=50mA CIN=None , CL=None 1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10μs/div 6.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 5.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10μs/div 6.0 5.0 CE Input Voltage 4.0 3.0 2.0 1.0 CE Input Voltage 4.0 3.0 2.0 1.0 Output Voltage 0.0 -1.0 Output Voltage 0.0 -1.0 11/19 XC8102 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Output Turn-on Time with CE (Continued) XC8102AA01 VIN=4.0V CE=0.3V →1.2V tr=tf=5μs , IOUT=50mA CIN=None , CL=None XC8102AA01 VIN=6.0V CE=0.3V →1.2V tr=tf=5μs , IOUT=50mA CIN=None , CL=None 1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10μs/div 12.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 10.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10μs/div 12.0 Output Voltage :VOUT (V) Output Voltage :VOUT (V) Output Voltage :VOUT (V) 10.0 CE Input Voltage 8.0 6.0 4.0 2.0 CE Input Voltage 8.0 6.0 4.0 Output Voltage 2.0 0.0 -2.0 Output Voltage 0.0 -2.0 (9) Output Turn-off Time with CE XC8102AA01 VIN=1.2V CE=1.2V →0.3V tr=tf=5μs , IOUT=50mA CIN=None , CL=None XC8102AA01 VIN=1.5V CE=1.2V →0.3V tr=tf=5μs , IOUT=50mA CIN=None , CL=None 1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10μs/div 6.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 5.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10μs/div 6.0 5.0 CE Input Voltage 4.0 3.0 CE Input Voltage 4.0 3.0 Output Voltage 2.0 1.0 0.0 -1.0 Output Voltage 2.0 1.0 0.0 -1.0 XC8102AA01 VIN=1.8V CE=1.2V →0.3V tr=tf=5μs , IOUT=50mA CIN=None , CL=None XC8102AA01 VIN=2.9V CE=1.2V →0.3V tr=tf=5μs , IOUT=50mA CIN=None , CL=None CE Input Voltage 1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 10μs/div 6.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 5.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 5μs/div 6.0 5.0 4.0 3.0 2.0 CE Input Voltage 4.0 3.0 Output Voltage 2.0 1.0 0.0 -1.0 Output Voltage 1.0 0.0 -1.0 12/19 XC8102 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Output Turn-off Time with CE (Continued) XC8102AA01 VIN=4.0V CE=1.2V →0.3V tr=tf=5μs , IOUT=50mA CIN=None , CL=None CE Input Voltage XC8102AA01 VIN=6.0V CE=1.2V →0.3V tr=tf=5μs , IOUT=50mA CIN=None , CL=None CE Input Voltage 1.5 CE Input Voltage: VCE (V) 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 5μs/div 12.0 Output Voltage :VOUT (V) CE Input Voltage: VCE (V) 10.0 8.0 6.0 4.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 Time: 5μs/div 12.0 Output Voltage :VOUT (V) 10.0 8.0 6.0 4.0 Output Voltage 2.0 0.0 -2.0 Output Voltage 2.0 0.0 -2.0 13/19 XC8102 Series ■PACKAGING INFORMATION ●SOT-25 ●SSOT-24 Unit : mm Unit : mm ●USP-4 ●USPN-4 Unit : mm Unit : mm 14/19 XC8102 Series ■PACKAGING INFORMATION (Continued) ● SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used) Material:Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient Temperature Evaluation Board (Unit: mm) 評価基板レイアウト（単位：mm） Board Mount (Tj max = 125℃) Ambient Temperature（℃） 25 85 Power Dissipation Pd（mW） 600 240 Thermal Resistance (℃/W) 166.67 Pd-Ta特性グラフ Pd vs. Ta 700 600 500 400 300 200 100 0 25 45 65 85 105 125 Ambient Temperature Ta (℃) 周辺温度Ta（℃） Power Dissipation Pd (mW) 許容損失Pd（mW） 15/19 XC8102 Series ■PACKAGING INFORMATION (Continued) ● SSOT-24 Power Dissipation Power dissipation data for the SSOT-24 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 40.0 2. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 28.9 28.9 2.54 1.4 Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） 25 85 Power Dissipation Pd（mW） 500 200 Thermal Resistance (℃/W) 200.00 Pd-Ta特 Ta フ 性グラ Pd vs. 600 Power Dissipation Pd (mW) 許容損失Pd（mW 500 400 300 200 100 0 25 45 65 85 ） Ambient周辺温度Ta（℃ ) Temperature Ta (℃ 105 125 16/19 2.5 40.0 XC8102 Series ■PACKAGING INFORMATION (Continued) ● USP-4 Power Dissipation Power dissipation data for the USP-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 28.9 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Evaluation Board (Unit: mm) Ambient Temperature（℃） 25 85 Power Dissipation Pd（mW） 1000 400 Thermal Resistance (℃/W) 100.00 Pd vs Ta 1200 Power Dissipation Pd (mW) 1000 800 600 400 200 0 25 45 65 85 Ambient Temperature Ta（℃） 105 125 2.5 40.0 17/19 XC8102 Series ■PACKAGING INFORMATION (Continued) ● USPN-4 Power Dissipation Power dissipation data for the USPN-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 40.0 2.5 2. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 28.9 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Evaluation Board (Unit: mm) Ambient Temperature（℃） 25 85 Power Dissipation Pd（mW） 640 240 Thermal Resistance (℃/W) 166.67 Pd-Ta特性グラフ Pd vs Ta 700 600 500 400 300 200 100 0 25 45 65 85 周囲温度Ta（℃） Ambient Temperature Ta(℃) 105 125 18/19 Power Dissipation Pd (mW) 許容損失Pd（mW） XC8102 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 19/19