XC8107AD05ER-G

XC8107 Series ETR33003-008d 85mΩ High Function Power Switch ■GENERAL DESCRIPTION The XC8107 series is a P-channel MOSFET power switch IC with a low ON resistance. A current limit, reverse current prevention (prevents reverse current from VOUT to VIN), soft start, thermal shutdown, and an under voltage lockout (UVLO) are incorporated as protective functions. A flag function monitors the power switch status. The flag output has N-channel open drain configuration, and it outputs Low level signal when over-current or overheating is detected, or when the reverse current prevention is operated. The voltage level which is fed to CE pin determines the status of XC8107. The logic level of CE pin is selectable between either one of active high or active low. ■FEATURES ■APPLICATIONS : 2.5V ~ 5.5V : 2A : 85mΩ@VIN=5.0V (TYP.) *USP-6C 100mΩ@VIN=5.0V (TYP.)*SOT-25 (XC8107A,B) 95mΩ@VIN=5.0V (TYP.) *SOT-25 (XC8107X,Y) : 40μA@ VIN=5.0V : 0.1μA (MAX.) : 7.5ms (TYP.) * At over-current detection : 4ms (TYP.) * At reverse voltage detection : Reverse Current Prevention Thermal Shutdown Under Voltage Lockout(UVLO） Soft-start : Flag Output CE Pin Input Logic Selectable : 2μs(TYP.) *Reference value : -40℃ ~ 105℃ : USP-6C SOT-25 (Au wire or Cu wire) : EU RoHS Compliant, Pb Free Input Voltage Maximum Output Current ON Resistance ●Set Top Boxes ●Digital TVs ●PCs ●USB Ports/USB Hubs Supply Current Stand-by Current Flag Delay Time ●HDMI Protection Circuit Functions Current Limit Response Time Operating Ambient Temperature Packages Environmentally Friendly ■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE CHARACTERISTICS XC8107xCxxxR CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 6.0 USB Port 100kΩ USB Control VIN VOUT 1.0μF 1.0μF FLG CE VSS + 120μF VBUS GND Output Voltage : VOUT [V] 0.5A type 5V Input 1.0A type 5.0 1.5A type 2.0A type 4.0 3.0 2.0 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Output Current : I OUT [A] 1/23 XC8107 Series ■BLOCK DIAGRAM Reverse Current Prevention VOUT VIN CURRENT SENSE UVLO CE ON/OFF Control each circuit CURRENT LIMIT CONTROL 4ms Delay 7.5ms Delay THERMAL SHUTDOWN VSS * Diodes inside the circuit are an ESD protection diode and a parasitic diode. 2/23 FLG XC8107 Series ■PRODUCT CLASSIFICATION ●Ordering Information XC8107①②③④⑤⑥-⑦ DESIGNATOR ITEM ① CE Logic ⑤⑥-⑦ B (*1) Refer to Selection Guide C D Maximum Output Current ③④ DESCRIPTION A Protection Circuits Type ② (*1) SYMBOL Packages 05 0.5A 10 1.0A 15 1.5A 20 2.0A ER-G USP-6C (3,000pcs/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. XC8107①②③④⑤⑥-⑦ DESIGNATOR ITEM ① CE Logic ② Protection Circuits Type ⑤⑥-⑦ A X B Y (*1) DESCRIPTION Refer to Selection Guide C D Maximum Output Current ③④ (*1) SYMBOL Au wire Cu wire Packages 05 0.5A 10 1.0A 15 1.5A 20 2.0A MR-G SOT-25 (3,000pcs/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. ●Selection Guide FUNCTION TYPE AC, XC AD, XD BC, YC BD, YD CE LOGIC SELECTABLE Active High Active Low SOFT-START Yes Yes UVLO Yes Yes REVERSE CURRENT PREVENTION Yes Yes THERMAL SHUT DOWN Yes Yes CURRENT LIMIT ADJUSTABLE Yes Yes CURRENT LIMITER / REVERSE CURRENT PREVENTION (Automatic Recovery) CURRENT LIMITER / REVERSE CURRENT PREVENTION (Latch Protection) Yes - Yes - - Yes - Yes 3/23 XC8107 Series ■PIN CONFIGURATION FLG 3 4 CE NC 2 5 VSS VOUT 1 6 VIN USP-6C USP-6C (BOTTOM (BOTTOM VIEW) VIEW) VOUT 1 VSS 2 FLG 3 5 VIN 4 CE SOT-25 SOT-25 (TOPVIEW) VIEW) (TOP * The dissipation pad for the USP-6C packages should be solder-plated for mounting strength and heat dissipation. Please refer to the reference mount pattern and metal masking. The dissipation pad should be connected to the VSS (No. 5) pin. ■PIN ASSIGNMENT PIN NAME PIN NAME FUNCTIONS 1 VOUT Output 2 - NC No connection 3 3 FLG Fault Report 4 4 CE ON/OFF Control 5 2 VSS Ground 6 5 VIN Power Input USP-6C SOT-25 1 ■FUNCTION PIN NAME TYPE A, X CE B, Y * Avoid leaving the CE pin open; set to any fixed voltage. 4/23 Signal STATUS H Active L Stand-by OPEN Undefined State (*1) H Stand-by L Active OPEN Undefined State (*1) XC8107 Series ■ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN -0.3 ~ 6.0 V Output Voltage VOUT -0.3 ~ 6.0 V CE Input Voltage VCE -0.3 ~ 6.0 V FLG Pin Voltage VFLG -0.3 ~ 6.0 V FLG Pin Current IFLG 15 mA Pd 120 (IC only) 1000 (40mm x 40mm Standard board) (*1) 1250 (JESD51-7 board) (*1) 250 (IC only) 600 (40mm x 40mm Standard board) (*1) 760 (JESD51-7 board) (*1) mW Operating Ambient Temperature Topr -40 ~ 105 ℃ Storage Temperature Tstg -55 ~ 125 ℃ USP-6C Power Dissipation (Ta=25℃) SOT-25 * All voltages are described based on the VSS. (*1) The power dissipation figure shown is PCB mounted and is for reference only. Please refer to PACKAGING INFORMATION for the mounting condition. 5/23 XC8107 Series ■ELECTRICAL CHARACTERISTICS Ta=25℃ PARAMETER SYMBOL Input Voltage VIN CONDITIONS - ISS 5.5 110 104 135 120 130 115 75 V mΩ mΩ mΩ mΩ mΩ mΩ μA ① 1.0 μA ② - 0.01 1.0 μA ② VOUT=VIN-0.3V, XC8107xx05 series 0.81 0.90 0.99 A VOUT=VIN-0.3V, XC8107xx10 series 1.26 1.40 1.54 A VOUT=VIN-0.3V, XC8107xx15 series 1.71 1.90 2.09 A VOUT=VIN-0.3V, XC8107xx20 series 2.16 2.40 2.64 A VOUT=0V, XC8107xx05 series - 0.45 - A VOUT=0V, XC8107xx10 series - 0.70 - A VOUT=0V, XC8107xx15 series - 0.95 - A VOUT=0V, XC8107xx20 series - 1.20 - A μs ① V ① Switch Leakage Current ILEAK VIN=5.5V, VOUT=0V VCE=VSS (XC8107A,X) VCE=VIN (XC8107B,Y) ISHORT 2.5 - 0.01 ISTBY Short-Circuit Current CIRCUIT - Stand-by Current ILIMT UNITS - VIN=3.3V (*1) VIN=5.0V (*1) VIN=3.3V (*1) VIN=5.0V (*1) VIN=3.3V (*1) VIN=5.0V (*1) VIN=5.5V, VOUT=OPEN VCE=VSS (XC8107A,X) VCE=VIN (XC8107B,Y) Current Limit MAX. VOUT=OPEN SOT-25 (XC8107A,B) RON SOT-25 (XC8107X,Y) Supply Current TYP. 100 85 115 100 110 95 40 USP-6C On Resistance MIN. ① ② ① ① - 2.0 - 1.5 VSS VSS 1.5 -0.1 - 5.5 0.8 0.8 5.5 0.1 V ① ICEH VIN=5.0V, VOUT: OPEN→0V Measure from VOUT=0V to when current falls below a certain ILIM value VIN=5.5V, XC8107A,X series VIN=5.5V, XC8107B,Y series VIN=5.5V, XC8107A,X series VIN=5.5V, XC8107B,Y series VIN=5.5V, VCE=5.5V μA ① ICEL VIN=5.5V, VCE=0V -0.1 - 0.1 μA ① VUVLOD VIN: 2.2V→1.7V 1.8 1.9 2.0 V ① UVLO Released Voltage VUVLOR VIN: 1.7V→2.2V 1.9 2.0 2.1 V ① UVLO Hysteresis VUHYS - - 0.1 - V ① Current Limit Circuit Response Time (*2) tCLR CE "H" Level Voltage VCEH CE "L" Level Voltage VCEL CE "H" Level Current CE "L" Level Current UVLO Detected Voltage NOTE: Unless otherwise stated, VIN=5.0V, IOUT=1mA, VCE=VIN (XC8107A, X) or VCE=VSS (XC8107B, Y) (*1) IOUT=0.25A (XC8107xx05), IOUT=0.5A (XC8107xx10), IOUT=0.75A (XC8107xx15), IOUT=1.0A (XC8107xx20) (*2) Design reference value. This parameter is provided only for reference. 6/23 XC8107 Series ■ELECTRICAL CHARACTERISTICS (Continued) Ta=25℃ PARAMETER SYMBOL turn-on time tON turn-off time CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT RLOAD=10Ω, VCE=0V→2.2V - 0.60 1.00 ms ① tOFF RLOAD=10Ω, VCE=2.2V→0V - 0.08 0.13 ms ① FLG output FET On-resistance RFLG IFLG=10mA, VOUT=5.5V - 15 20 Ω ③ FLG output FET Leakage Current IFOFF VIN=5.5V, VFLG=5.5V, VOUT=OPEN - 0.01 0.1 μA ③ tFD1 over-current condition 6.5 7.5 8.5 ms ① tFD2 reverse-voltage condition 2.7 4.0 4.7 ms ① - 0.1 1.0 μA ① - 140 - - 170 - mV ① - 160 - FLG delay time N=0V, Reverse Current IREV VOUT=5.5V VCE=5.0V (XC8107A,X) VCE=VSS (XC8107B,Y) USP-6C Reverse Current Prevention Detect Voltage VREV_D Thermal Shutdown Detect Temperature TTSD Junction Temperature - 150 - ℃ ① Thermal Shutdown Release Temperature TTSR Junction Temperature - 130 - ℃ ① Thermal Shutdown Hysteresis Width THYS Junction Temperature - 20 - ℃ ① VIN: 5.0V→4.7V VOUT=5.0V SOT-25 (XC8107A,B) SOT-25 (XC8107X,Y) NOTE: Unless otherwise stated, VIN=5.0V, IOUT=1mA, VCE=VIN (XC8107A, X) or VCE=VSS (XC8107B, Y) ■TIMING CHART ●turn-on time, turn-off time Voltege[V] Voltege[V] VCE CE "H" Level Voltage CE "L" Level Voltage CE "L" Level Voltage CE "H" Level Voltage VCE 90% 90% 10% VOUT tON tOFF XC8107 Series, Type A, X Time[ms] 10% VOUT tON tOFF Time[ms] XC8107 Series, Type B, Y 7/23 XC8107 Series ■TEST CIRCUITS CIN=1.0μF, CL=1.0μF 1) CIRCUIT① Measurement Waveform A VOUT VIN RFLG=100kΩ Measurement Waveform A FLG IOUT VIN V CIN (ceramic) A VCE CE VOUT VSS CL (ceramic) V V 2) CIRCUIT② A VIN VOUT RFLG=100kΩ FLG CE VIN VSS 3) CIRCUIT③ VOUT VIN FLG A V CIN (ceramic) 8/23 CE VFLG ↓ VIN V VCE VOUT VSS V CL (ceramic) V XC8107 Series ■OPERATIONAL EXPLANATION The XC8107 series is a P-channel MOSFET power switch IC. The XC8107 series consists of a CE circuit, UVLO circuit, thermal shutdown circuit, current limiter circuit, reverse current prevention circuit, control block and others. The gate voltage of the power switch transistor is controlled with control block. The current limiter circuit and reverse current prevention circuit will operate based on the output voltage and output current. Reverse Current Prevention VOUT VIN CURRENT SENSE UVLO CE ON/OFF Control each circuit CURRENT LIMIT CONTROL 4ms Delay THERMAL SHUTDOWN 7.5ms Delay FLG VSS BLOCK DIAGRAM The voltage level which is fed to CE pin controls the status of this IC. If either “H” level or “L” level which is defined as the electrical specification is fed to CE pin, then XC8107 can operate in standard manner. However, if the middle voltage which is neither “H” level nor “L” level is fed to CE pin, the consumption current will increase due to the shoot-through current at internal circuits. Also if CE pin is open, the status of XC8107 cannot be fixed and the behavior will be unstable. For protection against heat damage of the ICs, thermal shutdown function is built in. When the internal junction temperature reaches the temperature limit, the thermal shutdown circuit operates and the power switch transistor will turn OFF. The IC resumes its operation when the thermal shutdown function is released and the IC’s operation is automatically restored because the junction temperature drops to the level of the thermal shutdown release temperature. When the thermal shutdown circuit detects higher junction temperature than the detect temperature, the voltage level of FLG pin is low level. When the thermal shutdown circuit detects lower junction temperature than the release temperature, the thermal shutdown function is released and the voltage level of FLG pin is high level. When the VIN pin voltage goes down to lower voltage than UVLO detected voltage, the power switch transistor turns OFF by UVLO function in order to prevent false output caused by unstable operation of the internal circuitry. When the VIN pin voltage goes up to higher voltage than UVLO released voltage, the UVLO function is released and the power switch transistor can turn ON. The soft-start circuit can reduce the in-rush current charged on the output capacitor when IC starts up. Additionally, due to the reduction of the in-rush current, the circuit can reduce the fluctuation of the input voltage as well. The soft-start time is optimized internally and defined as turn-on time. (TYP: 0.6ms) 9/23 XC8107 Series ■OPERATIONAL EXPLANATION (Continued) When the output current reaches the current limit value, the current limit function is activated. When the current limiting function operates, the constant current limiting circuit operates to reduce the output voltage while maintaining the output current. The short-circuit protection function operates when the output voltage drops below 0.7V (TYP.). The behavior after the current limit or short circuit protection function is activated differs depending on the product type. The operation of each type is as follows. Automatic Recovery type: C type After 7.5ms (TYP.) has passed since the current limiting function was activated, the FLG pin changes to Low level output. After the short-circuit protection function operates, the output current is reduced to the short-circuit current. If the overcurrent state continues, this state is maintained. When the overcurrent state is resolved and the state below the maximum output current continues for 7.5ms (TYP.), the FLG pin returns to High level output. Latch off type: D type After 7.5ms (TYP.) elapses when the current limiting function is activated, the FLG pin changes to Low level output and the switch transistor turns off. The off state is maintained regardless of whether the overcurrent state is resolved. Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below the UVLO detected voltage once and after that raising it higher than UVLO released voltage. An internal circuit is built in that prevents reverse current from the VOUT pin to the VIN pin. When the difference between input voltage and VOUT pin voltage is higher than the detect voltage set internally, the reverse current prevention circuit activates, and the power switch transistor turns off, then the reverse current from the VOUT pin to the VIN pin is reduced to 0.1μA (TYP.). If the reverse-voltage state lasts for 4ms (TYP.), the FLG pin changes to Low level output. The behavior after the reverse current prevention function is activated differs depending on the product type. The operation of each type is as follows. Automatic Recovery type: C type On the auto recovery type, when the output voltage drops below the input voltage, the reverse current prevention circuit stops immediately, and the power switch transistor turns on again. If the output voltage remains lower than the input voltage for 4ms (TYP.), the FLG pin returns to High level output. Latch off type: D type On the latch off type, the power switch transistor remains in the off state even if the reverse voltage state is released. Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below the UVLO detected voltage once and after that raising it higher than UVLO released voltage. 10/23 XC8107 Series ■OPERATIONAL EXPLANATION (Continued) The flag circuit is built in which monitors the state of the power switch. The FLG pin outputs Low level when the reverse current prevention function is operating. A resistance of 10kΩ to 100kΩ is recommended for the FLG pin pull-up resistance. The pull-up voltage should be 5.5V or less. Automatic Recovery type: C type FLG pin Low level output Condition FLG pin High level output Condition Short Protection 7.5ms(TYP.) after maintaining over-current detection state 7.5ms(TYP.) after over-current release Reverse current prevention 4.0ms(TYP.) after maintaining reverse voltage detection state 4.0ms(TYP.) after reverse voltage release Thermal shutdown Same time as overheat state is detected Same time as overheat state is released CONDITION Current limiter UVLO Stand-by Always High level output Latch off type: D type FLG pin Low level output Condition FLG pin High level output Condition Short Protection 7.5ms(TYP.) after maintaining over-current release state When latch operation is released Reverse current prevention 4.0ms(TYP.) after maintaining reverse voltage release state When latch operation is released Thermal shutdown Same time as overheat state is detected Same time as overheat state is released CONDITION Current limiter UVLO Stand-by Always High level output 11/23 XC8107 Series ■NOTES ON USE 1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated if IC is used beyond the absolute MAX. specifications. 2. Where wiring impedance is high, operations may become unstable due to noise depending on output current. Please keep the resistance low between VIN and VSS wiring in particular. 3. Please place the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible. For the input or output capacitor, a capacitance of 1.0μF or higher is recommended. 4. The IC can be broken if the VOUT pin voltage suddenly undershoots to a negative voltage due to an output short circuit between the VOUT pin and GND, or if the VIN pin voltage overshoots after the current limiting operation and exceeds the rated voltage. We recommend the following counter measures so that the rated voltage is not exceeded. (a) To suppress the amount of the undershoot by increasing the output capacitance and slowing down the rate of decreasing VOUT at the time of short circuit. (b) To add a SBD between VOUT pin and GND to suppress the undershoot of VOUT pin voltage. (c) To increase the input capacitor to suppress the overshoot of the VIN pin voltage after the current limiter is activated. IC VIN VOUT VIN CE VOUT CE VFLG CIN GND RFLG VSS FLG CL SBD FLG GND Recommended countermeasure circuit diagram 5. It is recommended to use the output current at 80% or less of the current limit set value (ILIMIT). 6. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. 12/23 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) UVLO threshold Voltage vs. Ambient Temperature CIN =1.0μF(ceramic), C L=1.0μF(ceramic) 2.5 2.0 1.5 1.0 UVLO detect UVLO release 0.5 0.0 -50 -25 0 25 50 75 100 125 Ambient Temperature : Ta [℃] (2) Stand-by Current vs. Input Voltage Stand-by Current : Istby [μA] 3.0 2.5 2.0 (3) Stand-by Current vs. Ambient Temperature CIN =1.0μF(ceramic), C L =1.0μF(ceramic) Ta=105℃ Ta=25℃ Ta=-40℃ 1.5 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Input Voltage : VIN [V] CIN =1.0μF(ceramic), C L=1.0μF(ceramic) 3.0 Stand-by Current : Istby [μA] UVLO threshold Voltage : UVLO [V] 3.0 Istby 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 13/23 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) 50 45 40 35 30 25 20 15 10 5 0 (5) Supply Current vs. Ambient Temperature VIN =5.0V, C IN =1.0μF(ceramic), C L=1.0μF(ceramic) Ta=105℃ Ta=25℃ Ta=-40℃ 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 (6) CE threshold Voltage vs. Ambient Temperature CE threshold Voltage : VCE [V] CIN =1.0μF(ceramic), C L=1.0μF(ceramic) 14/23 3.0 CE"H"Level 2.0 CE"L"Level 1.5 1.0 0.5 0.0 -50 50 45 40 35 30 25 20 15 10 5 0 CIN =1.0μF(ceramic), C L=1.0μF(ceramic) VIN=5.0V -50 -25 0 25 50 75 Ambient Temperature : Ta [℃] Input Voltage : VIN [V] 2.5 Supply Current : ISS [μA] Supply Current : ISS [μA] (4) Supply Current vs. Input Voltage(sweep up) -25 0 25 50 75 Ambient Temperature : Ta [℃] 100 125 100 125 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) On Resistance vs. Input Voltage (USP-6C) (8) On Resistance vs. Ambient Temperature (USP-6C) XC8107xxxxER XC8107xxxxER 180 160 140 120 100 80 60 40 20 0 CIN =1.0μF(ceramic), CL=1.0μF(ceramic) On Resistance : Ron [mΩ] On Resistance : Ron [mΩ] CIN =1.0μF(ceramic), C L=1.0μF(ceramic) Ta=105℃ Ta=25℃ Ta=-40℃ 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : VIN [V] 5.5 6.0 (9) On Resistance vs. Input Voltage (SOT-25:XC8107A,B) 180 160 140 120 100 80 60 40 20 0 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 (10) On Resistance vs. Ambient Temperature (SOT-25:XC8107A,B) XC8107xxxxMR XC8107xxxxMR CIN =1.0μF(ceramic), CL =1.0μF(ceramic) On Resistance : Ron [mΩ] On Resistance : Ron [mΩ] CIN =1.0μF(ceramic), C L=1.0μF(ceramic) 180 160 140 120 100 80 60 40 20 0 Ta=105℃ Ta=25℃ Ta=-40℃ 2.0 2.5 3.0 3.5 4.0 4.5 Input Voltage : V IN [V] 5.0 5.5 180 160 140 120 100 80 60 40 20 0 6.0 (11) On Resistance vs. Input Voltage (SOT-25:XC8107X,Y) VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 (12) On Resistance vs. Ambient Temperature (SOT-25:XC8107X,Y) XC8107xxxxMR XC8107xxxxMR Ta=105℃ Ta=25℃ Ta=-40℃ 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : V IN [V] 5.5 CIN =1.0μF(ceramic), C L=1.0μF(ceramic) On Resistance : Ron [mΩ] On Resistance : Ron [mΩ] CIN =1.0μF(ceramic), CL =1.0μF(ceramic) 180 160 140 120 100 80 60 40 20 0 6.0 180 160 140 120 100 80 60 40 20 0 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] 125 15/23 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (13) turn-on time vs. Input Voltage CIN =1.0μF(ceramic), C L=1.0μF(ceramic) 0.7 0.6 0.5 0.4 0.3 0.2 Ta=105℃ Ta=25℃ Ta=-40℃ 0.1 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : V IN [V] CIN =1.0μF(ceramic), C L=1.0μF(ceramic) 0.7 0.6 turn-on time : tDLY(ON) [ms] turn-on time : tDLY(ON) [ms] (14) turn-on time vs. Ambient Temperature 5.5 0.5 0.4 0.3 0.1 0.0 6.0 (15) turn-off time vs. Input Voltage VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V 0.2 -50 -25 0 25 50 75 100 Ambient Temperature : Ta [℃] (16) turn-off time vs. Ambient Temperature CIN=1.0μF(ceramic), CL =1.0μF(ceramic) turn-off time : tDLY(OFF) [ms] turn-off time : tDLY(OFF) [ms] VIN=4.3V, CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 Ta=105℃ Ta=25℃ Ta=-40℃ 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input Voltage : V IN [V] 5.5 6.0 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V -50 -25 0 25 50 vs. Ambient Temperature 0 XC8107xxxxxR CIN =1.0μF(ceramic), C L=1.0μF(ceramic) 25 50 75 Ambient Temperature : Ta [℃] 16/23 125 XC8107xxxxxR VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V -25 100 CIN =1.0μF(ceramic), C L=1.0μF(ceramic) 100 125 FLG reverse-voltage : tFD [ms] FLG over-current : tFD [ms] (18) FLG delay time reverse-voltage vs. Ambient Temperature -50 75 Ambient Temperature : Ta [℃] (17) FLG delay time over-current 9.0 8.5 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5 4.0 125 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V -50 -25 0 25 50 75 Ambient Temperature : Ta [℃] 100 125 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (19) Output Voltage vs. Output Current XC8107xCxxxR 0.5A 1.0A 1.5A 2.0A 5.0 4.0 type type type type 3.0 2.0 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Output Current : IOUT [A] 3.5 4.0 (20) turn-on Delay vs. Rise Time (CL=1.0μF) 4.0 3.0 2.0 1.0 0.0 4.0 3.5 8.0 3.0 6.0 2.5 2.0 Output Voltage 0.0 2.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 0.0 Supply Current -8.0 -2.0 -8.0 0.0 1.5 1.0 0.5 Supply Current 0.0 -0.5 Time [500μs/div] 2.5 2.0 1.5 CE Input Voltage 1.0 0.5 Supply Current VCE=5.0V→0V, tf=5μs, R L=10Ω, Ta=25℃ VIN =5.0V, C IN =1.0μF, CL=120μF(ceramic) 6.0 Voltage : [V] 2.5 -2.0 -8.0 8.0 3.5 2.0 -6.0 3.0 Output Voltage 0.0 -0.5 XC8107xx10xR 2.0 -4.0 3.5 (23) turn-off Delay vs. Fall Time (CL=120μF) 3.0 Output Voltage 4.0 Time [100μs/div] Supply Current : Isupply [A] Voltage : [V] 4.0 3.5 VCE=5.0V→0V, tf=5μs, R L =10Ω, Ta=25℃ VIN =5.0V, C IN =CL=1.0μF(ceramic) 0.0 XC8107xx10xR CE Input Voltage 1.0 1.5 2.0 2.5 3.0 Output Current : IOUT [A] 2.0 -6.0 (22) turn-on Delay vs. Rise Time (CL=120μF) 6.0 0.5 4.0 Time [100μs/div] 8.0 0.0 -4.0 -0.5 VCE=0V→5.0V, tr=5μs, R L=10Ω, Ta=25℃ VIN =5.0V, C IN =1.0μF, C L=120μF(ceramic) If the over-current state lasts for 7.5ms, the latch off type turns off the power switch transistor. XC8107xx10xR Voltage : [V] CE Input Voltage type type type type (21) turn-off Delay vs. Fall Time (CL=1.0μF) Supply Current : Isupply [A] Voltage : [V] 6.0 VCE=0V→5.0V, tr=5μs, R L=10Ω, Ta=25℃ VIN =5.0V, C IN =CL=1.0μF(ceramic) 0.5A 1.0A 1.5A 2.0A 5.0 XC8107xx10xR 8.0 CIN =1.0μF(ceramic), C L=1.0μF(ceramic) 6.0 Output Voltage : V OUT [V] 6.0 Output Voltage : V OUT [V] XC8107xDxxxR CIN =1.0μF(ceramic), C L=1.0μF(ceramic) 3.0 4.0 2.5 Output Voltage 2.0 0.0 -2.0 -8.0 2.0 1.5 CE Input Voltage -4.0 -6.0 3.5 1.0 0.5 Supply Current 0.0 -0.5 Time [500μs/div] 17/23 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (24) Short Circuit Current, Device Enabled Into Short XC8107xx10xR CE Input Voltage 6.0 3.5 3.0 4.0 2.5 2.0 2.0 0.0 Output Voltage -2.0 -4.0 1.0 0.5 Supply Current -6.0 -8.0 1.5 Time [40μs/div] 0.0 VCE=5.0V→0V, tf=5μs, Ta=25℃ VIN =5.0V, CIN =1.0μF, C L=120μF(ceramic) CE Input Voltage 6.0 Voltage : [V] Voltage : [V] 8.0 8.0 Supply Current : Isupply [A] VCE=0V→5.0V, tr=5μs, Ta=25℃ VIN =5.0V, C IN =CL=1.0μF(ceramic) 3.5 3.0 4.0 2.5 2.0 2.0 0.0 Output Voltage -2.0 1.0 -4.0 0.5 Supply Current -6.0 -0.5 -8.0 3.5 8.0 3.0 6.0 1.5 Time [40μs/div] 0.0 Supply Current : Isupply [A] XC8107xx10xR -0.5 4.0 Input Voltage 2.0 2.5 Output Voltage 0.0 2.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 Supply Current -8.0 0.0 VIN =5.0V→0V, tf=3ms, Ta=25℃ RL=5Ω, C IN =C L=1.0μF(ceramic) 3.0 Input Voltage 4.0 2.5 2.0 2.0 0.0 1.5 Output Voltage -2.0 -4.0 Supply Current -8.0 Time [500μs/div] 1.0 0.5 -6.0 -0.5 3.5 0.0 Supply Current : Isupply [A] Voltage : [V] 6.0 Voltage : [V] VIN =0V→5.0V, tr=3ms, Ta=25℃ R L=5Ω, C IN =C L=1.0μF(ceramic) 8.0 Supply Current : Isupply [A] (25) UVLO Transient Response (CL=1.0μF) -0.5 Time [500μs/div] (26) UVLO Transient Response (CL=120μF) 3.0 6.0 4.0 2.5 2.0 2.0 Output Voltage 0.0 1.5 -2.0 1.0 -4.0 -6.0 0.5 Supply Current -8.0 0.0 -0.5 Time [500μs/div] 18/23 8.0 VIN =5.0V→0V, tf=3ms, Ta=25℃ RL=5Ω, CIN =1.0μF, C L=120μF(ceramic) 3.5 3.0 Output Voltage 4.0 2.5 2.0 2.0 0.0 Input Voltage -2.0 -4.0 -6.0 1.5 1.0 0.5 Supply Current -8.0 0.0 -0.5 Time [500μs/div] Supply Current : Isupply [A] Input Voltage 3.5 Voltage : [V] Voltage : [V] 6.0 VIN =0V→5.0V, tr=3ms, Ta=25℃ RL=5Ω, C IN =1.0μF, C L=120μF(ceramic) Supply Current : Isupply [A] 8.0 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (27) Reverse Voltage Detected Voltage (CL=1.0μF) 3.0 0.0 FLG Voltage -2.0 -6.0 2.0 1.0 0.0 Supply Current -1.0 -8.0 6.0 4.0 2.0 0.0 Output Voltage 0.0 5.0 4.0 Input Voltage 2.0 3.0 FLG Voltage 2.0 -2.0 1.0 -4.0 0.0 -6.0 Supply Current -8.0 -1.0 -2.0 Time [500μs/div] 0.0 Supply Current -1.0 -8.0 -2.0 8.0 6.0 6.0 Voltage : [V] 4.0 VOUT=5.5V forced 1.0 (30) Reverse Voltage Released Voltage (CL=120μF) Supply Current : Isupply [A] Voltage : [V] 6.0 2.0 Time [500μs/div] (29) Reverse Voltage Detected Voltage (CL=120μF) 8.0 3.0 FLG Voltage -6.0 Time [500μs/div] VIN =5.0V, Ta=25℃ CIN =1.0μF, C L=120μF(ceramic) 4.0 Output Voltage -2.0 -4.0 -2.0 5.0 Input Voltage Supply Current : Isupply [A] 2.0 -4.0 5.0 4.0 Input Voltage 6.0 VOUT = 5.5V Removed 4.0 2.0 VIN =5.0V, Ta=25℃ C IN =1.0μF, C L =120μF(ceramic) 6.0 VOUT = 5.5V Removed Input Voltage Output Voltage FLG Voltage 5.0 4.0 3.0 0.0 2.0 -2.0 1.0 -4.0 -6.0 Supply Current -8.0 0.0 -1.0 Supply Current : Isupply [A] 4.0 Output Voltage VIN =5.0V, R L=5Ω, Ta=25℃ CIN =CL=1.0μF(ceramic) 8.0 Voltage : [V] Voltage : [V] 6.0 VOUT=5.5V forced 6.0 Supply Current : Isupply [A] VIN =5.0V, R L=5Ω, Ta=25℃ CIN =CL=1.0μF(ceramic) 8.0 (28) Reverse Voltage Released Voltage (CL=1.0μF) -2.0 Time [500μs/div] 19/23 XC8107 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (31) CE Transient Response Voltage : [V] 6.0 0.035 0.030 4.0 0.025 2.0 0.020 0.0 0.5A type 1.0A type -2.0 1.5A type -4.0 2.0A type -6.0 In Rush Current -8.0 Time [500μs/div] 0.015 0.010 0.005 0.000 -0.005 (32) Current Limit adapted time Current Limit Response : [μs] XC8107xx10xR 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 20/23 0.0 1.0 VIN =5.0V, Ta=25℃ CL=open 2.0 3.0 4.0 5.0 Peak Limit Current [A] 6.0 8.0 6.0 3.5 CE Voltage 3.0 4.0 2.5 2.0 2.0 0.0 0.5A 1.0A 1.5A 2.0A -2.0 -4.0 -6.0 -8.0 In Rush Current Time [500μs/div] type type type type 1.5 1.0 0.5 0.0 -0.5 In Rush Current : IRUSH [A] CE Voltage Voltage : [V] 8.0 VCE=0→5.0V, tr=5μs, Ta=25℃ VIN =5.0V, C IN =1.0μF, C L=120μF(ceramic) In Rush Current : IRUSH [A] VCE=0→5.0V, tr=5μs, Ta=25℃ VIN =5.0V, C IN =CL=1.0μF(ceramic) XC8107 Series ■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLINE / LAND PATTERN THERMAL CHARACTERISTICS SOT-25 SOT-25 PKG SOT-25 Power Dissipation USP-6C USP-6C PKG USP-6C Power Dissipation 21/23 XC8107 Series ■MARKING RULE ●SOT-25(Au Wire) / USP-6C(Au Wire) / SOT-25(Cu Wire) ① SOT-25 SOT-25 5 ① represents products series 4 ② ③ ④ ② ⑤ 2 PRODUCT SERIES Z XC8107******-G represents product type MARK 1 MARK Wire Type 1 3 2 3 USP-6C Active High Au Active Low 4 R ② ⑤ ③ 3 ④ 2 ① 1 T 6 S 5 CE LOGIC Active High Cu Active Low U Protection Circuits Type Auto-recovery PRODUCT SERIES Latch-off XC8107AD****-G Auto-recovery XC8107BC****-G Latch-off XC8107BD****-G Auto-recovery XC8107XC****-G Latch-off XC8107XD****-G Auto-recovery XC8107YC****-G Latch-off XC8107YD****G 4 ③ represents maximum output current MARK 1 2 CURRENT (A) 0.5 PRODUCT SERIES 1.0 XC8107**05**-G XC8107**10**-G 3 1.5 XC8107**15**-G 4 2.0 XC8107**20**-G ④⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 22/23 XC8107AC****-G XC8107 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 23/23