XC8107 Series
ETR33003-006
85mΩ High Function Power Switch
■GENERAL DESCRIPTION
The XC8107 series is a P-channel MOSFET power switch IC with a low ON resistance. A current limit, reverse current
prevention (prevents reverse current from VOUT to VIN), soft start, thermal shutdown, and an under voltage lockout (UVLO) are
incorporated as protective functions. A flag function monitors the power switch status. The flag output has N-channel open
drain configuration, and it outputs Low level signal when over-current or overheating is detected, or when the reverse current
prevention is operated. The voltage level which is fed to CE pin determines the status of XC8107. The logic level of CE pin is
selectable between either one of active high or active low.
■FEATURES
■APPLICATIONS
: 2.5V ~ 5.5V
: 2A
: 85mΩ@VIN=5.0V (TYP.) *USP-6C
100mΩ@VIN=5.0V (TYP.)*SOT-25 (XC8107A,B)
95mΩ@VIN=5.0V (TYP.) *SOT-25 (XC8107X,Y)
: 40μA@ VIN=5.0V
: 0.1μA (MAX.)
: 7.5ms (TYP.)
* At over-current detection
: 4ms(TYP.)
* At reverse voltage detection
: Reverse Current Prevention
Thermal Shutdown
Under Voltage Lockout(UVLO)
Soft-start
: Flag Output
CE Pin Input Logic Selectable
: 2μs(TYP.) *Reference value
: -40℃ ~ +105℃
: USP-6C,
SOT-25(Au wire or Cu wire)
: EU RoHS Compliant, Pb Free
Input Voltage
Maximum Output Current
ON Resistance
●Set Top Boxes
●Digital TVs
●PCs
●USB Ports/USB Hubs
Supply Current
Stand-by Current
Flag Delay Time
●HDMI
Protection Circuit
Functions
Current Limit Response Time
Operating Ambient Temperature
Packages
Environmentally Friendly
■TYPICAL APPLICATION CIRCUIT
■TYPICAL PERFORMANCE
CHARACTERISTICS
XC8107xCxxxR
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
6.0
USB Port
100kΩ
USB
Control
VIN
VOUT
1.0μF
1.0μF
FLG
CE
VSS
+
120μF
VBUS
GND
Output Voltage : VOUT [V]
0.5A type
5V Input
1.0A type
5.0
1.5A type
2.0A type
4.0
3.0
2.0
1.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Output Current : IOUT [A]
1/24
XC8107 Series
■BLOCK DIAGRAM
XC8107 Series
Reverse
Current
Prevention
VOUT
VIN
CURRENT
SENSE
UVLO
CE
ON/OFF
Control
each
circuit
CURRENT
LIMIT
CONTROL
4ms
Delay
7.5ms
Delay
THERMAL
SHUTDOWN
VSS
* Diodes inside the circuit are an ESD protection diode and a parasitic diode.
2/24
FLG
XC8107
Series
■PRODUCT CLASSIFICATION
●Ordering Information
XC8107①②③④⑤⑥-⑦
DESIGNATOR
ITEM
①
CE Logic
A
X
B
Y
C
②
Protection Circuits Type
Maximum Output
Current
③④
⑤⑥-⑦
SYMBOL
Au wire Cu wire
(*1)
Packages
DESCRIPTION
Refer to Selection Guide
D
05
0.5A
10
1.0A
15
1.5A
20
2.0A
ER-G
USP-6C (3,000pcs/Reel) (*2)
MR-G
SOT-25 (3,000pcs/Reel)
(*1)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
(*2)
USP - 6C package is available for the A/B Type.
●Selection Guide
TYPE
CE LOGIC SELECTABLE
SOFT-START
CURRENT
LIMITTER
AC, XC
Active High
Yes
Yes
AD, XD
Active High
Yes
Yes
BC, YC
Active Low
Yes
Yes
BD, YD
Active Low
Yes
Yes
TYPE
UVLO
FLG OUTPUT
REVERSE CURRENT
PREVENTION
AC, XC
Yes
Yes
Yes
AD, XD
Yes
Yes
Yes
BC, YC
Yes
Yes
Yes
BD, YD
Yes
Yes
Yes
TYPE
THERMAL
SHUT DOWN
LATCH
PROTECTION
AC, XC
Yes
No
AD, XD
Yes
Yes
BC, YC
Yes
No
BD, YD
Yes
Yes
3/24
XC8107 Series
■PIN CONFIGURATION
FLG 3
4 CE
NC 2
5 VSS
VOUT 1
6 VIN
USP-6C
USP-6C
(BOTTOM
(BOTTOM VIEW)
VIEW)
VOUT
1
VSS
2
FLG
3
5
VIN
4
CE
SOT-25
SOT-25
(TOPVIEW)
VIEW)
(TOP
* The dissipation pad for the USP-6C packages should be solder-plated for mounting strength and heat dissipation.
Please refer to the reference mount pattern and metal masking. The dissipation pad should be connected to the VSS (No. 5) pin.
■PIN ASSIGNMENT
PIN NAME
PIN NAME
FUNCTIONS
1
VOUT
Output
2
-
NC
No connection
3
3
FLG
Fault Report
4
4
CE
ON/OFF Control
5
2
VSS
Ground
6
5
VIN
Power Input
USP-6C
SOT-25
1
■FUNCTION
PIN
NAME
TYPE
A, X
Signal
STATUS
H
Active
L
Stand-by
OPEN
Undefined State (*1)
H
Stand-by
L
Active
OPEN
Undefined State (*1)
CE
B, Y
* Avoid leaving the CE pin open; set to any fixed voltage.
4/24
XC8107
Series
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
VIN
-0.3 ~ +6.0
V
Output Voltage
VOUT
-0.3 ~ +6.0
V
CE Input Voltage
VCE
-0.3 ~ +6.0
V
FLG Pin Voltage
VFLG
-0.3 ~ +6.0
V
FLG Pin Current
IFLG
15
mA
Pd
120
1000 (40mm x 40mm Standard board) (*1)
1250 (JESD51-7 board) (*1)
250
600 (40mm x 40mm Standard board) (*1)
760 (JESD51-7 board) (*1)
mW
Operating Ambient Temperature
Topr
-40 ~ +105
℃
Storage Temperature
Tstg
-55 ~ +125
℃
USP-6C
Power Dissipation
(Ta=25℃)
SOT-25
* All voltages are described based on the VSS.
(*1)
The power dissipation figure shown is PCB mounted and is for reference only.
Please see the power dissipation page for the mounting condition.
5/24
XC8107 Series
■ELECTRICAL CHARACTERISTICS
PARAMETER
SYMBOL
Input Voltage
VIN
CONDITIONS
SOT-25
(XC8107A,B)
RON
SOT-25
(XC8107X,Y)
MAX.
UNITS
CIRCUIT
2.5
-
100
5.5
110
V
mΩ
①
VIN=3.3V (*1)
VIN=5.0V (*1)
VIN=3.3V (*1)
-
85
115
104
135
mΩ
mΩ
VIN=5.0V (*1)
VIN=3.3V (*1)
-
100
110
120
130
mΩ
mΩ
①
-
95
40
115
75
mΩ
μA
②
ISTBY
VIN=5.5V, VOUT=OPEN
VCE=VSS (XC8107A,X series)
VCE=VIN (XC8107B,Y series)
-
0.01
1.0
μA
②
ILEAK
VIN=5.5V, VOUT=0V
VCE=VSS (XC8107A,X series)
VCE=VIN (XC8107B,Y series)
-
0.01
1.0
μA
②
VOUT=VIN-0.3V,
XC8107xx05 series
0.81
0.90
0.99
A
VOUT=VIN-0.3V,
XC8107xx10 series
1.26
1.40
1.54
A
VOUT=VIN-0.3V,
XC8107xx15 series
1.71
1.90
2.09
A
VOUT=VIN-0.3V,
XC8107xx20 series
2.16
2.40
2.64
A
VOUT=0V,
XC8107xx05 series
-
0.45
-
A
VOUT=0V,
XC8107xx10 series
-
0.70
-
A
VOUT=0V,
XC8107xx15 series
-
0.95
-
A
VOUT=0V,
XC8107xx20 series
-
1.20
-
A
μs
①
V
①
ISS
Stand-by Current
Switch Leakage Current
Short-Circuit Current
TYP.
VOUT=OPEN
Supply Current
Current Limit
MIN.
USP-6C
On Resistance
Ta=25℃
ILIMT
ISHORT
VIN=5.0V (*1)
①
①
VIN=5.0V, VOUT: OPEN→0V
Measure from VOUT=0V
to when current falls below
a certain ILIM value
VIN=5.5V, XC8107A,X series
-
2.0
-
1.5
-
5.5
VIN=5.5V, XC8107B,Y series
VIN=5.5V, XC8107A,X series
-
-
0.8
0.8
1.5
-0.1
-
5.5
0.1
V
①
ICEH
VIN=5.5V, XC8107B,Y series
VIN=5.5V, VCE=5.5V
μA
①
CE "L" Level Current
ICEL
VIN=5.5V, VCE=0V
-0.1
-
0.1
μA
①
UVLO Detected Voltage
VUVLOD
VIN: 2.2V→1.7V
1.8
1.9
2.0
V
①
UVLO Released Voltage
VUVLOR
VIN: 1.7V→2.2V
1.9
2.0
2.1
V
①
UVLO Hysteresis
VUHYS
-
-
0.1
-
V
①
Current Limit Circuit
Response Time (*2)
tCLR
CE "H" Level Voltage
VCEH
CE "L" Level Voltage
VCEL
CE "H" Level Current
NOTE:
Unless otherwise stated, VIN=5.0V, IOUT=1mA, VCE=VIN (XC8107A, X series) or VCE=VSS (XC8107B, Y series)
(*1)
IOUT=0.25A (XC8107xx05 series), IOUT=0.5A (XC8107xx10 series), IOUT=0.75A (XC8107xx15series), IOUT=1.0A (XC8107xx20 series)
(*2)
Design reference value. This parameter is provided only for reference.
6/24
XC8107
Series
■ELECTRICAL CHARACTERISTICS (Continued)
Ta=25℃
PARAMETER
SYMBOL
turn-on time
tON
turn-off time
CONDITIONS
MIN.
TYP.
MAX.
UNITS
CIRCUIT
RLOAD=10Ω, VCE=0V→2.2V
-
0.60
1.00
ms
①
tOFF
RLOAD=10Ω, VCE=2.2V→0V
-
0.08
0.13
ms
①
FLG output FET
On-resistance
RFLG
IFLG=10mA, VOUT=5.5V
-
15
20
Ω
③
FLG output FET
Leakage Current
IFOFF
VIN=5.5V, VFLG=5.5V, VOUT=OPEN
-
0.01
0.1
μA
③
tFD1
over-current condition
6.5
7.5
8.5
ms
①
tFD2
reverse-voltage condition
2.7
4.0
4.7
ms
①
VOUT=5.5V
VCE=5.0V (XC8107A,X series)
VCE=VSS (XC8107B,Y series)
-
0.1
1.0
μA
①
USP-6C
-
140
-
-
170
-
mV
①
-
160
-
FLG delay time
N=0V,
Reverse Current
IREV
Reverse Current
Prevention
Detect Voltage
VREV_D
VIN: 5.0V→4.7V
VOUT=5.0V
SOT-25
(XC8107A,B)
SOT-25
(XC8107X,Y)
Thermal Shutdown
Detect Temperature
TTSD
Junction Temperature
-
150
-
℃
①
Thermal Shutdown
Release Temperature
TTSR
Junction Temperature
-
130
-
℃
①
Thermal Shutdown
Hysteresis Width
THYS
Junction Temperature
-
20
-
℃
①
NOTE:
Unless otherwise stated, VIN=5.0V, IOUT=1mA, VCE=VIN (XC8107A, X series) or VCE=VSS (XC8107B, Y series)
■TIMING CHART
●turn-on time, turn-off time
Voltege[V]
Voltege[V]
VCE
CE "H" Level Voltage
CE "L" Level Voltage
CE "L" Level Voltage
CE "H" Level Voltage
VCE
90%
90%
10%
VOUT
tON
tOFF
XC8107 Series, Type A, X
Time[ms]
10%
VOUT
tON
tOFF
Time[ms]
XC8107 Series, Type B, Y
7/24
XC8107 Series
■TEST CIRCUITS
CIN=1.0μF, CL=1.0μF
1) CIRCUIT①
Measurement Waveform
A
VOUT
VIN
RFLG=100kΩ
Measurement Waveform
A
FLG
IOUT
VIN
V
CIN
(ceramic)
A
VCE
CE
VOUT
VSS
CL
(ceramic)
V
V
2) CIRCUIT②
A
VIN
VOUT
RFLG=100kΩ
FLG
CE
VIN
VSS
3) CIRCUIT③
VOUT
VIN
FLG
A
V
VFLG
CIN
(ceramic)
8/24
↓
VIN
V
CE
VCE
VOUT
VSS
V
CL
(ceramic)
V
XC8107
Series
■OPERATIONAL EXPLANATION
The XC8107 series is a P-channel MOSFET power switch IC.
The XC8107 series consists of a CE circuit, UVLO circuit, thermal shutdown circuit, current limiter circuit, reverse current
prevention circuit, control block and others. The gate voltage of the power switch transistor is controlled with control block. The
current limiter circuit and reverse current prevention circuit will operate based on the output voltage and output current.
(See the BLOCK DIAGRAM below)
Reverse
Current
Prevention
VOUT
VIN
CURRENT
SENSE
UVLO
CE
ON/OFF
Control
each
circuit
CURRENT
LIMIT
CONTROL
4ms
Delay
7.5ms
Delay
THERMAL
SHUTDOWN
FLG
VSS
BLOCK DIAGRAM (XC8107 Series)
The voltage level which is fed to CE pin controls the status of this IC. If either “H” level or “L” level which is defined as the
electrical specification is fed to CE pin, then XC8107 can operate in standard manner. However, if the middle voltage which is
neither “H” level nor “L” level is fed to CE pin, the consumption current will increase due to the shoot-through current at internal
circuits. Also if CE pin is open, the status of XC8107 cannot be fixed and the behavior will be unstable.
For protection against heat damage of the ICs, thermal shutdown function is built in. When the internal junction temperature
reaches the temperature limit, the thermal shutdown circuit operates and the power switch transistor will turn OFF. The IC resumes
its operation when the thermal shutdown function is released and the IC’s operation is automatically restored because the junction
temperature drops to the level of the thermal shutdown release temperature. When the thermal shutdown circuit detects higher
junction temperature than the detect temperature, the voltage level of FLG pin is low level. When the thermal shutdown circuit
detects lower junction temperature than the release temperature, the thermal shutdown function is released and the voltage level
of FLG pin is high level.
When the VIN pin voltage goes down to lower voltage than UVLO detected voltage, the power switch transistor turns OFF by
UVLO function in order to prevent false output caused by unstable operation of the internal circuitry. When the VIN pin voltage
goes up to higher voltage than UVLO released voltage, the UVLO function is released and the power switch transistor can turn
ON.
The soft-start circuit can reduce the in-rush current charged on the output capacitor when IC starts up. Additionally, due to the
reduction of the in-rush current, the circuit can reduce the fluctuation of the input voltage as well. The soft-start time is optimized
internally and defined as turn-on time. (TYP: 0.6ms)
9/24
XC8107 Series
■OPERATIONAL EXPLANATION (Continued)
When the output current reaches the current limit value, the constant current limiter circuit activates and as a result, the output
voltage goes down.
If the short circuit comes at the VOUT pin, the output current is limited to the current which is specified as the short-circuit current
value. If the over-current state lasts for 7.5ms (TYP.), the FLG pin changes to Low level output.
Two types are available for the current limiter circuit: an auto recovery type (product type C) and a latch off type (product type
D). After the current limiter circuit activates and the FLG pin outputs low level, the operation is different between these two types.
The auto recovery type continuously limits the output current by the current limit value.
When the over-current status finishes and the status of that the output current is less than the current limit value continues for
7.5ms (TYP.) or more, the voltage of FLG pin goes up “H” level again.
The latch off type turns off the power switch transistor after the FLG pin outputs Low level. The off state is maintained regardless
of whether the over-current state is released.
Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage
below the UVLO detected voltage once and after that raising it higher than UVLO released voltage.
An internal circuit is built in that prevents reverse current from the VOUT pin to the VIN pin.
When the difference between input voltage and VOUT pin voltage is higher than the detect voltage set internally, the reverse current
prevention circuit activates, and the power switch transistor turns off, then the reverse current from the VOUT pin to the VIN pin is
reduced to 0.1μA (TYP.).
If the reverse-voltage state lasts for 4ms (TYP.), the FLG pin changes to Low level output.
Two types are available for the reverse current prevention circuit: the auto recovery type (product type C) and the latch off type
(product type D). After the reverse current prevention circuit activates and the FLG pin outputs low level, the operation is different
between these two types.
On the auto recovery type, when the output voltage drops below the input voltage, the reverse current prevention circuit stops
immediately, and the power switch transistor turns on again. If the output voltage remains lower than the input voltage for 4ms
(TYP.), the FLG pin returns to High level output.
On the latch off type, the power switch transistor remains in the off state even if the reverse voltage state is released.
Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below
the UVLO detected voltage once and after that raising it higher than UVLO released voltage.
10/24
XC8107
Series
■OPERATIONAL EXPLANATION (Continued)
The flag circuit is built in which monitors the state of the power switch.
The FLG pin outputs Low level when the reverse current prevention function is operating. A resistance of 10kΩ to 100kΩ is
recommended for the FLG pin pull-up resistance.
Auto recovery type (product type C)
Protective function
FLG pin Low level output
Return to FLG pin High level output
Current limiter
7.5ms after over-current detection
7.5ms after over-current release
Reverse current prevention
4.0ms after reverse voltage detection
4.0ms after reverse voltage release
Thermal shutdown
Same time as overheat state is detected
Same time as overheat state is released
Protective function
FLG pin Low level output
Return to FLG pin High level output
Current limiter
7.5ms after over-current detection
When latch operation is released
Reverse current prevention
4.0ms after reverse voltage detection
When latch operation is released
Thermal shutdown
Same time as overheat state is detected
Same time as overheat state is released
Latch off type (product type D)
11/24
XC8107 Series
■NOTES ON USE
1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated
if IC is used beyond the absolute MAX. specifications.
2. Where wiring impedance is high, operations may become unstable due to noise depending on output current.
Please keep the resistance low between VIN and VSS wiring in particular.
3. Please place the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible.
For the input or output capacitor, a capacitance of 1.0μF or higher is recommended.
4. When the voltage which is higher than the maximum input voltage is fed to the VIN pin, and VOUT is shorted to the VSS level, in
this case the short circuit may cause a fatal impact to operation for the IC. Please use within the operational voltage range.
5. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
12/24
XC8107
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) UVLO detect Voltage vs. Input Voltage
(2) UVLO release Voltage vs. Input Voltage
XC8107xxxxxR
XC8107xxxxxR
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
UVLO release Voltage : UVLO [V]
UVLO detect Voltage : UVLO [V]
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
3.0
Ta=105℃
Ta=25℃
Ta=-40℃
2.5
2.0
1.5
1.0
0.5
0.0
3.0
Ta=105℃
Ta=25℃
Ta=-40℃
2.5
2.0
1.5
1.0
0.5
0.0
1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10
Input Voltage : VIN [V]
1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10
Input Voltage : VIN [V]
(3) UVLO threshold Voltage vs. Ambient Temperature
XC8107xxxxxR
UVLO threshold Voltage : UVLO [V]
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
3.0
2.5
2.0
1.5
1.0
UVLO detect
UVLO release
0.5
0.0
-50
-25
0
25
50
75 100
Ambient Temperature : Ta [℃]
125
(4) Stand-by Current vs. Input Voltage
(5) Stand-by Current vs. Ambient Temperature
XC8107xxxxxR
XC8107xxxxxR
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
3.0
Ta=105℃
2.5
Ta=25℃
Ta=-40℃
2.0
1.5
1.0
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Stand-by Current : Istby [μA]
Stand-by Current : Istby [μA]
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
3.0
Istby
2.5
2.0
1.5
1.0
0.5
0.0
-50
Input Voltage : VIN [V]
-25
0
25
50
75 100
Ambient Temperature : Ta [℃]
125
13/24
XC8107 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(6) Supply Current vs. Input Voltage(sweep up)
(7) Supply Current vs. Ambient Temperature
XC8107xxxxxR
XC8107xxxxxR
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
Supply Current : ISS [μA]
Supply Current : ISS [μA]
VIN=5.0V, CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
50
45
40
35
30
25
20
15
10
5
0
Ta=105℃
Ta=25℃
Ta=-40℃
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
50
45
40
35
30
25
20
15
10
5
0
-50
Input Voltage : VIN [V]
(8) CE "H" Level Voltage vs. Input Voltage
VIN=5.0V
-25
0
25
50
75 100
Ambient Temperature : Ta [℃]
(9) CE "L" Level Voltage vs. Input Voltage
XC8107xxxxxR
XC8107xxxxxR
2.5
2.0
1.5
Ta=105℃
Ta=25℃
0.5
Ta=-40℃
0.0
0.0
0.5
1.0
1.5
2.0
Input Voltage : VIN [V]
2.5
(10) CE threshold Voltage vs. Ambient Temperature
XC8107xxxxxR
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
CE threshold Voltage : VCE [V]
3.0
CE"H"Level
2.5
CE"L"Level
2.0
1.5
1.0
0.5
0.0
-50
14/24
-25
0
25
50
75 100
Ambient Temperature : Ta [℃]
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
CE "L" Level Voltage : VCEL [V]
CE "H" Level Voltage : VCEH [V]
CIN=1.0μF(ceramic), CL=1.0μF(ceramic)
3.0
1.0
125
125
3.0
2.5
2.0
1.5
1.0
Ta=105℃
Ta=25℃
0.5
Ta=-40℃
0.0
0.0
0.5
1.0
1.5
2.0
Input Voltage : VIN [V]
2.5
XC8107
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(11) On Resistance vs. Input Voltage (USP-6C)
(12) On Resistance
vs. Ambient Temperature (USP-6C)
XC8107xxxxER
XC8107xxxxER
CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic)
On Resistance : Ron [mΩ]
On Resistance : Ron [mΩ]
CIN =1.0μF(ceramic), CL=1.0μF(ceramic)
180
160
140
120
100
80
60
40
20
0
2.0
Ta=105℃
Ta=25℃
Ta=-40℃
2.5
3.0 3.5 4.0 4.5 5.0
Input Voltage : V IN [V]
5.5
180
160
140
120
100
80
60
40
20
0
VIN=4.5V
VIN=5.0V
VIN=5.5V
-50
6.0
(13) On Resistance vs. Input Voltage (SOT-25:XC8107A,B)
VIN=2.5V
VIN=3.5V
-25
0
25
50
75 100
Ambient Temperature : Ta [℃]
125
(14) On Resistance
vs. Ambient Temperature (SOT-25:XC8107A,B)
XC8107xxxxMR
XC8107xxxxMR
CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic)
On Resistance : Ron [mΩ]
On Resistance : Ron [mΩ]
CIN =1.0μF(ceramic), CL=1.0μF(ceramic)
180
160
140
120
100
80
60
40
20
0
2.0
Ta=105℃
Ta=25℃
Ta=-40℃
2.5
3.0 3.5 4.0 4.5
Input Voltage : V IN [V]
5.0
5.5
180
160
140
120
100
80
60
40
20
0
-50
6.0
(15) On Resistance vs. Input Voltage (SOT-25:XC8107X,Y)
VIN=2.5V
VIN=3.5V
VIN=4.5V
VIN=5.0V
VIN=5.5V
-25
0
25
50
75 100
Ambient Temperature : Ta [℃]
125
(16) On Resistance
vs. Ambient Temperature (SOT-25:XC8107X,Y)
XC8107xxxxMR
XC8107xxxxMR
Ta=105℃
Ta=25℃
Ta=-40℃
2.5
3.0 3.5 4.0 4.5 5.0
Input Voltage : V IN [V]
5.5
CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic)
On Resistance : Ron [mΩ]
On Resistance : Ron [mΩ]
CIN =1.0μF(ceramic), CL=1.0μF(ceramic)
180
160
140
120
100
80
60
40
20
0
2.0
6.0
180
160
140
120
100
80
60
40
20
0
VIN=2.5V
VIN=3.5V
VIN=4.5V
VIN=5.0V
VIN=5.5V
-50
-25
0
25
50
75 100
Ambient Temperature : Ta [℃]
125
15/24
XC8107 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(17) turn-on time vs. Input Voltage
(18) turn-on time vs. Ambient Temperature
XC8107xxxxxR
XC8107xxxxxR
0.7
0.6
0.6
turn-on time : tDLY(ON) [ms]
turn-on time : tDLY(ON) [ms]
CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic)
0.7
0.5
0.4
0.3
0.2
Ta=105℃
Ta=25℃
Ta=-40℃
0.1
0.0
2.0
2.5
3.0 3.5 4.0 4.5 5.0
Input Voltage : V IN [V]
5.5
0.5
0.4
0.3
VIN=2.5V
VIN=3.5V
VIN=4.5V
VIN=5.0V
VIN=5.5V
0.2
0.1
0.0
6.0
(19) turn-off time vs. Input Voltage
CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic)
-50
-25
turn-off time : tDLY(OFF) [ms]
turn-off time : tDLY(OFF) [ms]
XC8107xxxxxR
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
Ta=105℃
Ta=25℃
Ta=-40℃
2.5
3.0 3.5 4.0 4.5 5.0
Input Voltage : V IN [V]
5.5
6.0
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
VIN=2.5V
VIN=3.5V
VIN=4.5V
VIN=5.0V
VIN=5.5V
-50
-25
0
25
50
(22) FLG delay time reverse-voltage
vs. Ambient Temperature
vs. Ambient Temperature
VIN=2.5V
VIN=3.5V
VIN=4.5V
VIN=5.0V
VIN=5.5V
-25
0
25
50
75
Ambient Temperature : Ta [℃]
16/24
100
125
XC8107xxxxxR
CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic)
100
125
FLG reverse-voltage : tFD [ms]
FLG over-current : tFD [ms]
XC8107xxxxxR
-50
75
Ambient Temperature : Ta [℃]
(21) FLG delay time over-current
9.0
8.5
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
125
(20) turn-off time vs. Ambient Temperature
XC8107xxxxxR
2.0
0
25
50
75 100
Ambient Temperature : Ta [℃]
CIN =1.0μF(ceramic), CL=1.0μF(ceramic)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VIN=2.5V
VIN=3.5V
VIN=4.5V
VIN=5.0V
-50
-25
0
25
50
75
Ambient Temperature : Ta [℃]
100
125
XC8107
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(23) Output Voltage vs. Output Current
XC8107xCxxxR
0.5A
1.0A
1.5A
2.0A
3.0
2.0
1.0
0.0
0.0
0.5
1.0 1.5 2.0 2.5 3.0
Output Current : IOUT [A]
3.5
4.0
(24) turn-on Delay vs. Rise Time (CL=1.0μF)
4.0
3.0
2.0
1.0
If the over-current state lasts for 7.5ms,
the latch off type turns off the power switch transistor.
0.0
0.0
4.0
3.5
8.0
3.0
6.0
2.5
2.0
Output Voltage
0.0
2.0
1.5
-2.0
1.0
-4.0
0.5
-6.0
Supply Current
-8.0
0.0
Voltage : [V]
CE Input Voltage
2.0
-6.0
2.5
2.0
2.0
0.0
1.5
-2.0
1.0
-4.0
0.5
-6.0
0.0
Supply Current
-8.0
-0.5
Time [500μs/div]
8.0
3.5
Supply Current
0.0
-0.5
VCE= 5.0V→0V, tf= 5μs, RL= 10Ω, Ta= 25℃
VIN =5.0V, CIN = 1.0μF, CL= 120μF(ceramic)
6.0
Voltage : [V]
Output Voltage
0.5
XC8107xx10xR
3.0
CE Input Voltage
1.0
(27) turn-off Delay vs. Fall Time (CL=120μF)
Supply Current : Isupply [A]
Voltage : [V]
4.0
4.0
Time [100μs/div]
XC8107xx10xR
6.0
1.5
CE Input Voltage
-8.0
-0.5
2.5
2.0
0.0
-2.0
3.5
3.0
Output Voltage
-4.0
(26) turn-on Delay vs. Rise Time (CL=120μF)
8.0
3.5
VCE= 5.0V→0V, tf= 5μs, RL= 10Ω, Ta= 25℃
VIN =5.0V, CIN =CL= 1.0μF(ceramic)
4.0
Time [100μs/div]
VCE= 0V→5.0V, tr= 5μs, RL= 10Ω, Ta= 25℃
VIN =5.0V, CIN = 1.0μF, CL= 120μF(ceramic)
1.0 1.5 2.0 2.5 3.0
Output Current : IOUT [A]
XC8107xx10xR
Supply Current : Isupply [A]
Voltage : [V]
6.0
VCE= 0V→5.0V, tr= 5μs, RL= 10Ω, Ta= 25℃
VIN =5.0V, CIN =CL= 1.0μF(ceramic)
0.5
(25) turn-off Delay vs. Fall Time (CL=1.0μF)
XC8107xx10xR
8.0
type
type
type
type
Supply Current : Isupply [A]
4.0
0.5A
1.0A
1.5A
2.0A
5.0
3.0
4.0
2.5
Output Voltage
2.0
2.0
1.5
0.0
-2.0
3.5
CE Input Voltage
-4.0
1.0
0.5
-6.0
0.0
Supply Current : Isupply [A]
5.0
CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic)
6.0
type
type
type
type
Output Voltage : V OUT [V]
6.0
Output Voltage : V OUT [V]
XC8107xDxxxR
CIN = 1.0μF(ceramic), CL= 1.0μF(ceramic)
Supply Current
-8.0
-0.5
Time [500μs/div]
17/24
XC8107 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(28) Short Circuit Current, Device Enabled Into Short
XC8107xx10xR
XC8107xx10xR
VCE= 0V→5.0V, tr= 5μs, Ta= 25℃
VIN =5.0V, CIN =CL= 1.0μF(ceramic)
3.0
4.0
2.5
2.0
2.0
0.0
1.5
Output Voltage
-2.0
1.0
-4.0
0.5
Supply Current
2.5
2.0
2.0
0.0
XC8107xC10xR
2.5
2.0
0.0
1.5
Output Voltage
1.0
0.5
Supply Current
-6.0
0.0
-0.5
Time [2ms/div]
Voltage : [V]
FLG Voltage
6.0
Supply Current : Isupply [A]
Voltage : [V]
3.0
2.0
-8.0
8.0
3.5
VOUT = Short circuit to Vss
6.0
-4.0
4.0
0.0
-8.0
18/24
1.5
1.0
0.5
Time [2ms/div]
0.5
Supply Current
0.0
-0.5
Time [2ms/div]
0.0
-0.5
VIN = 5.0V, tr= 100μs, Ta= 25℃
FLG= 100kΩ, CIN =CL= 1.0μF(ceramic)
3.5
VOUT = Removed Short circuit
Voltage : [V]
2.5
2.0
Supply Current
1.0
6.0
Supply Current : Isupply [A]
Voltage : [V]
-8.0
3.0
FLG Voltage
-4.0
-6.0
8.0
3.5
VOUT = Short circuit to Vss
Output Voltage
1.5
XC8107xC10xR
8.0
0.0
2.0
FLG Voltage
-6.0
VIN = 5.0V, tf= 100μs, Ta= 25℃
FLG= 100kΩ, CIN =CL= 1.0μF(ceramic)
-2.0
2.5
Output Voltage
-2.0
-4.0
3.5
3.0
2.0
XC8107xC10xR
2.0
VOUT = Removed Short circuit
(VOUT=short→open, CL=1.0μF)
(VOUT=open→short, CL=1.0μF)
4.0
VIN = 5.0V, tr= 100μs, Ta= 25℃
FLG= 100kΩ, CIN =CL= 1.0μF(ceramic)
(32) Short-Curcuit Transient Response
(31) Short-Curcuit Transient Response
6.0
-0.5
Time [40μs/div]
(VOUT=short→5.0Ω, CL=1.0μF)
VIN = 5.0V, tf= 100μs, Ta= 25℃
FLG= 100kΩ, CIN =CL= 1.0μF(ceramic)
-2.0
0.0
-6.0
XC8107xC10xR
4.0
0.5
Supply Current
(30) Short-Curcuit Transient Response
(VOUT=5.0Ω→short, CL=1.0μF)
8.0
1.5
1.0
-4.0
-8.0
(29) Short-Curcuit Transient Response
Output Voltage
-2.0
-0.5
Time [40μs/div]
3.0
4.0
Supply Current : Isupply [A]
-8.0
0.0
6.0
4.0
3.0
2.5
Output Voltage
2.0
FLG Voltage
2.0
0.0
1.5
-2.0
1.0
-4.0
0.5
-6.0
-8.0
Supply Current
Time [2ms/div]
0.0
-0.5
Supply Current : Isupply [A]
-6.0
3.5
Supply Current : Isupply [A]
CE Input Voltage
Voltage : [V]
6.0
VCE= 5.0V→0V, tf= 5μs, Ta= 25℃
VIN =5.0V, CIN = 1.0μF, CL= 120μF(ceramic)
CE Input Voltage
3.5
Supply Current : Isupply [A]
Voltage : [V]
8.0
8.0
XC8107
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(33) Short-Curcuit Transient Response
(34) Short-Curcuit Transient Response
(VOUT=5.0Ω→short, CL=120μF)
(VOUT=short→5.0Ω, CL=120μF)
XC8107xC10xR
VIN = 5.0V, tf= 100μs, Ta= 25℃
FLG= 100kΩ, CIN = 1.0μF, CL= 120μF(ceramic)
3.0
4.0
FLG Voltage
2.0
2.5
2.0
0.0
1.5
Output Voltage
-2.0
1.0
-4.0
0.5
Supply Current
-6.0
Time [2ms/div]
4.0
1.5
1.0
Supply Current
-8.0
0.0
-0.5
Time [2ms/div]
(36) Short-Curcuit Transient Response
XC8107xC10xR
VOUT = Short circuit to Vss
3.5
3.0
FLG Voltage
2.5
2.0
Output Voltage
1.5
-2.0
1.0
-4.0
8.0
0.5
6.0
Voltage : [V]
VIN = 5.0V, tf= 100μs, Ta= 25℃
FLG= 100kΩ, CIN = 1.0μF, CL= 120μF(ceramic)
Supply Current : Isupply [A]
Voltage : [V]
0.5
-4.0
-0.5
0.0
-6.0
2.0
(VOUT=short→open, CL=120μF)
4.0
2.0
FLG Voltage
0.0
XC8107xC10xR
6.0
2.5
-2.0
-6.0
(VOUT=open→short, CL=120μF)
8.0
3.5
3.0
Output Voltage
2.0
0.0
(35) Short-Curcuit Transient Response
VOUT = Removed Short circuit
-8.0
VOUT = Removed Short circuit
2.5
Output Voltage
2.0
FLG Voltage
0.0
1.5
-2.0
1.0
-4.0
0.5
0.0
Supply Current
-8.0
-0.5
3.5
3.0
2.0
-6.0
0.0
Supply Current
4.0
VIN = 5.0V, tr= 100μs, Ta= 25℃
FLG= 100kΩ, CIN = 1.0μF, CL= 120μF(ceramic)
Time [2ms/div]
Supply Current : Isupply [A]
-8.0
6.0
Voltage : [V]
Voltage : [V]
6.0
8.0
3.5
VOUT = Short circuit to Vss
Supply Current : Isupply [A]
8.0
VIN = 5.0V, tr= 100μs, Ta= 25℃
FLG= 100kΩ, CIN = 1.0μF, CL= 120μF(ceramic)
Supply Current : Isupply [A]
XC8107xC10xR
-0.5
Time [2ms/div]
(37) UVLO Transient Response (CL=1.0μF)
Voltage : [V]
6.0
4.0
2.0
3.0
Input Voltage
2.5
Output Voltage
0.0
1.0
-4.0
-6.0
2.0
1.5
-2.0
0.5
Supply Current
-8.0
0.0
-0.5
Time [500μs/div]
8.0
3.5
6.0
Voltage : [V]
8.0
XC8107xxxxxR
Supply Current : Isupply [A]
VIN = 0V→5.0V, tr= 3ms, Ta= 25℃
RL= 5Ω, CIN =CL= 1.0μF(ceramic)
VIN = 5.0V→0V, tf= 3ms, Ta= 25℃
RL= 5Ω, CIN =CL= 1.0μF(ceramic)
3.5
3.0
Input Voltage
4.0
2.5
2.0
2.0
0.0
-2.0
1.5
Output Voltage
-4.0
-6.0
1.0
0.5
Supply Current
-8.0
0.0
Supply Current : Isupply [A]
XC8107xxxxxR
-0.5
Time [500μs/div]
19/24
XC8107 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(38) UVLO Transient Response (CL=120μF)
8.0
3.0
6.0
4.0
2.5
2.0
2.0
0.0
1.5
-2.0
1.0
-4.0
0.5
-6.0
Supply Current
-8.0
0.0
2.5
2.0
2.0
-6.0
8.0
5.0
6.0
0.0
-2.0
2.0
1.0
-4.0
0.0
Supply Current
-6.0
-1.0
-8.0
-2.0
Voltage : [V]
6.0
3.0
FLG Voltage
4.0
Input Voltage
2.0
0.0
-2.0
-6.0
-2.0
-8.0
20/24
5.0
4.0
2.0
-1.0
-2.0
Time [500μs/div]
1.0
0.0
Supply Current
-6.0
-1.0
-8.0
-2.0
8.0
6.0
0.0
Supply Current
2.0
VIN =5.0V, Ta=25℃
CIN = 1.0μF, CL= 120μF(ceramic)
1.0
-4.0
3.0
XC8107xxxxxR
3.0
FLG Voltage
4.0
Output Voltage
FLG Voltage
-4.0
6.0
Voltage : [V]
Output Voltage
5.0
Input Voltage
(42) Reverse Voltage Released Voltage (CL=120μF)
Supply Current : Isupply [A]
Voltage : [V]
4.0
VOUT=5.5V forced
6.0
VOUT = 5.5V Removed
0.0
XC8107xxxxxR
6.0
VIN =5.0V, RL= 5Ω, Ta= 25℃
CIN =CL= 1.0μF(ceramic)
Time [500μs/div]
(41) Reverse Voltage Detected Voltage (CL=120μF)
8.0
-0.5
2.0
Time [500μs/div]
VIN =5.0V, Ta=25℃
CIN = 1.0μF, CL= 120μF(ceramic)
0.0
Supply Current
XC8107xxxxxR
4.0
Input Voltage
2.0
0.5
(40) Reverse Voltage Released Voltage (CL=1.0μF)
Supply Current : Isupply [A]
Voltage : [V]
4.0
Output Voltage
1.0
Time [500μs/div]
XC8107xxxxxR
VOUT=5.5V forced
Input Voltage
-8.0
(39) Reverse Voltage Detected Voltage (CL=1.0μF)
6.0
1.5
0.0
-2.0
Time [500μs/div]
8.0
3.0
Output Voltage
4.0
-4.0
-0.5
VIN =5.0V, RL= 5Ω, Ta= 25℃
CIN =CL= 1.0μF(ceramic)
3.5
Supply Current : Isupply [A]
Output Voltage
VIN = 5.0V→0V, tf= 3ms, Ta= 25℃
RL= 5Ω, CIN = 1.0μF, CL= 120μF(ceramic)
4.0
2.0
6.0
VOUT = 5.5V Removed
Input Voltage
Output Voltage
FLG Voltage
5.0
4.0
3.0
0.0
2.0
-2.0
1.0
-4.0
0.0
Supply Current
-6.0
-1.0
-8.0
-2.0
Time [500μs/div]
Supply Current : Isupply [A]
Input Voltage
3.5
Voltage : [V]
Voltage : [V]
6.0
XC8107xxxxxR
Supply Current : Isupply [A]
8.0
VIN = 0V→5.0V, tr= 3ms, Ta= 25℃
RL= 5Ω, CIN = 1.0μF, CL= 120μF(ceramic)
Supply Current : Isupply [A]
XC8107xxxxxR
XC8107
Series
■ TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(43) CE Transient Response
XC8107xxxxxR
XC8107xxxxxR
0.030
4.0
0.025
2.0
0.020
0.0
0.5A type
1.0A type
-2.0
1.5A type
-4.0
-6.0
-8.0
2.0A type
In Rush Current
Time [500μs/div]
0.015
0.010
0.005
0.000
8.0
Voltage : [V]
6.0
0.035
CE Voltage
In Rush Current : IRUSH [A]
Voltage : [V]
8.0
3.5
CE Voltage
6.0
4.0
2.5
2.0
2.0
0.0
0.5A
1.0A
1.5A
2.0A
-2.0
-4.0
1.5
1.0
0.5
0.0
In Rush Current
-8.0
-0.5
Time [500μs/div]
(45) Current Limit adapted time
XC8107xx10xR
14.0
12.0
10.0
4.0
2.0
8.0
Output Voltage
0.0
6.0
-2.0
4.0
-4.0
2.0
In Rush Current
-6.0
0.0
-8.0
-2.0
Time [2μs/div]
VIN =5.0V, Ta=25℃
CL=open
Current Limit Response : [μs]
VOUT = Short circuit to Vss
XC8107xx10xR
In Rush Current : [A]
VIN =5.0V, Ta=25℃
CL=open
8.0
Voltage : [V]
type
type
type
type
-6.0
-0.005
(44) Short Applied
6.0
3.0
In Rush Current : IRUSH [A]
VCE= 0→5.0V, tr= 5μs, Ta= 25℃
VIN =5.0V, CIN = 1.0μF, CL= 120μF(ceramic)
VCE= 0→5.0V, tr= 5μs, Ta= 25℃
VIN =5.0V, CIN =CL= 1.0μF(ceramic)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0.0
1.0
2.0
3.0
4.0
5.0
Peak Limit Current [A]
6.0
21/24
XC8107 Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
OUTLINE / LAND PATTERN
SOT-25
SOT-25 PKG
THERMAL CHARACTERISTICS
Standard Board
SOT-25 Power Dissipation
JESD51-7 Board
Standard Board
USP-6C
USP-6C PKG
USP-6C Power Dissipation
JESD51-7 Board
22/24
XC8107
Series
■MARKING RULE
●SOT-25(Au Wire) / USP-6C(Au Wire) / SOT-25(Cu Wire)
①
SOT-25
SOT-25
5
①
represents products series
4
②
③
④
②
⑤
2
PRODUCT SERIES
Z
XC8107******-G
represents product type
MARK
1
MARK
Wire Type
1
3
2
3
USP-6C
Active High
Au
Active Low
4
R
③
⑤
3
②
④
2
①
1
S
6
T
5
CE LOGIC
Active High
Cu
Active Low
U
Protection Circuits
PRODUCT SERIES
Auto-recovery
XC8107AC****-G
Latch-off
XC8107AD****-G
Auto-recovery
XC8107BC****-G
Latch-off
XC8107BD****-G
Auto-recovery
XC8107XC****-G
Latch-off
XC8107XD****-G
Auto-recovery
XC8107YC****-G
Latch-off
XC8107YD****G
4
③
represents maximum output current
MARK
CURRENT
PRODUCT SERIES
1
2
0.5
1.0
XC8107**05**-G
XC8107**10**-G
3
1.5
XC8107**15**-G
4
2.0
XC8107**20**-G
④⑤ represents production lot number
01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
23/24
XC8107 Series
1.
The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2.
The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3.
Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4.
The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5.
Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6.
Our products are not designed to be Radiation-resistant.
7.
Please use the product listed in this datasheet within the specified ranges.
8.
We assume no responsibility for damage or loss due to abnormal use.
9.
All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
24/24