XC8108 Series
ETR33004-009b
85mΩ High Function Power Switch
■GENERAL DESCRIPTION
The XC8108 series is a P-channel MOSFET power switch IC with a low ON resistance. A current limit, reverse current
prevention (prevents reverse current from VOUT to VIN), soft start, thermal shutdown, and an under voltage lockout (UVLO) are
incorporated as protective functions. A flag function monitors the power switch status. The flag output has N-channel open
drain structure, and outputs Low level signal while over-current or overheating is detected, or while the reverse current
prevention is operated.
A variable current limiting function is integrated, allowing the current limit value to be set, using an external resistor.
The voltage level which is fed to CE pin determines the status of XC8108. The logic level of CE pin is selectable between
either one of active high or active low.
■APPLICATIONS
■FEATURES
●Set Top Boxes
Input Voltage
Maximum Output Current
ON Resistance
Supply Current
Stand-by Current
Flag Delay Time
●Digital TVs
●PCs
●USB Ports/USB Hubs
●HDMI
Protection Circuit
Functions
Current Limit Response Time
Operating Ambient Temperature
Packages
Environmentally Friendly
■TYPICAL APPLICATION CIRCUIT
: 2.5V ~ 5.5V
: 2A
: 85mΩ@VIN=5.0V (TYP.)
: 40μA@ VIN=5.0V
: 0.1μA (TYP.)
: 7.5ms (TYP.)
* At over-current detection
: 4ms (TYP.)
* At reverse voltage detection
: Reverse Current Prevention
0.9A ~ 2.4A(TYP.)
Thermal Shutdown
Under Voltage Lockout (UVLO)
Soft start
: Flag Output
CE Pin Input Logic Selectable
: 2μs (TYP.)
*Reference value
: -40℃ ~ 105℃
: USP-6C
: EU RoHS Compliant, Pb Free
■TYPICAL PERFORMANCE
CHARACTERISTICS
XC8108xC20ER
USB Port
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
100kΩ
USB
Control
VIN
VOUT
1.0μF
1.0μF
FLG
CE
ILIM
VSS
RLIM
+
120μF
VBUS
GND
6.0
RILIM=39.2kΩ
Output Voltage : VOUT [V]
5V Input
5.0
RILIM=18.4kΩ
RILIM=5.76kΩ
4.0
RILIM=0kΩ
3.0
2.0
1.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Output Current : IOUT [A]
3.5
4.0
1/24
XC8108 Series
■BLOCK DIAGRAM
Reverse
Current
Prevention
VOUT
VIN
CURRENT
SENSE
UVLO
CE
ON/OFF
Control
each
circuit
CURRENT
LIMIT
CONTROL
4ms
Delay
7.5ms
Delay
THERMAL
SHUTDOWN
VSS
* Diodes inside the circuit are an ESD protection diode and a parasitic diode.
2/24
ILIM
FLG
XC8108
Series
■PRODUCT CLASSIFICATION
●Ordering Information
XC8108①②③④⑤⑥-⑦
DESIGNATOR
ITEM
①
CE Logic
B
Refer to Selection Guide
C
Protection Circuits Type
③④
Maximum Output Current
20
Package (Order Unit)
ER-G
(*1)
DESCRIPTION
A
②
⑤⑥-⑦
(*1)
SYMBOL
D
2.0A
(Adjustable current limit range:
900mA~2400mA)
USP-6C (3,000pcs/Reel)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
●Selection Guide
FUNCTION
TYPE
AC
AD
BC
BD
CE LOGIC SELECTABLE
Active High
Active Low
SOFT-START
Yes
Yes
UVLO
Yes
Yes
REVERSE CURRENT PREVENTION
Yes
Yes
THERMAL SHUT DOWN
Yes
Yes
CURRENT LIMIT ADJUSTABLE
Yes
Yes
CURRENT LIMITER /
REVERSE CURRENT PREVENTION
(Automatic Recovery)
CURRENT LIMITER /
REVERSE CURRENT PREVENTION
(Latch Protection)
Yes
-
Yes
-
-
Yes
-
Yes
3/24
XC8108 Series
■PIN CONFIGURATION
FLG 3
4 CE
ILIM 2
5 VSS
VOUT 1
6 VIN
USP-6C
(BOTTOM VIEW)
* The dissipation pad for the USP-6C packages should be solder-plated for mounting strength and heat dissipation.
Please refer to the reference mount pattern and metal masking. The dissipation pad should be connected to the VSS (No. 5) pin.
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
1
VOUT
Output
2
ILIM
Current Limit Adjustment
3
FLG
Fault Report
4
CE
ON/OFF Control
5
VSS
Ground
6
VIN
Power Input
USP-6C
■FUNCTION
TYPE
PIN NAME
A
CE
B
SIGNAL
STATUS
H
Active
L
Stand-by
OPEN
Undefined State (*1)
H
Stand-by
L
Active
OPEN
Undefined State (*1)
* Avoid leaving the CE pin open; set to any fixed voltage.
4/24
XC8108
Series
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
VIN
-0.3 ~ 6.0
V
Output Voltage
VOUT
-0.3 ~ 6.0
V
Output Current
IOUT
2.8
A
CE Input Voltage
VCE
-0.3 ~ 6.0
V
FLG Pin Voltage
VFLG
-0.3 ~ 6.0
V
FLG Pin Current
IFLG
15
mA
ILIM Pin Voltage
VILIM
-0.3 ~ 6.0
V
ILIM Pin Current
IILIM
±1
mA
Power Dissipation
(Ta=25℃)
120
USP-6C
Pd
1000 (40mm x 40mm Standard board) (*2)
1250 (JESD51-7
mW
board) (*1)
Operating Ambient Temperature
Topr
-40 ~ 105
℃
Storage Temperature
Tstg
-55 ~ 125
℃
* All voltages are described based on the VSS.
(*1)
Use with IOUT less than Pd/(VIN-VOUT).
(*2)
The power dissipation figure shown is PCB mounted and is for reference only
Please refer to PACKAGING INFORMATION for the mounting condition.
5/24
XC8108 Series
■ELECTRICAL CHARACTERISTICS
PARAMETER
SYMBOL
Input Voltage
VIN
On Resistance
RON
Supply Current
ISS
Stand-by Current
ISTBY
Switch Leakage Current
ILEAK
Current Limit
ILIMT
CONDITIONS
VIN=3.3V, IOUT=1.0A
VIN=5.0V, IOUT=1.0A
ISHORT
MIN.
MAX.
UNITS
CIRCUIT
-
5.5
V
①
-
100
85
110
104
mΩ
mΩ
①
VOUT=OPEN
-
40
75
μA
②
VIN=5.5V, VOUT=OPEN
VCE=VSS (XC8108A)
VCE=VIN (XC8108B)
-
0.01
1.0
μA
②
-
0.01
1.0
μA
②
2.16
2.40
2.64
1.34
1.52
A
①
1.16
-
1.20
-
A
①
-
0.67
-
μs
①
V
①
VIN=5.5V, VOUT=0V
VCE=VSS (XC8108A)
VCE=VIN (XC8108B)
VOUT=VIN-0.3V
ILIM shorted to VSS
VOUT=VIN-0.3V
RILIM=18.4kΩ
ILIM shorted to VSS
VOUT=0V
RILIM=18.4kΩ
VIN=5.0V, VOUT: OPEN→0V
Measure from VOUT=0V
to when current falls below
a certain ILIMT value
VIN=5.5V, XC8108A series
-
2.0
-
1.5
-
5.5
VIN=5.5V, XC8108B series
VIN=5.5V, XC8108A series
VSS
VSS
-
0.8
0.8
1.5
-0.1
-
5.5
0.1
V
①
Current Limit Circuit
Response Time (*2)
tCLR
CE "H" Level Voltage
VCEH
CE "L" Level Voltage
VCEL
CE "H" Level Current
ICEH
VIN=5.5V, XC8108B series
VIN=5.5V, VCE=5.5V
μA
①
CE "L" Level Current
ICEL
VIN=5.5V, VCE=0V
-0.1
-
0.1
μA
①
UVLO Detected Voltage
VUVLOD
VIN: 2.2V→1.7V
1.8
1.9
2.0
V
①
UVLO Released Voltage
VUVLOR
VIN: 1.7V→2.2V
1.9
2.0
2.1
V
①
UVLO Hysteresis
VUHYS
-
-
0.1
-
V
①
NOTE:
Unless otherwise stated, VIN=5.0V, IOUT=1mA, ILIM=VSS, VCE=VIN (XC8108A) or VCE=VSS (XC8108B)
(*2)
TYP.
2.5
VOUT=0V
Short-Circuit Current
Ta=25℃
Design reference value. This parameter is provided only for reference.
6/24
XC8108
Series
■ELECTRICAL CHARACTERISTICS (Continued)
MIN.
TYP.
MAX.
UNITS
Ta=25℃
CIRCUIT
RLOAD=10Ω, VCE=0V→2.2V
-
0.60
1.00
ms
①
tOFF
RLOAD=10Ω, VCE=2.2V→0V
-
0.08
0.13
ms
①
FLG output FET
On-resistance
RFLG
IFLG=10mA, VOUT=5.5V
-
15
20
Ω
③
FLG output FET
Leakage Current
IFOFF
VIN=5.5V, VFLG=5.5V, VOUT=OPEN
-
0.01
0.1
μA
③
tFD1
over-current condition
6.5
7.5
8.5
ms
①
tFD2
reverse-voltage condition
2.7
4.0
4.7
ms
①
Reverse Current
IREV
VIN=0V, VOUT=5.5V
VCE=5.0V (XC8108A)
VCE=VSS (XC8108B)
-
0.1
1.0
μA
①
Reverse Current
Prevention
Detect Voltage
VREV_D
VIN: 5.0V→4.7V
VOUT=5.0V
-
140
-
mV
①
Thermal Shutdown
Detect Temperature
TTSD
Junction Temperature
-
150
-
℃
①
Thermal Shutdown
Release Temperature
TTSR
Junction Temperature
-
130
-
℃
①
Thermal Shutdown
Hysteresis Width
THYS
Junction Temperature
-
20
-
℃
①
PARAMETER
SYMBOL
turn-on time
tON
turn-off time
CONDITIONS
FLG delay time
NOTE:
Unless otherwise stated, VIN=5.0V, IOUT=1mA, ILIM=VSS, VCE=VIN (XC8108A) or VCE=VSS (XC8108B)
■TIMING CHART
●turn-on time, turn-off time
Voltege[V]
Voltege[V]
VCE
CE "H" Level Voltage
CE "L" Level Voltage
CE "L" Level Voltage
CE "H" Level Voltage
VCE
90%
90%
10%
VOUT
tON
tOFF
XC8108 Series, Type A
Time[ms]
10%
VOUT
tON
tOFF
Time[ms]
XC8108 Series, Type B
7/24
XC8108 Series
■TEST CIRCUITS
CIN=1.0μF, CL=1.0μF
1) CIRCUIT①
Measurement Waveform
A
RFLG=100kΩ
Measurement Waveform
VIN
VOUT
FLG
ILIM
A
IOUT
VIN
V
CIN
(ceramic)
A
VCE
CE
VSS
RILIM=18.4kΩ
V
VOUT
V
CL
(ceramic)
2) CIRCUIT②
A
VIN
VOUT
RFLG=100kΩ
FLG
CE
VIN
ILIM
VSS
3) CIRCUIT③
VOUT
VIN
FLG
A
V
VFLG
CIN
(ceramic)
8/24
↓
VIN
V
ILIM
CE
VCE
VOUT
VSS
V
CL
(ceramic)
V
XC8108
Series
■OPERATIONAL EXPLANATION
The XC8108 series is a P-channel MOSFET power switch IC.
The XC8108 series consists of a CE circuit, UVLO circuit, thermal shutdown circuit, current limiter circuit, reverse current
prevention circuit, control block and others. The gate voltage of the power switch transistor is controlled with control block. The
current limiter circuit and reverse current prevention circuit will operate based on the output voltage and output current.
Reverse
Current
Prevention
VOUT
VIN
CURRENT
SENSE
UVLO
CE
ON/OFF
Control
each
circuit
CURRENT
LIMIT
CONTROL
4ms
Delay
7.5ms
Delay
THERMAL
SHUTDOWN
ILIM
FLG
VSS
BLOCK DIAGRAM
The voltage level which is fed to CE pin controls the status of this IC. If either “H” level or “L” level which is defined as the electrical
specification is fed to CE pin, then XC8108 can operate in standard manner. However, if the middle voltage which is neither “H”
level nor “L” level is fed to CE pin, the consumption current will increase due to the shoot-through current at internal circuits. Also
if CE pin is open, the status of XC8108 cannot be fixed and the behavior will be unstable.
For protection against heat damage of the ICs, thermal shutdown function is built in. When the internal junction temperature
reaches the temperature limit, the thermal shutdown circuit operates and the power switch transistor will turn OFF. The IC resumes
its operation when the thermal shutdown function is released and the IC’s operation is automatically restored because the junction
temperature drops to the level of the thermal shutdown release temperature. When the thermal shutdown circuit detects higher
junction temperature than the detect temperature, the voltage level of FLG pin is low level. When the thermal shutdown circuit
detects lower junction temperature than the release temperature, the thermal shutdown function is released and the voltage level
of FLG pin is high level.
When the VIN pin voltage goes down to lower voltage than UVLO detected voltage, the power switch transistor turns OFF by
UVLO function in order to prevent false output caused by unstable operation of the internal circuitry. When the VIN pin voltage
goes up to higher voltage than UVLO released voltage, the UVLO function is released and the power switch transistor can turn
ON.
The soft-start circuit can reduce the in-rush current charged on the output capacitor when IC starts up. Additionally, due to the
reduction of the in-rush current, the circuit can reduce the fluctuation of the input voltage as well. The soft-start time is optimized
internally and defined as turn-on time. (TYP: 0.6ms)
9/24
XC8108 Series
■OPERATIONAL EXPLANATION (Continued)
When the output current reaches the current limit value, the current limit function is activated.
When the current limiting function operates, the constant current limiting circuit operates to reduce the output voltage while
maintaining the output current.
The short-circuit protection function operates when the output voltage drops below 0.7V (TYP.).
The behavior after the current limit or short circuit protection function is activated differs depending on the product type. The
operation of each type is as follows.
Automatic Recovery type: C type
After 7.5ms (TYP.) has passed since the current limiting function was activated, the FLG pin changes to Low level output.
After the short-circuit protection function operates, the output current is reduced to the short-circuit current.
If the overcurrent state continues, this state is maintained.
When the overcurrent state is resolved and the state below the maximum output current continues for 7.5ms (TYP.), the FLG pin
returns to High level output.
Latch off type: D type
After 7.5ms (TYP.) elapses when the current limiting function is activated, the FLG pin changes to Low level output and the
switch transistor turns off. The off state is maintained regardless of whether the overcurrent state is resolved.
Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below
the UVLO detected voltage once and after that raising it higher than UVLO released voltage.
10/24
XC8108
Series
■OPERATIONAL EXPLANATION (Continued)
By connecting a resistor to the current limit external adjustment pin(ILIM pin), the current limit can be set to any value.
By the following equation, the current limit value can be set to any value within a range of 900mA to 2400mA. When the ILIM pin is
open, the switch transistor is forcibly turned off.
RILIM(kΩ) = 57207 / ILIMIT(T)(mA) - 24.32(kΩ)
RILIM: External resistance value ILIMIT(T): Current limit set value
Table1. Current limit set value
ILIMIT(T)
(mA)
RILIM
(kΩ)
E96 External
resistance value
(kΩ)
Current limit value
when use E96
external resistance
(mA)
900
39.24
39.2
901
1000
32.89
33.2
995
1100
27.69
28.0
1093
1200
23.35
23.2
1204
1300
19.69
19.6
1303
1400
16.54
16.5
1401
1500
13.82
13.7
1505
1600
11.43
11.5
1597
1700
9.33
9.31
1701
1800
7.46
7.5
1798
1900
5.79
5.76
1902
2000
4.28
4.32
1997
2100
2.92
2.94
2099
2200
1.68
1.69
2199
2300
0.55
0.549
2300
2400
ILIM shorted to VSS
2400
11/24
XC8108 Series
■OPERATIONAL EXPLANATION (Continued)
(Continued)
Fig1. Current limit set value
LIMIT (mA): Current limit set value
(mA) ： 電流制限設定値
IILIMIT(T)
XC8108
電流制限設定値
－ 外部抵抗値
XC8108
Current
limit set value
vs. External resistor
2500
2400
2300
2200
2100
2000
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
0
5
10
15
20
25
30
35
40
： 外部抵抗値
RILIM R(kΩ):
External
resistor
ILIM (kΩ)
An internal circuit is built in that prevents reverse current from the VOUT pin to the VIN pin.
When the difference between input voltage and VOUT pin voltage is higher than the detect voltage set internally, the reverse current
prevention circuit activates, and the power switch transistor turns off, then the reverse current from the VOUT pin to the VIN pin is
reduced to 0.1μA (TYP.).
If the reverse-voltage state lasts for 4ms (TYP.), the FLG pin changes to Low level output.
The behavior after the reverse current prevention function is activated differs depending on the product type. The operation of
each type is as follows.
Automatic Recovery type: C type
On the auto recovery type, when the output voltage drops below the input voltage, the reverse current prevention circuit stops
immediately, and the power switch transistor turns on again. If the output voltage remains lower than the input voltage for 4ms
(TYP.), the FLG pin returns to High level output.
Latch off type: D type
On the latch off type, the power switch transistor remains in the off state even if the reverse voltage state is released.
Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below
the UVLO detected voltage once and after that raising it higher than UVLO released voltage.
12/24
XC8108
Series
■OPERATIONAL EXPLANATION (Continued)
The flag circuit is built in which monitors the state of the power switch.
The FLG pin outputs Low level when the reverse current prevention function is operating. A resistance of 10kΩ to 100kΩ is
recommended for the FLG pin pull-up resistance.
The pull-up voltage should be 5.5V or less.
Automatic Recovery type: C type
FLG pin
Low level output Condition
FLG pin
High level output Condition
Short Protection
7.5ms(TYP.) after maintaining over-current
detection state
7.5ms(TYP.) after over-current release
Reverse current
prevention
4.0ms(TYP.) after maintaining reverse
voltage detection state
4.0ms(TYP.) after reverse voltage release
Thermal shutdown
Same time as overheat state is detected
Same time as overheat state is released
CONDITION
Current limiter
UVLO
Stand-by
Always High level output
Latch off type: D type
FLG pin
Low level output Condition
FLG pin
High level output Condition
Short Protection
7.5ms(TYP.) after maintaining over-current
release state
When latch operation is released
Reverse current
prevention
4.0ms(TYP.) after maintaining reverse
voltage release state
When latch operation is released
Thermal shutdown
Same time as overheat state is detected
Same time as overheat state is released
CONDITION
Current limiter
UVLO
Stand-by
Always High level output
13/24
XC8108 Series
■NOTES ON USE
1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated
if IC is used beyond the absolute MAX. specifications.
2. Where wiring impedance is high, operations may become unstable due to noise depending on output current.
Please keep the resistance low between VIN and VSS wiring in particular.
3. Please place the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible.
For the input or output capacitor, a capacitance of 1.0μF or higher is recommended.
4. The IC can be broken if the VOUT pin voltage suddenly undershoots to a negative voltage due to an output short circuit between
the VOUT pin and GND, or if the VIN pin voltage overshoots after the current limiting operation and exceeds the rated voltage.
We recommend the following counter measures so that the rated voltage is not exceeded.
(a) To suppress the amount of the undershoot by increasing the output capacitance and slowing down the rate of decreasing
VOUT at the time of short circuit.
(b) To add a SBD between VOUT pin and GND to suppress the undershoot of VOUT pin voltage.
(c) To increase the input capacitor to suppress the overshoot of the VIN pin voltage after the current limiter is activated.
IC
VIN
VOUT
VIN
CE
VOUT
RFLG
CE
FLG
CIN
ILIM
GND
VFLG
VSS
FLG
CL
SBD
RLIM
GND
Recommended countermeasure circuit diagram
5. The current limit value can be adjusted by external resistor (RLIM). The characteristics of the resistor influence the current limit
value. Therefore, please choose the resistor with small tolerance and temperature coefficient.
6. It is recommended to use the output current at 80% or less of the current limit set value (ILIMIT).
7. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
14/24
XC8108
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) UVLO threshold Voltage vs. Ambient Temperature
XC8108xx20ER
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
UVLO threshold Voltage : UVLO [V]
3.0
2.5
2.0
1.5
1.0
UVLO detect
UVLO release
0.5
0.0
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta [℃]
(2) Stand-by Current vs. Input Voltage
(3) Stand-by Current vs. Ambient Temperature
XC8108xx20ER
XC8108xx20ER
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
3.0
Ta=105℃
2.5
Ta=25℃
Ta=-40℃
2.0
1.5
1.0
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Stand-by Current : Istby [μA]
Stand-by Current : Istby [μA]
3.0
Istby
2.5
2.0
1.5
1.0
0.5
0.0
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta [℃]
Input Voltage : VIN [V]
15/24
XC8108 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Supply Current vs. Input Voltage(sweep up)
(5) Supply Current vs. Ambient Temperature
XC8108xx20ER
XC8108xx20ER
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
50
45
45
40
40
Supply Current : ISS [μA]
Supply Current : ISS [μA]
VIN=5.0V, CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
50
35
30
25
20
15
Ta=105℃
10
Ta=25℃
Ta=-40℃
5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage : VIN [V]
25
20
15
VIN=5.0V
10
XC8108xx20ER
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
3.0
2.5
CE"H"Level
2.0
CE"L"Level
1.5
1.0
0.5
0.0
-50
-25
0
25
50
0
-50
-25
0
25
50
75
Ambient Temperature : Ta [℃]
(6) CE threshold Voltage vs. Ambient Temperature
CE threshold Voltage : VCE [V]
30
5
0
75
Ambient Temperature : Ta [℃]
16/24
35
100
125
100
125
XC8108
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) On Resistance vs. Input Voltage
(8) On Resistance vs. Ambient Temperature
XC8108xx20ER
XC8108xx20ER
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
180
180
160
160
On Resistance : Ron [mΩ]
On Resistance : Ron [mΩ]
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
140
120
100
80
60
40
Ta=105℃
Ta=25℃
20
Ta=-40℃
140
120
100
80
VIN=3.5V
40
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VIN=4.5V
VIN=5.0V
20
0
2.0
VIN=2.5V
60
VIN=5.5V
0
6.0
-50
-25
(9) turn-on time vs. Input Voltage
25
50
0.6
0.6
turn-on time : tDLY(ON) [ms]
0.7
0.5
0.4
0.3
0.2
Ta=105℃
Ta=25℃
0.1
0.5
0.4
0.3
VIN=2.5V
0.2
VIN=3.5V
VIN=4.5V
0.1
VIN=5.0V
Ta=-40℃
VIN=5.5V
0.0
3.0
3.5
4.0
4.5
5.0
5.5
0.0
6.0
-50
Input Voltage : VIN [V]
(11) turn-off time vs. Input Voltage
-25
0
25
50
75
100
Ambient Temperature : Ta [℃]
125
(12) turn-off time vs. Ambient Temperature
XC8108xx20ER
XC8108xx20ER
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
VIN=4.3V, CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
0.09
0.09
0.08
0.08
turn-off time : tDLY(OFF) [ms]
turn-off time : tDLY(OFF) [ms]
125
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
0.7
2.5
100
XC8108xx20ER
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
2.0
75
(10) turn-on time vs. Ambient Temperature
XC8108xx20ER
turn-on time : tDLY(ON) [ms]
0
Ambient Temperature : Ta [℃]
Input Voltage : VIN [V]
0.07
0.06
0.05
0.04
Ta=105℃
0.03
Ta=25℃
0.02
Ta=-40℃
0.01
0.07
0.06
0.05
0.04
VIN=2.5V
VIN=3.5V
0.03
VIN=4.5V
VIN=5.0V
0.02
VIN=5.5V
0.01
0.00
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Input Voltage : VIN [V]
5.5
6.0
0.00
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta [℃]
17/24
XC8108 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(13) FLG delay time over-current
(14) FLG delay time reverse-voltage
vs. Ambient Temperature
vs. Ambient Temperature
XC8108xx20ER
XC8108xx20ER
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
5.0
8.5
4.5
FLG reverse-voltage : tFD [ms]
FLG over-current : tFD [ms]
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
9.0
8.0
7.5
7.0
6.5
6.0
VIN=2.5V
5.5
VIN=3.5V
5.0
VIN=4.5V
VIN=5.0V
4.5
VIN=5.5V
4.0
4.0
3.5
3.0
2.5
2.0
1.5
VIN=2.5V
VIN=3.5V
1.0
VIN=4.5V
VIN=5.0V
0.5
0.0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta [℃]
Ambient Temperature : Ta [℃]
(15) Output Voltage vs. Output Current
XC8108xD20ER
XC8108xC20ER
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
CIN=1.0μF(ceramic), CL =1.0μF(ceramic)
6.0
6.0
RILIM=39.2kΩ
RILIM=5.76kΩ
RILIM=0kΩ
4.0
3.0
2.0
1.0
0.0
RILIM=18.4kΩ
5.0
RILIM=5.76kΩ
RILIM=0kΩ
4.0
3.0
2.0
1.0
If the over-current state lasts for 7.5ms,
the latch off type turns off the power switch transistor.
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
Output Current : IOUT [A]
XC8108xx20ER
3.5
8.0
3.0
6.0
0.0
2.0
1.5
-2.0
1.0
-4.0
0.5
-6.0
Supply Current
-8.0
18/24
Time [100μs/div]
3.0
3.5
4.0
3.5
3.0
Output Voltage
Voltage : [V]
2.5
Output Voltage
2.5
XC8108xx20ER
Supply Current : Isupply [A]
Voltage : [V]
2.0
2.0
VCE=5.0V→0V, tf=5μs, RL =10Ω, Ta=25℃
VIN=5.0V, CIN=CL =1.0μF(ceramic), RILIM =18.4kΩ
CE Input Voltage
4.0
1.5
(17) turn-off Delay vs. Fall Time (CL=1.0μF)
VCE=0V→5.0V, tr=5μs, RL =10Ω, Ta=25℃
VIN=5.0V, CIN=CL =1.0μF(ceramic), RILIM =18.4kΩ
6.0
1.0
Output Current : IOUT [A]
(16) turn-on Delay vs. Rise Time (CL=1.0μF)
8.0
0.5
4.0
2.5
2.0
2.0
0.0
1.5
CE Input Voltage
-2.0
1.0
-4.0
0.5
0.0
-6.0
-0.5
-8.0
0.0
Supply Current
-0.5
Time [100μs/div]
Supply Current : Isupply [A]
Output Voltage : VOUT [V]
RILIM=18.4kΩ
Output Voltage : VOUT [V]
RILIM=39.2kΩ
5.0
XC8108
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(18) turn-on Delay vs. Rise Time (CL=120μF)
(19) turn-off Delay vs. Fall Time (CL=120μF)
XC8108xx20ER
XC8108xx20ER
4.0
CE Input Voltage
Output Voltage
8.0
3.5
3.0
6.0
3.0
2.5
2.0
2.0
0.0
1.5
-2.0
1.0
-4.0
0.5
-6.0
Supply Current
-8.0
Voltage : [V]
Voltage : [V]
6.0
3.5
Supply Current : Isupply [A]
8.0
Supply Current : Isupply [A]
VCE=5.0V→0V, tf=5μs, RL =10Ω, Ta=25℃
VIN=5.0V, CIN=1.0μF, CL =120μF(ceramic), RILIM =18.4kΩ
VCE=0V→5.0V, tr=5μs, RL =10Ω, Ta=25℃
VIN=5.0V, CIN=1.0μF, CL =120μF(ceramic), RILIM =18.4kΩ
2.5
4.0
Output Voltage
2.0
2.0
1.5
0.0
CE Input Voltage
-2.0
1.0
-4.0
0.5
0.0
-6.0
-0.5
-8.0
Time [500μs/div]
0.0
Supply Current
-0.5
Time [500μs/div]
(20) Short Circuit Current, Device Enabled Into Short
XC8108xx20ER
XC8108xx20ER
VCE=0V→5.0V, tr=5μs, Ta=25℃
VIN=5.0V, CIN=CL =1.0μF(ceramic), RILIM =18.4kΩ
8.0
8.0
3.5
VCE=5.0V→0V, tf=5μs, Ta=25℃
VIN=5.0V, CIN=1.0μF, CL =120μF(ceramic), RILIM =18.4kΩ
3.5
3.0
4.0
2.5
2.0
2.0
0.0
-2.0
1.5
Output Voltage
-4.0
-6.0
1.0
0.5
Supply Current
-8.0
Time [40μs/div]
Voltage : [V]
CE Input Voltage
Supply Current : Isupply [A]
Voltage : [V]
6.0
6.0
3.0
4.0
2.5
2.0
2.0
0.0
1.5
Output Voltage
-2.0
1.0
-4.0
0.5
Supply Current : Isupply [A]
CE Input Voltage
Supply Current
0.0
-6.0
-0.5
-8.0
0.0
-0.5
Time [40μs/div]
19/24
XC8108 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(21) UVLO Transient Response (CL=1.0μF)
4.0
Input Voltage
2.0
Output Voltage
0.0
3.5
3.0
2.5
4.0
2.5
2.0
2.0
2.0
1.0
-4.0
0.5
-8.0
Input Voltage
6.0
-2.0
Supply Current
VIN=5.0V→0V, tf=3ms, Ta=25℃
RL =5Ω, CIN=CL =1.0μF(ceramic), RILIM =18.4kΩ
3.0
1.5
-6.0
8.0
3.5
Voltage : [V]
Voltage : [V]
6.0
XC8108xx20ER
Supply Current : Isupply [A]
8.0
VIN=0V→5.0V, tr=3ms, Ta=25℃
RL =5Ω, CIN=CL =1.0μF(ceramic), RILIM =18.4kΩ
0.0
1.5
Output Voltage
-2.0
1.0
-4.0
0.5
0.0
-6.0
-0.5
-8.0
Supply Current : Isupply [A]
XC8108xx20ER
0.0
Supply Current
Time [500μs/div]
-0.5
Time [500μs/div]
(22) UVLO Transient Response (CL=120μF)
XC8108xx20ER
XC8108xx20ER
VIN=0V→5.0V, tr=3ms, Ta=25℃
RL =5Ω, CIN=1.0μF, CL =120μF(ceramic), RILIM =18.4kΩ
6.0
2.5
2.0
Output Voltage
0.0
2.0
1.5
-2.0
1.0
-4.0
0.5
-6.0
Supply Current
-8.0
2.5
2.0
2.0
0.0
-2.0
1.0
-4.0
0.5
-6.0
-0.5
-8.0
(24) Reverse Voltage Released Voltage (CL=1.0μF)
4.0
Input Voltage
2.0
0.0
-2.0
4.0
2.0
0.0
Supply Current
Input Voltage
6.0
5.0
1.0
-4.0
VIN=5.0V, RL =5Ω, Ta=25℃
CIN=CL =1.0μF(ceramic), RILIM =18.4kΩ
6.0
VOUT = 5.5V Removed
3.0
FLG Voltage
8.0
6.0
Voltage : [V]
Voltage : [V]
6.0
-0.5
XC8108xC20ER
Supply Current : Isupply [A]
Output Voltage
0.0
Supply Current
Time [500μs/div]
XC8108xC20ER
VOUT=5.5V forced
1.5
Input Voltage
0.0
(23) Reverse Voltage Detected Voltage (CL=1.0μF)
8.0
3.0
4.0
Time [500μs/div]
VIN=5.0V, RL =5Ω, Ta=25℃
CIN=CL =1.0μF(ceramic), RILIM =18.4kΩ
Output Voltage
4.0
Output Voltage
2.0
5.0
4.0
3.0
FLG Voltage
0.0
2.0
-2.0
1.0
-4.0
Supply Current
0.0
-6.0
-1.0
-6.0
-1.0
-8.0
-2.0
-8.0
-2.0
Time [500μs/div]
20/24
Supply Current : Isupply [A]
4.0
3.0
3.5
Time [500μs/div]
Supply Current : Isupply [A]
Input Voltage
8.0
Voltage : [V]
Voltage : [V]
6.0
VIN=5.0V→0V, tf=3ms, Ta=25℃
RL =5Ω, CIN=1.0μF, CL =120μF(ceramic), RILIM =18.4kΩ
3.5
Supply Current : Isupply [A]
8.0
XC8108
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(25) Reverse Voltage Detected Voltage (CL=120μF)
(26) Reverse Voltage Released Voltage (CL=120μF)
XC8108xC20ER
XC8108xC20ER
VIN=5.0V, Ta=25℃
CIN=1.0μF, CL =120μF(ceramic), RILIM =18.4kΩ
6.0
8.0
5.0
6.0
4.0
Input Voltage
2.0
3.0
FLG Voltage
0.0
-2.0
2.0
1.0
-4.0
0.0
Supply Current
6.0
VOUT = 5.5V Removed
4.0
2.0
Input Voltage
5.0
4.0
Output Voltage
3.0
FLG Voltage
0.0
2.0
-2.0
1.0
0.0
-4.0
Supply Current
-6.0
-1.0
-6.0
-1.0
-8.0
-2.0
-8.0
-2.0
Time [500μs/div]
Supply Current : Isupply [A]
4.0
Output Voltage
Voltage : [V]
Voltage : [V]
6.0
VOUT=5.5V forced
Supply Current : Isupply [A]
8.0
VIN=5.0V, Ta=25℃
CIN=1.0μF, CL =120μF(ceramic), RILIM =18.4kΩ
Time [500μs/div]
(27) CE Transient Response
XC8108xx20ER
XC8108xx20ER
VCE=0→5.0V, tr=5μs, Ta=25℃
VIN=5.0V, CIN=1.0μF, CL =120μF(ceramic)
8.0
0.035
4.0
0.025
2.0
RILIM=39.2kΩ
RILIM=18.4kΩ
0.0
RILIM=5.76kΩ
RILIM=0kΩ
-2.0
-4.0
0.020
0.015
0.010
0.005
-6.0
0.000
In Rush Current
-8.0
-0.005
Time [500μs/div]
Voltage : [V]
0.030
In Rush Current : IRUSH [A]
Voltage : [V]
6.0
3.5
8.0
CE Voltage
6.0
CE Voltage
3.0
4.0
2.5
2.0
RILIM=39.2kΩ
RILIM=18.4kΩ
0.0
RILIM=5.76kΩ
RILIM=0kΩ
-2.0
-4.0
2.0
1.5
1.0
0.5
-6.0
In Rush Current : IRUSH [A]
VCE=0→5.0V, tr=5μs, Ta=25℃
VIN=5.0V, CIN=CL =1.0μF(ceramic)
0.0
In Rush Current
-8.0
Time [500μs/div]
-0.5
(28) Current Limit adapted time
XC8108xx20ER
Current Limit Response : [μs]
VIN=5.0V, Ta=25℃
CL =open, RILIM =18.4kΩ
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0.0
1.0
2.0
3.0
4.0
5.0
Peak Limit Current [A]
6.0
21/24
XC8108 Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
OUTLINE / LAND PATTERN
THERMAL CHARACTERISTICS
USP-6C
USP-6C PKG
USP-6C Power Dissipation
22/24
XC8108
Series
■MARKING RULE
① represents products series
USP-6C
②
⑤
③
3
④
2
①
1
6
5
4
MARK
PRODUCT SERIES
Z
XC8108******-G
② represents product type
MARK
CE LOGIC
PROTECTION CIRCUIT TYPE
PRODUCT
1
Active High
Auto-recovery
XC8108AC****-G
2
Active High
Latch-off
XC8108AD****-G
3
Active Low
Auto-recovery
XC8108BC****-G
4
Active Low
Latch-off
XC8108BD****-G
③ represents maximum output current
MARK
CURRENT (A)
PRODUCT SERIES
5
2.0
XC8108**20**-G
④⑤ represents production lot number
01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
23/24
XC8108 Series
1.
The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2.
The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3.
Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4.
The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5.
Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6.
Our products are not designed to be Radiation-resistant.
7.
Please use the product listed in this datasheet within the specified ranges.
8.
We assume no responsibility for damage or loss due to abnormal use.
9.
All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
24/24
