XC8109AC10ER-G

XC8109 Series ETR33004-004c 85mΩ High Function Power Switch ■GENERAL DESCRIPTION The XC8109 series is a P-channel MOSFET power switch IC with a low ON resistance. A current limit, reverse current prevention (prevents reverse current from VOUT to VIN), soft start, thermal shutdown, and an under-voltage lockout (UVLO) are incorporated as protective functions. A flag function monitors the power switch status. The flag output has N-channel open drain structure, and outputs Low level signal while over-current or overheating is detected, or while the reverse current prevention is operated. A variable current limiting function is integrated, allowing the current limit value to be set, using an external resistor. The voltage level which is fed to CE pin determines the status of XC8109. The logic level of CE pin is selectable between either one of active high or active low. ■APPLICATIONS ■FEATURES ●Set Top Boxes Input Voltage : 2.5V ~ 5.5V ●Digital TVs Maximum Output Current : 0.9A ON Resistance : 85mΩ@VIN=5.0V (TYP.) Supply Current : 40μA@ VIN=5.0V Stand-by Current : 0.1μA (TYP.) Flag Delay Time : 7.5ms (TYP.) ●PCs ●USB Ports/USB Hubs ●HDMI * At over-current detection : 4ms (TYP.) * At reverse voltage detection Protection Circuit : Reverse Current Prevention 75mA ~ 1.3A (TYP.) Thermal Shutdown Under Voltage Lockout (UVLO) Soft-start Functions : Flag Output CE Pin Input Logic Selectable ■TYPICAL APPLICATION CIRCUIT Current Limit Response Time : 2μs (TYP.) Operating Ambient Temperature : -40℃ ~ 105℃ *Reference value Package : USP-6C Environmentally Friendly : EU RoHS Compliant, Pb Free ■TYPICAL PERFORMANCE CHARACTERISTICS XC8109xC10ER USB Port 100kΩ USB Control VIN VOUT 1.0μF 1.0μF FLG CE VBUS + GND 120μF ILIM VSS RLIM * The Typical circuit is based on USB high side switch. The XC8109 series can accommodate 1μF output capacitor (CL). CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 6.0 Output Voltage : VOUT [V] 5V Input RILIM=515kΩ RILIM=18.4kΩ RILIM=0kΩ 5.0 4.0 3.0 2.0 1.0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 Output Current : IOUT [A] 1/24 XC8109 Series ■BLOCK DIAGRAM Reverse Current Prevention VOUT VIN CURRENT SENSE UVLO CE ON/OFF Control each circuit CURRENT LIMIT CONTROL 4ms Delay 7.5ms Delay THERMAL SHUTDOWN VSS * Diodes inside the circuit are an ESD protection diode and a parasitic diode. 2/24 ILIM FLG XC8109 Series ■PRODUCT CLASSIFICATION ●Ordering Information XC8109①②③④⑤⑥-⑦ DESIGNATOR ITEM ① CE Logic B Refer to Selection Guide C Protection Circuits Type ③④ Maximum Output Current 10 Package (Order Unit) ER-G (*1) DESCRIPTION A ② ⑤⑥-⑦ (*1) SYMBOL D 0.9A * Adjustable current limit range:75mA~1300mA USP-6C (3,000pcs/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. ●Selection Guide FUNCTION TYPE AC AD BC BD CE LOGIC SELECTABLE Active High Active Low SOFT-START Yes Yes UVLO Yes Yes REVERSE CURRENT PREVENTION Yes Yes THERMAL SHUT DOWN Yes Yes CURRENT LIMIT ADJUSTABLE Yes Yes SHORT PROTECTION / REVERSE CURRENT PREVENTION (Automatic Recovery) SHORT PROTECTION / REVERSE CURRENT PREVENTION (Latch Protection) Yes - Yes - - Yes - Yes 3/24 XC8109 Series ■PIN CONFIGURATION FLG 3 4 CE ILIM 2 5 VSS VOUT 1 6 VIN USP-6C (BOTTOM VIEW) * The dissipation pad for the USP-6C packages should be solder-plated for mounting strength and heat dissipation. Please refer to the reference mount pattern and metal masking. The dissipation pad should be connected to the VSS (No. 5) pin. ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTIONS 1 VOUT Output 2 ILIM Current Limit Adjustment 3 FLG Fault Report 4 CE ON/OFF Control 5 VSS Ground 6 VIN Power Input USP-6C ■FUNCTION TYPE PIN NAME A CE B SIGNAL STATUS H Active L Stand-by OPEN Undefined State (*1) H Stand-by L Active OPEN Undefined State (*1) * Avoid leaving the CE pin open; set to any fixed voltage. 4/24 XC8109 Series ■ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN -0.3 ~ 6.0 V Output Voltage VOUT -0.3 ~ 6.0 V Output Current IOUT 1.7 A CE Input Voltage VCE -0.3 ~ 6.0 V FLG Pin Voltage VFLG -0.3 ~ 6.0 V FLG Pin Current IFLG 15 mA ILIM Pin Voltage VILIM -0.3 ~ 6.0 V ILIM Pin Current IILIM ±1 mA Power Dissipation (Ta=25℃) 120 USP-6C Pd 1000 (40mm x 40mm Standard board) (*2) 1250 (JESD51-7 board) mW (*2) Operating Ambient Temperature Topr -40 ~ 105 ℃ Storage Temperature Tstg -55 ~ 125 ℃ * All voltages are described based on the VSS. (*1) Use with I OUT less than Pd/(VIN-VOUT). (*2) The power dissipation figure shown is PCB mounted and is for reference only. Please refer to PACKAGING INFORMATION for the mounting condition. 5/24 XC8109 Series ■ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL Input Voltage VIN On Resistance RON Supply Current ISS Stand-by Current ISTBY Switch Leakage Current ILEAK Current Limit ILIMT Short-Circuit Current ISHORT CONDITIONS VIN=3.3V, IOUT=1.0A VIN=5.0V, IOUT=1.0A Ta=25℃ MIN. MAX. UNITS CIRCUIT 2.5 - 5.5 V ① - 100 85 110 104 mΩ mΩ ① VOUT=OPEN - 40 75 μA ② VIN=5.5V, VOUT=OPEN VCE=VSS (XC8109A) VCE=VIN (XC8109B) - 0.01 1.0 μA ② - 0.01 1.0 μA ② 1.170 1.300 1.430 0.730 0.840 A ① 0.621 - 0.650 - 0.365 - A ① - μs ① V ① VIN=5.5V, VOUT=0V VCE=VSS (XC8109A) VCE=VIN (XC8109B) VOUT=VIN-0.3V ILIM shorted to VSS VOUT=VIN-0.3V RILIM=18.4kΩ VOUT=0V ILIM shorted to VSS VOUT=0V RILIM=18.4kΩ VIN=5.0V, VOUT: OPEN→0V Measure from VOUT=0V to when current falls below a certain ILIMT value VIN=5.5V, XC8109A series - 2.0 - 1.5 - 5.5 VIN=5.5V, XC8109B series VIN=5.5V, XC8109A series VSS VSS - 0.8 0.8 1.5 -0.1 - 5.5 0.1 V ① ICEH VIN=5.5V, XC8109B series VIN=5.5V, VCE=5.5V μA ① ICEL VIN=5.5V, VCE=0V -0.1 - 0.1 μA ① VUVLOD VIN: 2.2V→1.7V 1.8 1.9 2.0 V ① UVLO Released Voltage VUVLOR VIN: 1.7V→2.2V 1.9 2.0 2.1 V ① UVLO Hysteresis VUHYS - - 0.1 - V ① Current Limit Circuit Response Time (*2) tCLR CE "H" Level Voltage VCEH CE "L" Level Voltage VCEL CE "H" Level Current CE "L" Level Current UVLO Detected Voltage NOTE: Unless otherwise stated, VIN=5.0V, IOUT=1mA, ILIM=VSS, VCE=VIN (XC8109A) or VCE=VSS (XC8109B) (*2) TYP. Design reference value. This parameter is provided only for reference. 6/24 XC8109 Series ■ELECTRICAL CHARACTERISTICS (Continued) MIN. TYP. MAX. UNITS Ta=25℃ CIRCUIT RLOAD=10Ω, VCE=0V→2.2V - 0.60 1.00 ms ① tOFF RLOAD=10Ω, VCE=2.2V→0V - 0.08 0.13 ms ① FLG output FET On-resistance RFLG IFLG=10mA, VOUT=5.5V - 15 20 Ω ③ FLG output FET Leakage Current IFOFF VIN=5.5V, VFLG=5.5V, VOUT=OPEN - 0.01 0.1 μA ③ tFD1 over-current condition 6.5 7.5 8.5 ms ① tFD2 reverse-voltage condition 2.7 4.0 4.7 ms ① Reverse Current IREV VIN=0V, VOUT=5.5V VCE=5.0V (XC8109A) VCE=VSS (XC8109B) - 0.1 1.0 μA ① Reverse Current Prevention Detect Voltage VREV_D VIN: 5.0V→4.7V VOUT=5.0V - 140 - mV ① Thermal Shutdown Detect Temperature TTSD Junction Temperature - 150 - ℃ ① Thermal Shutdown Release Temperature TTSR Junction Temperature - 130 - ℃ ① Thermal Shutdown Hysteresis Width THYS Junction Temperature - 20 - ℃ ① PARAMETER SYMBOL turn-on time tON turn-off time CONDITIONS FLG delay time NOTE: Unless otherwise stated, VIN=5.0V, IOUT=1mA, ILIM=VSS, VCE=VIN (XC8109A) or VCE=VSS (XC8109B) ■TIMING CHART ●turn-on time, turn-off time Voltege[V] Voltege[V] VCE CE "H" Level Voltage CE "L" Level Voltage CE "L" Level Voltage CE "H" Level Voltage VCE 90% 90% 10% VOUT tON tOFF XC8109 Series, Type A Time[ms] 10% VOUT tON tOFF Time[ms] XC8109 Series, Type B 7/24 XC8109 Series ■TEST CIRCUITS CIN=1.0μF, CL=1.0μF 1) CIRCUIT① Measurement Waveform A RFLG=100kΩ Measurement Waveform VIN VOUT FLG ILIM A IOUT VIN V CIN (ceramic) A VCE CE VSS RILIM=18.4kΩ V VOUT V CL (ceramic) 2) CIRCUIT② A VIN VOUT RFLG=100kΩ FLG CE VIN ILIM VSS 3) CIRCUIT③ VOUT VIN FLG A V VFLG CIN (ceramic) 8/24 ↓ VIN V ILIM CE VCE VOUT VSS V CL (ceramic) V XC8109 Series ■OPERATIONAL EXPLANATION The XC8109 series is a P-channel MOSFET power switch IC. The XC8109 series consists of a CE circuit, UVLO circuit, thermal shutdown circuit, current limiter circuit, reverse current prevention circuit, control block and others. The gate voltage of the power switch transistor is controlled with control block. The current limiter circuit and reverse current prevention circuit will operate based on the output voltage and output current. Reverse Current Prevention VOUT VIN CURRENT SENSE UVLO CE ON/OFF Control each circuit CURRENT LIMIT CONTROL 4ms Delay THERMAL SHUTDOWN 7.5ms Delay ILIM FLG VSS BLOCK DIAGRAM The voltage level which is fed to CE pin controls the status of this IC. If either “H” level or “L” level which is defined as the electrical specification is fed to CE pin, then XC8109 can operate in standard manner. However, if the middle voltage which is neither “H” level nor “L” level is fed to CE pin, the consumption current will increase due to the shoot-through current at internal circuits. Also if CE pin is open, the status of XC8109 cannot be fixed and the behavior will be unstable. For protection against heat damage of the ICs, thermal shutdown function is built in. When the internal junction temperature reaches the temperature limit, the thermal shutdown circuit operates and the power switch transistor will turn OFF. The IC resumes its operation when the thermal shutdown function is released and the IC’s operation is automatically restored because the junction temperature drops to the level of the thermal shutdown release temperature. When the thermal shutdown circuit detects higher junction temperature than the detect temperature, the voltage level of FLG pin is low level. When the thermal shutdown circuit detects lower junction temperature than the release temperature, the thermal shutdown function is released and the voltage level of FLG pin is high level. When the VIN pin voltage goes down to lower voltage than UVLO detected voltage, the power switch transistor turns OFF by UVLO function in order to prevent false output caused by unstable operation of the internal circuitry. When the VIN pin voltage goes up to higher voltage than UVLO released voltage, the UVLO function is released and the power switch transistor can turn ON. The soft-start circuit can reduce the in-rush current charged on the output capacitor when IC starts up. Additionally, due to the reduction of the in-rush current, the circuit can reduce the fluctuation of the input voltage as well. The soft-start time is optimized internally and defined as turn-on time. (TYP: 0.6ms) 9/24 XC8109 Series ■OPERATIONAL EXPLANATION (Continued) When the output current reaches the current limit value, the current limit function is activated. When the current limiting function operates, the constant current limiting circuit operates to reduce the output voltage while maintaining the output current. The short-circuit protection function operates when the output voltage drops below 0.7V (TYP.). The behavior after the current limit or short circuit protection function is activated differs depending on the product type. The operation of each type is as follows. Automatic Recovery type: C type After the short-circuit protection function operates, the output current is reduced to the short-circuit current. The FLG pin outputs a Low-level signal after 7.5ms (TYP.) has passed since the short-circuit protection function was activated. If the overcurrent state continues, the above-mentioned state will continue to be maintained. When the overcurrent state is released, the output voltage rises, and if it continues to be 0.7V (TYP.) or higher for 7.5ms (TYP.), the FLG pin returns to the High-level output. Latch off type: D type After the short-circuit protection function is activated, the output current is reduced to the short-circuit current. After 7.5ms (TYP.) elapses after the short-circuit protection function is activated, the FLG pin outputs a Low level and turns off the switch transistor. The off-state is maintained regardless of whether the overcurrent state is resolved. Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below the UVLO detected voltage once and after that raising it higher than UVLO released voltage. 10/24 XC8109 Series ■OPERATIONAL EXPLANATION (Continued) By connecting a resistor to the current limit external adjustment pin (ILIM pin), the current limit can be set to any value. By the following equations, the current limit value can be set to any value within a range of 75mA to 1300mA. When the ILIM pin is open, the switch transistor is forcibly turned off. (In the case of ILIMIT(T)≧500mA.) equation 1. RILIM(kΩ) = 32164 / ILIMIT(T)(mA) – 25.71(kΩ) (In the case of ILIMIT(T)＜500mA.) equation 2. RILIM(kΩ) = 130170 / ILIMIT(T)(mA) 1.2814(kΩ) RILIM: External resistance value ILIMIT(T): Current limit set value Table1. Current limit set value RILIM (kΩ) E96 External resistance value (kΩ) MIN. TYP. MAX. 75 515 511 49 75 102 100 356 357 69 100 131 200 147 147 156 200 243 300 87.2 86.6 241 302 362 400 60.3 60.4 314 399 485 500 38.6 38.3 427 503 578 600 27.9 28.0 509 599 689 700 20.2 20.0 598 704 809 800 14.5 14.7 716 796 876 900 10.0 10.0 811 901 991 1000 6.46 6.49 899 999 1099 1100 3.53 3.57 989 1099 1208 1200 1.09 1.10 1080 1200 1320 1170 1300 1430 1300 ILIM shorted to VSS MIN. value and MAX. value are reference values. Fig1. Current limit set value XC8109 電流制限設定値 － 外部抵抗値 XC8109 Current limit set value vs. External resistor 1400 1300 1200 (mA) limit ： 電流制限設定値 ILIMIT (mA):ILIMIT(T) Current set value (*) Current limit value when use E96 external resistance (mA)(*) ILIMIT(T) (mA) 1100 1000 900 800 700 600 500 400 300 200 100 0 0 50 100 150 200 250 300 350 400 450 500 550 RILIMR(kΩ): External resistor ILIM (kΩ) ： 外部抵抗値 11/24 XC8109 Series ■OPERATIONAL EXPLANATION (Continued) (Continued) The TYP value of dropout Voltage which is the voltage difference between VIN and VOUT is defined by the equation 3 using output current (IOUT). equation 3. Vdif(mV) = IOUT(mA) x 0.085(Ω) The maximum value of dropout voltage has the influence of the setting of a current limit circuit. (Refer to Table 2) 【Example】 In the case of ILIMIT(T)=500mA, When output current is 200mA, dropout voltage MAX. value is 22mV. Table2. Dropout volltage MAX. value (*) Dropout voltage MAX. value Output Current limit set value: ILIMIT(T) Current: 75mA 100mA 200mA 300mA 400mA IOUT 10mA 4 3 1 1 1 30mA 15 10 5 4 3 50mA 41 24 9 6 5 70mA 49 14 10 8 100mA 28 15 12 150mA 71 29 20 200mA 55 33 250mA 112 58 300mA 100 400mA 500mA - unit: (mV) 500mA 600mA 1 3 5 7 10 15 22 32 46 105 - 1 3 5 7 10 15 20 26 35 67 143 unit: (mV) Dropout voltage MAX. value Output Current: IOUT 10mA 30mA 50mA 70mA 100mA 150mA 200mA 250mA 300mA 400mA 500mA 600mA 700mA 800mA 900mA (*) Current limit set value: ILIMIT(T) 700mA 800mA 900mA 1000mA 1100mA 1200mA 1300mA 1 3 5 7 10 15 20 26 30 48 85 167 - 1 3 5 7 10 15 20 26 30 41 60 100 183 - 1 3 5 7 10 15 20 26 30 41 51 75 122 214 - 1 3 5 7 10 15 20 26 30 41 51 61 85 132 223 1 3 5 7 10 15 20 26 30 41 51 61 71 97 144 1 3 5 7 10 15 20 26 30 41 51 61 71 82 107 1 3 5 7 10 15 20 26 30 41 51 61 71 81 92 MAX. value is reference value. 12/24 XC8109 Series ■OPERATIONAL EXPLANATION (Continued) An internal circuit is built in that prevents reverse current from the VOUT pin to the VIN pin. When the difference between input voltage and VOUT pin voltage is higher than the detect voltage set internally, the reverse current prevention circuit activates, and the power switch transistor turns off, then the reverse current from the VOUT pin to the VIN pin is reduced to 0.1μA (TYP.). If the reverse-voltage state lasts for 4ms (TYP.), the FLG pin changes to Low level output. The behavior after the reverse current prevention function is activated differs depending on the product type. The operation of each type is as follows. Automatic Recovery type: C type On the auto recovery type, when the output voltage drops below the input voltage, the reverse current prevention circuit stops immediately, and the power switch transistor turns on again. If the output voltage remains lower than the input voltage for 4ms (TYP.), the FLG pin returns to High level output. Latch off type: D type On the latch off type, the power switch transistor remains in the off state even if the reverse voltage state is released. Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage below the UVLO detected voltage once and after that raising it higher than UVLO released voltage. The flag circuit is built in which monitors the state of the power switch. The FLG pin outputs Low level when the reverse current prevention function is operating. A resistance of 10kΩ to 100kΩ is recommended for the FLG pin pull-up resistance. The pull-up voltage should be 5.5V or less. Automatic Recovery type: C type CONDITION FLG pin Low level output Condition FLG pin High level output Condition Short Protection 7.5ms(TYP.) after maintaining short protection release state 7.5ms(TYP.) after short protection release Reverse current prevention 4.0ms(TYP.) after maintaining reverse voltage detection state 4.0ms(TYP.) after reverse voltage release Thermal shutdown Same time as overheat state is detected Same time as overheat state is released Current limiter UVLO Always High level output Stand-by Latch off type: D type CONDITION FLG pin Low level output Condition FLG pin High level output Condition Short Protection 7.5ms(TYP.) after maintaining short protection release state When latch operation is released Reverse current prevention 4.0ms(TYP.) after maintaining reverse voltage release state When latch operation is released Thermal shutdown Same time as overheat state is detected Same time as overheat state is released Current limiter UVLO Always High level output Stand-by 13/24 XC8109 Series ■NOTES ON USE 1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated if IC is used beyond the absolute MAX. specifications. 2. Where wiring impedance is high, operations may become unstable due to noise depending on output current. Please keep the resistance low between VIN and VSS wiring in particular. 3. Please place the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible. For the input or output capacitor, a capacitance of 1.0μF or higher is recommended. 4. The IC can be broken if the VOUT pin voltage suddenly undershoots to a negative voltage due to an output short circuit between the VOUT pin and GND, or if the VIN pin voltage overshoots after the current limiting operation and exceeds the rated voltage. We recommend the following counter measures so that the rated voltage is not exceeded. (a) To suppress the amount of the undershoot by increasing the output capacitance and slowing down the rate of decreasing VOUT at the time of short circuit. (b) To add a SBD between VOUT pin and GND to suppress the undershoot of VOUT pin voltage. (c) To increase the input capacitor to suppress the overshoot of the VIN pin voltage after the current limiter is activated. IC VIN VOUT VIN CE VOUT RFLG CE FLG CIN ILIM GND VFLG VSS FLG CL RLIM SBD GND Recommended countermeasure circuit diagram 5. The current limit value can be adjusted by external resistor (RLIM). The characteristics of the resistor influence the current limit value. Therefore, please choose the resistor with small tolerance and temperature coefficient. 6. It is recommended to use the output current at 80% or less of the current limit set value (ILIMIT(T)). 7. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment. 14/24 XC8109 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) UVLO threshold voltage vs. Ambient temperature XC8109xx10ER CIN=1.0μF(ceramic), CL =1.0μF(ceramic) UVLO threshold voltage : UVLO [V] 3.0 2.5 2.0 1.5 UVLO detect 1.0 0.5 0.0 -50 -25 0 25 50 75 100 Ambient temperature : Ta [℃] 125 (2) Stand-by current vs. Input voltage (3) Stand-by current vs. Ambient temperature XC8109xx10ER 2.5 Ta=105℃ Ta=25℃ Ta=-40℃ 2.0 Istby 2.5 2.0 1.5 1.5 1.0 1.0 0.5 0.0 CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 3.0 Stand-by current : Istby [μA] Stand-by current : Istby [μA] 3.0 XC8109xx10ER CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Input voltage : V IN [V] 0.0 -50 -25 0 25 50 75 100 Ambient temperature : Ta [℃] 125 15/24 XC8109 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (4) Supply current vs. Input voltage(sweep up) (5) Supply current vs. Ambient temperature XC8109xx10ER VIN=5.0V, CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 50 45 45 40 35 30 25 20 Ta=105℃ Ta=25℃ Ta=-40℃ 15 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Input voltage : V IN [V] XC8109xx10ER CIN=1.0μF(ceramic), CL =1.0μF(ceramic) CE threshold voltage : V CE [V] 3.0 2.5 CE"H"level CE"L"level 2.0 1.5 1.0 0.5 16/24 35 30 25 20 VIN=5.0V 15 5 (6) CE threshold voltage vs. Ambient temperature 0.0 40 10 5 0 CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 50 Supply current : ISS [μA] Supply current : ISS [μA] XC8109xx10ER -50 -25 75 0 25 50 100 Ambient temperature : Ta [℃] 125 0 -50 -25 0 25 50 75 100 Ambient temperature : Ta [℃] 125 XC8109 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) On resistance vs. Input voltage (8) On resistance vs. Ambient temperature XC8109xx10ER XC8109xx10ER CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 160 160 140 140 120 120 100 100 80 60 Ta=105℃ Ta=25℃ Ta=-40℃ 40 20 0 CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 180 On resistance : Ron [mΩ] On resistance : Ron [mΩ] 180 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input voltage : V IN [V] 5.5 80 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V 60 40 20 0 6.0 -50 -25 (9) Turn-on time vs. Input voltage CIN=1.0μF(ceramic), CL =1.0μF(ceramic) Turn-on time : tDLY(ON) [ms] Turn-on time : tDLY(ON) [ms] 0.4 0.3 0.2 Ta=105℃ Ta=25℃ Ta=-40℃ 0.1 2.5 3.0 3.5 4.0 4.5 5.0 Input voltage : V IN [V] 5.5 0.4 0.3 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V 0.2 0.0 6.0 -50 -25 0 25 50 75 100 Ambient temperature : Ta [℃] 125 (12) Turn-off time vs. Ambient temperature XC8109xx10ER VIN=4.3V, CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 0.08 0.07 0.06 0.05 0.04 Ta=105℃ Ta=25℃ Ta=-40℃ 0.03 0.02 0.01 CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 0.09 Turn-off time : tDLY(OFF) [ms] Turn-off time : tDLY(OFF) [ms] 125 0.5 XC8109xx10ER 0.00 100 0.6 0.1 (11) Turn-off time vs. Input voltage 0.09 75 CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 0.7 0.5 2.0 50 XC8109xx10ER 0.6 0.0 25 (10) Turn-on time vs. Ambient temperature XC8109xx10ER 0.7 0 Ambient temperature : Ta [℃] 0.08 0.07 0.06 0.05 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V 0.04 0.03 0.02 0.01 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Input voltage : V IN [V] 5.5 6.0 0.00 -50 -25 0 25 50 75 100 Ambient temperature : Ta [℃] 125 17/24 XC8109 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (13) FLG delay time over-current (14) FLG delay time reverse-voltage vs. Ambient temperature vs. Ambient temperature XC8109xx10ER XC8109xx10ER CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 8.5 4.5 8.0 4.0 7.5 7.0 6.5 6.0 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V VIN=5.5V 5.5 5.0 4.5 4.0 -50 -25 0 25 50 75 100 CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 5.0 FLG reverse-voltage : tFD [ms] FLG over-current : tFD [ms] 9.0 3.5 3.0 2.5 2.0 1.5 VIN=2.5V VIN=3.5V VIN=4.5V VIN=5.0V 1.0 0.5 0.0 125 -50 -25 0 25 50 75 100 125 Ambient temperature : Ta [℃] Ambient temperature : Ta [℃] (15) Output voltage vs. Output current XC8109xD10ER XC8108xD20ER XC8109xC10ER CIN=1.0μF(ceramic), CL =1.0μF(ceramic) RILIM=515kΩ RILIM=18.4kΩ RILIM=0kΩ 4.0 3.0 2.0 1.0 0.0 4.0 3.0 2.0 1.0 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 Output current : IOUT [A] RILIM=515kΩ RILIM=18.4kΩ RILIM=0kΩ 5.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 Output current : IOUT [A] In over-current states, after output voltage drops and the lapse of 7.5ms, the latch off type turns off the power switch transistor. (16) Turn-on delay vs. Rise time (CL=1.0μF) (17) Turn-off delay vs. Fall time (CL=1.0μF) XC8109xx10ER 4.0 2.0 8.0 3.0 6.0 2.5 Output voltage 0.0 2.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 Supply current -8.0 -0.5 Time [100μs/div] 18/24 0.0 Voltage : [V] Voltage : [V] 6.0 CE Input voltage 3.5 Supply current : Isupply [A] 8.0 XC8109xx10ER VCE=0V→5.0V, tr=5μs, RL =10Ω, Ta=25℃ VIN=5.0V, CIN=CL =1.0μF(ceramic), RILIM =0kΩ VCE=5.0V→0V, tf=5μs, RL =10Ω, Ta=25℃ VIN=5.0V, CIN=CL =1.0μF(ceramic), RILIM =0kΩ 3.5 3.0 Output voltage 4.0 2.0 Supply current : Isupply [A] 5.0 CIN=1.0μF(ceramic), CL =1.0μF(ceramic) 6.0 Output voltage : V OUT [V] Output voltage : V OUT [V] 6.0 2.5 2.0 0.0 1.5 CE Input voltage -2.0 1.0 -4.0 0.5 -6.0 Supply current -8.0 0.0 -0.5 Time [100μs/div] XC8109 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (18) Turn-on delay vs. Rise time (CL=120μF) (19) Turn-off delay vs. Fall time (CL=120μF) 4.0 CE Input voltage Output voltage 8.0 3.0 6.0 2.5 Voltage : [V] Voltage : [V] 6.0 3.5 Supply current : Isupply [A] 8.0 VCE=0V→5.0V, tr=5μs, RL =10Ω, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL =120μF(ceramic), RILIM =0kΩ XC8109xx10ER VCE=5.0V→0V, tf=5μs, RL =10Ω, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL =120μF(ceramic), RILIM =0kΩ 3.5 3.0 4.0 Output voltage 2.5 2.0 2.0 0.0 1.5 -2.0 1.0 -2.0 1.0 0.5 -4.0 0.5 0.0 -6.0 -0.5 -8.0 -4.0 -6.0 -8.0 Supply current Time [500μs/div] 2.0 0.0 2.0 1.5 CE Input voltage Supply current Supply current : Isupply [A] XC8109xx10ER 0.0 Time [500μs/div] -0.5 (20) Short circuit current, Device enabled into short XC8109xx10ER XC8109xx10ER 8.0 3.5 8.0 VCE=5.0V→0V, tf=5μs, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL =120μF(ceramic), RILIM =0kΩ CE Input voltage 3.5 6.0 4.0 2.5 4.0 2.5 2.0 2.0 2.0 2.0 0.0 1.5 Output voltage -4.0 -6.0 -8.0 1.0 0.5 Supply current Time [40μs/div] 0.0 -0.5 0.0 1.5 Output voltage -2.0 1.0 -4.0 -6.0 -8.0 3.0 Supply current : Isupply [A] -2.0 Voltage : [V] 3.0 CE Input voltage Supply current : Isupply [A] Voltage : [V] 6.0 VCE=0V→5.0V, tr=5μs, Ta=25℃ VIN=5.0V, CIN=CL =1.0μF(ceramic), RILIM =0kΩ 0.5 Supply current Time [40μs/div] 0.0 -0.5 19/24 XC8109 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (21) UVLO transient response (CL=1.0μF) XC8109xx10ER XC8109xx10ER 2.0 3.0 6.0 2.5 4.0 2.5 2.0 2.0 2.0 Output voltage 0.0 1.5 -2.0 1.0 -4.0 0.5 -6.0 Supply current -8.0 0.0 3.0 Input voltage 0.0 1.5 Output voltage -2.0 -4.0 1.0 0.5 -6.0 0.0 Supply current -8.0 -0.5 3.5 Supply current : Isupply [A] Voltage : [V] 4.0 Input voltage 8.0 Voltage : [V] 6.0 VIN=5.0V→0V, tf=3ms, Ta=25℃ RL =5Ω, CIN=CL =1.0μF(ceramic), RILIM =0kΩ 3.5 Supply current : Isupply [A] 8.0 VIN=0V→5.0V, tr=3ms, Ta=25℃ RL =5Ω, CIN=CL =1.0μF(ceramic), RILIM =0kΩ -0.5 Time [500μs/div] Time [500μs/div] (22) UVLO transient response (CL=120μF) XC8109xx10ER 6.0 2.5 Output voltage 2.0 2.0 0.0 1.5 -2.0 1.0 -4.0 0.5 Supply current -6.0 -8.0 Time [500μs/div] 4.0 2.5 2.0 2.0 0.0 0.0 -6.0 -0.5 -8.0 Voltage : [V] 6.0 4.0 Input voltage 2.0 0.0 6.0 8.0 5.0 4.0 3.0 FLG voltage 1.0 0.5 Supply current 0.0 Time [500μs/div] -0.5 XC8109xC10ER 2.0 -2.0 1.0 -4.0 0.0 Supply current VIN=5.0V, RL =5Ω, Ta=25℃ CIN=CL =1.0μF(ceramic), RILIM =0kΩ VOUT = 5.5V removed Input voltage 6.0 Voltage : [V] Output voltage 1.5 (24) Reverse voltage released voltage (CL=1.0μF) Supply current : Isupply [A] VOUT=5.5V forced Input voltage -4.0 XC8109xC10ER 8.0 3.0 -2.0 (23) Reverse voltage detected voltage (CL=1.0μF) VIN=5.0V, RL =5Ω, Ta=25℃ CIN=CL =1.0μF(ceramic), RILIM =0kΩ Output voltage 3.5 Supply current : Isupply [A] 4.0 3.0 VIN=5.0V→0V, tf=3ms, Ta=25℃ RL =5Ω, CIN=1.0μF, CL =120μF(ceramic), RILIM =0kΩ 4.0 2.0 Output voltage FLG voltage 0.0 5.0 4.0 3.0 2.0 -2.0 -4.0 6.0 Supply current : Isupply [A] Input voltage 3.5 8.0 Voltage : [V] Voltage : [V] 6.0 XC8109xx10ER Supply current : Isupply [A] 8.0 VIN=0V→5.0V, tr=3ms, Ta=25℃ RL =5Ω, CIN=1.0μF, CL =120μF(ceramic), RILIM =0kΩ 1.0 Supply current 0.0 -6.0 -1.0 -6.0 -1.0 -8.0 -2.0 -8.0 -2.0 Time [500μs/div] 20/24 Time [500μs/div] XC8109 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (26) Reverse voltage released voltage (CL=120μF (25) Reverse voltage detected voltage (CL=120μF) VIN=5.0V, Ta=25℃ CIN=1.0μF, CL =120μF(ceramic), RILIM =0kΩ VOUT=5.5V forced Input voltage 5.0 6.0 2.0 4.0 FLG voltage 0.0 3.0 2.0 -2.0 1.0 Supply current -4.0 0.0 -6.0 -8.0 Time [500μs/div] VIN=5.0V, Ta=25℃ CIN=1.0μF, CL =120μF(ceramic), RILIM =0kΩ VOUT = 5.5V removed Input voltage 6.0 5.0 Output voltage Voltage : [V] Voltage : [V] 8.0 Output voltage 6.0 4.0 6.0 Supply current : Isupply [A] 8.0 XC8109xC10ER 4.0 2.0 4.0 FLG voltage 3.0 0.0 2.0 -2.0 -4.0 -1.0 -6.0 -2.0 -8.0 1.0 Supply current 0.0 Supply current : Isupply [A] XC8109xC10ER -1.0 -2.0 Time [500μs/div] (27) CE transient response XC8109xx10ER CE voltage 8.0 0.030 6.0 4.0 0.025 2.0 0.020 0.0 0.015 -2.0 0.010 -4.0 0.005 -6.0 0.000 In rush current -8.0 -0.005 Time [500μs/div] 4.0 VCE=0→5.0V, tr=5μs, Ta=25℃ VIN=5.0V, CIN=1.0μF, CL =120μF(ceramic) 3.5 3.0 CE voltage 2.5 2.0 2.0 0.0 1.5 -2.0 1.0 -4.0 RILIM=1 … 0.5 RILIM=0 … -6.0 -8.0 0.0 In rush current In rush current : IRUSH [A] Voltage : [V] 6.0 0.035 Voltage : [V] 8.0 XC8109xx10ER In rush current : IRUSH [A] VCE=0→5.0V, tr=5μs, Ta=25℃ VIN=5.0V, CIN=CL =1.0μF(ceramic) -0.5 Time [500μs/div] (28) Current limit adapted time XC8109xx10ER VIN=5.0V, Ta=25℃ CL =open, RILIM =0kΩ Current limit response : [μs] 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0.0 1.0 2.0 3.0 4.0 5.0 Peak limit current [A] 6.0 21/24 XC8109 Series ■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLINE / LAND PATTERN THERMAL CHARACTERISTICS USP-6C USP-6C PKG USP-6C Power Dissipation 22/24 XC8109 Series ■MARKING RULE ① represents products series USP-6C ② ⑤ ③ 3 ④ 2 ① 1 6 5 4 MARK PRODUCT SERIES Z XC8109******-G ② represents product type MARK CE LOGIC PROTECTION CIRCUIT TYPE PRODUCT 1 Active High Auto-recovery XC8109AC****-G 2 Active High Latch-off XC8109AD****-G 3 Active Low Auto-recovery XC8109BC****-G 4 Active Low Latch-off XC8109BD****-G ③ represents maximum output current MARK CURRENT (A) PRODUCT SERIES 6 0.9 XC8109**10**-G ④⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. 23/24 XC8109 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 24/24