XC9242/XC9243 Series
ETR05021-013
2A Synchronous Step-Down DC/DC Converters
☆Green Operation Compatible
対応
■GENERAL DESCRIPTION
The XC9242/XC9243 series is a group of synchronous-rectification step-down DC/DC converters with a built-in 0.11Ω Pchannel MOS driver transistor and 0.12Ω N-channel MOS switching transistor, designed to allow the use of ceramic
capacitors. The small on-resistances of these two internal driver transistors enable a high efficiency, stable power supply with
an output current up to 2A. The XC9242/XC9243 series has operating voltage range of 2.7V~6.0V and a 0.8V (±2.0%)
reference voltage, and using externally connected resistors, the output voltage can be set freely from 0.9V. With an internal
switching frequency of 1.2MHz or 2.4MHz, small external components can be used.
The XC9242 series is PWM control, and the XC9243 series is PWM/PFM, which automatically switches from PWM to PFM
during light loads and provides high efficiency, high load response, low voltage ripple, can be achieved over a wide range of
load conditions.
The integrated CL discharge function which enables the electric charge at the output capacitor CL to be discharged via the
internal discharge switch located between the LX and VSS pins. Due to CL discharge function, malfunction on LX is prevented
when Stand-by mode.
■APPLICATIONS
■FEATURES
Smart phones / Mobile phones
Bluetooth
Mobile devices / terminals
Portable game consoles
Digital still cameras / Camcorders
■TYPICAL APPLICATION CIRCUIT
Driver Transistor
:
Input Voltage Range
Output Voltage Setting
FB Voltage
High Efficiency
Output Current
Oscillation Frequency
Maximum Duty Cycle
Functions
:
:
:
:
:
:
:
:
Output Capacitor
Control Methods
:
:
Operating Ambient Temperature
Packages
Environmentally Friendly
:
:
:
0.11Ω P-ch Driver Transistor
0.12Ω N-ch Switching Transistor
2.7V ~ 6.0V
0.9V ~ VIN
0.8V ± 2.0%
95%
2.0A
1.2MHz±15%, 2.4MHz±15%
100%
Soft-Start
CL Discharge
Current Limit Circuit（automatic return）
Thermal Shutdown
UVLO
Low ESR Ceramic Capacitor
PWM control (XC9242)
PWM/PFM Auto (XC9243)
-40℃ ~ 85℃
USP-10B, SOP-8FD
EU RoHS Compliant, Pb Free
■TYPICAL PERFORMANCE
CHARACTERISTICS
●Efficiency vs. Output Current (fosc=1.2MHz, VOUT=3.3V)
XC9242B 08C
L=4.7μH(SLF7055),CIN1 =20μF(LMK212ABJ106KGx2)
Lx
Lx
PGND
PVIN
PGND
PVIN
FB
AVIN
AGND
CE
VIN
CIN1
CIN2
CIN2 =1μF(LMK107BJ105KAx1),CL =20μF(LMK212ABJ106KGx2)
RFB1 =47kΩ, RFB2 =15kΩ, CFB=330pF
100
VOUT
L
90
CFB
80
RFB1
CL
RFB2
Efficiency: EFFI (%)
●
●
●
●
●
70
60
VIN=5.0V
50
40
30
20
10
0
0.1
1
10
100
1000
Output Current: I OUT (mA)
10000
1/28
XC9242/XC9243 Series
■BLOCK DIAGRAM
AVIN
PVIN
UVLO
Comparator
R1
UVLO
R2
Current Feedback
Current Limit
PWM
Comparator
Error Amp
Logic
FB
Lx
Phase
Compensation
Vref with
Soft Start
CE
CE
Synch
Buffer
Drive
Ramp Wave
Generator
OSC
CE
Control
Logic
OEB
Thermal
Shutdown
PFM/PWM
Selector
OEB
PGND
AGND
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
■ PRODUCT CLASSIFICATION
●Ordering Information
XC9242①②③④⑤⑥-⑦(*1)
Fixed PWM control
XC9243①②③④⑤⑥-⑦(*1)
PWM / PFM automatic switching control
(*1)
(*2)
DESIGNATOR
ITEM
SYMBOL
①
②③
Functional Selection
FB Voltage
④
Oscillation Frequency
⑤⑥-⑦(*1)
Package (Order Unit)
B
08
C
D
DR-G
QR-G
DESCRIPTION
CL Discharge
0.8V
1.2MHz
2.4MHz
USP-10B (3,000pcs/Reel)(*2)
SOP-8FD (1,000pcs/Reel)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
The USP-10B reels are shipped in a moisture-proof packing.
Selection Guide
2/28
TYPE
SOFT-START
TIME
CHIP
ENABLE
CURRENT
LIMITER
THERMAL
SHUTDOWN
UVLO
CL AUTODISCHARGE
B
Fixed
Yes
Yes
Yes
Yes
Yes
XC9242/XC9243
Series
■PIN CONFIGURATION
AGND 5
6
CE
FB 4
7
AVIN
PGND
3
8
PVIN
PGND
2
9
PVIN
Ｌx
1
LX
1
8
LX
PGND
2
7
PVIN
FB
3
6
AVIN
AGND
4
5
CE
10 Ｌx
USP-10B
USP-10B
( BOTTOM VIEW )
(BOTTOM VIEW)
SOP-8FD
SOP-8FD
(TOP
VIEW)
(TOP VIEW)
USP-10B
* Please connect the power input pins (No.8 and No.9) and analog input pin (No.7) when operating.
* Please connect the two Lx pins (No.1 and 10).
* Please connect the power ground pins (No.2 and 3) and analog ground pin (No.5) when operating.
* It is recommended that the heat dissipation pad of the USP-10B package is soldered by using the reference mount pattern and metal mask
pattern for mounting strength. The mount pattern should be electrically opened or connected to AGND pin (No.5) and PGND pin (No.2, and
3).
SOP-8FD
* Please connect the power input pin (No.7) and analog input pin (No.6) when operating.
* Please connect the two Lx pins (No.1 and 8).
* Please connect the two power ground pins (No.2 and 4).
* It is recommended that the heat dissipation pad of the SOP-8FD package is soldered by using the reference mount pattern and metal
mask pattern for mounting strength. The mount pattern should be electrically opened or connected to AGND pin (No.6) and PGND pin
(No.7).
■ PIN ASSIGNMENT
USP-10B
PIN NUMBER
SOP-8FD
1,10
2,3
4
5
6
7
8,9
1,8
2
3
4
5
6
7
PIN NAME
FUNCTIONS
Lx
PGND
FB
AGND
CE
AVIN
PVIN
Switching Output
Power Ground
Output Voltage Monitor
Analog Ground
Chip Enable
Analog Input
Power Input
■ CE PIN FUNCTION
PIN NAME
SIGNAL
STATUS
CE
H
L
Active
Stand-by
* Please do not leave the CE pin open.
3/28
XC9242/XC9243 Series
■ ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
PVIN Pin Voltage
AVIN Pin Voltage
CE Pin Voltage
FB Pin Voltage
Lx Pin Voltage
Lx Pin Current
VPVIN
VAVIN
VCE
VFB
VLx
ILx
USP-10B
Power Dissipation
Pd
SOP-8FD
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
RATINGS
UNIT
-0.3 ~ 7.0(*1)
V
-0.3 ~ 7.0
-0.3 ~ 7.0
-0.3 ~ 7.0 or VPVIN +0.3 (*2)
±6.0 (*3)
150 (IC only)
1000 (40mm x 40mm standard board) (*4)
300 (IC only)
2500 (JESD51-7 board) (*4)
-40 ~ 85
-55 ~ 125
V
V
V
A
All voltages are described based on the ground voltage of AGND and PGND.
(*1) Please connect PVIN pin and AVIN pin for use.
(*2) The maximum value should be either 7.0V or VPVIN+0.3V in the lowest.
(*3) It is measured when the two Lx pins (USP-10B No.1 and 10, SOP-8FD No.1 and 8) are tied up to each other.
(*4) The power dissipation figure shown is PCB mounted and is for reference only.
Please refer to PACKAGING INFORMATION for the mounting condition.
4/28
mW
℃
℃
XC9242/XC9243
Series
■ ELECTRICAL CHARACTERISTICS
●XC9242/XC9243, fOSC=1.2MHz, Ta=25℃
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP.
MAX.
UNIT
CIRCUIT
0.784
0.800
0.816
V
③
2.7
-
6.0
V
①
2.0
-
-
A
①
2.00
-
2.68
V
③
VIN=VCE=5.0V, VFB=0.88V
-
41
78
μA
②
VIN=5.0V, VCE=0V, VFB=0.88V
-
0.01
1.00
μA
②
1020
1200
1380
kHz
①
-
280
-
mA
①
-
180
250
%
①
100
-
-
0
%
%
③
③
-
95
-
%
①
-
0.11
0.21
Ω
④
-
0.12
0.30(*7)
Ω
-
VIN=5.0V, VCE=0V, VFB=0.88V, VLx=0V
-
0.01
1.00(*8)
μA
⑤
VIN=VCE=5.0V, VFB=0.72V (*9)
IOUT=100mA
-40℃≦Topr≦85℃
When connected to external components
VIN=5.0V, VFB=0.72V Applied voltage to VCE
Voltage changes Lx to “H” level
VIN=5.0V, VFB=0.72V Applied to VCE Voltage
changes Lx to “L” level
VIN=5.0V, VCE=5.0V, VFB=0V
VIN=5.0V, VCE=0V, VFB=0V
VIN=5.0V, VCE=0V, VFB=5.0V
VIN=5.0V, VCE=0V, VFB=0V
VIN=5.0V, VCE=0V→5.0V, IOUT=1mA
When connected to external components
-
4.0
-
A
④
-
±100
-
ppm/℃
①
1.2
-
VIN
V
③
AGND
-
0.4
V
③
-0.1
-0.1
-0.1
-0.1
-
0.1
0.1
0.1
0.1
μA
μA
μA
μA
⑤
⑤
⑤
⑤
0.3
1.0
2.0
ms
①
-
150
-
℃
-
80
20
130
160
℃
Ω
⑥
FB Voltage
VFB
VIN= 5.0V, VCE =5.0V
Voltage to start oscillation while
VFB=0.72V → 0.88V
Operating Voltage Range
VIN
When connected to external components
(*1,*2)
Maximum Output Current
IOUTMAX
UVLO Voltage
VUVLO
Quiescent Current
Iq
Stand-by Current
ISTB
Oscillation Frequency
fOSC
PFM Switch Current
(*4)
IPFM
PFM Duty Limit (*4)
DTYLIMIT_PFM
Maximum Duty Limit
Minimum Duty Limit
DMAX
DMIN
Efficiency
EFFI
LXSW”H”ON Resistance
RLxH
LXSW”L”ON Resistance
RLxL
LXSW”H” Leakage Current
ILeakH
Current Limit
Output Voltage
Temperature
Characteristics
ILIM
ΔVOUT/
(VOUT・Δtopr)
CE”H” Voltage
VCEH
CE”L” Voltage
VCEL
CE”H” Current
CE”L” Current
FB”H” Current
FB”L” Current
ICEH
ICEL
IFBH
IFBL
Soft-Start Time
tSS
Thermal Shutdown
Temperature
Hysteresis Width
CL Discharge
VIN=VCE=5.0V
When connected to external components
VCE=5.0V, VFB=0.72V
Voltage which Lx pin holding ”L” level (*3)
VIN=VCE=5.0V, IOUT=300mA
When connected to external components
VIN=VCE=4.0V, IOUT=1mA
When connected to external components
VIN=VCE=2.7V, IOUT=1mA
When connected to external components
VIN=VCE=5.0V, VFB=0.72V
VIN=VCE=5.0V, VFB=0.88V
VIN=VCE=5.0V, IOUT=500mA (*5)
RFB1=47kΩ, RFB2=15kΩ, CFB=330pF
VIN=VCE=4.0V, VFB=0.72V (*6)
TTSD
THYS
RDCHG
VIN=5.0V, VCE=0V, VFB=0.72V, VLx=1.0V
NOTE:
External Components: CIN1=20μF(ceramic), CIN2=1μF(ceramic), L=4.7μH(SLF7055T-4R7 TDK), CL=20μF(ceramic)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
Condition: Unless otherwise stated, ”H”=VIN ~ VIN - 1.2V, “L”=+ 0.1V ~ -0.1V
(*1) Mount conditions affect heat dissipation. Maximum output current is not guaranteed when TTSD starts to operate earlier.
(*2) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*3) These values include UVLO detect voltage, UVLO release voltage and hysteresis operating voltage range.
UVLO release voltage is defined as the VIN voltage which makes Lx pin “H”.
(*4) XC9242 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
(*5) EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
(*6) On resistance = (VIN – Lx pin measurement voltage) / 100mA
(*7) Design value
(*8) When temperature is high, a current of approximately 20μA (maximum) may leak.
(*9) Current limit denotes the level of detection at peak of coil current.
5/28
XC9242/XC9243 Series
■ ELECTRICAL CHARACTERISTICS (Continued)
●XC9242/XC9243, fOSC=2.4MHz, Ta=25℃
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNIT
CIRCUIT
0.784
0.800
0.816
V
③
2.7
-
6.0
V
①
2.0
-
-
A
①
2.00
-
2.68
V
③
VIN=VCE=5.0V, VFB=0.88V
-
53
92
μA
②
VIN=5.0V, VCE=0V, VFB=0.88V
-
0.01
1.00
μA
②
2040
2400
2760
kHz
①
-
680
-
mA
①
-
180
250
%
①
VIN= VCE =5.0V
FB Voltage
VFB
Voltage to start oscillation while
VFB=0.72V → 0.88V
Operating Voltage Range
VIN
Maximum Output Current
IOUTMAX
UVLO Voltage
VUVLO
Quiescent Current
Iq
Stand-by Current
ISTB
Oscillation Frequency
PFM Switch Current
fOSC
When connected to external components
VIN=VCE=5.0V
(*1,*2)
When connected to external components
VCE=5.0V, VFB=0.72V
Voltage which Lx pin holding ”L” level(*3)
VIN=VCE=5.0V, IOUT=1000mA
When connected to external components
VIN=VCE=6.0V, IOUT=1mA
(*4)
IPFM
PFM Duty Limit (*4)
DTYLIMIT_PFM
Maximum Duty Limit
DMAX
VIN=VCE=5.0V, VFB=0.72V
100
-
-
%
③
Minimum Duty Limit
DMIN
VIN=VCE=5.0V, VFB=0.88V
-
-
0
%
③
-
95
-
%
①
-
0.11
0.21
Ω
④
Efficiency
EFFI
LXSW”H”ON Resistance
RLXH
LXSW”L”ON Resistance
RLXL
LXSW”H” Leakage Current
ILeakH
Current Limit
ILIM
Output Voltage
Temperature
Characteristics
ΔVOUT/
(VOUT・Δtopr)
When connected to external components
VIN=VCE=2.7V, IOUT=1mA
When connected to external components
VIN=VCE=5.0V, IOUT=500mA (*5)
RFB1=47kΩ, RFB2=15kΩ, CFB=330pF
VIN=VCE=4.0V, VFB=0.72V (*6)
(*7)
-
0.12
0.30
Ω
-
VIN=5.0V, VCE=0V, VFB=0.88V, VLx=0V
-
0.01
1.00(*8)
μA
⑤
VIN=VCE=5.0V, VFB=0.72V (*9)
-
4.0
-
A
④
-
±100
-
ppm/℃
①
1.2
-
VIN
V
③
AGND
-
0.4
V
③
IOUT=100mA
-40℃≦Topr≦85℃
When connected to external components
VIN=5.0V, VFB=0.72V
CE”H” Voltage
VCEH
CE”L” Voltage
VCEL
CE”H” Current
ICEH
VIN=5.0V, VCE=5.0V, VFB=0V
-0.1
-
0.1
μA
⑤
CE”L” Current
ICEL
VIN=5.0V, VCE=0V, VFB=0V
-0.1
-
0.1
μA
⑤
FB”H” Current
IFBH
VIN=5.0V,VCE=0V, VFB=5.0V
-0.1
-
0.1
μA
⑤
FB”L” Current
IFBL
VIN=5.0V,VCE=0V, VFB=0V
-0.1
-
0.1
μA
⑤
0.3
1.0
2.0
ms
①
-
150
-
℃
-
Soft-Start Time
Thermal Shutdown
Temperature
tSS
Applied voltage to VCE Voltage changes Lx to “H” level
VIN=5.0V, VFB=0.72V
Applied voltage to VCE Voltage changes Lx to “L” level
VIN=5.0V, VCE=0V→5.0V, IOUT=1mA
When connected to external components
TTSD
Hysteresis Width
THYS
CL Discharge
RDCHG
VIN=5.0V, VCE=0V, VFB=0.72V, VLx=1.0V
-
20
-
℃
-
80
130
160
Ω
⑥
NOTE:
External Components: CIN1=20μF(ceramic), CIN2=1μF(ceramic), L=2.2μH(SLF7055T-2R2 TDK), CL=20μF(ceramic)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
Condition: Unless otherwise stated, ”H”= VIN ~ VIN - 1.2V, “L”= + 0.1V ~ -0.1V
(*1) Mount conditions affect heat dissipation. Maximum output current is not guaranteed when TTSD starts to operate earlier.
(*2) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*3) These values include UVLO detect voltage, UVLO release voltage and hysteresis operating voltage range.
UVLO release voltage is defined as the VIN voltage which makes Lx pin “H”.
(*4) XC9242 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
(*5) EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
(*6) On resistance = (VIN – Lx pin measurement voltage) / 100mA
(*7) Design value
(*8) When temperature is high, a current of approximately 20μA (maximum) may leak.
(*9) Current limit denotes the level of detection at peak of coil current.
6/28
XC9242/XC9243
Series
■TYPICAL APPLICATION CIRCUIT
●XC9242/XC9243 Series
VOUT
Lx
L
RFB1 CFB CL
Lx
PGND
PGND
RFB2
VIN
PVIN
CIN1
PVIN
AVIN
FB
AGND
CIN2
CE
External Components
1.2MHz
2.4MHz
4.7μH(SLF7055T-4R7)
L:
2.2μH(SLF7055T-2R2)
L:
4.7μH(SPM6530T-4R7)
2.2μH(SPM6530T-2R2)
20μF (LMK212ABJ106KG 10V/10μF x2)
CIN1:
CIN2
1μF (LMK107BJ105KA 10V/1μF x1)
CIN2
1μF (LMK107BJ105KA 10V/1μF x1)
CL:
20μF (LMK212ABJ106KG 10V/10μF x2)
CL:
20μF (LMK212ABJ106KG 10V/10μF x2)
CIN1:
20μF (LMK212ABJ106KG 10V/10μF x2)
Output voltage can be set by adding external split resistors. Output voltage is determined by the following equation, based on the values of RFB1
and RFB2. The sum of RFB1 and RFB2 should normally be 100k or less. Output voltage range is 0.9V~5.5V by a 0.8V (±2.0%) reference voltage.
When input voltage (VIN) ≦setting output voltage, output voltage (VOUT) can not output the power more than input voltage (VIN).
VOUT = 0.8 x (RFB1 + RFB2) / RFB2
The value of CFB, speed-up capacitor for phase compensation, should be fZFB= 1 / (2 x x CFB x RFB1) which is equal to 10kHz. Adjustments
are required from 1kHz to 10kHz depending on the application, value of inductance (L), and value of load capacitance (CL).
[Example of calculation]
When RFB1=47kΩ, RFB2=15kΩ, VOUT=0.8×(47kΩ+15kΩ) / 15kΩ =3.3V
When CFB=330pF, fzfb= 1/(2×π×330pF×47 kΩ) =10.26kHz
VOUT
(V)
RFB1
(kΩ)
RFB2
(kΩ)
CFB
(pF)
VOUT
(V)
RFB1
(kΩ)
RFB2
(kΩ)
CFB
(pF)
1.0
1.2
1.5
1.8
7.5
15
26
30
30
30
30
24
2000
1000
560
510
2.5
3.0
3.3
5.0
51
33
47
43
24
12
15
8.2
300
470
330
390
7/28
XC9242/XC9243 Series
■ OPERATIONAL DESCRIPTION
The XC9242/XC9243 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation
circuit, output voltage adjustment resistors, P-channel MOS driver transistor, N-channel MOS switching transistor for the synchronous switch,
current limiter circuit, UVLO circuit and others. (See the block diagram above.) The series ICs compare, using the error amplifier, the voltage of
the internal voltage reference source with the feedback voltage from the FB pin. Phase compensation is performed on the resulting error amplifier
output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator compares, in terms
of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting output to the buffer
driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to ensure stable output voltage.
The current feedback circuit monitors the P-channel MOS driver transistor current for each switching operation, and modulates the error amplifier
output signal to provide multiple feedback signals. This enables a stable feedback loop even when a low ESR capacitor such as a ceramic
capacitor is used ensuring stable output voltage.
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
The ramp wave circuit determines switching frequency. The frequency is fixed internally and can be selected from 1.2MHz or 2.4MHz. Clock
pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits.
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by
the external split resistors, R1 and R2. When a voltage lower than the reference voltage is fed back, the output voltage of the error amplifier
increases.
The gain and frequency characteristics of the error amplifier output are fixed internally to deliver an optimized signal to the mixer.
The XC9242/XC0243 series includes a fold-back circuit, which aids the operation of the current limiter and circuit protection. The
XC9242/XC9243 series monitors the current flowing through the P-channel MOS driver transistor.
①When current flowing through P-channel MOS driver transistor reaches current limit ILIM, the current limiter circuit operates to limit the inductor
current ILX. If this state continues, the fold-back circuit operates and limit the output current in order to protect the IC from damage.
②The output voltage is automatically resumed if the load goes light.
When it is resumed, the soft-start function operates.
①
ILIM
ILx
VOUT
VLx
8/28
②
XC9242/XC9243
Series
■OPERATIONAL DESCRIPTION (Continued)
For protection against heat damage, the thermal shutdown function monitors chip temperature. When the chip’s temperature reaches 150OC
(TYP.), the thermal shutdown circuit starts operating and the P-channel driver transistor will be turned off. At the same time, the output voltage
decreases. When the temperature drops to 130OC (TYP.) after shutting off the current flow, the IC performs the soft start function to initiate output
startup operation.
< Function of CE pin >
The XC9242/9243 series will enter into stand-by mode by inputting a low level signal to the CE pin. During a stand-by mode, the current
consumption of the IC becomes 0μA (TYP.). The IC starts its operation by inputting a high level signal to the CE pin. The input of the CE pin is a
CMOS input and the sink current is 0μA (TYP.).
When the VIN pin voltage becomes 2.4V (TYP.) or lower, the P-channel MOS driver transistor output driver transistor is forced OFF to prevent
false pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 2.68V (MAX.) or higher, switching
operation takes place. By releasing the UVLO function, the IC performs the soft start function to initiate output startup operation. The soft start
function operates even when the VIN pin voltage falls momentarily below the UVLO operating voltage. The UVLO circuit does not cause a complete
shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry remains in operation.
The XC9242/XC9243 series provide 1.0ms (TYP). Soft start time is defined as the time interval to reach 90% of the output voltage from the time
when the VCE is turned on.
The XC9242/XC9243 series can quickly discharge the electric charge at the output capacitor (CL) when a low signal to the CE pin which enables
a whole IC circuit put into OFF state, is inputted via the N-channel MOS switch transistor located between the LX pin and the VGND pin. When the
IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction. Discharge time of the
output capacitor (CL) is set by the CL auto-discharge resistance (R) and the output capacitor (CL). By setting time constant of a CL auto-discharge
resistance value [R] and an output capacitor value (CL) as τ(τ=C x R), discharge time of the output voltage after discharge via the N-channel
transistor is calculated by the following formulas.
V = VOUT(E)×e -t /τ or
t = τln (VOUT(E) /V)
V : Output voltage after discharge
VOUT(E) : Output voltage
t: Discharge time
τ: CL×RDCHG
CL : Capacitance of Output capacitor
RDCHG : CL auto-discharge resistance
Output Voltage Dischage characteristics
Rdischg = 130Ω(TYP.)
RDCHG
CL=20μF
5.0
4.5
Output Voltage: V OUT (V)
4.0
3.5
3.0
2.5
VOUT =1.2V
VOUT
= 1.2V
2.0
VOUT
VOUT =1.8V
= 1.8V
1.5
VOUT =3.3V
VOUT
= 3.3V
1.0
0.5
0.0
0
2
4
6
8
10 12
14
16 18
20
Discharge Time: t(ms)
9/28
XC9242/XC9243 Series
■OPERATIONAL DESCRIPTION (Continued)
(*1)
In PFM control operation, until coil current reaches to a specified level (IPFM), the IC keeps the P-channel MOS driver transistor on. In this
case, time that the P-channel MOS driver transistor is kept on (tON) can be given by the following formula. Please refer to IPFM①
tON = L × IPFM / (VIN - VOUT)
< PFM Duty Limit > (*1)
In PFM control operation, the PFM duty limit (DTYLIMIT_PFM) is set to 200% (TYP.). Therefore, under the condition that the duty increases (e.g.
the condition that the step-down ratio is small), it’s possible for P-channel MOS driver transistor to be turned off even when coil current doesn’t
reach to IPFM. Please refer to IPFM②
(*1)
XC9242 Series is excluded.
DTYLIMIT_PFM
tON
VLx
VLx
fOSC
IPFM
ILx
0mA
Fig.図 IPFM ①
10/28
IPFM
ILx
0mA
Fig.
図 IPFM ②
XC9242/XC9243
Series
■NOTE ON USE
1.
Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising phenomenon,
the IC is liable to malfunction should the ratings be exceeded.
2.
Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current.
Please wire the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible.
3.
When the difference between VIN and VOUT is large in PWM control, very narrow pulses will be outputted, and there is the possibility that some
cycles may be skipped completely.
4.
When the difference between VIN and VOUT is small, and the load current is heavy, very wide pulses will be outputted and there is the possibility
that some cycles may be skipped completely.
5.
With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when dropout voltage or load
current is high, current limit starts operation, and this can lead to instability. When peak current becomes high, please adjust the coil inductance
value and fully check the circuit operation. In addition, please calculate the peak current according to the following formula:
Ipk = (VIN-VOUT)×OnDuty / (2×L×fOSC) + IOUT
L : Coil Inductance Value
fOSC: Oscillation Frequency
6.
Use of the IC at voltages below the recommended voltage range may lead to instability.
7.
This IC should be used within the stated absolute maximum ratings in order to prevent damage to the device.
8.
When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the leak current of the
P-channel driver transistor.
9.
The XC9242/XC9243 uses fold-back circuit limiter. However, fold-back may become “droop” affected by the wiring conditions. Care must be
taken especially for CIN distance and position.
10. If CL capacitance reduction happens such as in the case of low temperature, the IC may enter unstable operation. Care must be taken for CL
capacitor selection and its capacitance value.
Ta = - 50℃
VIN = 3.6V, VOUT = 0.9V, fOSC = 2.4MHz
CIN = 20μF(Ceramic)
CL = 14.7μF(Ceramic)
IOUT = 300mA
1ch VLx ：2.0V/diｖ
2ch VOUT ：50mV/diｖ
x-axis : 2.0μs / div
11. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
11/28
XC9242/XC9243 Series
■NOTE ON USE (Continued)
●Instructions of pattern layouts
1.
In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the PVIN & PGND
pins and the AVIN & AGND pins.
2.
Make sure to avoid noise from the PVIN pin to the AVIN pin. Please connect the AGND pin and PGND pin in the shortest length for wiring.
3.
Please mount each external component as close to the IC as possible.
4.
Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
5.
This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-channel and N-channel MOS driver
6.
Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of
transistors.
switching may result in instability of the IC.
●Recommended Pattern Layout（USP-10B)
1st Layer(USP-10B)
3rd Layer(USP-10B)
12/28
2nd Layer(USP-10B)
4th Layer(USP-10B)
XC9242/XC9243
Series
■NOTE ON USE (Continued)
1st Layer(SOP-8FD)
2nd Layer(SOP-8FD)
3rd Layer(SOP-8FD)
4th Layer(SOP-8FD)
13/28
XC9242/XC9243 Series
■TEST CIRCUITS
1) CIRCUIT ①
Oscillation Check Point
Lx
PVIN
A
L
AVIN
VIN
CE
CIN1
CIN2
CFB
RFB1
A
CL
FB
IOUT
V
(*1)XC924xB08C TYPE
L ：4.7μH (SLF7055T-4R7 : TDK)
XC924xB08D TYPE
L ：2.2μH (SLF7055T-2R2 : TDK)
RFB2
GND
VCE
※External components
CIN1 : 20μF（ceramic）
CIN2 : 1μF（ceramic）
CL : 20μF（ceramic）
RFB1 : 15kΩ
RFB2 : 30kΩ
CFB : 1000pF
※The condtion to measure EFFI
RFB1 : 47kΩ
RFB2 : 15kΩ
CFB : 330pF
3) CIRCUIT ③
2) CIRCUIT ②
Oscillation Check Point
PVIN
A
PVIN
Lx
AVIN
AVIN
CE
VIN
1μF
Lx
FB
CE
VIN
1μF
GND
VFB
VCE
200Ω
FB
GND
VCE
4) CIRCUIT ④
VFB
5) CIRCUIT ⑤
Oscillation Check Point
PVIN
Lx
A
CE
FB
ILｘ
1μF
ICEH
VIN
A
1μF
VCE
VFB
6) CIRCUIT ⑥
ILｘ
Lx
AVIN
V
CE
FB
GND
14/28
A
VLx
1μF
VCE
A
IFBH
CE
FB
A
IFBL
GND
VCE
VIN
AVIN
ICEL
GND
PVIN
Lx
PVIN
AVIN
VIN
ILeakH
VFB
VFB
XC9242/XC9243
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
XC9242B08C (VOUT=1.2V)
XC9243B08C (VOUT=1.2V)
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
100
90
80
70
60
50
40
30
20
10
0
VIN=3.7V
Efficiency: EFFI (%)
Efficiency: EFFI (%)
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN=5.0V
0.1
1
10
100
1000
Output Current: IOUT (mA)
100
90
80
70
60
50
40
30
20
10
0
10000
VIN=5.0V
VIN=3.7V
0.1
XC9242B08D (VOUT=1.2V)
1
10
100
1000
Output Current: IOUT (mA)
XC9243B08D (VOUT=1.2V)
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
100
100
90
90
80
VIN=3.7V
70
60
Efficiency: EFFI (%)
Efficiency: EFFI (%)
80
10000
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
VIN=5.0V
50
40
30
70
60
VIN=3.7V
40
30
20
20
10
10
0
VIN=5.0V
50
0
0.1
1
10
100
1000
10000
0.1
1
Output Current: IOUT (mA)
10
100
1000
Output Current: IOUT (mA)
10000
(2) Output Voltage vs. Output Current
XC9242B08C (VOUT=1.2V)
XC9243B08C (VOUT=1.2V)
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
1.4
Output Voltage: VOUT (V)
Output Voltage: VOUT (V)
1.4
1.3
1.2
VIN=3.7V, 5.0V
1.1
1
1.3
1.2
VIN=3.7V, 5.0V
1.1
1
0.1
1
10
100
1000
Output Current: IOUT (mA)
10000
0.1
1
10
100
1000
Output Current: IOUT (mA)
10000
15/28
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
XC9242/XC9243 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Output Voltage vs. Output Current
XC9242B08D (VOUT=1.2V)
XC9243B08D (VOUT=1.2V)
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
1.4
Output Voltage: VOUT (V)
Output Voltage: VOUT (V)
1.4
1.3
1.2
VIN=3.7V, 5.0V
1.1
1
0.1
1
10
100
1000
1.3
1.2
VIN=3.7V, 5.0V
1.1
1
10000
0.1
Output Current: IOUT (mA)
1
10
100
1000
Output Current: IOUT (mA)
10000
(3) Ripple Voltage vs. Output Current
XC9242B08C (VOUT=1.2V)
XC9243B08C (VOUT=1.2V)
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
90
90
80
80
70
60
50
VIN = 5.0V
40
VIN = 3.7V
30
20
Ripple Voltage: Vr(mV)
100
Ripple Voltage: Vr(mV)
100
10
70
60
50
VIN = 3.7V
40
30
20
10
0
0
0.1
1
10
100
1000
Output Current: IOUT (mA)
10000
0.1
XC9242B08D (VOUT=1.2V)
1
10
100
1000
Output Current: IOUT (mA)
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
90
80
80
Ripple Voltage: Vr(mV)
100
90
Ripple Voltage: Vr(mV)
100
70
60
50
40
30
VIN = 5.0V, 3.7V
20
10000
XC9243B08D (VOUT=1.2V)
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN = 3.7V
70
VIN = 5.0V
60
50
40
30
20
10
10
0
0
0.1
16/28
VIN = 5.0V
1
10
100
1000
Output Current: IOUT (mA)
10000
0.1
1
10
100
1000
Output Current: IOUT (mA)
10000
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
XC9242/XC9243
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) FB Voltage vs. Ambient Temperature
(5) UVLO Voltage vs. Ambient Temperature
XC9242B08C
XC9242B08C
2.7
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
0.86
0.84
UVLO Voltage: UVLO (V)
Feedback Voltage: VFB (V)
0.88
0.82
0.80
0.78
0.76
0.74
0.72
-50
2.6
2.5
UVLO
2.4
2.3
2.2
2.1
2.0
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
(6) Quiescent Current vs. Ambient Temperature
100
90
80
70
60
50
40
30
20
10
0
-50
XC9242B08D
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
Quiescent Current: Iq (μA)
Quiescent Current: Iq (μA)
XC9242B08C
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
100
90
80
70
60
50
40
30
20
10
0
-50
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
(7) Stand-by Current vs. Ambient Temperature
XC9242B08D
XC9242B08C
5.0
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
4.0
Standby Current: ISTB (μA)
Standby Current: ISTB (μA)
5.0
3.0
2.0
1.0
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
4.0
3.0
2.0
1.0
0.0
0.0
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
17/28
XC9242/XC9243 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Oscillation Frequency vs. Ambient Temperature
XC9242B08C
XC9242B08D
3000
Oscillation Freqency: fOSC (KHz)
Oscillation Freqency: fOSC (KHz)
1800
1600
1400
1200
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
1000
800
600
2800
2600
2400
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
2200
2000
1800
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
(9) PFM Switching Current vs. Ambient Temperature
XC9243B08C
VIN = 6.0V
PFM SW Current: IPFM (mA)
PFM SW Current: IPFM (mA)
1000
900
800
700
600
500
400
300
200
100
0
-50
XC9243B08D
VIN = 5.0V
VIN = 4.0V
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
2000
1800
1600
1400
1200
1000
800
600
400
200
0
-50
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
(10) PFM Duty Limit vs. Ambient Temperature
XC9243B08D
300
PFM Duty Limit: DTYLIMIT_PFM (%)
PFM Duty Limit: DTYLIMIT_PFM (%)
XC9243B08Ｃ
250
200
150
100
50
18/28
0
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
300
250
200
150
100
50
0
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
XC9242/XC9243
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(11) Pch Driver ON Resistance vs. Ambient Temperature
(12) Nch Driver ON Resistance vs. Ambient Temperature
300
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
250
200
150
100
50
0
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
300
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
250
200
150
100
50
0
100
(13) LxSW”H” Leakage Current vs. Ambient Temperature
-50
4.0
Current Limit: ILIM (mA)
LxSW”H” Leakage Current: ILx (μA)
8000
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
3.0
2.0
1.0
-25
0
25
50
75
Ambient Temperature : Ta (℃)
6000
5000
4000
3000
100
XC9242B08C
1.4
1.4
1.2
1.2
CE”L” Voltage VCEL (V)
CE”H” Voltage VCEH (V)
-25
0
25
50
75
Ambient Temperature : Ta (℃)
(16) CE”L” Voltage vs. Ambient Temperature
XC9242B08C
1.0
0.8
0.6
0.0
-50
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
7000
2000
-50
100
(15) CE”H” Voltage vs. Ambient Temperature
0.2
100
XC9242B08C
5.0
0.4
-25
0
25
50
75
Ambient Temperature: Ta (℃)
(14) Current Limit vs. Ambient Temperature
XC9242B08C
0.0
-50
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
XC9242B08C
Lx SW Nch ON Resistance: RLxL (mΩ)
Lx SW Pch ON Resistance: RLxH (mΩ)
XC9242B08C
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
1.0
0.8
0.6
0.4
0.2
0.0
-50
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
19/28
XC9242/XC9243 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(18) CL Discharge Resistance vs. Ambient Temperature
(17) Soft-Start Time vs. Ambient Temperature
20/28
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50
XC9242B08C
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
CL Discharge Resistance: RDCHG (Ω)
Soft-Start Time: tSS (ms)
XC9242B08C
300
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
250
200
150
100
50
0
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
XC9242/XC9243
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(19) Load Transient Response
XC9242B08C
L=4.7μH(SLF7055),CIN1=20μF(LMK212ABJ106KGx2)
CIN2=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN = 5.0V, VOUT = 1.2V, IOUT = 1mA ⇒ 1.5Ａ
VIN = 5.0V, VOUT = 1.2V, IOUT = 1.5A ⇒ 1mＡ
VOUT : 200mV/div
VOUT : 100mV/div
ILx : 1.0A/div
ILx : 1.0A/div
x-axis : 10μs / div
x-axis : 10μs / div
XC9243B08C
L=4.7μH(SLF7055),CIN1=20μF(LMK212ABJ106KGx2)
CIN2=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN = 5.0V, VOUT = 1.2V, IOUT = 1mA ⇒ 1.5Ａ
VIN = 5.0V, VOUT = 1.2V, IOUT = 1.5A ⇒ 1mＡ
VOUT : 100mV/div
VOUT : 200mV/div
ILx : 1.0A/div
ILx : 1.0A/div
x-axis : 10μs / div
x-axis : 1ms / div
21/28
XC9242/XC9243 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(19) Load Transient Response
XC9242B08D
L=2.2μH(SLF7055),CIN1=20μF(LMK212ABJ106KGx2)
CIN2=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN = 5.0V, VOUT = 1.2V, IOUT = 1mA ⇒ 1.5Ａ
VIN = 5.0V, VOUT = 1.2V, IOUT = 1.5A ⇒ 1mＡ
VOUT : 100mV/div
VOUT : 200mV/div
ILx : 1.0A/div
ILx : 1.0A/div
x-axis : 10μs / div
x-axis : 10μs / div
XC9243B08D
L=2.2μH(SLF7055),CIN1=20μF(LMK212ABJ106KGx2)
CIN2=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN = 5.0V, VOUT = 1.2V, IOUT = 1mA ⇒ 1.5Ａ
VIN = 5.0V, VOUT = 1.2V, IOUT = 1.5A ⇒ 1mＡ
VOUT : 100mV/div
VOUT : 200mV/div
ILx : 1.0A/div
ILx : 1.0A/div
x-axis : 10μs / div
22/28
x-axis : 1ms / div
XC9242/XC9243
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(20) Frequency Response
Test Condition:
Measurement equipment:NF FRA5097 Version:3.00
OSC amplitude=20.0mVpeak OSC.Dcbias=0.00V
OSC waveform:SIN, Sweep minimum frequency=1Hz
Sweep maximum frequency=15MHz
Sweep resolution=300steps/sweep
Integration period=100cycle, Delay time=0cycle
Order of harmonic analysis=1, Measure mode:CH1&CH2
Auto integration:OFF, Amplitude compression:OFF
Slow sweep:OFF
XC9242B08CDR
L=4.7μH(SLF7055), CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN=5.0V, VCE=VIN, VOUT=1.2V, IOUT=1mA
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN=5.0V, VCE=VIN, VOUT=1.2V, IOUT=1000mA
23/28
XC9242/XC9243 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(20) Frequency Response (Continued)
Test Condition:
Measurement equipment:NF FRA5097 Version:3.00
OSC amplitude=20.0mVpeak OSC.Dcbias=0.00V
OSC waveform:SIN, Sweep minimum frequency=1Hz
Sweep maximum frequency=15MHz
Sweep resolution=300steps/sweep
Integration period=100cycle, Delay time=0cycle
Order of harmonic analysis=1, Measure mode:CH1&CH2
Auto integration:OFF, Amplitude compression:OFF
Slow sweep:OFF
XC9242B08DDR
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN=5.0V, VCE=VIN, VOUT=1.2V, IOUT=1mA
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN=5.0V, VCE=VIN, VOUT=1.2V, IOUT=1000mA
24/28
XC9242/XC9243
Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
OUTLINE / LAND PATTERN
THERMAL CHARACTERISTICS
SOP-8FD
SOP-8FD PKG
SOP-8FD Power Dissipation
USP-10B
USP-10B PKG
USP-10B Power Dissipation
25/28
XC9242/XC9243 Series
■MARKING RULE
●USP-10B
① represents product series
MARK
PRODUCT SERIES
2
9
B
XC9242******-G
8
C
XC9243******-G
3
4
5
① ② ③
10
④ ⑤ ⑥
1
7
6
② represents product function
MARK
FUNCTION
PRODUCT SERIES
B
CL High Speed Discharge
XC924*B*****-G
③ represents reference voltage
MARK
OUTPUT VOLTAGE (V)
PRODUCT SERIES
8
0.8
XC924*B08***-G
MARK
OSCILLATION FREQUENCY (MHz)
PRODUCT SERIES
C
1.2
XC924*B**C**-G
D
2.4
XC924*B**D**-G
④ represents oscillation frequency
⑤⑥ represents production lot number
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to AZ, B1 to ZZ repeated
(G, I, J, O, Q, W excluded)
*No character inversion used.
26/28
XC9242/XC9243
Series
■MARKING RULE (Continued)
●SOP-8FD
① represents product series
MARK
PRODUCT SERIES
B
XC9242******-G
C
XC9243******-G
② represents product function
MARK
FUNCTION
PRODUCT SERIES
B
CL High Speed Discharge
XC924*B*****-G
③ represents oscillation frequency
MARK
OSCILLATION FREQUENCY (MHz)
PRODUCT SERIES
C
1.2
XC924*B**C**-G
D
2.4
XC924*B**D**-G
④⑤ represents production lot number
01 to 09, 0A to 0Z, A1 to A9, AA to AZ, B1 to ZZ repeated
(G, I, J, O, Q, W excluded)
*No character inversion used.
27/28
XC9242/XC9243 Series
1.
The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2.
The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3.
Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4.
The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5.
Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6.
Our products are not designed to be Radiation-resistant.
7.
Please use the product listed in this datasheet within the specified ranges.
8.
We assume no responsibility for damage or loss due to abnormal use.
9.
All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
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