XC9246/XC9247 Series
ETR05024-006
16V Driver Transistor Built-In Step-Down DC/DC Converters
☆GreenOperation-compatible
■GENERAL DESCRIPTION
XC9246/XC9247 series is a 16V step-down DC/DC converter with a built-in driver transistor. The series provides high efficiency,
and a stable power supply with output currents up to 1A. The series is designed for use with small ceramic capacitors.
The series has a 1.0V reference voltage, and using externally connected resistors, the output voltage can be set freely. With an
internal switching frequency of 1.2MHz, small external components can be used. The soft-start time is internally set to 1.5ms (TYP.),
but can be adjusted to set a longer time using an external resistor and capacitor.
As for operation mode, the XC9246 series is PWM control and the XC9247 series is automatic PWM/PFM switching control.
In PWM/PFM switching control mode, provides fast response, low ripple and high efficiency over the full range of loads (from light
load to heavy load).
With the UVLO (Under Voltage Lock Out) function, the internal driver transistor is forced OFF when input voltage becomes lower
than detect voltage. The series includes current limit, thermal shutdown, and short-circuit protection.
Two types of package SOT-26W and USP-6C are available.
■APPLICATIONS
■FEATURES
Input Voltage
:
●BD/HDD recorders
Output Voltage Range
:
●Set top box
Output Current
:
Efficiency
Oscillation Frequency
Maximum Duty Cycle
Soft-start Time
:
:
:
:
Control Methods
:
Protection Circuits
:
UVLO
Output Capacitor
Operating Ambient Temperature
Packages
Environmentally Friendly
:
:
:
:
:
●Home video game consoles
●Multifunction printers
■TYPICAL APPLICATION CIRCUIT
4.5V～16V
(The VIN range depends on the product)
1.2V～5.6V (VFB=1.0V)
(The VOUT range depends on the product)
1A (VIN≧6V and VOUT/VIN≦50%)
1A (VIN＜6V and VOUT/VIN≦40%)
90%(VIN=12V, VOUT=5V, IOUT=200mA)
1.2MHz
80%
Internally fixed 1.5ms
Adjustable by RC
PWM Control (XC9246)
PWM/PFM Automatic switching control (XC9247)
Current limiter (Integral Latching)
Thermal shutdown
Short-circuit protection
4.15V, 5.65V, 7.65V
Ceramic Capacitor Compatible
-40℃～+85℃
USP-6C, SOT-26W
EU RoHS Compliant, Pb Free
■TYPICAL PERFORMANCE
CHARACTERISTICS
XC9246B75/XC9247B75 (VOUT=5.0V)
L=6.8μH(VLP4045LT-6R8M), SBD=XBS204S19R
CIN=10μF(TMK316BJ106KL), CL=10μF×2(LMK212ABJ106KG)
100
90
80
Efficiency :EFFI(%)
●LCD-TVs
70
60
50
40
30
XC9246@VIN=12V
20
XC9247@VIN=12V
10
0
1
10
100
1000
Output Current :IOUT(mA)
1/33
XC9246/XC9247 Series
■BLOCK DIAGRAM(*1) (*2) (*3)
(*1)
Diodes inside the circuit are an ESD protection diode and a parasitic diode.
The XC9246 offers a fixed PWM control, a Control Logic to PWM/PFM Selector is fixed internally.
(*3)
The XC9247 control scheme is a fixed PWM/PFM automatic switching, a Control Logic to PWM/PFM Selector is fixed internally.
(*2)
■PRODUCT CLASSIFICATION
●Ordering Information
XC9246B①②③④⑤-⑥ PWM Control
XC9247B①②③④⑤-⑥ PWM/PFM Automatic switching control
DESIGNATOR
Oscillation Frequency
③
(*1)
SYMBOL
UVLO Release Voltage
①②
④⑤-⑥
ITEM
(*1)
DESCRIPTION
42
4.15V (1.2V≦VOUT≦2.7V)
65
5.65V (1.2V≦VOUT≦3.8V)
75
7.65V
(XC9246: 1.5V≦VOUT≦5.0V)
(XC9247: 1.5V≦VOUT≦5.6V)
C
1.2MHz
ER-G
USP-6C (3,000pcs/Reel)
MR-G
SOT-26W (3,000pcs/Reel)
Packages (Order Unit)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
●Selection Guide
TYPE
EN/SS
CURRENT LIMIT
LATCH
UVLO
THERMAL
SHUTDOWN
B
Yes
Yes
Yes
Yes
Yes
2/33
XC9246/XC9247
Series
■PIN CONFIGURATION
(*1)
The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance
mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the GND (No. 5) pin.
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
6
BST
Pre Driver Supply
2
5
GND
Ground
3
4
FB
Output Voltage Monitor
4
3
EN/SS
Enable Soft-start
5
2
VIN
Power Input
6
1
Lx
Switching Output
SOT-26W
USP-6C
1
■FUNCTION
PIN NAME
EN/SS(*1)
(*1)
SIGNAL
STATUS
L
Stand-by
H
Active
Please do not leave the EN/SS pin open.
3/33
XC9246/XC9247 Series
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
VIN Pin Voltage
VIN
-0.3～+22.0
V
BST Pin Voltage
VBST
-0.3～+22.0
and
Lx-0.3～Lx+6.0
V
FB Pin Voltage
VFB
-0.3～+6.0
V
EN/SS Pin Voltage
VEN/SS
-0.3～+22.0
V
Lx Pin Voltage
VLX
-0.3～VIN+0.3 or VBST+0.3 or 22.0 (*1)
V
Lx Pin Current
ILX
4000
mA
250
SOT-26W
Power Dissipation
600 (40mm x 40mm standard board) (*2)
Pd
USP-6C
120
1000 (40mm x 40mm standard board)
mW
(*2)
1250 (JEDEC board) (*2)
Operating Ambient Temperature
Topr
-40～+85
℃
Storage Temperature
Tstg
-55～+125
℃
All voltages are described based on the AGND and PGND pin.
(*1)
The maximum value is the lowest one among VIN+0.3V, VBST + 0.3V or +22V.
(*2)
The power dissipation figure shown is PCB mounted and is for reference only.
Please see the power dissipation page for the mounting condition
4/33
XC9246/XC9247
Series
■ELECTRICAL CHARACTERISTICS
Ta=25℃
XC9246/XC9247 Series
PARAMETER
SYMBOL
FB Voltage
VFB
Operating Voltage Range
VIN
Maximum Output Current
IOUTMAX
UVLO Detection Voltage
VUVLOD
UVLO Release Voltage
VUVLOR
UVLO Hysteresis Voltage
VUVLOHYS
CONDITIONS
MIN.
VIN=12V, VEN/SS=5V, VFB=0.9V→1.1V
Voltage to start oscillation while
-
1000
VEN/SS=5V, VFB=0.9V
Voltage which Lx pin holding ”L” level (*6)
VEN/SS=5V, VFB=0.9V
Voltage to start oscillation while
-
TYP.
UNITS
CIRCUIT
D1 (*1)
V
②
D2 (*1)
V
①
mA
①
D3 (*1)
V
②
D4 (*1)
V
②
D5 (*1)
V
-
-
MAX.
-
Supply Current
Iq
VIN=12V, VEN/SS=5V, VFB=1.1V
-
150
300
μA
③
Stand-by Current
ISTB
VIN=16V, VEN/SS=0V
-
6
15
μA
③
Oscillation Frequency
fOSC
VIN=12V, VEN/SS=5V, VFB=0.9V
1020
1200
1380
kHz
②
Maximum Duty Cycle
DMAX
VIN=12V, VEN/SS=5V, VFB=0.9V
72
80
88
%
②
Minimum Duty Cycle
DMIN
VIN=12V, VEN/SS=5V, VFB=1.1V
-
-
0
%
②
PFM Switch Current (*2)
IPFM
-
300
-
mA
①
PFM Duty Limit (*2)
DTYLIMIT_PFM
-
200
-
%
①
VIN=12V, VEN/SS=5V, VOUT=3.3V, IOUT=10mA
When connected to external components
-
0.35
(*4)
0.5
(*4)
Lx SW ON Resistance
RLx
VIN=12V, VEN/SS=5V, VFB=0.9V
-
Ω
-
Current Limit (*5)
ILIM
VIN=12V, VEN/SS=5V, VFB=0.9V
1600
2500
-
mA
②
Integral Latch Time
tLAT
VIN=12V, VEN/SS=5V, VFB=0.9V
0.75
1.5
3
ms
②
Short Detect Voltage
VSHORT
0.3
0.5
0.7
V
④
0.75
1.5
3
ms
②
18
26
35
ms
⑤
-
90
-
%
①
-
±100
-
ppm/℃
①
Sweeping VFB, VIN=12V, VEN/SS=5V,
Short VOUT at1ΩResistance, VFB voltage which
Lx becomes “L” level within 300μs
Internal Soft-start Time
tSS1
VIN=12V, VEN/SS=0V→5V,VFB=0.9V
VIN=12V, VEN/SS=0V→5V, VFB=0.9V
External Soft-start Time
tSS2
RSS=120KΩ, CSS=0.47μF
When connected to external components
Efficiency
EFFI
Output Voltage
∆VOUT/
Temperature Characteristics
(VOUT・∆Topr）
Thermal Shutdown
Temperature
Hysteresis Width
Target Output Voltage=5.0V
VIN=12V, IOUT=200mA (*3)
IOUT=100mA
-40℃≦Topr≦85℃
TTSD
-
-
150
-
℃
-
THYS
-
-
20
-
℃
-
-
2.0
2.5
V
②
0.4
-
-
V
②
VIN=12V, VFB=VFB(E)-10mV (*7),
EN/SS "H" Voltage
VEN/SSH
EN/SS "L" Voltage
VEN/SSL
EN/SS "H" Current
IEN/SSH
VIN=VEN/SS=16V
-
7
15
μA
⑥
EN/SS "L" Current
IEN/SSL
VIN=12V, VEN/SS=0V
-0.1
-
0.1
μA
⑥
FB "H" Current
IFBH
VIN=12V, VEN/SS=0V, VFB=5.5V
-0.1
-
0.1
μA
⑥
FB "L" Current
IFBL
VIN=12V, VEN/SS=0V, VFB=0V
-0.1
-
0.1
μA
⑥
Lx "L" Current
ILXL
VIN=16V, VEN/SS=5V, VFB=1.1V, VLX=0V
-7.5
-4
-
μA
⑦
VEN/SS=5V→1V, Voltage to stop oscillation while
VIN=12V, VFB=0V
VEN/SS=5V→0V, Voltage to stop oscillation while
Unless otherwise stated, VIN=12V, VEN/SS=5V
(*1)
Please refer to SPEC Table below.
(*2)
As the XC9246 series work in the PWM control operation only, IPFM and DTYLIMIT_PFM are not for XC9246 series.
(*3)
EFFI=[(output voltage x output current)÷(input voltage x input current)]×100
(*4)
Design value
(*5)
Current limit denotes the level of detection at peak of coil current.
(*6)
"H"=VIN～VIN-1.2V , "L"=+0.1V～-0.1V
(*7)
VFB(E) is effective value of FB voltage.
5/33
XC9246/XC9247 Series
■ELECTRICAL CHARACTERISTICS (Continued)
SPEC Table
No.
PARAMETER
SOT-26W
SYNBOL
D1
FB Voltage
VFB
No.
PARAMETER
SYNBOL
USP-6C
UNITS
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
0.985
1.000
1.015
0.98
1.00
1.02
XC9246B42/XC9247B42
XC9246B65/XC9247B65
XC9246B75/XC9247B75
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
V
UNITS
D2
Operating Voltage Range
VIN
4.5
-
16.0
6.0
-
16.0
8.0
-
16.0
V
D3
UVLO Detection Voltage
VUVLOD
3.7
4.0
-
4.8
5.5
-
6.9
7.4
-
V
D4
UVLO Release Voltage
VUVLOR
-
4.15
4.48
-
5.65
5.98
-
7.65
7.98
V
D5
UVLO Hysteresis Voltage
VUVLOHYS
-
0.12
-
-
0.15
-
-
0.25
-
V
6/33
XC9246/XC9247
Series
■TEST CIRCUITS
Waveform check point
VIN
BST
＊External components
CIN :10μF(ceramic)
CL:22μF(ceramic)
CL:47μF(ceramic)(*1)
CBS T:0.22μF(ceramic)
L:4.7μH
SBD:XBS204S19R-G
( *1) Output Voltage Temperature Characteristics
CBS T
L
EN/SS
LX
SBD
RFB1
CFB
CL
CIN
FB
GN D
RFB2
Target Output Voltage=3.3V
RFB1:62kΩ
RFB2:27kΩ
CFB:130pF
Target Output Voltage=5.0V
RFB1:30kΩ
RFB2:7.5kΩ
CFB:270pF
CBS T
VIN
Waveform check point
BST
L
EN/SS
＊External components
CIN :10μF(ceramic)
CL:22μF(ceramic)
CBS T:0.22μF(ceramic)
L:4.7μH
SBD:XBS204S19R-G
LX
SBD
CIN
CL
FB
GN D
A
VIN
EN/SS
0.22μF
BST
LX
1μF
FB
GN D
Waveform check point
VIN
CBS T
BST
L
EN/SS
LX
SBD
CL
CIN
FB
GN D
＊External components
CIN :10μF(ceramic)
CL:22μF(ceramic)
CBS T:0.22μF(ceramic)
L:4.7μH
SBD:XBS204S19R-G
7/33
XC9246/XC9247 Series
■TEST CIRCUITS (Continued)
Waveform check point
VIN
CBS T
BST
L
EN/SS
LX
SBD
CIN
CL
RSS
FB
GN D
CSS
VIN
EN/SS
A
BST
LX
1μF
FB
GN D
A
VIN
EN/SS
BST
LX
1μF
FB
8/33
GN D
A
＊External components
CIN :10μF(ceramic)
CL:22μF(ceramic)
CBS T:0.22μF(ceramic)
L:4.7μH
SBD:XBS204S19R-G
RSS :120kΩ
CSS :0.47μF
XC9246/XC9247
Series
■TYPICAL APPLICATION CIRCUIT
【Typical Examples】
L
SBD
(*1)
CIN
CL
MANUFACTURER
PRODUCT NUMBER
VALUE
Coilcraft
XFL4020-332MEB
3.3μH
Coilcraft
XFL4020-472MEB
4.7μH
TDK
VLP4045LT-4R7M
4.7μH
TDK
VLP4045LT-6R8M
6.8μH
TOREX
XBS204S19R
VF=0.42V(1A)
TOREX
XBS203V19R
VF=0.305V(1A)
SHINDENGEN
D1FJ4
VF=0.48V(1A)
VISHAY
SS2P3L
VF=0.45V(2A)
TOSHIBA
CMS17
VF=0.42V(1A)
TDK
C2012X5R1E106K
10μF/25V
TAIYO YUDEN
TMK316BJ106KL
10μF/25V
TDK
C2012X5R1A106K
10μF/10V 2parallel
TAIYO YUDEN
LMK212ABJ106KG
10μF/10V 2parallel
CBST
(*1) The
0.22μF/10V
Inter-Terminal Capacitance of the schottky barrier diode should be around 180pF.
Ct Test Conditions: f=1MHz, VR=1V
【Recommended L Value and VOUT Range】
VOUT
Recommended L Value (*1)
1.2V≦VOUT≦3.5V
3.3μH
4.7μH
3.5V＜VOUT≦4.0V
-
4.7μH
4.0V＜VOUT≦5.6V
-
6.8μH
(*1) For
the coil value (L), use a component with 20% accuracy or less.
9/33
XC9246/XC9247 Series
■TYPICAL APPLICATION CIRCUIT (Continued)
The output voltage can be set by connecting external dividing resistors. The output voltage is determined by the values of RFB1
and RFB2 as given in the equation below. The total of RFB1 and RFB2 should be less than 100kΩ or less. Output voltage range
can be set freely from 1.2V to 5.6V with a 1.0V reference voltage. (The step down ratio is determined based on the version. Refer
to the “Output voltage range classified by product” graph below.) However, it should be noted that the output voltage can not be
stable when VIN=16V and VOUT=1.2V so please set the step down ration under the condition of VOUT/VIN x 100≧18%
VOUT=1.0× (RFB1+RFB2)/RFB2
Adjust the value of the phase compensation speed-up capacitor CFB so that fzfp=1 / (2 × π× CFB x RFB1) is about 20kHz.
Adjustments are required from 10kHz to 50kHz depending on the application, value of inductance (L), and value of load
capacitance (CL).
【Examples】
When RFB1=30kΩ and RFB2=7.5kΩ, VOUT=1.0× (30kΩ+7.5kΩ) / 7.5kΩ =5V
When CFB=270pF, fzfb= 1/ (2×π×270pF×30kΩ) =19.65 kHz
【Typical Examples】
VOUT (V)
RFB1(kΩ)
RFB2(kΩ)
CFB(pF)
VOUT(V)
RFB1(kΩ)
RFB2(kΩ)
CFB(pF)
1.2
15
75
510
2.5
36
24
220
1.5
18
36
430
3.0
36
18
220
1.8
24
30
330
3.3
62
27
130
2.0
47
47
160
5.0
30
7.5
270
10/33
XC9246/XC9247
Series
■TYPICAL APPLICATION CIRCUIT (Continued)
0.22μF is recommended for the CBST capacitance when CL=22μF. Do not fix it at CBST=0.22μF for all conditions but rather change
it depending on the CL capacitance (*1).
As a guideline, make it about CL: CBST=100:1.
(*1)
Think of the CL capacitance as the total capacitance connected to the VOUT of XC9246/XC9247.
【CBST Optimum Settings】
CL(μF)
CBST(μF)
CL≦22
0.22
22＜CL≦47
0.47
47＜CL≦100
1
100＜CL≦220
2.2
The Vref voltage applied to the error amplifier is restricted by the start-up voltage of the EN/SS pin. This ensures that the error
amplifier operates with its two inputs in balance, thereby preventing ON-time signal from becoming longer than necessary.
Therefore, start-up time of the EN/ESS pin becomes the set-time of soft-start. The soft-start time can be adjusted by adding a
capacitor and a resistor to the EN/SS pin. If the EN/SS pin voltage rises steeply without connecting CSS and RSS (RSS=0Ω),
Output rises with taking the soft-start time of 1.5ms (TYP.) which is fixed internally. The soft-start function operates when the
voltage at the EN/SS pin is between 0.4V to 2.5V. If the voltage at the EN/SS pin does not start from 0V but from a mid level
voltage when the power is switched on, the soft-start function will become ineffective and the possibilities of large inrush
currents and ripple voltages occurring will be increased. Soft-start time is approximated by the equation below according to values of
VEN, RSS, and CSS.
tss=- Css × Rss × In { (VEN/SS– 2) / VEN/SS }
Example: When Css=0.47μF, Rss=120kΩ and VEN/SS=5V, tSS=-0.47x10-6 x 120x103 x In ((5-2)/5) =29ms (Approx.)
* When RSS=0Ω and CSS=0F, the soft-start time is 1.5ms (TYP.) and it’s set internally.
11/33
XC9246/XC9247 Series
■OPERATIONAL EXPLANATION
The XC9246/XC9247 series consists of a reference voltage source (Vref), an internal reference voltage source (VL), ramp wave
circuit, error amplifier, PWM comparator, phase compensation circuit, N-ch MOS driver transistor, current limiter circuit, short
protection circuit, UVLO circuit, thermal shutdown circuit, over voltage protection, load disconnect control and others. (See the
BLOCK DIAGRAM below.)
By using the error amplifier, the FB pin voltage is compared with the reference voltage. The error amplifier output is sent to the
PWM comparator in order to determine the duty cycle of PWM switching. The signal from the error amplifier is compared with
the ramp wave from the ramp wave circuit, and the resulting output is delivered to the buffer driver circuit to provide on-time of
the duty cycle at the LX pin. This process is continuously performed to ensure stable output voltage.
The current feedback circuit monitors the N-ch MOS driver transistor current for each switching operation, and modulates the
error amplifier output signal to provide multiple feedback signals. This enables a stable feedback loop even when using a low
ESR capacitor such as ceramic, which results in ensuring stable output voltage.
The reference voltage source (Vref voltage) provides the reference voltage to ensure stable output voltage of the DC/DC
converter.
The ramp wave circuit determines switching frequency. The frequency is fixed 1.2MHz internally. Clock pulses generated in this
circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits.
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage.
When a voltage lower than the reference voltage is fed back, the output voltage of the error amplifier increases. The gain and
frequency characteristics of the error amplifier output are fixed internally to deliver an optimized signal to the mixer. The error
amplifier output signal optimized in the mixer is modulated with the current feedback signal. This signal is delivered to the PWM
comparator.
12/33
XC9246/XC9247
Series
■OPERATIONAL EXPLANATION (Continued)
The current limit circuit monitors the current flowing through the N-ch MOS driver transistor, and features a combination of
the current limit mode and the operation suspension mode.
① When the driver current is greater than a specific level, the current limit operates to turn off the pulses from the LX pin at
any given timing.
② When the N-ch MOS driver transistor is turned off, the limiter circuit is then released from the current limit detection state.
③ At the next pulse, the N-ch MOS driver transistor is turned on. However, the N-ch MOS transistor is immediately turned off
in the case of an over current state.
④ When the over current state is eliminated, the IC resumes its normal operation.
As ① to ③ are repeated and an over-current state continues for about 20μs, the off period of the N-ch MOS driver Tr.will
be longer to prevent from DC overlapping of the coil current. The over-current state continues for several ms. and as ① to ③
are repeated, the off state of the N-ch MOS driver will be latched and IC will be stopped. Once IC is in the state, operation can
be resumed by feeding H-level to EN/SS pin after L-level is fed to the pin, or by turning the VIN power off and turning it on
again. Under the function-stop state, clock is stopped, however it is not the shutdown state. So the internal circuitries operate.
The current limiting value is 2500mA typically.
The latch time may be longer than spec., or the latch situation may not happen in spite of the over-current condition due to
the ambient noise or the allocation of external components on PCB. Putting the input capacitor to IC as close as possible is
recommended.
For protection against heat damage of the ICs, thermal shutdown function monitors chip temperature. The thermal shutdown
circuit starts operating and the N-ch MOS driver transistor will be turned off when the chip’s temperature reaches 150℃. When
the temperature drops to 130℃ or less after shutting of the current flow, the IC performs the soft-start function to initiate output
startup operation.
When the VIN voltage becomes 4.0V (XC9246B42 / XC9247B42) either 5.5V (9246B65 / XC9247B65) and 7.4V (9246B75 /
XC9247B75) or lower, the N-ch MOS driver transistor is forced OFF to prevent false pulse output caused by unstable operation
of the internal circuitry. When the VIN voltage becomes 4.15V (TYP.) either 5.65V (TYP.) and 7.65V (TYP.) or higher, switching
operation takes place. By releasing the UVLO function, the IC performs the soft-start function to initiate output startup operation.
The soft-start function operates even when the VIN voltage falls momentarily below the UVLO detect voltage. The UVLO circuit
does not cause a complete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry
remains in operation.
An N-ch MOS driver transistor is used in the high side driver, so a voltage higher than the VIN voltage is required in order to
turned the driver on. Therefore, the boot strap method is used to generate a voltage that is higher than the VIN voltage. The
boot strap method is connecting the CBST capacitor between the BST-LX to cause the VLx to be lower than the VL (VL voltage =
4V), which is the internal power supply, so that the VL charges the CBST. Charging the CBST requires more than a certain time
when VLX is 0V or less. If the load current is below several mA, sufficient time to charge the CBST cannot be obtained, so
oscillation might stop, but the product compulsorily increases the load current to provide stable operation even at light loads.
13/33
XC9246/XC9247 Series
■OPERATIONAL EXPLANATION (Continued)
VOUT voltage is observed with the voltage at FB pin (hence FB voltage) and the voltage is produced by RFB1 and RFB2 which
are connected between VOUT and GND. And in the event that VOUT is shorted to GND accidentally, the FB voltage drops to one
half of the reference voltage or less, and if a current which is greater than ILIM flows to the driver, the short-circuit protection is
activated instantaneously and turns off the driver and the driver latches. Once IC is in the latch state, operation can be resumed
by feeding H-level to EN/SS pin after L-level is fed to the pin, or by turning the VIN power off and turning it on again. In this
case, VIN should go down to lower voltage than UVLO detect voltage, and after that VIN should go up to higher voltage than
UVLO release voltage.
(*1)
In PFM control operation, until coil current reaches to a specified level (IPFM), the IC keeps the N-ch MOS driver transistor on.
In this case, time that the N-ch MOS driver transistor is kept on (tON) can be given by the following formula. →IPFM①
tON = L × IPFM / (VIN - VOUT)
< PFM Duty Limit > (*1)
In the PFM control operation, the PFM Duty Limit (DTYLIMIT_PFM) is set to 200% (TYP.). Therefore, under the condition that
the duty increases (e.g. the condition that the step-down ratio is small), it’s possible for N-ch MOS driver transistor to be turned
off even when coil current does not reach to IPFM. →IPFM②
(*1)
XC9246 series excluded.
14/33
XC9246/XC9247
Series
■NOTE ON USE
1.
For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or
deteriorated if IC is used beyond the absolute MAX. Specifications.
2.
Make sure that the absolute maximum ratings of the external components and of this IC are not exceeded.
3. The DC/DC converter characteristics depend greatly on the externally connected components as well as on the characteristics
of this IC, so refer to the specifications and standard circuit examples of each component when carefully considering which
components to select. Be especially careful of the capacitor characteristics and use B characteristics (JIS standard) or X7R,
X5R (EIA standard) ceramic capacitors.
4. If there is a large dropout voltage, then a stable output voltage will not always be supplied under all conditions.
Please use it under the condition of VOUT/VIN×100≧18%. The operation might become unstable if used under 18%.
5. If there is a large dropout voltage, then there might be pulse-skip during light loads even with PWM control.
6. The DC/DC converter of this IC uses a current-limiting circuit to monitor the coil peak current. If the potential dropout voltage
is large or the load current is large, the peak current will increase, which makes it easier for current limitation to be applied
which in turn could cause the operation to become unstable. When the peak current becomes large, adjust the coil inductance
and sufficiently check the operation. The following formula is used to show the peak current.
Peak Current: Ipk = (VIN – VOUT) × OnDuty / (2 × L × fOSC) + IOUT
L: Coil Inductance
fOSC: Oscillation Frequency
7.
If an over-current (peak current) that exceeds the current limitation flows for a set time, N-ch MOS driver transistor is
turned off (integral latch circuit). The current limited portion of the current will flow during the time from when the over-current
is detected until N-ch MOS driver transistor is turned off, so be careful about the coil ratings.
8.
If there is a large dropout voltage, a circuit delay could create the ramp-up of coil current with staircase waveform exceeding
the current limit.
9. When the over-current state continues for 20μs, the driver off time is lengthened to prevent superimposing of the coil current.
The lengthened driver off time causes the VOUT to lower and thus triggering the short circuit protection without waiting for the
integral latch time.
10. If a steep load change occurs, the voltage drop of the VOUT voltage is directly transmitted to the FB via the CFB, so the short
circuit protection is triggered when the voltage is more than half the VOUT voltage.
11. The ripple current might rise during light loads. This is done to charge the CBST to ensure normal operation. Although it
depends on the input and output conditions, this can be improved by pulling a load of several mA.
12.
When using CL=22μF or above, also correspondingly increase the CBST capacitance. When not using the specified
capacitance, the oscillation stops and the output voltage may become unstable.
【CBST Optimum Settings】
CL(μF)
CBST(μF)
CL≦22
0.22
22＜CL≦47
0.47
47＜CL≦100
1.0
100＜CL≦220
2.2
15/33
XC9246/XC9247 Series
■NOTE ON USE (Continued)
13. When the voltage difference between input and output is small and the load is light, the voltage between the BST-LX will
lower and prevent driver on/off control, which could cause oscillation to stop and the output voltage to become unstable.
Use the specified input-output voltage range and set to the recommended coil inductance each.
Also use about 180pF for the capacitance between SBD terminals. Using a large capacitance between terminals could
cause oscillation stop.
【Recommended L Value and VOUT Range】
VOUT
Recommended L Value
1.2V≦VOUT≦3.5V
3.3μH
4.7μH
3.5V＜VOUT≦4.0V
-
4.7μH
4.0V＜VOUT≦5.6V
-
6.8μH
14. When the input voltage is high and the load is light, the VOUT could rise above the set voltage. Use the recommended coil
inductance specified for each set voltage. Also please use the SBD which has inter-terminal capacitance of approx. 180pF.
The over voltage situation may be caused at the output if the SBD with smaller inter-terminal capacitance than 180pF is
used.
15. When using the EN/SS pin to switch between enable status and disable status, switch to the enable status after the VOUT
voltage has become 1V or less. When switching to enable status when the VOUT is over 1V, sufficient voltage will not be
applied between the BST-LX, which could cause oscillation stop and the output voltage to become unstable.
16. If the voltage at the EN/SS Pin does not start from 0V but it is at the midpoint potential when the power is switched on, the
soft start function may not work properly and it may cause the larger inrush current and bigger ripple voltages.
17.
When using at an ambient temperature of -30ºC or less, use CL=47μF or higher. Abnormal oscillation may occur at CL=22μF.
18. The ripple voltage could be increased when switching from discontinuous conduction mode to Continuous conduction mode.
19. For the XC9246B42 and XC9247B42, when the IC is operated under VIN=5.0V, the efficiency may get lower significantly in
the discontinuous conduction mode.
20. There is the possibility to get the ripple voltage larger in case the peak current is unstable at the light current load in PFM
control operation.
21. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their
systems.
16/33
XC9246/XC9247
Series
■NOTE ON USE (Continued)
The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high,
please place the input capacitor(CIN) and the output capacitor (CL) as close to the IC as possible.
●Instructions of pattern layouts
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the
VIN and GND pins.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
(4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents at
the time of switching may result in instability of the IC.
(5) Please note that internal driver transistors bring on heat because of the load current and ON resistance of the N-ch MOS driver
transistors.
17/33
XC9246/XC9247 Series
■NOTE ON USE (Continued)
PCB mounted (SOT-26W)
PCB mounted (USP-6C)
0
0
0
0
0
0
18/33
XC9246/XC9247
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output current
XC9246B42/XC9247B42 (VOUT=1.8V)
XC9246B65/XC9247B65 (VOUT=3.3V)
L=4.7μH(VLP4045LT-4R7M), SBD=XBS204S19R
CIN =10μF(TMK316BJ106KL), CL =10μF×2(LMK212ABJ106KG)
100
100
90
90
80
80
Efficiency :EFFI(%)
Efficiency :EFFI(%)
L=4.7μH(VLP4045LT-4R7M), SBD=XBS204S19R
CIN =10μF(TMK316BJ106KL), CL=10μF×2(LMK212ABJ106KG)
70
60
50
40
30
70
60
50
40
30
20
XC9246@VIN=5V
20
XC9246@VIN=7.4V
10
XC9247@VIN=5V
10
XC9247@VIN=7.4V
0
0
1
10
100
1000
1
Output Current :IOUT(mA)
1000
XC9246B75/XC9247B75 (VOUT=5.0V)
L=6.8μH(VLP4045LT-6R8M), SBD=XBS204S19R
CIN =10μF(TMK316BJ106KL), C L=10μF×2(LMK212ABJ106KG)
L=4.7μH(VLP4045LT-4R7M), SBD=XBS204S19R
CIN =10μF(TMK316BJ106KL), CL =10μF×2(LMK212ABJ106KG)
100
100
90
90
80
80
Efficiency :EFFI(%)
Efficiency :EFFI(%)
100
Output Current :IOUT(mA)
XC9246B75/XC9247B75 (VOUT=3.3V)
70
60
50
40
30
XC9246@VIN=12V
20
10
70
60
50
40
30
XC9246@VIN=12V
20
XC9247@VIN=12V
XC9247@VIN=12V
10
10
0
0
1
10
100
1
1000
Output Current :IOUT(mA)
10
100
1000
Output Current :IOUT(mA)
(2) Output Voltage vs. Output Current
XC9246B42/XC9247B42 (VOUT=1.8V)
XC9246B65/XC9247B65 (VOUT=3.3V)
L=4.7μH(VLP4045LT-4R7M), SBD=XBS204S19R
CIN =10μF(TMK316BJ106KL), CL=10μF×2(LMK212ABJ106KG)
2.00
3.50
1.95
3.45
Output Voltage : VOUT(V)
Output Voltage : VOUT(V)
L=4.7μH(VLP4045LT-4R7M), SBD=XBS204S19R
CIN =10μF(TMK316BJ106KL), CL =10μF×2(LMK212ABJ106KG)
1.90
XC9247
1.85
1.80
1.75
XC9246
1.70
XC9246@VIN=5V
1.65
3.40
XC9247
3.35
3.30
3.25
XC9246
3.20
XC9246@VIN=7.4V
3.15
XC9247@VIN=7.4V
XC9247@VIN=5V
3.10
1.60
1
10
100
Output Current :IOUT(mA)
1000
1
10
100
1000
Output Current :IOUT(mA)
19/33
XC9246/XC9247 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Output Voltage vs. Output Current (Continued)
XC9246B75/XC9247B75 (VOUT=3.3V)
XC9246B75/XC9247B75 (VOUT=5.0V)
L=6.8μH(VLP4045LT-6R8M), SBD=XBS204S19R
C IN =10μF(TMK316BJ106KL), C L=10μF×2(LMK212ABJ106KG)
3.50
5.20
3.45
5.15
Output Voltage : VOUT(V)
Output Voltage : VOUT(V)
L=4.7μH(VLP4045LT-4R7M), SBD=XBS204S19R
C IN =10μF(TMK316BJ106KL), C L=10μF×2(LMK212ABJ106KG)
3.40
XC9247
3.35
3.30
3.25
XC9246
3.20
XC9247
5.05
5.00
4.95
XC9246
4.90
XC9246@VIN=12V
XC9246@VIN=12V
3.15
5.10
4.85
XC9247@VIN=12V
XC9247@VIN=12V
3.10
4.80
1
10
100
1000
1
10
Output Current :IOUT(mA)
100
1000
Output Current :IOUT(mA)
(3) Ripple Voltage vs. Output Current
XC9246B42/XC9247B42 (VOUT=1.8V)
XC9246B75/XC9247B75 (VOUT=3.3V)
L=4.7μH(VLP4045LT-4R7M), SBD=XBS204S19R
CIN =10μF(TMK316BJ106KL), C L=10μF×2(LMK212ABJ106KG)
L=4.7μH(VLP4045LT-4R7M), SBD=XBS204S19R
CIN =10μF(TMK316BJ106KL), CL=10μF×2(LMK212ABJ106KG)
80
80
XC9246@VIN=5V
XC9246@VIN=12V
XC9247@VIN=12V
Ripple Voltage :Vr(mV)
Ripple Voltage :Vr(mV)
XC9247@VIN=5V
60
40
20
0
60
40
20
0
0.1
1
10
100
0.1
1000
1
Output Current :IOUT(mA)
10
100
1000
Output Current :I OUT(mA)
(3) Ripple Voltage vs. Output Current
(4) FB Voltage vs. Ambient Temperature
XC9246B75/XC9247B75 (VOUT=5.0V)
XC9246B/XC9247B
L=6.8μH(VLP4045LT-6R8M), SBD=XBS204S19R
CIN =10μF(TMK316BJ106KL), CL=10μF×2(LMK212ABJ106KG)
1.020
80
XC9246@VIN=12V
1.015
60
FB Voltage :VFB(V)
Ripple Voltage :Vr(mV)
XC9247@VIN=12V
40
20
1.010
1.005
1.000
0.995
0.990
VIN=4.5V
0.985
VIN=12V
VIN=16V
0.980
0
0.1
1
10
100
Output Current :IOUT(mA)
20/33
1000
-50
-25
0
25
50
Ambient Temperature :Ta(℃)
75
100
XC9246/XC9247
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(5) UVLO Voltage vs. Ambient Temperature
XC9246B65/XC9247B65
4.9
6.2
4.7
6.0
UVLO Voltage :VUVLO(V)
UVLO Voltage :VUVLO (V)
XC9246B42/XC9247B42
4.5
4.3
4.1
3.9
Release
3.7
5.8
5.6
5.4
5.2
Relea se
5.0
Detection
Detection
3.5
4.8
-50
-25
0
25
50
75
100
-50
-25
Ambient Temperature :Ta(℃)
0
25
50
75
100
Ambient Temperature :Ta(℃)
(6) Oscillation Frequency vs. Ambient Temperature
XC9246B75/XC9247B75
XC9246B
1420
Oscillation Frequency :fosc(kHz)
8.2
UVLO Voltage :VUVLO(V)
8.0
7.8
7.6
7.4
7.2
Release
7.0
Detection
1320
1220
VIN=4.5V
1120
VIN=12V
VIN=16V
1020
6.8
-50
-25
0
25
50
75
-50
100
-25
0
25
50
75
100
75
100
Ambient Temperature :Ta(℃)
Ambient Temperature :Ta(℃)
(7) Supply Current vs. Ambient Temperature
(8) Stand-by Current vs. Ambient Temperature
XC9246B/XC9247B
XC9246B/XC9247B
300
16
Stand-by Current :ISTB(uA)
VIN=4.5V
Supply Current :Iq(uA)
250
200
150
100
VIN=4.5V
50
VIN=12V
14
VIN=16V
12
10
8
6
4
2
VIN=16V
0
0
-50
-25
0
25
50
Ambient Temperature :Ta(℃)
75
100
-50
-25
0
25
50
Ambient Temperature :Ta(℃)
21/33
XC9246/XC9247 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(9) PFM Switch Current vs. Output current
XC9247B (VOUT=3.3V)
XC9247B (VOUT=5.0V)
L=4.7μH(VLP4045LT-4R7M), SBD=XBS204S19R
C IN =10μF(TMK316BJ106KL), C L=10μF×2(LMK212ABJ106KG)
L=6.8μH(VLP4045LT-6R8M), SBD=XBS204S19R
CIN =10μF(TMK316BJ106KL), CL=10μF×2(LMK212ABJ106KG)
1000
1000
VIN=8.0V
VIN=12V
PFM Switch Current :IPFM(mA)
PFM Switch Current :IPFM(mA)
VIN=7.0V
VIN=16V
800
600
400
200
800
600
400
200
0
0
0
5
10
15
20
25
0
30
5
10
Output current :IOUT(mA)
20
30
75
100
XC9246B/XC9247B
-1
Lx "L" Current :ILXL(uA)
0.5
0.4
0.3
0.2
-2
-3
-4
-5
-6
-7
0.1
-8
-50
-25
0
25
50
75
-50
100
Ambient Temperature :Ta(℃)
-25
0
25
50
Ambient Temperature :Ta(℃)
(12) Current Limit vs. Ambient Temperature
(13) FB Voltage vs. EN/SS Voltage
XC9246B/XC9247B
XC9246B/XC9247B
1.2
3500
1.0
FB Voltage :VFB(V)
4000
3000
2500
2000
0.8
0.6
0.4
Ta=-40℃
VIN=4.5V
1500
0.2
VIN=5.5V
Ta=25℃
Ta=85℃
VIN=16V
1000
0.0
-50
-25
0
25
50
Ambient Temperature :Ta(℃)
22/33
25
(11) Lx "L" Current vs. Ambient Temperature
XC9246B/XC9247B
Lx SW ON Resistance :RLX(Ω)
15
Output current :IOUT(mA)
(10) Lx SW ON Resistance vs. Ambient Temperature
Current Limit :ILIM(mA)
VIN=12V
VIN=16V
75
100
0
1
2
3
EN/SS Voltage :VEN/SS(V)
4
5
XC9246/XC9247
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(14) Internal Soft-Start Time vs. Ambient Temperature
(15) External Soft-Start Time vs. Ambient Temperature
XC9246B/XC9247B (VOUT=5.0V)
XC9246B/XC9247B (VOUT=5V)
3.0
40
VIN=8.0V
External Soft-Start Time
:tSS2(mA)
Internal Soft-Start Time
:tSS1(ms)
VIN=8.0V
VIN=12V
2.5
VIN=16V
2.0
VIN=16V,12V,8V
1.5
1.0
0.5
VIN=12V
35
VIN=16V
30
VIN=16V,12V,8V
25
20
15
-50
-25
0
25
50
75
Ambient Temperature :Ta(℃)
100
-50
-25
0
25
50
75
100
Ambient Temperature :Ta(℃)
23/33
XC9246/XC9247 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(16) Load Transient Response
XC9246B
XC9246B
VIN =12V, V OUT =3.3V, I OUT =10mA →200mA
VIN =12V, V OUT =3.3V, I OUT =200mA →10mA
L=4.7μH(XFL4020-472MEB), SBD=XBS204S19R
CIN=10μF(TMK316BJ106KL), CL=10μF×2(LMK212ABJ106KG)
L=4.7μH(XFL4020 -472MEB), SBD=XBS204S19R
CIN=10μF(TMK316BJ106KL), CL=10μF×2(LMK212ABJ106KG)
50μs/div
50μs/div
VOUT : 50mV/div
VOUT : 50mV/div
IOUT =200mA →10mA
IOUT =10mA→200mA
XC9246B
XC9246B
VIN =12V, V OUT =3.3V, I OUT =10mA →500mA
VIN =12V, V OUT =3.3V, I OUT =500mA →10mA
L=4.7μH(XFL4020-472MEB), SBD=XBS204S19R
CIN=10μF(TMK316BJ106KL), CL=10μF×2(LMK212ABJ106KG)
L=4.7μH(XFL4020-472MEB), SBD=XBS204S19R
CIN=10μF(TMK316BJ106KL), CL=10μF×2(LMK212ABJ106KG)
50μs/div
100μs/div
VOUT : 50mV/div
VOUT : 50mV/div
IOUT =500mA →10mA
IOUT =10mA→500mA
XC9246B
XC9246B
VIN =12V, V OUT =3.3V, I OUT =200mA →800mA
L=4.7μH(XFL4020 -472MEB), SBD=XBS204S19R
CL=10μF ×2(LMK212ABJ106KG)
C=10μF(TMK316BJ106KL),
IN
50μs/div
VIN =12V, V OUT =3.3V, I OUT =800mA →200mA
L=4.7μH(XFL4020-472MEB), SBD=XBS204S19R
CIN=10μF(TMK316BJ106KL), CL=10μF×2(LMK212ABJ106KG)
50μs/div
VOUT : 50mV/div
VOUT : 50mV/div
IOUT =200mA→800mA
24/33
IOUT =800mA →200mA
XC9246/XC9247
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(16) Load Transient Response (Continued)
XC9247B
XC9247B
VIN =12V, V OUT =3.3V, I OUT =10mA→200mA
VIN =12V, V OUT =3.3V, I OUT =200mA →10mA
L=4.7μH(XFL4020 -472MEB), SBD=XBS204S19R
CIN=10μF(TMK316BJ106KL), CL=10μF ×2(LMK212ABJ106KG)
L=4.7μH(XFL4020 -472MEB), SBD=XBS204S19R
C=10μF(TMK316BJ106KL),
CL=10μF ×2(LMK212ABJ106KG)
IN
100μs/div
50μs/div
VOUT : 50mV/div
VOUT : 50mV/div
IOUT =200mA→10mA
IOUT =10mA→200mA
XC9247B
XC9247B
VIN =12V, V OUT =3.3V, I OUT =10mA→500mA
VIN =12V, V OUT =3.3V, I OUT =500mA →10mA
L=4.7μH(XFL4020 -472MEB), SBD=XBS204S19R
C=10μF(TMK316BJ106KL),
CL=10μF ×2(LMK212ABJ106KG)
IN
L=4.7μH(XFL4020-472MEB), SBD=XBS204S19R
CL=10μF ×2(LMK212ABJ106KG)
C=10μF(TMK316BJ106KL),
IN
50μs/div
100μs/div
VOUT : 100mV/div
VOUT : 100mV/div
IOUT =10mA→500mA
XC9247B
IOUT =500mA →10mA
XC9247B
VIN =12V, V OUT =3.3V, I OUT =200mA→800mA
L=4.7μH(XFL4020 -472MEB), SBD=XBS204S19R
CIN=10μF(TMK316BJ106KL), CL=10μF ×2(LMK212ABJ106KG)
50μs/div
VIN =12V, V OUT =3.3V, I OUT =800mA →200mA
L=4.7μH(XFL4020 -472MEB), SBD=XBS204S19R
CIN
=10μF(TMK316BJ106KL), CL=10μF ×2(LMK212ABJ106KG)
50μs/div
VOUT : 50mV/div
VOUT : 50mV/div
IOUT =200mA →800mA
IOUT =800mA →200mA
25/33
XC9246/XC9247 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
26/33
XC9246/XC9247
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
27/33
XC9246/XC9247 Series
■PACKAGING INFORMATION
●SOT-26W (unit: mm)
●SOT-26W Reference Pattern Layout (unit: mm)
1.0
2.4
0.7
0.95
●USP-6C (unit: mm)
0.95
●USP-6C Reference Pattern Layout (unit: mm)
1.8±0.05
2.4
2
5
0.25
3
4
0.25
0.5
0.05
1.6
6
1.8
1
0.6MAX
1pin INDENT
0.25
0.45
0.5
0.225
2.0±0.05
0.45
0.05
1.0
0.05
2.3
2
5
1.4±0.05
0.25
0.20±0.05
4
0.6
3
0.15
0.15
0.8
28/33
1.2
6
1.4
1
0.5
(0.50)
0.10±0.05
0.25
0.35
0.25
0.225
0.35
0.5
0.70±0.05
1.0±0.05
(0.1)
0.25±0.05
0.30±0.05
●USP-6C Reference Metal Mask Design (unit: mm)
XC9246/XC9247
Series
■PACKAGING INFORMATION (Continued)
●SOT-26W Power Dissipation (40mm x 40mm Standard board)
Power dissipation data for the SOT-26W is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition： Mount on a board
Ambient： Natural convection
Soldering： Lead (Pb) free
Board： Dimensions 40 x 40 mm
(1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board
area In top and back faces
Package heat-sink is tied to the copper traces
Material： Glass Epoxy (FR-4)
Thickness ： 1.6mm
Through-hole： 4 x 0.8 Diameter
Evaluation Board (Unit：mm)
2.Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃ )
Ambient Temperature（℃）
Power Dissipation Pd（ mW ）
Thermal Resistance (℃/ W )
600
240
166.67
25
85
Pd vs Ta
Power Dissipation Pd（mW）
700
600
500
400
300
200
100
0
25
45
65
85
105
125
Ambient Temperature（℃）
29/33
XC9246/XC9247 Series
■PACKAGING INFORMATION (Continued)
●USP-6C Power Dissipation (40mm x 40mm Standard board)
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition： Mount on a board
Ambient： Natural convection
Soldering： Lead (Pb) free
Board： Dimensions 40 x 40 mm
(1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board
area In top and back faces
Package heat-sink is tied to the copper traces
Material： Glass Epoxy (FR-4)
Thickness ： 1.6mm
Through-hole： 4 x 0.8 Diameter
Evaluation Board (Unit：mm)
2.Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃ )
Ambient Temperature（℃）
25
85
Power Dissipation Pd（ mW ）
Thermal Resistance (℃/ W )
1000
400
100.00
Pd vs Ta
Power Dissipation Pd（mW）
1200
1000
800
600
400
200
0
25
30/33
45
65
85
Ambient Temperature（℃）
105
125
XC9246/XC9247
Series
■PACKAGING INFORMATION (Continued)
31/33
XC9246/XC9247 Series
■MARKING RULE
SOT-26W
① represents products series
6
① ②
1
4
5
MARK
PRODUCT SERIES
6
7
XC9246B*****-G
XC9247B*****-G
③ ④
2
3
② represents products type
MARK
TYPE
②
PRODUCT SERIES
4
UVLO Voltage=4.15V
6
UVLO Voltage=5.65V
7
UVLO Voltage=7.65V
XC9246B42***-G
XC9247B42***-G
XC9246B65***-G
XC9247B65***-G
XC9246B75***-G
XC9247B75***-G
③④ represents production lot number
01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
USP-6C
②
⑤
③
3
④
2
①
1
① represents products series
6
MARK
PRODUCT SERIES
6
7
XC9246B*****-G
XC9247B*****-G
5
4
②③ represents products type
MARK
TYPE
②
③
4
2
UVLO Voltage=4.15V
6
5
UVLO Voltage=5.65V
7
5
UVLO Voltage=7.65V
PRODUCT SERIES
XC9246B42***-G
XC9247B42***-G
XC9246B65***-G
XC9247B65***-G
XC9246B75***-G
XC9247B75***-G
④⑤ represents production lot number
01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
32/33
XC9246/XC9247
Series
1.
The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2.
The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3.
Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4.
The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5.
Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6.
Our products are not designed to be Radiation-resistant.
7.
Please use the product listed in this datasheet within the specified ranges.
8.
We assume no responsibility for damage or loss due to abnormal use.
9.
All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
33/33
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