XC9266 Series
HiSAT-COT® Control, 6.0A Synchronous Step-Down DC/DC Converters
ETR05051-003
☆Green Operation-compatible
■GENERAL DESCRIPTION
The XC9266 series is a group of synchronous-rectification type DC/DC converters with a built-in 32mΩ P-channel MOS driver
transistor and 25mΩ N-channel MOS switching transistor, designed to allow the use of ceramic capacitors. The small on-resistances
of these two internal driver transistors enable a high efficiency, stable power supply with an output current up to 6.0A. A 0.6V
reference voltage source is incorporated, and the output voltage can be set freely by external resistors. Oscillation frequency is set
to 1.2MHz or 3.0MHz can be selected for suiting to your particular application. The operation mode is HiSAT-COT® Control (*)
control, which has an excellent transient response. PWM control or PWM/PFM auto switching control can be selected at the MODE1
pin, and a high-speed response, low ripple, and high efficiency are achieved across the entire load range (from light loads to heavy
loads).As for the soft-start function as fast as 0.25ms in typical for quick turn-on. The soft start time can be set as desired by adding
an external capacitance to the SS pin. Internal protection circuits include over current protection, short-circuit protection, and thermal
shutdown circuits to enable safe use. Short circuit protection or Hiccup mode can be selected at the MODE2 pin.
Soft-off function and CL High Speed discharge function discharge the electric charge at the output capacitor CL when putting the
IC in a stand-by mode. Soft-off function can be selected at the MODE3 pin. The package is the QFN0404-24C (4mm×4mm).
(*)
HiSAT-COT is a proprietary high-speed transient response technology for DC/DC converter which was developed by Torex. It is Ideal for the LSI's
that require high precision and high stability power supply voltage
■FEATURES
■APPLICATIONS
PC
Graphic board
Storage
Industrial application
FPGA
SSD
ASIC
DSP
Input Voltage Range
:
Output Voltage Range
:
FB Voltage
Output Current
Oscillation Frequency
Efficiency
Control Methods
:
:
:
:
:
Protection Circuits
:
Functions
:
Output Capacitor
Operating Ambient Temperature
Package
Environmentally Friendly
:
:
:
:
■TYPICAL APPLICATION CIRCUIT
VIN
RDD
PVIN
CIN
AVIN
CE
MODE1
CDD
CSS
Lx
FB
L
RFB1
RFB2
PGND
100
VOUT
CFB
SS
AGND
XC9266B06C VOUT=1.8V, fosc=1.2MHz L=0.56μH(XAL6030),
CIN=47μF(GRM31CR61A476ME15L),CL=47μF(GRM31CR60J476ME19L),RFB1=36kΩ,RFB2=18kΩ,CFB=1500pF
VOUT
MODE2
MODE3
RPG
PG
2.7V ~ 5.5V
PWM control 0.6V ~ 3.6V
PWM/PFM automatic switching control 0.8V ~ 3.6V
0.6V ± 1.0%
6.0A
1.2MHz, 3.0MHz
93%(VIN=5.0V, VOUT=1.8V, IOUT=1.0A)
HiSAT-COT® Control
100% Duty Cycle
Mode select between
Fixed PWM and PWM/PFM Auto
Thermal Shutdown
Current Limit (Pendent character)
HICCUP or Short Circuit Protection
UVLO , Soft-Start, Soft-off
CL High Speed Discharge ,Power good
Ceramic Capacitor
-40℃ ~ + 105℃
QFN0404-24C
EU RoHS Compliant, Pb Free
■TYPICAL PERFORMANCE
CHARACTERISTICS
CL
80
Efficiency : EFFI (%)
●
●
●
●
●
●
●
●
VIN =5.0V
PWM/PFM
60
40
PWM
20
0
1
10
100
1000
10000
Output Current : IOUT (mA)
1/30
XC9266 Series
■BLOCK DIAGRAM
●XC9266
Error Amp.
+
FB
SS
CE
MODE1
MODE2
MODE3
Short
Protection
Phase
Compensation
VOUT
Vref with
Soft Start
Current Limit
HICCUP
Comparator
+
S
Synch.
Buffer
Driver
Logic
Q
R
Minimum
On Time
Generator
Lx
PGND
PVIN
VOUT
Logic,
CE Control
UVLO,
Thermal Shutdown
CL Auto-Discharge
PWM/PFM
Selector
AVIN
AGND
Power Good
Comparator
FB
* Diodes inside the circuit are an ESD protection diode and a parasitic diode.
2/30
PVIN
+
PG
XC9266
Series
■PRODUCT CLASSIFICATION
1) Ordering Information
XC9266①②③④⑤⑥-⑦
DESIGNATOR
ITEM
SYMBOL
①
Type
B
Refer to Selection Guide
②③
Adjustable Output
Voltage
06
Output voltage can be adjustable.
PWM control
: 0.6V ~ 3.6V
PWM/PFM automatic control : 0.8V ~ 3.6V
④
Oscillation Frequency
C
1.2MHz
D
3.0MHz
⑤⑥-⑦
(*1)
Package (Order Unit)
(*1)
ZR-G
DESCRIPTION
QFN0404-24C (1,000pcs/Reel)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
2) Selection Guide
TYPE
CL AUTO-DISCHARGE
with SOFT-OFF
SHORT PROTECTION
with LATCH
or
HICCUP MODE
UVLO
CHIP ENABLE
B
Yes
Yes
Yes
Yes
TYPE
CURRENT LIMT
SOFT-START TIME
THERMAL SHUTDOWN
POWER GOOD
B
Yes
Adjustable
Yes
Yes
3/30
XC9266 Series
■PIN CONFIGURATION
MODE1
SS
MODE3
CE
MODE2
PG
7
8
9
10 11 12
AGND 6
13 FB
AVIN 5
14 VOUT
PVIN 4
15 Lx
PVIN 3
16 Lx
PVIN 2
17 Lx
NC 1
18 Lx
24 23 22 21 20 19
NC
PGND
PGND
PGND
PGND
NC
QFN0404-24C
(BOTTOM VIEW)
* The dissipation pad for the QFN0404-24C package should be solder-plated in recommended mount pattern and
metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other
pins, it should be connected to the GND (No. 6,20,21,22,23) pin.
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
1,
2,3,4
5
6
7
8
9
10
11
12
13
14
15,16,17,18
19
20,21,22,23
24
NC
PVIN
AVIN
AGND
PG
CE
MODE1
SS
MODE2
MOED3
FB
VOUT
Lx
NC
PGND
NC
No Connection
Power Supply Voltage Input
Analog Supply Voltage Input
Analog Ground
Power-good Output
Chip Enable
Control Mode Select
Soft start
Protection Function Select
SOFT-OFF Select
Output Voltage Sense
Output Voltage Sense
Switching Output
No Connection
Power Ground
No Connection
■FUNCTION
PIN NAME
CE
SIGNAL
STATUS
L
Stand-by
H
Active
Please do not leave the CE pin open.
PIN NAME
MODE1
MODE2
MODE3
SIGNAL
STATUS
L
PWM/PFM automatic control
H
PWM control
L
SHORT PROTECTION with LATCH
H
HICCUP MODE
L
CL AUTO-DISCHARGE
H
CL AUTO-DISCHARGE with SOFT-OFF
Please do not leave the MODE1, MODE2, MODE3 pin open
4/30
XC9266
Series
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Power Input Voltage
VPVIN
Analog Input Voltage
VAVIN
Lx PIN Voltage
VLx
Output Voltage
VOUT
RATINGS
UNITS
-0.3 ~ 6.2
V
-0.3 ~ VIN + 0.3 or 6.2(*1)
V
4.0(*2)
V
-0.3 ~ VIN + 0.3 or
Feedback Input Voltage
VFB
-0.3 ~ 6.2
V
CE Input Voltage
VCE
-0.3 ~ 6.2
V
MODE1 Input Voltage
VMODE1
-0.3 ~ 6.2
V
MODE2 Input Voltage
VMODE2
-0.3 ~ 6.2
V
MODE3 Input Voltage
VMODE3
-0.3 ~ 6.2
V
PG Input Voltage
VPG
-0.3 ~ 6.2
-0.3 ~ VIN + 0.3 or
V
6.2(*1)
Soft Start Input Voltage
VSoftStart
Power Dissipation
(Ta=25℃)
V
Pd
1500 (40mm x 40mm Standard board) (*3)
mW
Operating Ambient Temperature
Topr
-40 ~ 105
℃
Storage Temperature
Tstg
-55 ~ 125
℃
All voltages are described based on the GND (AGND and PGND) pin.
(*1)
The maximum value should be either VIN + 0.3V or 6.2V in the lowest.
(*2)
The maximum value should be either VIN + 0.3V or 4.0V in the lowest.
(*3)
The power dissipation figure shown is PCB mounted and is for reference only.
The mounting condition is please refer to PACKAGING INFORMATION.
5/30
XC9266 Series
■ELECTRICAL CHARACTERISTICS
Ta=25℃
●XC9266 Series
PARAMETER
Feedback Voltage
SYMBOL
VFB
Load Regulation
⊿VLOADREG
Operating Voltage Range
VIN
CONDITIONS
MIN.
TYP.
MAX.
UNITS
0.594
0.600
0.606
V
0.594
0.600
0.606
V
0.591
0.600
0.609
V
-
0.13
-
%
①
2.7
0.6
0.8
6.0
-
5.5
3.6
3.6
-
V
V
V
A
①
2.20
-
2.68
V
④
VIN=5.0V, VCE=VIN, VOUT=VFB=0.66V
VMODE1=0.0V, VMODE2=VIN, VMODE3=0.0V
-
40
80
μA
②
VIN=5.0V, VCE=VOUT=VFB=0.0V
VMODE1=VMODE2=VMODE3=0.0V
-
0.0
10.0
μA
②
1.2MHz
350
500
650
ns
3.0MHz
140
200
260
ns
VIN=5.0V, VCE=VMODE1=VMODE2=VIN
VMODE3=0.0V,
Voltage to start oscillation while
VFB=0.66V→0.54V
VIN=5.0V ,VCE=VMODE1=VMODE2=VIN,
VMODE3=0.0V, IOUT=0mA ~ 6.0A
VOUTSET
Maximum Output Current
IOUTMAX
VIN=2.7V ~ 5.5V
UVLO Voltage(*2)
VUVLO
VCE=VIN, VOUT=0.4V, VFB=0.54V,
VMODE1=VMODE2=VIN, VMODE3=0.0V
Voltage which Lx pin holding “L” level(*5)
Quiescent Current
Iq
Stand-by Current
ISTB
Thermal shutdown
Thermal shutdown
hysteresis
Efficiency
(*3)
tONmin
Ta=0℃～
85℃(*9)
Ta=-40℃～
105℃(*9)
(*1)
Setting Output
Voltage Range
Minimum ON time
Ta=25℃
VMODE1=VIN
VMODE1=0V
(*1)
When connected to external components,
VIN=3.0V, VOUT=1.8V IOUT=1mA
VCE=VMODE1=VMODE2=VIN, VMODE3=0.0V
CIRCUIT
④
①
①
①
TTSD
-
-
150
-
℃
①
THYS
-
-
20
-
℃
①
1.2MHz,
-
95
-
EFFI
VIN=5.0V, VCE=VMODE1=VMODE2=VIN,
VMODE3=0.0V,VOUT=3.3V, IOUT=1.0A
%
①
3.0MHz,
-
92
-
Lx SW "H" ON
Resistance
RLXH
VIN=5.0V, VCE=VIN, VOUT=VFB=0.54V
VMODE1=0.0V, VMODE2=VIN, VMODE3=0.0V
ILx=100mA (*4)
-
32
70
mΩ
③
Lx SW "L" ON Resistance
RLXL
VIN=5.0V, VCE=VIN, VOUT=VFB=0.66V
VMODE1=0.0V, VMODE2=VIN, VMODE3=0.0V
ILx=100mA (*4)
-
25
60
mΩ
③
Lx SW”H” Leakage
Current(*6)
ILeakH
VIN= 5.5V, VFB=0.66V, VOUT=VCE=0.0V, VLx =5.5V
VMODE1=0.0V, VMODE2=VIN, VMODE3=0.0V
-
0.0
50.0
μA
⑤
Lx SW”L” Leakage
Current(*7)
ILeakL
-
0.0
10.0
μA
⑤
Current Limit (*8)
ILIM
9.0
10.0
13.0
A
⑥
Output Voltage
Temperature
Characteristics
⊿VOUT/
(VOUT・⊿Topr)
-
±30
-
ppm/℃
①
PG detect voltage
VPG
0.42
0.50
0.58
V
④
3.6
4.5
5.5
mA
④
0.10
0.25
0.50
ms
⑦
1.0
2.5
5.0
ms
⑦
VIN= 5.5V, VFB=0.66V, VOUT=VCE=0.0V, VLx=0.0V
VMODE1=0.0V, VMODE2=VIN, VMODE3=0.0V
VIN=5.0V, VCE=VIN, VOUT=VFB=0.54V
VMODE1=0.0V, VMODE2=VIN, VMODE3=0.0V
ILx until Lx pin oscillates
IOUT=30mA, -40℃≦Topr≦105℃
VIN=5.0V, VCE=VIN, VOUT=0.54V, VMODE1=0.0V,
VMODE2=VIN, VMODE3=0.0V, PG=Pull up 10kΩ(VIN)
VFB=0.58V→0.42V, Voltage which PG pin holding “L” level(*5)
VIN=5.0V, VCE=VIN, VOUT=0.54V
PG Output Current
IPG
VMODE1=0.0V, VMODE2=VIN, VMODE3=0.0V
VFB=0.42V , PG = 0.5V
VIN=5.0V, VOUT=VFB=0.54V, VMODE1=0.0V, VMODE2=VIN,
Soft-Start Time1
tSS1
VMODE3=0.0V, VCE=0.0V→3.6V, Time from VCE=3.6V to clocks
are generated at Lx pin. CSS = open
VIN=5.0V, VOUT=VFB=0.54V, VMODE1=0.0V, VMODE2=VIN,
Soft-Start Time2
tSS2
VMODE3=0.0V, VCE=0.0V→ 3.6V, Time from VCE=3.6V to
clocks are generated at Lx pin. CSS=3300pF
6/30
XC9266
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC9266 Series
Ta=25℃
PARAMETER
SYMBOL
Soft-Off Time
tso
CL Discharge
RDCHG
Hiccup wait time
tHW
MODE1 ”H” Voltage
VMODE1H
MODE1 ”L” Voltage
VMODE1L
MODE2 ”H” Voltage
VMODE2H
MODE2 ”L” Voltage
VMODE2L
MODE3 ”H” Voltage
VMODE3H
MODE3 ”L” Voltage
VMODE3L
MODE1 ”H” Current
I MODE1H
MODE1 ”L” Current
I MODE1L
MODE2 ”H” Current
I MODE2H
MODE2 ”L” Current
I MODE2L
MODE3 ”H” Current
I MODE 3H
MODE3 ”L” Current
I MODE 3L
CONDITIONS
MIN.
TYP.
MAX.
UNITS
CIRCUIT
0.05
0.10
0.15
ms
①
-
65
130
Ω
⑧
1.0
2.5
5.0
ms
①
1.4
-
5.5
V
①
AGND
-
0.5
V
①
1.4
-
5.5
V
④
AGND
-
0.5
V
④
1.4
-
5.5
V
①
AGND
-
0.5
V
①
-0.1
-
0.1
μA
⑤
-0.1
-
0.1
μA
⑤
-0.1
-
0.1
μA
⑤
-0.1
-
0.1
μA
⑤
-0.1
-
0.1
μA
⑤
-0.1
-
0.1
μA
⑤
1.4
-
5.5
V
④
AGND
-
0.5
V
④
-0.1
-
0.1
μA
⑤
-0.1
-
0.1
μA
⑤
0.10
0.20
0.50
V
④
VIN=5.0V, VMODE1=VMODE2=VMODE3=VIN,
CL=47uF, VOUT=1.8V, VCE=5.0V→0.0V
Time from VCE=0.0V to VOUT=0.2V
VIN=5.0V, VCE=0.0V, VFB=0.66V,
VMODE1=VMODE2=VIN, VMODE3=0.0V, VOUT=0.2V
VIN=5.0V,VCE=VMODE1=VMODE2=VIN,VMODE3=0.0V,
CSS=3300pF, VOUT=0.0V, Time from the
oscillation stop until the oscillation start
Applied voltage to VMODE1, Voltage for PWM Control
Applied voltage to VMODE1,
Voltage for PWM/PFM automatic control
Applied voltage to VMODE2, Voltage for HICCUP MODE
Applied voltage to VMODE2,
Voltage for SHORT PROTECTION with LATCH
Applied voltage to VMODE3, Voltage for
CL Auto-Discharge with SOFT-OFF
Applied voltage to VMODE3, Voltage for
CL Auto-Discharge
VIN=5.5V,VCE=0.0V,VMODE1=5.5V,VMODE2=5.5V, VMODE3=5.5V
VIN=5.5V, VCE=0.0V, VMODE1=0.0V,
VMODE2=0.0V, VMODE3=0.0V
VIN=5.5V, VCE=0.0V, VMODE1=5.5V,
VMODE2=5.5V, VMODE3=5.5V
VIN=5.5V, VCE=0.0V, VMODE1=0.0V,
VMODE2=0.0V, VMODE3=0.0V
VIN=5.5V, VCE=0.0V, VMODE1=5.5V,
VMODE2=5.5V, VMODE3=5.5V
VIN=5.5V, VCE=0.0V, VMODE1=0.0V, VMODE2=0.0V,
VMODE3=0.0V
CE ”H” Voltage
VCEH
VIN=5.0V, VOUT=VFB=0.54V
VMODE1=0.0V, VMODE2=VIN, VMODE3=0.0V
Applied voltage to VCE Voltage changes Lx to
“H” level (*5)
CE ”L” Voltage
VCEL
VIN=5.0V, VOUT=VFB=0.54V
VMODE1=0.0V, VMODE2=VIN, VMODE3=0.0V
Applied voltage to VCE Voltage changes Lx to “L” level (*5)
CE ”H” Current
ICEH
CE ”L” Current
ICEL
Short Protection
Threshold Voltage
VSHORT
VIN=5.5V, VCE=5.5V, VMODE1=5.5V,
VMODE2=5.5V, VMODE3=5.5V,
VIN=5.5V, VCE=0.0V, VMODE1=0.0V,
VMODE2=0.0V, VMODE3=0.0V
VIN=5.0V, VCE=VIN, VFB=0.54V
VMODE1=VIN, VMODE2=0.0V, VMODE3=0.0V
Sweeping VOUT, voltage which Lx becomes “L” level (*5)
Unless otherwise stated, VIN=5.0V, VCE=5.0V, VMODE1=0.0V, VMODE2=0.0V, VMODE3=0.0V
(*1)
When the difference between the input and the output is small, 100% duty might come up and internal control circuits keep Pch MOS driver
turning on even though the output current is not so large.
If current is further pulled from this state, output voltage will decrease because of Pch MOS driver ON resistance.
(*2)
Including UVLO detect voltage, hysteresis operating voltage range for UVLO release voltage.
(*3)
EFFI = [(output voltage × output current) ÷ (input voltage × input current)] × 100
(*4)
RLXH= (VIN - Lx pin measurement voltage) / 100mA, RLXL= Lx pin measurement voltage / 100mA
(*5)
"H"=VIN - 1.2V ~ VIN,
(*6)
When temperature is high, a current of approximately 150μA (maximum) may leak.
(*7)
When temperature is high, a current of approximately 50μA (maximum) may leak.
(*8)
Current limit denotes the level of detection at peak of Pch MOS driver Tr. current.
(*9)
Design value
"L"= -0.1V ~ 0.1V
7/30
XC9266 Series
■TEST CIRCUITS
< Circuit No.① >
VIN
< Circuit No.② >
PVIN
RDD
CIN
AVIN
PG
1μF
VIN
AGND
Lx
MODE1
CFB
RFB1
MODE2
CL
MODE3
V
FB
SS
CDD
VOUT
CE
VOUT
L
MODE2
PG
AVIN
VOUT
CE
< Circuit No.①
Lx >
MODE1
MODE3
PVIN
A
100Ω
Wave Form Measure
Point
FB
SS
RFB2
PGND
2.2μF
PGND
AGND
※ External Components
CFB : 1500ｐＦ
CIN : 47μF(ceramic)
RFB1 : 36kΩ
CL : 47μF(ceramic)
RFB2 : 18kΩ
RDD : 100Ω
CDD : 2.2μF
L (fosc=1.2MHz) : 0.56μH(XAL6030)
L (fosc=3.0MHz) : 0.22μH(XAL4020)
< Circuit No.③ >
VIN
PVIN
100Ω
1μF
AVIN
CE
MODE1
< Circuit No.④ >
VIN
PG
100Ω
VOUT
PVIN
1μF
AVIN
Lx
CE
ILX
MODE2
MODE3
MODE1
AGND
MODE3
2.2μF
< Circuit No.⑤ >
100Ω
1μF
A
ICEH
IMODE2L
A
IMODE2H
IMODE1L
A
IMODE1H
IMODE3L
A
CE
MODE1
AGND
100Ω
PG
1μF
AVIN
VOUT
CE
ILeakH
Lx
A
MODE1
ILeakL
MODE2
MODE3
MODE3
FB
SS
2.2μF
AGND
100Ω
PGND
AVIN
CE
MODE1
100Ω
PG
VOUT
8/30
2.2μF
AGND
Rpulldown
100Ω
PGND
PG
VOUT
Wave Form Measure
Point
Lx
ILX
FB
PGND
PVIN
CE
Lx
FB
1μF
AVIN
Wave Form Measure
Point
MODE1
PG
VOUT
Lx
MODE2
Rpulldown
100Ω
MODE3
SS
CSS
FB
< Circuit No.⑧ >
MODE2
MODE3
AGND
VIN
PVIN
1μF
Wave Form
Measure Point
SS
2.2μF
< Circuit No.⑦ >
VIN
Lx
PVIN
MODE2
IMODE3H
VOUT
< Circuit No.⑥ >
VIN
PVIN
AVIN
ICEL
A
SS
PGND
RLXH = (VIN -VLx)/ILX
RLXL = VLx/ILX
VIN
PG
MODE2
FB
SS
2.2μF
Wave Form
Measure Point
Rpullup
10kΩ
FB
SS
PGND
2.2μF
AGND
PGND
A
XC9266
Series
■TYPICAL APPLICATION CIRCUIT
VIN
RDD
PVIN
CIN
RPG
PG
AVIN
VOUT
CE
Lx
MODE1
MODE2
CFB
MODE3
CDD
CSS
VOUT
L
FB
SS
CL
RFB1
RFB2
AGND
PGND
【Typical Examples】fOSC=1.2MHz
L
MANUFACTURER
PRODUCT NUMBER
VALUE
SIZE(L×W×T)
Coilcraft
XAL6030-561MEB
XFL7015-471ME
0.56μH
0.47μH
6.36×6.56×3.1(mm)
7.5×7.5×1.5(mm)
TDK
SPM6530T-R47M170
0.47μH
7.1×6.5×3.0(mm)
MANUFACTURER
PRODUCT NUMBER
VALUE
SIZE(L×W×T)
Coilcraft
XAL4020-221MEB
XFL7015-251ME
0.22μH
0.25μH
4.0×4.0×2.1(mm)
7.5×7.5×1.5(mm)
TDK
SPM6530T-R25M230
0.25μH
7.1×6.5×3.0(mm)
【Typical Examples】fOSC=3.0MHz
L
【Typical Examples】(*1) fOSC=1.2MHz, fOSC=3.0MHz
CIN
MANUFACTURER
PRODUCT NUMBER
VALUE
SIZE(L×W×T)
murata
TAIYO YUDEN
GRM31CR61A476ME15L
LMK316ABJ476ML-T
47μF/10V
47μF/10V
3.2×1.6×1.6(mm)
3.2×1.6×1.6(mm)
TDK
C3216X6S1A476M
47μF/10V
3.2×1.6×1.6(mm)
murata
CL
TAIYO YUDEN
TDK
GRM31CR60J476ME19L
(*2)
47μF/6.3V
3.2×1.6×1.6(mm)
GRM32ER71A476KE15L
47μF/10V(*2)
3.2×2.5×2.5(mm)
JMK316ABJ476ML-T
(*2)
47μF/6.3V
3.2×1.6×1.6(mm)
LMK325B7476KM-PR
47μF/10V(*2)
3.2×2.5×2.5(mm)
47μF/6.3V
3.2×1.6×1.6(mm)
C3216X6S0J476M
(*2)
CSS
330pF(*3)
RDD
100Ω
CDD
murata
GRM155R61A225KE95D
2.2μF/10V
1.0×0.5×0.5 (mm)
TAIYO YUDEN
LMK105BJ225MV-F
2.2μF/10V
1.0×0.5×0.5 (mm)
RPG
100kΩ
(*1)
Select components appropriate to the usage conditions (ambient temperature, input & output voltage).
(*2) Regarding the value of C , please refer to Fig.1, Fig.2
L
Can also be used without CSS (SS pin OPEN). When used without CSS, the IC starts at the soft start time set internally.
XC9266B06CZR-G
CL Reference value
5.1
4.7
5.5
External components
C L=47μF
4.3
3.9
3.5
3.1
2.7
XC9266B06DZR-G
CL Reference value
External components
C L=94μF or more
0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Output Voltage(V)
Fig.1:XC9266B06CZR-GのCL値
Input Voltage（Ｖ）
5.5
Input Voltage(V)
(*3)
5.1
4.7
External components
C L=47μF
4.3
3.9
3.5
3.1
2.7
External components
C L=94μF or more
0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Output Voltage(V)
Fig.2:XC9266B06DZR-GのCL値
9/30
XC9266 Series
■TYPICAL APPLICATION CIRCUIT(Continued)
< Output voltage setting >
The output voltage can be set by adding an external dividing resistor. The output voltage is determined by the equation below
based on the values of RFB1 and RFB2.
VOUT=0.6 × (RFB1+RFB2)/RFB2
with RFB1,RFB2 ≦100kΩ
Adjust the value of the phase compensation speed-up capacitor. Adjust the CFB value so that fzfb = 1/(2×π×CFB×RFB1) is about
3kHz
Output voltage setting range is 0.6V to 3.6V in PWM control, PFM/PWM automatic switching control is 0.8V to 3.6V.
【Setting Example】
VOUT
RFB1
RFB2
CFB
VOUT
RFB1
RFB2
CFB
0.6V
0Ω
Open
Open
1.8V
36kΩ
18kΩ
1500pF
0.7V
11kΩ
62kΩ
4700pF
3.3V
68kΩ
15kΩ
820pF
1.2V
91kΩ
91kΩ
560pF
< Inductance value setting >
In the XC9266 series, it is optimum to set an inductance value within the range below based on the set frequency.
fOSCSET: Set frequency
fOSCSET
Inductance value
3.0MHz
0.22μH ~ 0.25μH
1.2MHz
0.47μH ~ 0.56μH
< Soft-start function >
The soft start time of the XC9266 series can be adjusted externally (SS pin). The soft start time is the time from the start of VCE
until the output voltage reaches 90% of the set voltage. The soft start time depends on the external capacitance CSS, and is
determined by the equation below.
tSS2(ms) = 1.5 × CSS / ISS
CSS: External capacitance (nF)
ISS: 2.0 (μA)
* Note that the value of the soft start time tSS2 varies depending on the effective capacitance value of the delay capacitance CSS
and ISS.
【Calculation Example】
When CSS=3.3nF tSS2=1.5×3.3/{2μA}=2.475ms
The minimum value tSS2 of the soft-start time is set internally.
VCE
90% of setting voltage
VOUT
tSS1
tSS2
10/30
XC9266
Series
■OPERATIONAL EXPLANATION
The XC9266 series consists of a reference voltage source, error amplifier, comparator, phase compensation, minimum on time
generation circuit, output voltage adjustment resistors, P-channel MOS driver transistor, N-channel MOS switching transistor for
the synchronous switch, current limiter circuit, UVLO circuit, thermal shutdown circuit, short protection circuit, PWM/PFM
selection circuit and others. (See the BLOCK DIAGRAM below.)
Error Amp.
+
FB
SS
CE
MODE1
Short
Protection
Phase
Compensation
VOUT
+
Vref with
Soft Start
PVIN
Comparator
-
-
Current Limit
HICCUP
S
Synch.
Buffer
Driver
Logic
Q
R
Minimum
On Time
Generator
Lx
PGND
PVIN
VOUT
Logic,
CE Control
UVLO,
Thermal Shutdown
CL Auto-Discharge
PWM/PFM
Selector
AVIN
AGND
MODE2
Power Good
Comparator
-
MODE3
FB
PG
+
BLOCK DIAGRAM (XC9266 Series Type B)
The method is HiSAT-COT (High Speed circuit Architecture for Transient with Constant On Time) control, which features on time
control method and a fast transient response that also achieves low output voltage ripple.
The on time (ton) is determined by the input voltage and output voltage, and turns on the Pch MOS driver Tr. for a fixed time.
During the off time (toff), the voltage is generated by resistor division with resistors RFB1 and RFB2. The voltage is compared to the
reference voltage by the error amp, and the error amp output is phase compensated and sent to the comparator. The comparator
compares this signal to the reference voltage, and if the signal is lower than the reference voltage, sets the SR latch. On time then
resumes. By doing this, PWM operation takes place with the off time controlled to the optimum duty ratio and the output voltage
is stabilized. The phase compensation circuit optimizes the frequency characteristics of the error amp, and generates a ramp
wave similar to the ripple voltage that occurs in the output to modulate the output signal of the error amp. This enables a stable
feedback system to be obtained even when a low ESR capacitor such as a ceramic capacitor is used, and a fast transient response
and stabilization of the output voltage are achieved.
< Minimum on time generation circuit >
Generates an on time that depends on the input voltage and output voltage (ton). The on time is set as given by the equations
below.
fOSC=1.2MHz
ton (μs)=VOUT/VIN×0.833
fOSC=3.0MHz
ton (μs)=VOUT/VIN×0.333
< Switching frequency >
The switching frequency can be obtained from the on time (ton), which is determined by the input voltage and output voltage, and
the PWM controlled off time (toff) as given by the equation below.
fOSC (MHz) = VOUT(V) / (VIN(V)×ton(μs))
When the load current is heavy and the voltage difference between input voltage and output voltage is small, 100% duty cycle
mode is activated and it keeps the Pch MOS driver Tr. keep on. 100% duty cycle mode attains a high output voltage stability and
a high-speed response under all load conditions, from light to heavy, even in conditions where the dropout voltage is low.
11/30
XC9266 Series
■OPERATIONAL EXPLANATION (Continued)
< Error amp >
The error amp monitors the output voltage. The voltage divided by the external RFB1 and RFB2 resistors is a feedback voltage for
Error Amp. and compared to the reference voltage. The output voltage of the error amp becomes higher when the feedback
voltage is higher than the reference voltage. The frequency characteristics of the error amp are optimized internally.
< Reference voltage source, soft start function >
The reference voltage forms a reference that is used to stabilize the output voltage of the IC.
After “H” level is fed to CE pin, the reference voltage connected to the error amp increases linearly during the soft start interval.
This allows the voltage divided by the external RFB1 and RFB2 resistors and the reference voltage to be controlled in a balanced
manner, and the output voltage rises in proportion to the rise of the reference voltage. This operation prevents rush input current
and enables the output voltage to rise smoothly.
If the output voltage does not reach the set output voltage within the soft start time, for example a case when the load is heavy
or a large capacity output capacitor is connected, the balance between the feedback voltage and the reference voltage is lost,
however, the current limit function is activated in order to prevent an excessive increase of input current, enabling a smooth rise
of the output voltage.
< Control system selection circuit >
XC9266 series is selectable on the control method between PWM control and PWM/PFM auto switching control by using MODE1
pin. When “H” level is fed to MODE1 pin, XC9266 works with PWM control, whereas when “L” level is fed to MODE1 pin, it
works with PWM/PFM auto switching control.
Under PWM control, XC9266 works with the continuous conduction mode (CCM) and ON-duty is decided based on the
relationship between the input voltage and the output voltage regardless the output current, and the switching frequency is stable.
On the other hand, under PWM/PFM auto switching control, XC9266 can work with the discontinuous conduction mode (DCM)
when the output current is low and the switching frequency varies to lower frequency so that the switching loss reduces and, as
a result, the efficiency is improved. MODE1 pin has CMOS input configuration and the sink current is 0μA.
< CE function >
Operation starts when “H” voltage is input into the CE pin. The IC can be put in the shutdown state by inputting “L” voltage into
the CE pin. In the shutdown state, the supply current of the IC is 0μA (TYP.), and the Pch MOS driver Tr. And Nch MOS switch Tr.
for synchronous rectification turn off. The CE pin is a CMOS input and the sink current is 0μA.
< UVLO Circuit >
When the AVIN voltage becomes 2.40V (TYP.) or lower, the Pch MOS driver transistor output driver transistor is forced OFF to
prevent false pulse output caused by unstable operation of the internal circuitry. When the AVIN pin voltage becomes 2.50V (TYP.)
or higher, switching operation takes place. By releasing the UVLO function, the IC performs the soft start function to initiate output
startup operation. The UVLO circuit does not cause a complete shutdown of the IC, but causes pulse output to be suspended;
therefore, the internal circuitry remains in operation.
< Thermal Shutdown >
For protection against heat damage of the ICs, thermal shutdown function monitors chip temperature. The thermal shutdown
circuit starts operating and the Pch MOS driver and Nch MOS driver transistor will be turned off when the chip’s temperature
reaches TTSD(TYP. 150℃). When the temperature drops to TTSD-THYS(TYP. 130℃) or less after shutting of the current flow, the IC
performs the soft-start function to initiate output startup operation.
< Short-circuit protection function >
Short-circuit protection circuit protects the device that is connected to this product and to the input/output in situations such as
when the output is accidentally shorted to GND. The short-circuit protection circuit monitors the output voltage, and when the
output voltage falls below the short-circuit protection threshold voltage, it turns off the Pch MOS driver Tr and latches it. Once in
the latched state, operation is resumed by turning off the IC from the CE pin and then restarting, or by re-input into the VIN pin.
< Hiccup >
Hiccup is one of the means to protect the IC and the device connected to the IC from being damaged by an excessive temperature
rise caused by the overload state in the long time.
① When the load current reaches the current limit, IC will be turned off.
② The IC protects itself from being damaged by the heat by maintaining the off state for a constant time.
③ After a certain time in state ②, the IC resumes operation to check whether or not the over current condition is continuing.
④ If the over current state continues, the IC returns to ②. The IC restarts by a soft start if the overcurrent state is released.
12/30
XC9266
Series
■OPERATIONAL EXPLANATION (Continued)
< CL High Speed Discharge >
CL High Speed Discharge can quickly discharge the electric charge at the output capacitor (CL) via the Nch MOS switch transistor
and auto-discharge resistance located between the VOUT pin and the GND pin when “L” level signal is fed to CE pin and IC is
disable. It can prevent a malfunction of the device connected to the output of XC9266 due to the stored electric charge at the
output capacitor when XC9266 is disable.
V = VOUT(T) × e - t / τ
t = τLn (VOUT(T) / V)
V : Output voltage after discharge,
VOUT(T) : Output voltage
t : Discharge time
τ: CL×RDCHG
CL : Capacitance of Output capacitor
RDCHG : CL auto-discharge resistance,
but it depends on supply voltage.
< Soft-off function >
When H level is fed to MODE3 pin and L level is fed to CE pin, a Soft-off function is activated.
The function can discharge the electric charge in the output capacitor much faster than CL high speed discharge function because
the function can turn on an internal Nch MOS switch which is for synchronous rectification originally and use it for the discharge.
(Refer to a diagram below)
This function make a power-off sequence easier because it can prevent a device connected to the output of XC9266 from a
malfunction caused by the stored electric charge in the output capacitor of XC9266 when it is disable.
Furthermore, the Soft-off function regenerates energy by Nch MOS switching Tr., and the input voltage rises by the regenerative
energy .The rise voltage of the input voltage can be calculated with using the following equation, once the design has been
completed, verification with actual components should be required.
【Equation】
The rise voltage of the input voltage＝(VOUT-0.2)2×CL/(2×VIN×CIN)
VIN : Input voltage
VOUT : Output voltage
CL: Actual capacitance value of an output Capacitor (CL)
CIN: Actual capacitance value of an input Capacitor (CIN)
Soft-off function vs CL High Speed Discharge
CL＝47μF
【Calculation Example】
When VIN=5.0V, VOUT=1.8V, CIN=47μF, CL=47μF
The rise voltage of the input voltage＝(1.8-0.2)2×(47×10-6)/(2×5.0×(47×10-6))
＝0.256V
< Current Limit >
The current limiter circuit monitors the current flowing through the P-channel MOS driver transistor connected to the Lx pin.
When the driver current is bigger than a specific level, the current limit function operates to turn off the pulses from the Lx pin.
When the over current state is eliminated, the IC resumes its normal operation.
13/30
XC9266 Series
■OPERATIONAL EXPLANATION (Continued)
Output state can be monitored using the power good function.
Connect pull-up resistor to a PG pin as its output configuration is Nch open drain.
The PG pin outputs "L" signal in the following cases.
Case1: For VOUT fluctuation
VOUT
OV P
V PG
PG
①
②③ ④
⑤
⑥⑦ ⑧
⑨
①The initial conditions, VOUT is a stable state.
②When VOUT falls to less than the threshold VPG of the PG, PG system starts to count the internal delay (TYP=140μs).
③PG voltage goes down to GND level after the internal delay.
④After VOUT goes up higher than the threshold VPG , PG system starts to count the internal delay（TYP=180μs）.
⑤PG voltage goes up to the pull up voltage after the internal delay.
⑥When VOUT goes up to higher than threshold OVP , PG system starts to count the internal delay (TYP=140μs).
⑦PG voltage goes up to the pull up voltage after the internal delay.
⑧When VOUT falls to less than the threshold OVP , PG system starts to count the internal delay(TYP=180μs).
⑨PG voltage goes up to the pull up voltage after the internal delay.
* When the FB voltage becomes 0.7V of the OVP threshold and VOUT rises more than +17%, PG is made the GND level.
Case2: For Soft-start function, Thermal Shutdown, Short-circuit protection function
CE
VOUT
PG
①
②
③
④
①Assume VIN has been applied.When H level is fed to the CE pin, VOUT will rise by using a Soft-start function. PG voltage is
the GND level during Soft-start operation.
②After VOUT goes up to 90% of the setting voltage, PG system starts to count the internal delay (TYP=140μs).
③PG voltage goes up to the pull up voltage after the internal delay.
④When a short circuit comes at VOUT or when thermal shut down is activated , PG voltage goes down to the GND level
promptly without an internal delay.
14/30
XC9266
Series
■OPERATIONAL EXPLANATION (Continued)
Case3: For CL High Speed Discharge (CE= “L” voltage)
CE
VOUT
PG
①
②
①The initial conditions, VOUT is a stable state. Assume CL high speed Discharge is activated by using MODE3 pin.
②L level is fed to CE pin and then XC9266 is in a standby state. Therefore VOUT begins to fall down by a CL High Speed
Discharge. In this case, PG voltage goes down to GND level promptly.
Case4: For Soft-off function (CE= “L” voltage)
CE
VOUT
PG
①
②
③
①The initial conditions, VOUT is a stable state. Assume Soft-off function is activated by using MODE3 pin.
②L level is fed to CE pin and then XC9266 is in a standby state. Therefore VOUT begins to fall down sharply by soft-off
function. In this case, PG voltage goes down to GND level (VOUT = 0.2V or less) after soft-off function is completed.
15/30
XC9266 Series
■NOTE ON USE
1) For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated
if IC is used beyond the absolute MAX. specifications.
2) Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external
component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the
design has been completed, verification with actual components should be done.
3) The DC/DC converter characteristics depend greatly on the externally connected components as well as on the characteristics
of this IC, so refer to the specifications and standard circuit examples of each component when carefully considering which
components to select. Be especially careful of the capacitor characteristics and use B characteristics (JIS standard) or X7R,
X5R (EIA standard) ceramic capacitors.
If the capacitance value is not sufficient by degrading CL due to the low temp. Condition and DC bias feature, the duty cycle
might not be stable. Add capacitance value for CL if necessary.
4) Make sure that the PCB GND traces are as thick and wide as possible. The PGND pin and AGND pin fluctuation caused by
high ground current at the time of switching may result in instability of the IC. Therefore, the GND traces close to the PGND
pin and AGND pin are important.
5) Mount external components as close as possible to the IC. Keep the wiring short and thick to lower the wiring impedance.
6) A feature of HiSAT-COT control is that it controls the off time in order to control the duty, which varies due to the effects of power
loss. In addition, changes in the on time due to 100% duty cycle mode are allowed. For this reason, caution must be exercised
as the characteristics of the switching frequency will vary depending on the external component characteristics, board layout,
input voltage, output voltage, load current and other parameters.
7) Due to propagation delay inside the product, the on time generated by the minimum on time generation circuit is not the same
as the on time that is the ratio of the input voltage to the output voltage.
8) With regard to the current limiting value, the actual coil current may at times exceed the electrical characteristics due to
propagation delay inside the product.
9) The CE pin is a CMOS input pin. Do not use with the pin open. If connecting to the input or ground, use the resistor not more
than 1MΩ or less. To prevent malfunctioning of the device connected to this product or the input/output due to short circuiting
between pins, it is recommended that a resistor be connected.
10) Regarding XC9266 which has PWM/PFM auto switching control method, it works with a discontinuous conduction mode at
light loads, and in this case where the voltage difference between input voltage and output voltage is low or the coil inductance
is higher than the value indicated in the standard circuit example, the coil current may reverse when the load is light, and thus
pulse skipping will not be possible and light load efficiency will worsen.
11) When the voltage difference between input voltage and output voltage is low, the load stability feature may deteriorate.
12) Soft-off function regenerates energy by Nch MOS switching Tr. Additionally the input voltage rises by the regenerative energy.
In this case, please note the input voltage not to exceed 5.5V. The Lx voltage may be beyond the absolute maximum ratings
when the input voltage exceeds 5.5V.
The rise of input voltage can be suppressed by increasing CIN. Please increase CIN based on the following equation.
For your design, please evaluate this issue on your PCB and actual external components sufficiently.
【Equation】
CIN>(VOUT-0.2)2×CL/(⊿VIN×2×VIN)
VIN: Input voltage
⊿VIN:(5.5-VIN)
VOUT: Output voltage
CL: Actual capacitance value of an output Capacitor (CL)
CIN: Actual capacitance value of an input Capacitor (CIN)
【Calculation Example】
When VIN=5.0V、VOUT=1.8V、CL=47μF
⊿VIN=(5.5-5.0)=0.5V
CIN>(1.8-0.2)2×47/(0.5×2×5.0)
CIN>24.064μF
13) In case that the set output voltage is less than 0.8V with the PWM/PFM automatic control, super positioning ripple and
efficiency decline can occur at the light load.
Due to this reason, please be sure to set the output voltage in the range of 0.8V to 3.6V for the PWM/PFM automatic control.
16/30
XC9266
Series
■NOTE ON USE (Continued)
14) Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe
designs and post-aging protection treatment when using Torex products in their systems.
15) Instructions of pattern layouts
The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is
high, please place the input capacitor(CIN) and the output capacitor (CL) as close to the IC as possible.
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN, CDD) to be connected as close as
possible to the PVIN & PGND pins and the AVIN & AGND pins.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
(4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents
at the time of switching may result in instability of the IC.
(5) This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-channel and
N-channel MOS driver transistors. Please consider the countermeasures against heat if necessary.
< Reference pattern layout >
Layer
1st
3rd
Layer
2nd
Layer
4th
Layer
PCB mounted
17/30
XC9266 Series
■NOTE ON USE (Continued)
＜Estimation for the power consumption＞
The power loss of a total buck DC/DC system (P_all) is as follows.
P_all =VIN×IIN-VOUT×IOUT
=VOUT×IOUT/EFFI-VOUT×IOUT
=-VOUT×IOUT× (1-1/EFFI)
The power loss at a coil (P_coil) is as follows.
P_coil = IOUT2×DCR
DCR: The direct current resistance of a coil
The power loss at IC (P_IC) can be calculated by subtracting the power loss at a coil from the one of a total buck DC/DC
system.
P_IC = P_all - P_coil
The temperature of IC (Tj) can be calculated by the function below.
R : Thermal resistance（℃/W)
Tj = Ta + R×P_IC
The temperature resistance varies based on the power dissipation of a PC board and so on.
Please note that Tj should be lower than 125℃
＜Calculation Example＞
・Conditions :
VIN=5.0V
VOUT=1.8V
output current：IOUT=4.0A
Efficiency：EFFI=87.8%
Thermal resistance R=34.8℃/W （Mount on a board）
DCR of a coil =5.81mΩ
The power loss of a total buck DC/DC system (P_all) =-VOUT×IOUT× (1-1/EFFI)
=-1.8×4.0(1-1/0.878)
≒1.00 (W)
The power loss at a coil (P_coil) = IOUT2×DCR
=42×0.00581=0.093 (W)
The power loss at IC (P_IC) = P_all - P_coil
=1.00 -0.093
=0.91 (W)
The temperature of IC (Tj) = The ambient temperature so that Tj becomes125℃ (Ta) =Tj-R×P_IC
=125-34.8×0.91
=93.3℃
In this case, under the condition above, the ambient temperature up to 93.3℃ is acceptable
＜Reference example＞
Ta-IOUTMAX feature example with QFN0404-24C recommendation PCB pattern
VOUT(T)=1.8V
8.0
Measurement Condition
Condition
：Mount on a board
Soldering
：Lead (Pb) free
Board
：Dimensions 53 x 54 mm (2862 mm2 in one side)
(Reference pattern layout of QFN0404-24C)
Copper thickness
：18.35μm(Cu)＋20μm(plating)＝38.35μm
Material
：Glass Epoxy (FR-4)
Thickness
：1.2mm
Through-hole
：30×0.3 Diameter
8×0.8 Diameter
30×1.0 Diameter
IOUTMAX(A)
6.0
4.0
FOSC=3.0MHz VIN＝
5.0V
FOSC=3.0MHz VIN＝
3.7V
FOSC=1.2MHz VIN＝
5.0V
FOSC=1.2MHz VIN＝
3.7V
2.0
0.0
-50
-25
0
25
50
Ta(℃）
18/30
75
100
125
XC9266
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
XC9266B06C(VOUT=1.2V)
XC9266B06D(VOUT=1.2V)
100
90
80
70
60
50
40
30
20
10
0
PFM/PWM
VIN=5.0V
VIN=3.7V
PWM
VIN=5.0V
VIN=3.7V
1
10
100
1000
10000
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=91kΩ, RFB2=91kΩ, CFB=560pF
100
90
80
70
PFM/PWM
60
VIN=5.0V
VIN=3.7V
50
PWM
40
30
VIN=5.0V
20
VIN=3.7V
10
0
1
10
100
1000
10000
Efficiency: EFFI (%)
Efficiency: EFFI (%)
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=91kΩ, RFB2=91kΩ, CFB=560pF
Output Current: IOUT (mA)
Output Current: IOUT (mA)
XC9266B06D(VOUT=1.8V)
XC9266B06C(VOUT=1.8V)
100
90
80
70
60
50
40
30
20
10
0
VIN=5.0V
VIN=3.7V
PFM/PWM
PWM
VIN=5.0V
VIN=3.7V
1
10
100
1000
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF
100
90
80
70
PFM/PWM
VIN=5.0V
60
VIN=3.7V
PWM
50
40
30
VIN=5.0V
20
VIN=3.7V
10
Efficiency: EFFI (%)
Efficiency: EFFI (%)
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF
0
10000
1
Output Current: IOUT (mA)
PFM/PWM
PWM
10
100
1000
Output Current: IOUT (mA)
1000
10000
10000
XC9266B06C(VOUT=3.3V)
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 94μF(GRM31CR60J476ME19Lx2)
RFB1=68kΩ, RFB2=15kΩ, CFB=820pF
Efficiency: EFFI (%)
Efficiency: EFFI (%)
VIN=5.0V
1
100
Output Current: IOUT (mA)
XC9266B06D(VOUT=3.3V)
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 94μF(GRM31CR60J476ME19Lx2)
RFB1=68kΩ, RFB2=15Ω, CFB=820pF
100
90
80
70
60
50
40
30
20
10
0
10
100
90
80
70
60
50
40
30
20
10
0
VIN=5.0V
PFM/PWM
PWM
1
10
100
1000
10000
Output Current: IOUT (mA)
19/30
XC9266 Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
XC9266B06D(VOUT=1.8V)
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF MODE1= H
1.90
1.88
VIN=3.7,5.0V
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
10
0.1
1
100
1000
10000
XC9266B06D(VOUT=3.3V)
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 94μF(GRM31CR60J476ME19L)
RFB1=68kΩ, RFB2=15kΩ, CFB=820pF MODE1= H
3.60
Output Voltage: VOUT (V)
Output Voltage: VOUT (V)
(2) Output Voltage vs. Output Current
VIN=5.0V
3.50
3.40
3.30
3.20
3.10
3.00
0.1
1
Output Current: IOUT (mA)
10
1000
100
10000
Output Current: IOUT (mA)
(3) Ripple Voltage vs. Output Current
Ripple Voltage: Vr(mV)
100
90
80
70
60
50
40
30
20
10
0
PFM/PWM
VIN=3.7V
PWM
0.1
1
10
100
1000
XC9266B06D(VOUT=3.3V)
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 94μF(GRM31CR60J476ME19Lx2)
RFB1=68kΩ, RFB2=15kΩ, CFB=820pF
Ripple Voltage: Vr(mV)
XC9266B06D(VOUT=1.8V)
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 94μF(GRM31CR60J476ME19Lx2)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF
10000
Output Current: IOUT (mA)
XC9266B06C(VOUT=1.8V)
VIN=3.7V
10
100
1000
Output Current: IOUT (mA)
20/30
10000
Ripple Voltage: Vr(mV)
Ripple Voltage: Vr(mV)
PWM
1
VIN=5.0V
PWM
0.1
1
10
100
1000
10000
XC9266B06C(VOUT=3.3V)
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 94μF(GRM31CR60J476ME19Lx2)
RFB1=68kΩ, RFB2=15kΩ, CFB=820pF
PFM/PWM
0.1
PFM/PWM
Output Current: IOUT (mA)
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 94μF(GRM31CR60J476ME19Lx2)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
PFM/PWM
VIN=5.0V
0.1
1
PWM
10
100
Output Current: IOUT (mA)
1000
10000
XC9266
Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(4) Output Voltage vs. Ambient Temperature
(5) UVLO Voltage vs. Ambient Temperature
XC9266B06D(VOUT=1.8V)
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF MODE1=H(PWM)
XC9266B06D
1.815
VIN=5.0V
VIN=3.6V
VIN=2.7V
1.810
1.805
UVLO Voltage: UVLO (V)
Output Voltage: VOUT (V)
1.820
1.800
1.795
1.790
1.785
1.780
-50
-25
0
25
50
75
100
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
125
-50
-25
0
Ambient Temperature: Ta (℃)
(6) Quiescent Current vs. Ambient Temperature
75
100
125
XC9266B06D
5.0
VIN=5.0V,3.7V,2.7V
-50
-25
0
25
50
75
100
125
Standby Current: ISTB (μA)
Quiescent Current: Iq (μA)
50
(7) Stand-by Current vs. Ambient Temperature
XC9266B06D
100
90
80
70
60
50
40
30
20
10
0
25
Ambient Temperature: Ta (℃)
4.0
VIN=5.0V
3.0
VIN=3.7V
2.0
VIN=2.7V
1.0
0.0
-50
-25
0
Ambient Temperature: Ta (℃)
25
50
75
100
125
Ambient Temperature: Ta (℃)
(8) Oscillation Frequency vs. Ambient Temperature
XC9266B06D
XC9266B06C
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF MODE1=H (PWM)
6.0
5.0
VIN=5.0V
VIN=3.7V
VIN=3.0V
4.0
3.0
2.0
1.0
0
1000
2000
3000
4000
Output Current: IOUT (mA)
5000
6000
Oscillation Freqency: fOSC (MHz)
Oscillation Freqency: fOSC (MHz)
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF MODE1=H (PWM)
3.0
VIN=5.0V
VIN=3.7V
VIN=3.0V
2.5
2.0
1.5
1.0
0.5
0.0
0
1000
2000
3000
4000
5000
6000
Output Current: IOUT (mA)
21/30
XC9266 Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(9) Oscillation Frequency vs. Output Voltage
XC9266B06D
XC9266B06C
L = XAL6030 (0.56μH), MODE1=H (PWM)
Iout=1A, VIN=3.3V
6.0
Oscillation Freqency: f OSC (MHz)
Oscillation Freqency: f OSC (MHz)
L = XAL4020 (0.22μH), MODE1=H (PWM)
Iout=1A, VIN=3.3V
5.0
4.0
3.0
2.0
1.0
0
2
1
3
4
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
1
(10) Pch Driver ON Resistance vs. Ambient Temperature
150
100
50
-50
-25
0
25
50
75
100
125
Lx SW Nch ON Resistance: R LxL (mΩ)
(mΩ)
LxH
Lx SW Pch ON Resistance: R
V IN=5.0V
V IN=3.7V
V IN=2.7V
200
0
XC9266B06D
300
250
V IN=5.0V
V IN=3.7V
V IN=2.7V
200
150
100
50
0
-50
-25
XC9266B06D
V IN=5.5V
-25
0
25
50
75
Ambient Temperature : Ta (℃)
22/30
25
50
75
100
125
100
125
(13) LxSW”L” Leakage Current vs. Ambient Temperature
LxSW”L” Leakage Current: ILeakL (μA)
LxSW”H” Leakage Current: ILeakH (μA)
(12) LxSW”H” Leakage Current vs. Ambient Temperature
-50
0
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
50
45
40
35
30
25
20
15
10
5
0
4
(11) Nch Driver ON Resistance vs. Ambient Temperature
XC9266B06D
250
3
Output Voltage: V OUT (V)
Output Voltage: V OUT (V)
300
2
XC9266B06D
50
45
40
35
30
25
20
15
10
5
0
V IN=5.5V
-50
-25
0
25
50
75
Ambient Temperature : Ta (℃)
100
125
XC9266
Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(14) CE”H” Voltage vs. Ambient Temperature
(15) CE”L” Voltage vs. Ambient Temperature
XC9266B06D
1.4
1.2
1.2
CE”L” Voltage V CEL (V)
CE”H” Voltage V CEH (V)
XC9266B06D
1.4
1.0
0.8
0.6
V IN=5.0V
V IN=3.7V
V IN=2.7V
0.4
0.2
0.0
-50
-25
0
25
50
75
100
1.0
0.8
0.6
0.2
0.0
125
V IN=5.0V
V IN=3.7V
V IN=2.7V
0.4
-50
-25
Ambient Temperature: Ta (℃)
0
25
1.2
1.2
1.0
0.8
0.6
V IN=5.0V
V IN=3.7V
V IN=2.7V
-25
0
25
50
75
100
125
MODE1”L” Voltage V MODE1L (V)
MODE1”H” Voltage V MODE1H (V)
1.4
-50
1.0
0.8
0.6
0.4
V IN=5.0V
V IN=3.7V
V IN=2.7V
0.2
0.0
-50
-25
Ambient Temperature: Ta (℃)
0
1.2
1.2
1.0
0.8
0.6
V IN=5.0V
V IN=3.7V
V IN=2.7V
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
125
MODE2”L” Voltage V MODE2L (V)
MODE2”H” Voltage V MODE2H (V)
1.4
-50
75
100
125
XC9266B06D
XC9266B06D
0.0
50
(19) MODE2”L” Voltage vs. Ambient Temperature
1.4
0.2
25
Ambient Temperature: Ta (℃)
(18) MDOE2”H” Voltage vs. Ambient Temperature
0.4
125
XC9266B06D
1.4
0.0
100
(17) MODE1”L” Voltage vs. Ambient Temperature
XC9266B06D
0.2
75
Ambient Temperature: Ta (℃)
(16) MDOE1”H” Voltage vs. Ambient Temperature
0.4
50
1.0
0.8
0.6
0.4
V IN=5.0V
V IN=3.7V
V IN=2.7V
0.2
0.0
-50
-25
0
25
50
75
100
125
Ambient Temperature: Ta (℃)
23/30
XC9266 Series
■TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(20) MDOE3”H” Voltage vs. Ambient Temperature
XC9266B06D
1.2
1.0
0.8
0.6
V IN=5.0V
V IN=3.7V
V IN=2.7V
0.4
0.2
0.0
-50
-25
0
25
50
XC9266B06D
1.4
75
100
125
MODE3”L” Voltage V MODE3L (V)
1.4
MODE3”H” Voltage V MODE3H (V)
(21) MODE3”L” Voltage vs. Ambient Temperature
1.2
1.0
0.8
0.6
V IN=5.0V
V IN=3.7V
V IN=2.7V
0.4
0.2
0.0
-50
-25
(22) Current Limit vs. Ambient Temperature
Soft-Start Time: tSS (ms)
Current Limit: ILIMH (A)
11
10
9
V IN=5.0V
V IN=3.7V
V IN=2.7V
7
6
-50
-25
0
25
50
75
100
125
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
25
50
75
Ambient Temperature: Ta (℃)
24/30
100
125
CL Discharge Resistance: R DCHG (Ω)
Soft-Start Time tso (ms)
V IN=5.0V,3.6V,2.7V
0
125
100
125
V IN=2.7V
V IN=3.6V
V IN=5.0V
-50
-25
0
25
50
75
(25) CL Discharge Resistance vs. Ambient Temperature
XC9266B06D
-25
100
Ambient Temperature: Ta (℃)
(24) Soft - off Time vs. Ambient Temperature
-50
75
XC9266B06D
CSS = open
Ambient Temperature : Ta (℃)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
50
(23)Soft-Start Time vs. Ambient Temperature
XC9266B06D
8
25
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
12
0
XC9266B06D
300
250
200
V IN=5.0V
V IN=3.7V
V IN=2.7V
150
100
50
0
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
125
XC9266
Series
■ TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
XC9266B06D
PG detect voltage V Ｐ Ｇ (V)
1.4
1.2
1.0
0.8
V IN=5.0V,3.6V,2.7V
0.6
0.4
0.2
0.0
-50
-25
0
25
50
75
Ambient Temperature: Ta (℃)
100
125
Short Protection Threshold V SHORT (V)
(27) Short Protection Threshold vs. Ambient Temperature
(26) PG detect voltage vs. Ambient Temperature
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
XC9266B06D
V IN=5.0V,3.6V,2.7V
-50
-25
0
25
50
75
100
125
Ambient Temperature: Ta (℃)
25/30
XC9266 Series
■ TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(28) Load Transient Response
XC9266B06D
V IN = 5.0V V OUT = 1.2V f OSC = 3.0MHz IOUT = 0.1A ⇒ 6.0A
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=91kΩ, RFB2=91kΩ, CFB=560pF MODE1=H (PWM)
XC9266B06D
V IN= 5.0V V OUT = 1.2V f OSC= 3.0MHz IOUT = 0.1A ⇒ 6.0A
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=91kΩ, RFB2=91kΩ, CFB=560pF MODE1=Ｌ (PFM/PWM)
VOUT:100mV/div
VOUT:100mV/div
IOUT:6.0A
IOUT:0.1A
20μs/div
XC9266B06D
V IN= 5.0V V OUT = 1.8V f OSC = 3.0MHz IOUT = 0.1A ⇒ 6.0A
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF MODE1=H (PWM)
VOUT:100mV/div
IOUT:0.1A
IOUT:0.1A
20μs/div
XC9266B06D
V IN = 5.0V V OUT = 3.3V f OSC = 3.0MHz IOUT = 0.1A ⇒ 6.0A
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL= 94μF(GRM31CR60J476ME19Lx2)
RFB1=68kΩ, RFB2=15kΩ, CFB=820pF MODE1=H (PWM)
VOUT:100mV/div
XC9266B06D
VIN = 5.0V V OUT = 1.8V f OSC = 3.0MHz IOUT = 0.1A ⇒ 6.0A
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF MODE1=Ｌ (PFM/PWM)
IOUT:6.0A
20μs/div
IOUT:0.1A
XC9266B06D
V IN= 5.0V V OUT = 3.3V f OSC = 3.0MHz IOUT= 0.1A ⇒ 6.0A
L = XAL4020 (0.22μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 94μF(GRM31CR60J476ME19Lx2)
RFB1=68kΩ, RFB2=15kΩ, CFB=820pF MODE1=Ｌ (PFM/PWM)
VOUT:100mV/div
IOUT:6.0A
26/30
20μs/div
VOUT:100mV/div
IOUT:6.0A
IOUT:0.1A
IOUT:6.0A
IOUT:6.0A
20μs/div
IOUT:0.1A
20μs/div
XC9266
Series
■ TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
(28) Load Transient Response
XC9266B06C
V IN = 5.0V V OUT = 1.2V f OSC = 1.2MHz IOUT = 0.1A ⇒ 6.0A
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=91kΩ, RFB2=91kΩ, CFB=560pF MODE1=H (PWM)
XC9266B06C
V IN= 5.0V V OUT = 1.2V f OSC = 1.2MHz IOUT = 0.1A ⇒ 6.0A
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=91kΩ, RFB2=91kΩ, CFB=560pF MODE1=Ｌ (PFM/PWM)
VOUT:200mV/div
VOUT:200mV/div
IOUT:6.0A
IOUT:6.0A
20μs/div
IOUT:0.1A
XC9266B06C
V IN = 5.0V V OUT = 1.8V f OSC = 1.2MHz IOUT = 0.1A ⇒ 6.0A
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF MODE1=H (PWM)
XC9266B06C
V IN = 5.0V V OUT = 1.8V f OSC = 1.2MHz IOUT = 0.1A ⇒ 6.0A
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 47μF(GRM31CR60J476ME19L)
RFB1=36kΩ, RFB2=18kΩ, CFB=1500pF MODE1=Ｌ (PFM/PWM)
VOUT:200mV/div
VOUT:200mV/div
IOUT:6.0A
IOUT:6.0A
20μs/div
IOUT:0.1A
XC9266B06C
V IN = 5.0V V OUT = 3.3V f SOC = 1.2MHz IOUT = 0.1A ⇒ 6.0A
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 94μF(GRM31CR60J476ME19Lx2)
RFB1=68kΩ, RFB2=15kΩ, CFB=820pF MODE1=H (PWM)
20μs/div
IOUT:0.1A
XC9266B06C
V IN = 5.0V V OUT = 3.3V f OSC = 1.2MHz IOUT = 0.1A ⇒ 6.0A
L = XAL6030 (0.56μH), CIN = 47μF(GRM31CR61A476ME15L)
CL = 94μF(GRM31CR60J476ME19Lx2)
RFB1=68kΩ, RFB2=15kΩ, CFB=820pF MODE1=Ｌ (PFM/PWM)
VOUT:200mV/div
VOUT:200mV/div
IOUT:6.0A
IOUT:0.1A
20μs/div
IOUT:0.1A
IOUT:6.0A
20μs/div
IOUT:0.1A
20μs/div
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XC9266 Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
OUTLINE / LAND PATTERN
QFN0404-24C
QFN0404-24C PKG
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THERMAL CHARACTERISTICS
Standard Board
QFN0404-24C Power Dissipation
XC9266
Series
■MARKING RULE
QFN0404-24C
① represents product series
MARK
PRODUCT SERIES
6
XC9266*****-G
18
④,⑤
12
T
② represents Type and Adjustable Output Voltage
MARK
PRODUCT SERIES
B
XC9266B06***-G
③ represents Oscillation Frequency
MARK
frequency
C
1.2MHz
D
3.0MHz
13
19
O
R
E
① ②
③
④ ⑤
X
24
7
1
6
(''TOREX'' in the figure is fixed)
PRODUCT SERIES
XC9266***C**-G
XC9266***D**-G
represents production lot number
01～09、0A～0Z、11～9Z、A1～A9、AA～AZ、B1～ZZ in order.
(G，I，J，O，Q，W excluded)
* No character inversion used.
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XC9266 Series
1.
The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2.
The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3.
Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4.
The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5.
Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6.
Our products are not designed to be Radiation-resistant.
7.
Please use the product listed in this datasheet within the specified ranges.
8.
We assume no responsibility for damage or loss due to abnormal use.
9.
All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
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