XC9519 Series
ETR0710-009
Dual Output Step-Up/Inverting DC/DC Converter
■GENERAL DESCRIPTION
The XC9519 series is a 2 channel (step-up and inverting) DC/DC converter IC. One DC/DC converter is a step-up DC/DC and the other is an
inverting DC/DC converter. The step-up converter compares a built-in reference voltage 1.0V to the FBP voltage (accuracy ±1.5%) and a
positive output voltage can be set freely with the external components up to 18V. The inverting DC/DC converter compares a difference
between a reference voltage and the FBN voltage (accuracy ±1.5%) to the GND, then a negative output voltage can be set until -15V with the
external components.
With a 1.2MHz frequency, the size of the external components can be reduced. As for operation mode, the device can be selected to use PWM
control or automatic PWM/PFM switching control by the MODE pin. In the automatic PWM/PFM switching control mode, control switches from
PWM to PFM during light loads. The series is highly efficient from light loads through to large output currents. In the PWM control mode,
noise is easily reduced since the frequency is fixed. The control mode can be selected for each application. The soft start and current control
functions are internally optimized. During stand-by, all circuits in the IC are shutdown to reduce current consumption to as low as 1.0μA or
less. The device includes a gate control pin for the P-channel MOSFET which is used for a load disconnection at the stand-by mode. The
GAINP and GAINN pins are used for loop compensation in order to optimize load transient response. With the built-in UVLO (Under Voltage
Lock Out) function, the internal driver transistor is forced OFF when input voltage becomes 2.2V or lower.
■FEATURES
■APPLICATIONS
Input Voltage
Output Current
Positive Output Voltage
Negative Output Voltage
Oscillation Frequency
Soft-Start Circuit Built-In
: 2.7V ~ 5.5V
: 500mA @VIN=3.7V, VOUTP=5.0V, VOUTN=-5.0V
(*1)
o
: 4.0V ~ 18.0V (accuracy ±1.5% @25 C)
(*2)
o
: -15.0V ~ -4.0V (accuracy ±1.5% @25 C)
: 1.2MHz
: Step-up DC/DC converter 2.5ms (TYP.)
: Inverting DC/DC converter 2.2ms (TYP.)
Protection Circuits
: Over Current Limit (Integral Latching)
Short Protection Latching
UVLO
Thermal Shutdown
Over Voltage Protection
Function Addition
: Control Pin
Load disconnect Pin
Phase Compensation Pin
Ceramic Capacitor Compatible
Operating Ambient Temperature
: -40℃ ~ +85℃
Package
: QFN-24
Environmentally Friendly
: EU RoHS Compliant, Pb Free
（*1）VOUTPSET≧VIN + 0.2V (VOUTPSET :Positive output voltage range)
●AMOLED
- Smartphones
- Tablet PCs
- Automotive navigation systems
●CCD image sensors
- Surveillance cameras
●e-paper
-e-Books
（*2）VIN - VOUTNSET+ VFN≦21.0V
(VFN : Forward voltage of SBDN, VOUTNSET : Nagative output voltage range)
■TYPICAL PERFORMANCE
CHARACTERISTICS
■TYPICAL APPLICATION CIRCUIT
VOUTP=5.0V, VOUTN=-5.0V, IOUTP=IOUTN
CLP, CLN=4×4.7μF, LP, LN=3.3μH (VLF5014S-3R3M2R0), SBDP, SBDN: CMS03
LP
P-ch MOS: EMH1303, RZP=7.5kΩ, CZP=4.7nF, RZN=130kΩ, CZN=0.47nF
SBDP
VOUTP
100
CFBP
P-ch MOS
LXP
BSW
PVIN
VIN
CIN_SW CIN_P
CIN_A
RSP
CLP
VREF
RFBN2
AVIN
ENP
VENP="H",VENN="H"
RFBP1
VOUTP
FBP
RFBP2
FBN
XC9519
ENN
MODE
AGND
VOUTN
PGND
LXN
GAINP
CL_VR
RFBN1
VOUTN
RZN
CZP
CZN
VIN= 4.4V
60
3.6V
2.7V
40
20
SBDN
PWM/PFM (VMODE="H")
PWM (VMODE="L")
CLN
GAINN
RZP
80
Efficiency:EFFI(%)
SWP
LN
0
0.1
1
10
100
1000
Output Current:IOUT P, IOUT N (mA)
1/38
XC9519 Series
■BLOCK DIAGRAM
Internal ON/OFF Controller
* Diodes inside the circuit are an ESD protection diode and a parasitic diode.
■PRODUCT CLASSIFICATION
●Ordering Information
XC9519①②③④⑤⑥-⑦
DESIGNATOR
ITEM
SYMBOL
①
UVLO Detect Voltage
A
UVLO Detect Voltage 2.2V
UVLO Hysteresis width 0.2V
②③
Oscillation Frequency
12
1.2 MHz
④
Maximum Current Limit
A
2.0A
Package (Order Unit)
ZR-G
⑤⑥-⑦
(*1)
(*2)
2/38
(*1)
DESCRIPTION
QFN-24 (1,000/Reel) (*2)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
The XC9519 reels are shipped in a moisture-proof packing.
XC9519
Series
■PIN CONFIGURATION
*1
*1: The back metal pad, AGND pin and two PGND pins (No. 21 and 22) should be connected outside.
■ PIN ASSIGNMENT
PIN NUMBER
QFN-24
PIN NAME
1, 2
PVIN
3
NC
FUNCTION
Power Supply Input 1
No Connection
4, 5
LXN
6
VOUTN
Detect Monitoring of Inverting DC/DC Output Voltage
7
8
MODE
Selection Pin for Control Mode
VREF
Reference Output Voltage
9
AVIN
Power Supply Input 2
10
FBN
Feedback Pin for Inverting DC/DC Converter
11
GAINN
Loop Compensation Pin for Inverting DC/DC Converter
12
AGND
Analog Ground
13
GAINP
Loop Compensation Pin for Step-Up DC/DC Converter
14
FBP
Feedback Pin for Step-Up DC/DC Converter
15
ENP
Chip Enable Pin for Step-Up DC/DC Converter
16
BSW
P-channel MOS FET Gate Control Pin
17
VOUTP
18, 19
LXP
Switching Output of Step-Up DC/DC Converter
20
NC
No Connection
21, 22
PGND
Power Ground
Switching of Inverting DC/DC Converter
Output Voltage Sense for Step-Up DC/DC Converter
23
ENN
Chip Enable Pin for Inverting DC/DC Converter
24
SWP
Detect Monitoring Voltage Pin for P-channel MOS FET Drain
3/38
XC9519 Series
■FUNCTION
1. ENP Pin Function
ENP PIN
H
L
STATUS
Step-up DC/DC Converter Active
Step-up DC/DC Converter Stand-by
* Please do not leave the ENP pin open.
VIN
ENP
0V
VIN
BSW
0V
2.5ms
VOUTP
VIN
0V
2. ENN Pin Function
ENN PIN
H
L
STATUS
Inverting DC/DC Converter Active
Inverting DC/DC Converter Stand-by
* Please do not leave the ENP pin open.
VIN
ENN
0V
2.2ms
0V
VOUTN
3. MODE Pin Function
MODE PIN
H
L
STATUS
Auto PWM/PFM
PWM Control
* Please do not leave the MODE pin open.
4/38
XC9519
Series
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
PVIN Pin Voltage
AVIN Pin Voltage
ENP Pin Voltage
ENN Pin Voltage
MODE Pin Voltage
LXP Pin Voltage
LXN Pin Voltage
FBP Pin Voltage
FBN Pin Voltage
VOUTP Pin Voltage
VOUTN Pin Voltage
BSW Pin Voltage
SWP Pin Voltage
VREF Pin Voltage
GAINP Pin Voltage
GAINN Pin Voltage
LXP Pin Current
LXN Pin Current
Power Dissipation
Operating Ambient Temperature
Storage Temperature
VPVIN
VAVIN
VENP
VENN
VMODE
VLXP
VLXN
VFBP
VFBN
VOUTP
VOUTN
VBSW
VSWP
VREF
VGAINP
VGAINN
ILXP
ILXN
Pd
Topr
Tstg
-0.3 ~ +6.0
-0.3 ~ +6.0
-0.3 ~ +6.0
-0.3 ~ +6.0
-0.3 ~ +6.0
-0.3 ~ +22.0
VPVIN -22.0 ~ VPVIN +0.3
-0.3 ~ +6.0
-0.3 ~ +6.0
-0.3 ~ +22.0
VAVIN -22.0 ~ VAVIN +0.3
-0.3 ~ +6.0
-0.3 ~ +6.0
-0.3 ~ +6.0
-0.3 ~ +6.0
-0.3 ~ +6.0
4000
4000
1500 (PCB mounted) *
-40 ~ +85
-55 ~ +125
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
mA
mA
mW
o
C
o
C
* All voltages are described based on the AGND and PGND pin.
* The value is an example of data which is taken with the PCB mounted. Please refer to our web site for details.
5/38
XC9519 Series
■ELECTRICAL CHARACTERISTICS
●XC9519 Series, Common Characteristics
PARAMETER
SYMBOL
Input Voltage
VIN
UVLO Detect Voltage
VUVLO
UVLO Release Voltage
VUVLOR
UVLO Hysteresis Range
VUVLOH
fOSC=1.2MHz
CONDITIONS
(*1)
Ta=25℃
MIN.
TYP.
MAX.
UNITS
CIRCUIT
2.7
-
5.5
V
-
VENP =1.5V , VENN = VFBP = 0V, VFBN = 0.1V
The voltage which LXP stops oscillation while
VIN is decreasing from 2.4V.
2.0
2.2
2.4
V
⑨
VENP =1.5V , VENN = VFBP = 0V, VFBN = 0.1V
The voltage which LXP starts oscillation while
VIN is increasing from VUVLO.
2.2
2.4
2.6
V
⑨
VUVLOH = VUVLOR - VUVLO
-
0.2
-
V
-
50
170
450
μA
①
Supply Current 1
IDD1
VIN =VENP = VENN = VMODE = 5.5V
VFBP =5.5V, VFBN = -0.1V, VOUTP = VSWP = 5.5V
Supply Current 2
IDD2
VIN = VENN = VMODE = 5.5V, VENP = 0V
VFBN = -0.1V
30
90
250
μA
①
Supply Current 3
IDD3
VIN =VENP = VMODE = 5.5V, VENN =0V
VFBP = 5.5V, VOUTP = VSWP = 5.5V
30
110
250
μA
①
Stand-by Current
ISTB
VIN =5.5V, VENP =VENN = VMODE = 0V
-
0
1.0
μA
①
ENP ”H” Voltage
VENPH
VIN = 5.5V, VENN = VMODE = 0V, VFBP = 0V
The voltage which LXP starts oscillation while
VENP is increasing from 0.3V.
1.4
-
5.5
V
⑦
ENP ”L” Voltage
VENPL
VIN = 5.5V, VENN = VMODE = 0V, VFBP = 0V
The voltage which LXP stops oscillation while
VENP Is decreasing from 1.4V.
AGND
-
0.3
V
⑦
ENP ”H” Current
IENPH
VIN = VENP = 5.5V
-0.1
-
0.1
μA
⑦
ENP ”L” Current
IENPL
-0.1
-
0.1
μA
⑦
ENN ”H” Voltage
VENNH
1.4
-
5.5
V
⑦
ENN ”L” Voltage
VENNL
VIN = VENP = 0V
VIN = 5.5V, VENP = VMODE = 0V, VFBN = 5.5V
The voltage which LXN starts oscillation while
VENN is increasing from 0.3V.
VIN = 5.5V, VENP = VMODE = 0V, VFBN = 5.5V
The voltage which LXN stops oscillation while
VENN is decreasing from 1.4V.
AGND
-
0.3
V
⑦
ENN ”H” Current
IENNH
VIN = VENN = 5.5V
-0.1
-
0.1
μA
⑦
ENN ”L” Current
IENNL
-0.1
-
0.1
μA
⑦
MODE ”H” Voltage
VMODEH
1.4
-
5.5
V
⑦
MODE ”L” Voltage
VMODEL
AGND
-
0.3
V
⑦
MODE ”H” Current
IMODEH
VIN = VENN = 0V
VIN = VENP = 5.5V, VENN = 0V,
The voltage which supply current decreases
while VMODE is increasing from 0.3V.
VIN = VENP = 5.5V, VENN = 0V,
The voltage which supply current increases while
VMODE is decreasing from 1.4V.
VIN = VMODE = 5.5V
-0.1
-
0.1
μA
⑦
MODE ”L” Current
FBP ”H” Current
FBP ”L” Current
FBN ”H” Current
FBN ”L” Current
SWP ”H” Current
SWP ”L” Current
IMODEL
IFBPH
IFBPL
IFBNH
IFBNL
ISWPH
ISWPL
-0.1
-0.1
-0.1
-0.1
-0.1
-0.1
-0.1
-
0.1
0.1
0.1
0.1
0.1
0.1
0.1
μA
μA
μA
μA
μA
μA
μA
⑦
⑦
⑦
⑦
⑦
⑦
⑦
Integral Latch Time
tLAT
1.0
2.0
3.0
ms
⑤
TTSD
-
150
-
o
-
TTSDR
-
130
-
o
-
-
20
-
o
-
Thermal Shutdown
Temperature
Thermal Shutdown
Release Temperature
Thermal Shutdown
Hysteresis Range
THYS
VIN = VMODE = 0V
VIN =5.5V, VENP =VENN =VMODE =0V, VFBP =5.5V
VIN =5.5V, VENP =VENN =VMODE =0V, VFBP =0V
VIN =5.5V, VENP =VENN =VMODE =0V, VFBN =5.5V
VIN =5.5V, VENP =VENN =VMODE =0V, VFBN =0V
VIN =5.5V, VENP =VENN =VMODE =0V, VSWP =5.5V
VIN =5.5V, VENP =VENN =VMODE =0V, VSWP =0V
VIN =VENP =VENN = 5.5V, VMODE =0V
VFBP =0.9V, VFBN = 0.1V
Time to stop operation from the start of maximum
current limit status.
THYS =TTSDR - TTSD
(*1) If the applied voltage and its pin name are not stated, those pins are left open for measurement.
6/38
C
C
C
XC9519
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC9519 Series, Step-up DC/DC Converter
PARAMETER
SYMBOL
Output Voltage Range
VOUTPSET
Ta=25℃
CONDITIONS
(*1)
MIN.
4.0
(*2)
TYP.
MAX.
UNITS
CIRCUIT
-
18.0
V
-
FBP Voltage
VFBP
VIN = VENP = 3.6V, VENN = VMODE = 0V
VOUTP = VSWP = 3.6V
The voltage which LXP starts oscillation while
VFBP is decreasing.
Oscillation Frequency
fOSCP
VIN = VENP = 3.6V, VENN = VMODE = 0V
VOUTP = VSWP = 3.6V, VFBP =0V
1020
1200
1380
kHz
③
PFM Switching Current
IPFMP
VIN =VENP = VMODE = 3.6V, VENN =0V
180
350
550
mA
⑧
DMAXP
VIN = VENP = 3.6V, VENN = VMODE = 0V
VOUTP = VSWP = 3.6V, VFBP =0V
84
90
97
%
③
RLXPH
VIN = VENP = 3.6V, VENN = VMODE = 0V, ILXP = 100mA
-
0.12
0.28
Ω
④
ILEAKH
VIN =5.5V, VENP=0V, VLXP=5.5V
-
0.01
1.0
μA
⑥
ILIMP
VIN =VENP = 5.5V, VENN = VMODE =0V
VFBP = 0.9V, VOUTP = VSWP = 5.5V
2000
-
4000
mA
⑤
-
±100
-
ppm / C
-
0.8
2.5
5.2
ms
③
0.3
0.5
0.7
V
⑤
VFBP
+0.03
VFBP
+0.07
VFBP
+0.10
V
③
0.2
1.2
3.0
mA
⑦
50
200
500
Ω
②
Maximum Duty Cycle
LXP SW “H” ON
Resistance
LXP SW “H” Leak
Current
Maximum Current Limit
(*3)
FBP Voltage
Temperature
Characteristics
Soft-Start Time
Short Protection
Threshold Voltage
VFBP /
(VFBP・ Topr)
tSSP
VSHORTP
Over Voltage
Protection Limit
VOVPP
BSW Pin Current
IBSW
CL Discharge Resistance
RDCHGP
o
o
-40 C≦Topr≦85 C
VIN = 3.6V, VENN = VMODE = 0V
VOUTP = VSWP = 3.6V, VFBP = 0.95V
Time to start LXP oscillation from the rise of VENP.
(0V→3.6V)
VIN =VENP = 5.5V, VENN = VMODE =0V
VOUTP = VSWP = 5.5V
The voltage which the integral latch time
becomes 200μs or less while VFBP is decreasing.
VIN = VENP = 3.6V, VENN = VMODE = 0V
VOUTP = VSWP = 3.6V, VGAINP = 3.6V
The voltage which LXP stops oscillation while
VFBP is increasing.
VIN = VENP = 3.6V, VENN = VMODE = 0V
VOUTP = VSWP = 3.6V, VBSW =3.6V
VIN = 6.0V, VENP =VENN = VMODE = 0V
VOUTP = 4.0V
0.985
1.000
1.015
V
③
o
NOTE:
(*1) If the applied voltage and its pin name are not stated, those pins are left open for measurement.
(*2) Input voltage or positive output voltage range should be VOUTPSET≧VIN + 0.2V.
(*3) Maximum current limit denotes the level of detection at peak of coil current.
7/38
XC9519 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC9519 Series, Inverting DC/DC Converter
Ta=25℃
PARAMETER
SYMBOL
Output Voltage Range
VOUTNSET
FBN Voltage
VFBN
CONDITIONS
(*1)
MIN.
TYP.
MAX.
UNITS
CIRCUIT
-
-4.0
V
-
-26
0
26
mV
③
-15.0
VIN = VENN = 3.6V, VENP = VMODE = 0V
The voltage which LXN starts oscillation while
VFBN is increasing.
(*2)
VIN = VENN = 3.6V, VENP = VMODE = 0V, VFBN= 0.1V
0.970
1.000
1.030
V
①
VOUTNA =VREF -VFBN
0.985
1.000
1.015
V
-
fOSCN
VIN = VENN = 3.6V, VENP = VMODE = 0V, VFBN= 0.1V
1020
1200
1380
kHz
③
PFM Switching Current
IPFMN
VIN = VENN = VMODE = 3.6V, VENP = 0V
220
350
550
mA
⑧
Maximum Duty Cycle
DMAXN
VIN = VENN = 3.6V, VENP = VMODE = 0V, VFBN= 0.1V
84
90
97
%
③
RLXNL
VIN = VENN = 3.6V, VENP = VMODE = 0V, ILXN = 100mA
-
0.22
0.48
Ω
④
ILEAKL
VIN = VENN = 3.6V, VENP = VMODE = 0V, VFBN= 0.1V
-
0.01
1.0
μA
⑥
ILIMN
VIN = VENN = 5.5V, VENP = VMODE = 0V
VFBN = 0.1V
2000
-
4000
mA
⑤
-
±100
-
ppm / C
-
0.8
2.2
4.0
ms
③
0.3
0.5
0.7
V
⑤
VFBN
-0.10
VFBN
-0.07
VFBN
-0.03
V
③
50
200
500
Ω
②
Reference Voltage
VREF
Output Voltage Accuracy
VOUTNA
Oscillation Frequency
LXN SW “L” ON
Resistance
LXN SW “L” Leak
Current
Maximum Current Limit
(*3)
Reference Voltage
Temperature
Characteristics
Soft-Start Time
Short Protection
Threshold Voltage
VREF /
(VREF・ Topr)
tSSN
VSHORTN
Over Voltage
Protection Limit
VOVPN
CL Discharge Resistance
RDCHGN
o
o
-40 C≦Topr≦85 C
VIN = 3.6V, VENP = VMODE = 0V, VFBN = 0.05V
Time to start LXN oscillation from the rise of VENP.
(0V→3.6V)
VIN = VENN = 5.5V, VENP = VMODE = 0V
The voltage which the integral latch time
becomes 200μs or less while VFBN is increasing.
VIN = VENN = 3.6V, VENP = VMODE = 0V, VGAINN = 3.6V
The voltage which LXN stops oscillation while
VFBN is decreasing.
VIN = 6.0V, VENP =VENN = VMODE = 0V
VOUTN = -4.0V
o
NOTE:
(*1) If the applied voltage and its pin name are not stated, those pins are left open for measurement.
(*2) Input voltage or positive output voltage range should be VIN - VOUTNSET+ VFN≦21.0V (VFN: Forward voltage of external schottky barrier
diode) .
(*3) Maximum current limit denotes the level of detection at peak of coil current.
8/38
XC9519
Series
■OPERATIONAL EXPLANATION
The XC9519 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation circuit,
driver transistor, current limiter circuit, short protection circuit, UVLO circuit, thermal shutdown circuit, over voltage protection, load disconnect
control and others. (See the block diagram below.)
By using the error amplifier, the FBP (FBN) pin voltage is compared with the internal reference voltage. The error amplifier output is sent to the
PWM comparator in order to determine the duty cycle of PWM switching. The signal from the error amplifier is compared with the ramp wave from
the ramp wave circuit, and the resulting output is delivered to the buffer driver circuit to provide on-time of the duty cycle at the LXP (LXN) pin.
This process is continuously performed to ensure stable output voltage.
The current feedback circuit monitors the driver transistor current for each switching operation, and modulates the error amplifier output signal
to provide multiple feedback signals. This enables a stable feedback loop even when using a low ESR capacitor such as ceramic, which results in
ensuring stable output voltage.
Internal ON/OFF Controller
* Diodes inside the circuit are an ESD protection diode and a parasitic diode.
9/38
XC9519 Series
■OPERATIONAL EXPLANATION (Continued)
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
The step-up DC/DC converter error amplifier is an amplifier for output voltage monitoring. The FBP pin voltage is compared to the reference
voltage. When a voltage lower than the reference voltage is feedback to the FBP pin voltage, the output voltage of the error amplifier goes high.
External compensation of the error amplifier frequency characteristic is also possible.
The inverting DC/DC converter error amplifier is an amplifier for output voltage monitoring. The FBN pin voltage is compared to GND. When a
voltage higher than GND is feedback to the FBN pin voltage, the output voltage of the error amplifier goes high. External compensation of the
error amplifier frequency characteristic is also possible.
The ramp wave circuit determines switching frequency. The frequency is fixed 1.2MHz internally. Clock pulses generated in this circuit are
used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits.
When the AVIN pin voltage becomes 2.2V or lower, the driver transistor is forced OFF to prevent false pulse output caused by unstable
operation of the internal circuitry. When the AVIN pin voltage becomes 2.4V or higher, switching operation takes place. By releasing the UVLO
function, the IC performs the soft start function to initiate output startup operation. The soft start function operates even when the AVIN pin
voltage falls momentarily below the UVLO detect voltage. The UVLO circuit does not cause a complete shutdown of the IC, but causes pulse
output to be suspended; therefore, the internal circuitry remains in operation.
For protection against heat damage of the ICs, thermal shutdown function monitors chip temperature. The thermal shutdown circuit starts
o
o
operating and the driver transistor will be turned off when the chip’s temperature reaches 150 C. When the temperature drops to 130 C or less
after shutting of the current flow, the IC performs the soft start function to initiate output startup operation.
In PFM control operation, until coil current reaches to a specified level (IPFMP, IPFMN), the IC keeps the driver transistor on. In this case, time
(tON) that the driver transistor is kept on can be given by the following formula.
tON = L ×IPFMP (IPFMN) / VIN
< PFM Duty Limit >
In PFM control operation, the maximum duty cycle (DTYLIMIT_PFM) is set to 50% (TYP.). Therefore, under the condition that the duty increases
(e.g. the condition that the step-up ratio is large), it’s possible for the driver transistor to be turned off even when the coil current doesn’t reach to IPFMP
(IPFMN).
10/38
XC9519
Series
■OPERATIONAL EXPLANATION (Continued)
< CL Auto-Discharge Function >
This function enables high-speed discharge of the charge on the output capacitor (CL) when an L level signal is input to the ENP (ENN) pin by
means of the internal switch between the VOUTP pin and AGND pin (between the VOUTN pin and AVIN pin).
This function makes it possible to prevent malfunctioning of applications caused by charge remaining on CL.
The discharge time is determined by the CL discharge resistance (RDCHC) and CL. Ifτ(τ= CL × RDCHG) is the time constant of CL and RDCHG, the
equation for the output voltage discharge time can be obtained from the following CR discharge equation.
ｔ=τln（VOUTSET / V）
V: Output voltage during discharge
VOUTSET: Output voltage
t: Discharge time
τ: CL×RDCHG
[Example]
When the set voltage (VOUTPSET)=5.0V, CLP=18.8μF, and the CL discharge resistance (RDCHGP)=200Ω (TYP.) of the DC/DC Converter, the
discharge time t from the start of CL high-speed discharge until the output voltage falls to 1.0V can be calculated as follows:
ｔ=τln ( VOUTPSET / V )= CLP×RDCHGP ln ( VOUTPSET / V ) = 18.8μF×200Ω×ln ( 5.0V / 1.0V ) = 6.05×10-3 s = 6.05 ms (*1)
(*1) Calculated with IOUT = 0mA
The step-up DC/DC Converter and the Inverting DC/DC Converter are switching synchronously based on one internal clock. The phase of
the step-up driver on timing for the DC/DC Converter is shifted to completely opposite position (180 degrees different) upon the phase of driver
on timing for the Inverting DC/DC Converter.
1.2MHz
Internal OSC
Inductor Peak Current
Boost_ILX
0A
Inductor Peak Current
Inverting_ILX
0A
Overvoltage protection monitors the output voltage VOUTP (VOUTN) using the FBP (FBN) pin voltage, and prevents the output voltage VOUTP
(VOUTN) from rising too far above the set voltage. In particular, fluctuations in the load cause the output voltage to rise, and when the FBP (FBN)
pin voltage reaches the overvoltage protection detection voltage, the driver transistor of the step-up DC/DC converter (inverting DC/DC
converter) is turned off to hold down the rise of output voltage. When the output voltage falls after overvoltage protection detection, normal
DC/DC converter operation resumes.
The output voltage VOUT_OVP that is detected by overvoltage protection is obtained from the following equation:
VOUT_OVP P (VOUT_OVPN)=VOUTPSET (VOUTNSET) × VOVP P (VOVPN)
VOUTPSET (VOUTNSET): Output voltage, VOVPP(VOVPN): Detect Overvoltage Protection Voltage
[Example]
In a step-up DC/DC converter with the indicated conditions, the output voltage VOUT_OVPP that is detected by overvoltage protection can be
calculated as shown below.
Condition: Output Voltage (VOUTPSET)=5.0V, VOVPP=VFBP+0.07V(TYP.) , VFBP=1.0V(TYP.)
VOUT_OVPP = VOUTPSET × VOVP = 5.0V × (1.0 + 0.07(TYP.)) =5.0V × 1.07 = 5.35V
The Load disconnect control circuit makes it possible to break continuity between VIN and VOUTP by turning off the external P-ch MOS FET when the
step-up DC/DC converter is in the standby state.
11/38
XC9519 Series
■OPERATIONAL EXPLANATION (Continued)
The current limiter circuit of the XC9519 series monitors the current flowing through the driver transistor, and features a combination of the
current limit mode and the operation suspension mode.
① When the driver current is greater than a specific level, the current limit function operates to turn off the pulses from the LXP (LXN) pin at any
given timing.
② When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state.
③ At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over current state.
④ When the over current state is eliminated, the IC resumes its normal operation.
The IC waits for the over current state to end by repeating the steps ① through ③. If an over current state continues for the integral latch time
and the above three steps are repeatedly performed, the IC performs the function of integral latching the OFF state of the driver transistor, and
goes into operation suspension mode.
Once the IC is in suspension mode, operations can be resumed by either turning the IC off via the ENP (ENN) pin, or by restoring power. Care
must be taken when laying out the PC Board, in order to prevent misoperation of the current limit mode. Depending on the state of the PC Board,
latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the board should be laid out so that input
capacitors are placed as close to the IC as possible.
(a) Step-up DC/DC Converter
Limit < 2.0ms(TYP.)
Limit > 2.0ms(TYP.)
Current Limit Level
IOUTP
0mA
VOUTP
AGND,PGND
VLXP
ENP
Restart
AGND,PGND
(b) Inverting DC/DC Converter
Limit < 2.0ms(TYP.)
Limit > 2.0ms(TYP.)
Current Limit Level
IOUTN
0mA
AGND,PGND
VOUTN
VLXN
ENN
Restart
AGND,PGND
The short-circuit protection circuit monitors the output voltage from the VOUTP (VOUTN). In case where output is accidentally shorted to the GND
and when the FBP voltage decreases less than short protection threshold voltage or FBN pin voltage becomes larger than short protection
threshold voltage and a current more than the ILIM flows to the driver transistor, the short-circuit protection quickly operates to turn off and to latch
the driver transistor.
Once the IC is in suspension mode, operations can be resumed by either turning the IC off via the ENP (ENN) pin, or by restoring power.
12/38
XC9519
Series
■EXTERNAL COMPONENTS
The output voltage VOUTP of a step-up DC/DC converter can be set by connecting external dividing resistors RFBP1 and RFBP2.
The output voltage VOUTP is determined by the values of RFBP1 and RFBP2 as given in the equation below.
Adjust RFBP1 and RFBP2 so that (RFBP1 + RFBP2) < 500kΩ.
VOUTP = VFBP × (RFBP1 + RFBP2) / RFBP2
Set the output voltage so that VOUTP≧VIN + 0.2V is satisfied.
Adjust the value of the phase compensation speed-up capacitor CFBP so that fzfp=1 / (2 × π × RFBP1) is about 40kHz, and insert several kΩ in
series as RSP. If a high output voltage is set, inserting a phase compensation speed-up capacitor may cause unstable operation.
Examples of setting CFBP and RSP are shown in the next section, “Step-up DC/DC Converter Error Amplifier External Compensation”.
【Typical Examples】
VOUTP
RFBP1
RFBP2
4.0V
5.0V
9.0V
12.0V
15.0V
18.0V
300kΩ
300kΩ
240kΩ
330kΩ
336kΩ
408kΩ
100kΩ
75kΩ
30kΩ
30kΩ
24kΩ
24kΩ
The output voltage VOUTN of an inverting DC/DC converter can be set by connecting external dividing resistors RFBN1 and RFBN2.
The output voltage VOUTN is determined by the values of RFBN1 and RFBN2 as given in the equation below.
Adjust RFBN1 and RFBN2 so that (RFBN1 + RFBN2) < 500kΩ.
VOUTN = - (VREF - VFBN) × RFBN1 / RFBN2
Set the output voltage so that
VIN - VOUTN+ VFN≦21.0V
(VFN : Forward voltage of external diode SBDN) is satisfied.
【Typical Examples】
VOUTN
RFBN1
RFBN2
-4.0V
-5.0V
-9.0V
-12.0V
-15.0V
300kΩ
300kΩ
270kΩ
360kΩ
360kΩ
75kΩ
60kΩ
30kΩ
30kΩ
24kΩ
13/38
XC9519 Series
■COMPONENT SELECTION METHOD (Continued)
External compensation of the frequency characteristic of a step-up DC/DC converter error amplifier is possible with RZP and CZP. The values of
RZP and CZP can be adjusted to obtain the optimum load-transient response (step response). For adjustment using the input voltage and output
voltage, use the setting values below.
VIN
Li-ion
(2.7～4.4V)
VIN
3.3V±10%
VIN
5V±10%
Output Voltage Range
4.6V ≦ VOUTP ≦ 5.0V
3.3μH
5.0V < VOUTP ≦ 9.0V
3.3μH
9.0V < VOUTP ≦ 12.0V
3.3μH
12.0V < VOUTP ≦ 15.0V
3.3μH
15.0V < VOUTP ≦ 18.0V
3.3μH
Output Voltage Range
LP
4.0V ≦VOUTP ≦ 5.0V
3.3μH
5.0V < VOUTP ≦ 9.0V
3.3μH
9.0V < VOUTP ≦12.0V
3.3μH
12.0V < VOUTP ≦ 15.0V
3.3μH
15.0V < VOUTP ≦ 18.0V
3.3μH
VOUTP
LP
5.7V ≦ VOUTP ≦ 7.0V
3.3μH
7.0V < VOUTP ≦ 9.0V
3.3μH
9.0V < VOUTP ≦ 12.0V
3.3μH
12.0V < VOUTP ≦ 15.0V
3.3μH
15.0V < VOUTP ≦ 18.0V
3.3μH
(*1) Setting value with RFBP1 = 300kΩ
(*2) Setting value with RFBP1 = 360kΩ
(*3) Setting value with RFBP1 = 240kΩ
14/38
LP
CLP
2×4.7μF
RZP
5.1kΩ
CZP
4.7nF
CFBP
RSP
47pF
(*1)
4.7kΩ
47pF
(*1)
4.7kΩ
4×4.7μF
8.2kΩ
4.7nF
2×4.7μF
5.1kΩ
4.7nF
-
-
4×4.7μF
7.5kΩ
4.7nF
-
-
2×4.7μF
10kΩ
4.7nF
-
-
4×4.7μF
18kΩ
2.2nF
-
-
2×4.7μF
16kΩ
2.2nF
-
-
4×4.7μF
27kΩ
2.2nF
-
-
2×4.7μF
16kΩ
2.2nF
-
-
4×4.7μF
24kΩ
4.7nF
-
-
CLP
RZP
CZP
CFBP
2×4.7μF
8.2kΩ
4.7nF
RSP
47pF
(*2)
4.7kΩ
47pF
(*2)
4.7kΩ
4×4.7μF
13kΩ
4.7nF
2×4.7μF
16kΩ
2.2nF
-
-
4×4.7μF
22kΩ
2.2nF
-
-
2×4.7μF
18kΩ
2.2nF
-
-
4×4.7μF
30kΩ
2.2nF
-
-
2×4.7μF
24kΩ
2.2nF
-
-
4×4.7μF
36kΩ
2.2nF
-
-
2×4.7μF
22kΩ
2.2nF
-
-
4×4.7μF
36kΩ
2.2nF
-
-
CLP
RZP
CZP
CFBP
2×4.7μF
4.7kΩ
4.7nF
RSP
68pF
(*3)
4.7kΩ
68pF
(*3)
4.7kΩ
4×4.7μF
8.2kΩ
4.7nF
2×4.7μF
5.1kΩ
4.7nF
-
-
4×4.7μF
10kΩ
4.7nF
-
-
2×4.7μF
8.2kΩ
4.7nF
-
-
4×4.7μF
16kΩ
2.2nF
-
-
2×4.7μF
13kΩ
2.2nF
-
-
4×4.7μF
24kΩ
2.2nF
-
-
2×4.7μF
12kΩ
2.2nF
-
-
4×4.7μF
18kΩ
4.7nF
-
-
XC9519
Series
■COMPONENT SELECTION METHOD (Continued)
External compensation of the frequency characteristic of an inverting DC/DC converter error amplifier is possible with RZN and CZN. The values
of RZN and CZN can be adjusted to obtain the optimum load-transient response (step response). For adjustment using the input voltage and output
voltage, use the setting values below.
VIN
Li-ion
(2.7～4.4V)
VIN
Output Voltage Range
LN
-4.0V≧VOUTN≧-5.0V
3.3μH
-5.0V > VOUTN≧-9.0V
3.3μH
-9.0V > VOUTN≧-12.0V
3.3μH
-12.0V > VOUTN≧ -15.0V
3.3μH
Output Voltage Range
LN
-4.0V≧VOUTN≧-5.0V
3.3μH
-5.0V > VOUTN≧-9.0V
3.3μH
-9.0V > VOUTN≧-12.0V
3.3μH
-12.0V > VOUTN≧-15.0V
3.3μH
Output Voltage Range
LN
-4.0V≧VOUTN≧-5.0V
3.3μH
-5.0V > VOUTN≧-9.0V
3.3μH
-9.0V > VOUTN≧-12.0V
3.3μH
-12.0V > VOUTN≧-15.0V
3.3μH
3.3V±10%
VIN
5V±10%
CLN
RZN
CZN
2×4.7μF
51kΩ
1.0nF
4×4.7μF
110kΩ
0.47nF
2×4.7μF
68kΩ
0.47nF
4×4.7μF
130kΩ
0.47nF
2×4.7μF
120kΩ
0.47nF
4×4.7μF
200kΩ
0.47nF
2×4.7μF
110kΩ
1.0nF
4×4.7μF
200kΩ
0.47nF
CLN
RZN
CZN
2×4.7μF
51kΩ
1.0nF
4×4.7μF
110kΩ
0.47nF
2×4.7μF
68kΩ
0.47nF
4×4.7μF
130kΩ
0.47nF
2×4.7μF
120kΩ
0.47nF
4×4.7μF
200kΩ
0.47nF
2×4.7μF
110kΩ
1.0nF
4×4.7μF
200kΩ
0.47nF
CLN
RZN
CZN
2×4.7μF
51kΩ
1.0nF
4×4.7μF
110kΩ
0.47nF
2×4.7μF
68kΩ
0.47nF
4×4.7μF
130kΩ
0.47nF
2×4.7μF
120kΩ
0.47nF
4×4.7μF
200kΩ
0.47nF
2×4.7μF
110kΩ
1.0nF
4×4.7μF
200kΩ
0.47nF
15/38
XC9519 Series
■TYPICAL APPLICATION CIRCUIT
(VIN=3.6V, VOUTP=5.0V, VOUTN=-5.0V)
VIN=3.6V, VOUTP=5.0V, VOUTN=-5.0V
・ Capacitor
CIN_P
CIN_SW
CIN_A
CLP
CLN
CL_VR
CZP
CZN
CFBP
: 10μF/ 10V (C2012JB1A106M, TDK-EPC)
: 4.7μF/ 10V (C2012JB1A475M, TDK-EPC)
: 0.1μF/ 10V (C1005JB1A104K, TDK-EPC)
: 4×4.7μF/ 10V (C2012JB1A475M, TDK-EPC)
: 4×4.7μF/ 10V (C2012JB1A475M, TDK-EPC)
: 0.22μF/ 6.3V (C1005JB0J224M, TDK-EPC)
: 4.7nF/ 25V (C1005JB1E472K, TDK-EPC)
: 0.47nF/ 50V (C1005JB1H471K, TDK-EPC)
: 47pF/ 50V (C1005CH1H470J, TDK-EPC)
For CIN_P, CIN_SW, CIN_A, CL_VR, CLP, and CLN, use a B characteristic (JIS Standards) or X7R/X5R (EIA Standards), and use a ceramic capacitor with
minimal reduction of capacitance when a DC bias is applied.
・ Coil, Schottky diode, P-ch MOSFET
LP, LN
: 3.3μH (VLF5014S-3R3M2R0, TDK-EPC)
(MSS5121-332, Coilcraft)
SBDP, SBDN
: XBS304S17R-G (TOREX)
P-ch MOS
CMS03 (TOSHIBA)
: EMH1303 (SANYO)
When selecting external components, refer to the specifications of each component and select so as not to exceed the ratings.
・Resistor
RFBP1
RFBP2
RSP
16/38
: 300kΩ
: 75kΩ
: 4.7kΩ
RFBN1
RFBN2
: 300kΩ
: 60kΩ
RZP
RZN
: 8.2kΩ
: 110kΩ
XC9519
Series
■TYPICAL APPLICATION CIRCUIT (Continued)
(VIN=3.6V, VOUTP=15.0V, VOUTN=-15.0V)
VIN=3.6V, VOUTP=15.0V, VOUTN=-15.0V
・Capacitor
CIN_P
CIN_SW
CIN_A
CLP
CLN
CL_VR
CZP
CZN
CFBP
: 10μF/ 10V (C2012JB1A106M, TDK-EPC)
: 4.7μF/ 10V (C2012JB1A475M, TDK-EPC)
: 0.1μF/ 10V (C1005JB1A104K, TDK-EPC)
: 4×4.7μF/ 25V (TMK212BJ475KG, TAIYO YUDEN)
: 4×4.7μF/ 25V (TMK212BJ475KG, TAIYO YUDEN)
: 0.22μF/ 6.3V (C1005JB0J224M, TDK-EPC)
: 2.2nF/ 50V (C1005JB1H222K, TDK-EPC)
: 0.47nF/ 50V (C1005JB1H471K, TDK-EPC)
: OPEN
For CIN_P, CIN_SW, CIN_A, CL_VR, CLP, and CLN, use a B characteristic (JIS Standards) or X7R/X5R (EIA Standards), and
use a ceramic capacitor with minimal reduction of capacitance when a DC bias is applied.
・ Coil, Schottky diode, P-ch MOSFET
LP, LN
: 3.3μH (VLF5014S-3R3M2R0, TDK-EPC)
(MSS5121-332, Coilcraft)
SBDP, SBDN
: XBS304S17R-G (TOREX)
P-ch MOS
CMS03 (TOSHIBA)
: EMH1303 (SANYO)
When selecting external components, refer to the specifications of each component and select so as not to exceed the ratings.
・Resistor
RFBP1
RFBP2
RSP
: 336kΩ
: 24kΩ
: OPEN
RFBN1
RFBN2
: 360kΩ
: 24kΩ
RZP
RZN
: 27kΩ
: 200kΩ
17/38
XC9519 Series
■TEST CIRCUITS
1) Circuit ①
2) Circuit ②
3) Circuit ③
Wave Form Measure Point
47Ω
ENP
LXP
ENN
VOUTP
MODE
FBP
0.22μF
SWP
VREF
BSW
FBN
PVIN
VOUTN
AVIN
LXN
Wave Form Measure Point
47Ω
1μF
VIN
AGND
GAINN
PGND
GAINP
100kΩ
V
4) Circuit ④
18/38
XC9519
Series
■TEST CIRCUITS (Continued)
5) Circuit ⑤
6) Circuit ⑥
7) Circuit ⑦
Wave Form Measure Point
47Ω
A
ENP
LXP
A
ENN
VOUTP
A
A
MODE
FBP
A
A
SWP
VREF
A
A
BSW
FBN
A
PVIN
VOUTN
A
AVIN
LXN
1μF
A
VIN
Wave Form Measure Point
47Ω
AGND
GAINN
A
PGND
GAINP
A
19/38
XC9519 Series
■TEST CIRCUITS (Continued)
8) Circuit ⑧
9) Circuit ⑨
1. Capacitance between pins
The capacitances between the following pins are omitted in the circuit diagram.
PVIN pin – PGND pin: 1μF
FBP pin - AGND pin: 1μF
FBN pin - AGND pin: 1μF
VREF pin - AGND pin: 1μF
2. Testing method for on resistance
Testing is executed at 100% DUTY using test mode.
20/38
XC9519
Series
■NOTES ON USE
1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded.
2. The characteristics of this IC are highly dependent on peripheral circuits.
When selecting external components, refer to the specifications of each component and select so as not to exceed the ratings.
Some peripheral component selections may cause unstable operation.
Before use, sufficiently test operation using the actual equipment.
3. When the input voltage VIN is low and the output voltage VOUTP/VOUTN is high, the input current may be limited by the maximum duty limit and
the set output voltage may not be output.
4. If the step-up ratio is high and excessive load current flows, the input current may be limited by the maximum duty limit and maximum current
limit protection and short-circuit protection may not activate.
5. Do not connect a component other than CL_VR to the VREF pin.
If a component other than CL_VR is connected, the output voltage VOUTN of an inverting DC/DC converter may become unstable.
6. For external components, use the components specified in the standard circuit examples and component selection methods.
7. When the input voltage VIN is high and the output voltage VOUTP/VOUTN is low, intermittent oscillation may occur during PWM control.
8. If the step-up ratio is low in a step-up DC/DC converter, the output voltage VOUTP may become unstable during PFM/PWM switching control
(VMODE = "H").
Step-up DC/DC Converter: PWM/PFM MODE
(VIN=4.4V, VOUTP=5.0V, IOUTP=200mA
VENP="H", VENN="L", VMODE="H")
C LP=4×4.7μF
LP=3.3μH (VLF5014S-3R3M2R0)
SBD P: CMS03
P-ch MOS: EMH1303
R ZP=7.5kΩ, C ZP=4.7nF
V OUT P: 50mV/ di v
time:20μs/div
9. During PFM/PWM switching control (VMODE = "H"), the output voltage may become unstable near switching between PFM mode and PWM mode.
Step-up DC/DC Converter: PWM/PFM MODE
(VIN=3.6V, VOUTP=5.0V, IOUTP=120mA
VENP="H", VENN="L", VMODE="H")
C LP=4×4.7μF
LP=3.3μH (VLF5014S-3R3M2R0)
SBD P: CMS03
P-ch MOS: EMH1303
R ZP=7.5kΩ, C ZP=4.7nF
V OUTP: 20mV/ di v
time:10μs/div
21/38
XC9519 Series
■NOTES ON USE (Continued)
10. During PWM control (VMODE = "L"), the output voltage may become unstable at light loads.
Inverting DC Converter: PWM MODE
(VIN=5.5V, VOUTN=-15.0V, IOUTN=100mA
VENP="L", VENN="H", VMODE="L")
C LN=4×4.7μF
LN=3.3μH (VLF5014S-3R3M2R0)
SBD N: CMS03
R ZN=200kΩ, C ZN=0.47nF
V OUTN: 20mV/ di v
time:50μs/div
11. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems.
22/38
XC9519
Series
■NOTES ON USE (Continued)
●Notes on Layout
1. Position external components close to the IC so that the wiring is thick and short.
2. To minimize input voltage fluctuations, place CIN_P and CIN_A as close as possible to the IC.
3. Make the GND wiring sufficiently strong. Fluctuations of AGND or PGND voltage due to GND current during switching may cause unstable IC operation.
4. When creating a layout, refer to the circuit diagram and recommended layout pattern below.
5. This product is incorporated into a driver, and thus the driver transistor current and on-resistance may cause heat generation.
SBDP
LP
VOUTP
P-ch MOS
SWP
LXP
VOUTP
RFBP1
BSW
CFBP
FBP
RSP
VREF
RFBP2
CLP
PVIN
AVIN
RFBN2
ENP
VIN
CIN_SW
CIN_P
CIN_A
FBN
ENN
MODE
CL_VR
RFBN1
VOUTN
VOUTN
AGND
LXN
PGND
GAINP
GAINN
RZP
RZN
CZP
CZN
SBDN
CLN
LN
●Recommended Pattern Layout
Front
Back side see-through
23/38
XC9519 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
Step-up DC/DC Converter (VOUTP=5.0V)
Inverting DC/DC Converter (VOUTN=-5.0V)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
100
Efficiency:EFFI(%)
3.6V
40
VENP="L",VENN="H"
80
VIN= 4.4V
60
SBDN: CMS03, RZN=130kΩ, CZN=0.47nF
100
VENP="H",VENN="L"
80
Efficiency:EFFI(%)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDP: CMS03, P-ch MOS: EMH1303, RZP=7.5kΩ, CZP=4.7nF
2.7V
20
60
VIN= 4.4V
3.6V
40
2.7V
20
PWM/PFM (VMODE="H")
PWM (VMODE="L")
PWM/PFM (VMODE="H")
PWM (VMODE="L")
0
0
0.1
1
10
100
1000
0.1
1
Step-up DC/DC Converter (VOUTP=15.0V)
Inverting DC/DC Converter (VOUTN=-15.0V)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDN: CMS03, RZN=200kΩ, CZN=0.47nF
SBDP: CMS03, P-ch MOS: EMH1303, RZP=27kΩ, CZP=2.2nF
100
VENP="H",VENN="L"
Efficiency:EFFI(%)
Efficiency:EFFI(%)
VENP="L",VENN="H"
80
VIN= 5.5V
60
3.6V
40
20
60
3.6V
40
VIN= 5.5V
20
PWM/PFM (VMODE="H")
PWM (VMODE="L")
0
PWM/PFM (VMODE="H")
PWM (VMODE="L")
0
0.1
1
10
100
1000
0.1
1
Output Current:IOUTP (mA)
-4.8
Output Voltage:V OUTN(V)
VENP="H",VENN="L"
VIN＝4.4V,3.6V,2.7V
5.0
4.9
SBDN: CMS03, RZN=130kΩ, CZN=0.47nF
VENP="L",VENN="H"
VIN＝4.4V
-4.9
3.6V
-5.0
2.7V
-5.1
PWM/PFM (VMODE="H")
PWM (VMODE="L")
4.8
PWM/PFM (VMODE="H")
PWM (VMODE="L")
-5.2
0.1
1
10
100
Output Current:IOUTP (mA)
1000
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDP: CMS03, P-ch MOS: EMH1303, RZP=7.5kΩ, CZP=4.7nF
5.1
100
Inverting DC/DC Converter (VOUTN=-5.0V)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
5.2
10
Output Current:IOUTN (mA)
(2) Output Voltage vs. Output Current
Step-up DC/DC Converter (VOUTP=5.0V)
Output Voltage:V OUTP(V)
1000
Output Current:IOUTN (mA)
80
24/38
100
Output Current:IOUTP (mA)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
100
10
1000
0.1
1
10
100
Output Current:IOUTN (mA)
1000
XC9519
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Output Voltage vs. Output Current (Continued)
Inverting DC/DC Converter (VOUTN=-15.0V)
Step-up DC/DC Converter (VOUTP=15.0V)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
SBDP: CMS03, P-ch MOS: EMH1303, RZP=27kΩ, CZP=2.2nF
VENP="H",VENN="L"
15.2
VIN＝5.5V
15.0
3.6V
14.8
SBDN: CMS03, RZN=200kΩ, CZN=0.47nF
-14.6
Output Voltage:V OUTN(V)
Output Voltage:V OUTP(V)
15.4
VENP="L",VENN="H"
-14.8
VIN＝5.5 V,3.6V
-15.0
-15.2
PWM/PFM (VMODE="H")
PWM (VMODE="L")
14.6
PWM/PFM (VMODE="H")
PWM (VMODE="L")
-15.4
0.1
1
10
100
1000
0.1
1
Output Current:IOUTP (mA)
SBDN: CMS03, RZN=130kΩ, CZN=0.47nF
100
VENP="L",VENN="H"
PWM/PFM (VMODE="H")
PWM (VMODE="L")
80
Ripple Voltage : Vr(mVp-p)
Ripple Voltage : Vr(mVp-p)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDP: CMS03, P-ch MOS: EMH1303, RZP=7.5kΩ, CZP=4.7nF
60
4.4V
3.6V
40
VIN= 2.7V,3.6V,4.4V
2.7V
20
0
80
60
4.4V
40
3.6V
20
1
10
100
1000
0.1
10
100
1000
Inverting DC/DC Converter (VOUTN=-15.0V)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
SBDP: CMS03, P-ch MOS: EMH1303, RZP=27kΩ, CZP=2.2nF
VENP="H",VENN="L"
1
Output Current:IOUTN (mA)
Step-up DC/DC Converter (VOUTP=15.0V)
100
PWM/PFM (VMODE="H")
PWM (VMODE="L")
80
Ripple Voltage : Vr(mVp-p)
Ripple Voltage : Vr(mVp-p)
2.7V
VIN= 2.7V,3.6V,4.4V
Output Current:IOUTP (mA)
60
2.7V 5.5V 3.6V
40
PWM/PFM (VMODE="H")
PWM (VMODE="L")
0
0.1
100
1000
Inverting DC/DC Converter (VOUTN=-5.0V)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
VENP="H",VENN="L"
100
Output Current:IOUTN (mA)
(3) Ripple Voltage vs. Output Current
Step-up DC/DC Converter (VOUTP=5.0V)
100
10
VIN= 2.7V,3.6V,4.4V
20
0
SBDN: CMS03, RZN=200kΩ, CZN=0.47nF
VENP="L",VENN="H"
PWM/PFM (VMODE="H")
PWM (VMODE="L")
80
60
VIN= 5.5V
3.6V
40
2.7V
20
0
0.1
1
10
100
Output Current:IOUTP (mA)
1000
0.1
1
10
100
1000
Output Current:IOUTN (mA)
25/38
XC9519 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Oscillation Frequency vs. Ambient Temperature
1.5
Oscillation Frequency : fOSCN(MHz)
Oscillation Frequency : fOSCP(MHz)
1.5
1.4
3.6V
VIN=5.5V
1.3
1.2
1.1
2.7V
1.0
0.9
1.4
3.6V
1.3
1.2
1.1
2.7V
1.0
0.9
-50
-25
0
25
50
75
100
-50
-25
Ambient Temperature: Ta ( ℃)
50
75
100
200
VIN=5.5V
Supply Current 2: IDD2 ( μA)
Supply Current 1: IDD1 ( μA)
25
Supply Current 2
250
200
150
2.7V
100
50
150
VIN=5.5V
100
2.7V
50
0
-50
-25
0
25
50
75
100
Ambient Temperature: Ta ( ℃)
200
VIN=5.5V
150
100
2.7V
50
0
-50
-25
0
25
50
75
Ambient Temperature: Ta ( ℃)
-50
-25
0
25
50
75
Ambient Temperature: Ta ( ℃)
Supply Current 3
Supply Current 3: IDD3 ( μA)
0
Ambient Temperature: Ta ( ℃)
(5) Supply Current 1,2,3 vs. Ambient Temperature
Supply Current 1
26/38
VIN=5.5V
100
100
XC9519
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(6) FBP Voltage vs. Ambient Temperature
(7) Output Voltage Accuracy vs. Ambient Temperature
1.02
Output Voltage Accuracy : V OUTNA (V)
1.02
FBP Voltage : VFBP (V)
VIN=5.5V
1.01
1.00
2.7V,3.6V
0.99
0.98
-50
-25
0
25
50
75
VIN=5.5V
1.01
1.00
2.7V
3.6V
0.99
0.98
-50
100
-25
0
25
50
75
100
Ambient Temperature: Ta ( ℃)
Ambient Temperature: Ta ( ℃)
(8) UVLO Voltage vs. Ambient Temperature
2.7
UVLO Voltage : UVLO (V)
2.6
2.5
UVLO Release Voltage
2.4
2.3
UVLO Detect Voltage
2.2
2.1
VENP="H",VENN="L",VMODE="L"
2.0
-50
-25
0
25
50
75
100
Ambient Temperature: Ta ( ℃)
(10) ENP "L" Voltage vs. Ambient Temperature
1.4
1.2
1.3
1.1
ENP "L" Voltage : VENPL (V)
ENP "H" Voltage : VENPH (V)
(9) ENP "H" Voltage vs. Ambient Temperature
1.2
1.1
1.0
0.9
0.8
VIN=5.5V,VENN="L",VMODE="L"
1.0
0.9
0.8
0.7
0.6
VIN=5.5V,VENN="L",VMODE="L"
0.7
0.5
-50
-25
0
25
50
Ambient Temperature: Ta ( ℃)
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta ( ℃)
27/38
XC9519 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(12) ENN "L" Voltage vs. Ambient Temperature
1.4
1.2
1.3
1.1
ENN "L" Voltage : VENNL (V)
ENN "H" Voltage : VENNH (V)
(11) ENN "H" Voltage vs. Ambient Temperature
1.2
1.1
1.0
0.9
0.8
1.0
0.9
0.8
0.7
0.6
VIN=5.5V,VENP="L",VMODE="L"
VIN=5.5V,VENP="L",VMODE="L"
0.7
0.5
-50
-25
0
25
50
75
100
-50
-25
Ambient Temperature: Ta ( ℃)
1.4
1.2
1.3
1.1
MODE "L" Voltage : VMODEL (V)
MODE "H" Voltage : VMODEH (V)
50
75
100
(14) MODE "L" Voltage vs. Ambient Temperature
1.2
1.1
1.0
0.9
0.8
VIN=5.5V,VENP="H",VENN="L"
1.0
0.9
0.8
0.7
0.6
VIN=5.5V,VENP="H",VENN="L"
0.7
0.5
-50
-25
0
25
50
75
100
-50
-25
Ambient Temperature: Ta ( ℃)
0
25
50
75
100
Ambient Temperature: Ta ( ℃)
(15) LXP SW “H” ON Resistance vs. Ambient Temperature
(16) LXN SW "L" ON Resistance vs. Ambient Temperature
0.3
0.5
LXN SW “L” ON Resistance :RLXNL (Ω)
LXP SW “H” ON Resistance :R
LXPH (Ω)
25
Ambient Temperature: Ta ( ℃)
(13) MODE "H" Voltage vs. Ambient Temperature
2.7V
0.2
0.1
3.6V V =5.5V
IN
0.0
-50
-25
0
25
50
Ambient Temperature: Ta ( ℃)
28/38
0
75
100
0.4
2.7V
0.3
0.2
3.6V VIN=5.5V
0.1
0.0
-50
-25
0
25
50
Ambient Temperature: Ta ( ℃)
75
100
XC9519
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(17) Output Voltage Rise Wave Form
Step-up DC/DC Converter (VOUTP=15.0V)
Inverting DC/DC Converter (VOUTN=-15.0V)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
SBDN: CMS03, RZN=200kΩ, CZN=0.47nF
SBDP: CMS03, P-ch MOS: EMH1303, RZP=27kΩ, CZP=2.2nF
VIN =3.6V,VENP="L",VMODE="L"
VIN =3.6V,VENN ="L",VMODE="L"
1ch
VOUTN
VOUTP
1ch
VENP = 0 ⇒ 3.6V
2ch
VENN = 0 ⇒ 3.6V
2ch
1ch:5V/div, 2ch:5V/div
1ch:5V/div, 2ch:5V/div
time:500μs/div
time:500μs/div
(18) Soft Start Time vs. Ambient Temperature
Step-up DC/DC Converter
5.0
VIN=5.5V
3.6V
3.5
3.0
2.5
2.0
2.7V
1.5
3.5
Soft Start Time : tSSN (ms)
Soft Start Time : tSSP (ms)
4.5
4.0
Inverting DC/DC Converter
4.0
3.6V
3.0
VIN=5.5V
2.5
2.0
2.7V
1.5
1.0
1.0
-50
-25
0
25
50
75
-50
100
-25
Ambient Temperature: Ta ( ℃)
0
25
50
75
100
Ambient Temperature: Ta ( ℃)
(19) Maximum Duty Cycle vs. Ambient Temperature
Step-up DC/DC Converter
Inverting DC/DC Converter
96
94
92
90
88
86
VIN=3.6V,VENP="H",VENN="L",VMODE="L"
84
Maximum Duty Cycle : DMAXN (%)
Maximum Duty Cycle : DMAXP (%)
96
94
92
90
88
86
VIN=3.6V,VENP="L",VENN="H",VMODE="L"
84
-50
-25
0
25
50
75
Ambient Temperature: Ta ( ℃)
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta ( ℃)
29/38
XC9519 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(20) Maximum Current Limit vs. Ambient Temperature
Step-up DC/DC Converter (VOUTP=5.0V)
Inverting DC/DC Converter (VOUTN=-5.0V)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDP: CMS03, P-ch MOS: EMH1303, RZP=7.5kΩ, CZP=4.7nF
SBDN: CMS03, RZN=130kΩ, CZN=0.47nF
5.0
4.5
VIN=4.4V
2.7V
4.0
3.5
3.6V
3.0
2.5
VENP="H",VENN="L",VMODE="L"
Maximum Current Limit :LIMN
I (A)
Maximum Current Limit :LIMP
I (A)
5.0
2.0
4.5
VIN=4.4V
4.0
3.5
3.0
2.7V
VENP="L",VENN="H",VMODE="L"
2.0
-50
-25
0
25
50
75
100
-50
-25
Ambient Temperature: Ta ( ℃)
50
75
100
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDN: CMS03, RZN=200kΩ, CZN=0.47nF
SBDP: CMS03, P-ch MOS: EMH1303, RZP=27kΩ, CZP=2.2nF
5.0
Maximum Current Limit :LIMN
I (A)
5.0
Maximum Current Limit :LIMP
I (A)
25
Inverting DC/DC Converter (VOUTN=-15.0V)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
4.5
4.0
3.6V
3.5
3.0
VIN=5.5V
2.5
VENP="H",VENN="L",VMODE="L"
2.0
-50
-25
0
25
50
75
100
3.0
2.5
2.7V
2.0
3.6V
VIN=5.5V
1.0
-50
-25
0
25
50
75
Ambient Temperature: Ta ( ℃)
4.0
VIN=5.5V
3.5
3.0
3.6V
2.5
VENP="L",VENN="H",VMODE="L"
-50
-25
0
25
50
75
Ambient Temperature: Ta ( ℃)
(21) Latch Time vs. Ambient Temperature
1.5
4.5
2.0
Ambient Temperature: Ta ( ℃)
Integral Latch Time :tLAT (ms)
0
Ambient Temperature: Ta ( ℃)
Step-up DC/DC Converter (VOUTP=15.0V)
30/38
3.6V
2.5
100
100
XC9519
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(22) CL Discharge Resistance vs. Ambient Temperature
Step-up DC/DC Converter
350
2.7V
300
250
200
3.6V VIN=5.5V
150
100
-50
-25
0
25
50
Inverting DC/DC Converter
400
CL Discharge Resistance: RDCHGN (Ω)
CL Discharge Resistance: RDCHGP (Ω)
400
75
100
350
2.7V
300
250
200
150
3.6V VIN=5.5V
100
-50
Ambient Temperature: Ta ( ℃)
-25
0
25
50
75
100
Ambient Temperature: Ta ( ℃)
(23) PFM Switching Current vs. Ambient Temperature
Step-up DC/DC Converter (VOUTP=5.0V)
Inverting DC/DC Converter (VOUTN=-5.0V)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDP: CMS03, P-ch MOS: EMH1303, RZP=7.5kΩ, CZP=4.7nF
SBDN: CMS03, RZN=130kΩ, CZN=0.47nF
550
PFM Switching Current : PFMN
I
(mA)
PFM Switching Current : PFMP
I
(mA)
550
500
450
VIN=4.4V
400
350
300
3.6V
250
200
VENP="H",VENN="L",VMODE="H"
150
500
VIN=4.4V
450
400
350
300
3.6V
250
200
VENP="L",VENN="H",VMODE="H"
150
-50
-25
0
25
50
75
100
-50
Ambient Temperature: Ta ( ℃)
0
25
50
75
100
Ambient Temperature: Ta ( ℃)
Step-up DC/DC Converter (VOUTP=15.0V)
Inverting DC/DC Converter (VOUTN=-15.0V)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDP: CMS03, P-ch MOS: EMH1303, RZP=27kΩ, CZP=2.2nF
SBDN: CMS03, RZN=200kΩ, CZN=0.47nF
550
PFM Switching Current : PFMN
I
(mA)
550
PFM Switching Current : PFMP
I
(mA)
-25
500
450
VIN=5.5V
400
350
300
3.6V
250
200
VENP="H",VENN="L",VMODE="H"
150
500
VIN=5.5V
450
400
350
300
3.6V
250
200
VENP="H",VENN="L",VMODE="H"
150
-50
-25
0
25
50
75
Ambient Temperature: Ta ( ℃)
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta ( ℃)
31/38
XC9519 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(24) Load Transient Response
Step-up DC/DC Converter: PWM/PFM MODE
(VIN=3.6V, VOUTP=5.0V, IOUTP=1⇒200mA)
Step-up DC/DC Converter: PWM MODE
(VIN=3.6V, VOUTP=5.0V, IOUTP=200⇒1mA)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0), SBDP: CMS03
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0), SBDP: CMS03
P-ch MOS: EMH1303, RZP=8.2kΩ, CZP=4.7nF, CFBP=47pF, RSP=4.7kΩ
P-ch MOS: EMH1303, RZP=8.2kΩ, CZP=4.7nF, CFBP=47pF, RSP=4.7kΩ
VENP="H",VENN ="L",VMODE="L"
VENP="H",VENN ="L",VMODE="L"
VOUTP
VOUTP
1ch
1ch
2ch
IOUTP = 200 ⇒ 1mA
IOUTP = 1 ⇒ 200mA
2ch
1ch:200mV/div, 2ch:200mA/div
1ch:200mV/div, 2ch:200mA/div
time:100μs/div
time:1ms/div
Step-up DC/DC Converter: PWM/PFM MODE
(VIN=3.6V, VOUTP=5.0V, IOUTP=200⇒1mA)
Step-up DC/DC Converter: PWM/PFM MODE
(VIN=3.6V, VOUTP=5.0V, IOUTP=1⇒200mA)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0), SBDP: CMS03
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0), SBDP: CMS03
P-ch MOS: EMH1303, RZP=8.2kΩ, CZP=4.7nF, CFBP=47pF, RSP=4.7kΩ
P-ch MOS: EMH1303, RZP=8.2kΩ, CZP=4.7nF, CFBP=47pF, RSP=4.7kΩ
VENP="H",VENN ="L",VMODE="H"
VENP="H",VENN ="L",VMODE="H"
VOUTP
VOUTP
1ch
1ch
2ch
2ch
IOUTP = 1 ⇒ 200mA
1ch:200mV/div, 2ch:200mA/div
time:100μs/div
32/38
IOUTP = 200 ⇒ 1mA
1ch:200mV/div, 2ch:200mA/div
time:1ms/div
XC9519
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
Step-up DC/DC Converter: PWM MODE
(VIN=3.6V, VOUTP=15.0V, IOUTP=50⇒1mA)
Step-up DC/DC Converter: PWM MODE
(VIN=3.6V, VOUTP=15.0V, IOUTP=1⇒50mA)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
SBDP: CMS03, P-ch MOS: EMH1303, RZP=27kΩ, CZP=2.2nF
SBDP: CMS03, P-ch MOS: EMH1303, RZP=27kΩ, CZP=2.2nF
VENP="H",VENN ="L",VMODE="L"
VENP="H",VENN ="L",VMODE="L"
VOUTP
VOUTP
1ch
1ch
IOUTP = 1 ⇒ 50mA
2ch
IOUTP = 50 ⇒ 1mA
2ch
1ch:500mV/div, 2ch:50mA/div
1ch:500mV/div, 2ch:50mA/div
time:200μs/div
time:1ms/div
Step-up DC/DC Converter: PWM/PFM MODE
(VIN=3.6V, VOUTP=15.0V, IOUTP=1⇒50mA)
Step-up DC/DC Converter: PWM/PFM MODE
(VIN=3.6V, VOUTP=15.0V, IOUTP=50⇒1mA)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
CLP=4×4.7μF, LP=3.3μH (VLF5014S-3R3M2R0)
SBDP: CMS03, P-ch MOS: EMH1303, RZP=27kΩ, CZP=2.2nF
SBDP: CMS03, P-ch MOS: EMH1303, RZP=27kΩ, CZP=2.2nF
VENP="H",VENN ="L",VMODE="H"
VENP="H",VENN ="L",VMODE="H"
VOUTP
VOUTP
1ch
1ch
2ch
2ch
IOUTP = 1 ⇒ 50mA
1ch:500mV/div, 2ch:50mA/div
time:200μs/div
IOUTP = 50 ⇒ 1mA
1ch:500mV/div, 2ch:50mA/div
time:1ms/div
33/38
XC9519 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
Inverting DC/DC Converter: PWM MODE
(VIN=3.6V, VOUTN=-5.0V, IOUTN=1⇒200mA)
Inverting DC/DC Converter: PWM MODE
(VIN=3.6V, VOUTN=-5.0V, IOUTN=200⇒1mA)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDN: CMS03, RZN=130kΩ, CZN=0.47nF
SBDN: CMS03, RZN=130kΩ, CZN=0.47nF
VENP="L",VENN ="H",VMODE="L"
VENP="L",VENN ="H",VMODE="L"
VOUTN
VOUTN
1ch
1ch
2ch
IOUTN = 200 ⇒ 1mA
IOUTN = 1 ⇒ 200mA
2ch
1ch:200mV/div, 2ch:200mA/div
1ch:200mV/div, 2ch:200mA/div
time:100μs/div
Inverting DC/DC Converter: PWM/PFM MODE
(VIN=3.6V, VOUTN=-5.0V, IOUTN=1⇒200mA)
time:500μs/div
Inverting DC/DC Converter: PWM/PFM MODE
(VIN=3.6V, VOUTN=-5.0V, IOUTN=200⇒1mA)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDN: CMS03, RZN=130kΩ, CZN=0.47nF
SBDN: CMS03, RZN=130kΩ, CZN=0.47nF
VENP="L",VENN ="H",VMODE="H"
VENP="L",VENN ="H",VMODE="H"
VOUTN
VOUTN
1ch
1ch
2ch
2ch
IOUTN = 1 ⇒ 200mA
1ch:200mV/div, 2ch:200mA/div
time:100μs/div
34/38
IOUTN = 200 ⇒ 1mA
1ch:200mV/div, 2ch:200mA/div
time:500μs/div
XC9519
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
Inverting DC/DC Converter: PWM MODE
(VIN=3.6V, VOUTN=-15.0V, IOUTN=1⇒50mA)
Inverting DC/DC Converter: PWM MODE
(VIN=3.6V, VOUTN=-15.0V, IOUTN=50⇒1mA)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDN: CMS03, RZN=200kΩ, CZN=0.47nF
SBDN: CMS03, RZN=200kΩ, CZN=0.47nF
VENP="L",VENN ="H",VMODE="L"
VENP="L",VENN ="H",VMODE="L"
VOUTN
VOUTN
1ch
1ch
2ch
IOUTN = 1 ⇒ 50mA
IOUTN = 50 ⇒ 1mA
2ch
1ch:500mV/div,
1ch: 200mV/ di v,2ch:50mA/div
2ch: 200mA/ di v
1ch:500mV/div,
1ch: 200mV/ di v,2ch:50mA/div
2ch: 200mA/ di v
μs/div
t itime:100
me: 100μ
s/ di v
Inverting DC/DC Converter: PWM/PFM MODE
(VIN=3.6V, VOUTN=-15.0V, IOUTN=1⇒50mA)
μs/div
t itime:500
me: 500μ
s/ di v
Inverting DC/DC Converter: PWM/PFM MODE
(VIN=3.6V, VOUTN=-15.0V, IOUTN=50⇒1mA)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
CLN=4×4.7μF, LN=3.3μH (VLF5014S-3R3M2R0)
SBDN: CMS03, RZN=200kΩ, CZN=0.47nF
SBDN: CMS03, RZN=200kΩ, CZN=0.47nF
VENP="L",VENN ="H",VMODE="H"
VENP="L",VENN ="H",VMODE="H"
VOUTN
VOUTN
1ch
1ch
2ch
IOUTN = 1 ⇒ 50mA
IOUTN = 50 ⇒ 1mA
2ch
1ch:500mV/div,
1ch: 200mV/ di v,2ch:50mA/div
2ch: 200mA/ di v
μs/div
t itime:100
me: 100μ
s/ di v
1ch:500mV/div,
1ch: 200mV/ di v,2ch:50mA/div
2ch: 200mA/ di v
μs/div
t itime:500
me: 500μ
s/ di v
35/38
XC9519 Series
■PACKAGING INFORMATION
●QFN-24 (unit:mm)
1 PIN INDENT
4.0±0.10
0.075
0.40±0.05
7
8
9
10
11 12
6
13
5
14
4
15
3
16
2
17
1
18
24
23
22
21
20
19
2.8±0.05
●QFN-24 Reference Pattern Layout (unit:mm)
36/38
●QFN-24 Reference Metal Mask Design (unit:mm)
XC9519
Series
■MARKING RULE
QFN-24
1pin
① represent product series.
MARK
PRODUCT SERIES
9
①②③④⑤⑥
XC9519******-G
② represents UVLO detect voltage.
MARK
UVLO VOLTAGE
A
PRODUCT SERIES
Detect: 2.2V, Hysteresis Width: 0.2V
XC9519A*****-G
③④ represents oscillation frequency and maximum current limit.
MARK
OSCILLATION
MAXIMUM
FREQUENCY
CURRENT LIMIT
③
④
1
2
1.2MHz
2.0A
PRODUCT SERIES
XC9519*12A**-G
⑤⑥ represents production lot number.
01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, and B1～ZZ repeated
(G, I, J, O, Q, W excluded)
*No character inversion used.
37/38
XC9519 Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
38/38
