XCL100/XCL101 Series
ETR28004-006a
Inductor Built-in Step-up “micro DC/DC” Converter
☆Green Operation Compatible
■GENERAL DESCRIPTION
The XCL100/XCL101 series is a synchronous step-up micro DC/DC converter which integrates an inductor and a control IC
in one tiny package (2.5mm×2.0mm, h=1.0mm). A stable step-up power supply is configured using only two capacitors
connected externally. An internal coil simplifies the circuit and enables minimization of noise and other operational trouble
due to the circuit wiring.
The XCL100/XCL101 series can be used in applications that start from a single alkaline or nickel-metal hydride battery
because the input voltage range is 0.7V ~ 5.5V. The output voltage can be set from 1.8V to 5.0V (±2.0%) in steps of 0.1V.
PFM control enables a low quiescent current, making these products ideal for portable devices that require high efficiency.
The XCL100/XCL101 features a load disconnect function to break continuity between the input and output at shutdown
(A,B Type), and a bypass mode function to maintain continuity between the input and output (C Type).
■FEATURES
■APPLICATIONS
●Wearable devices
Input Voltage Range
:
Output Voltage Range
:
Operating hold voltage 0.7V~5.5V
Start-up voltage
●Mobile phones, Smart phones
●Mouses, Keyboards
0.9V~5.5V
XCL100
3.0V ~ 5.0V (±2.0%)
XCL101
1.8V ~ 5.0V (±2.0%)
●Remote controls
Output Current
:
80mA@VOUT=3.3V, VBAT=1.8V
●Portable information devices
Supply Current
:
6.3μA (VBAT=VOUT+0.5V)
Control Method
:
PFM Control
PFM Switching Current
:
350mA
Functions
:
Load Disconnection or
●Game consoles
Bypass Mode
CL Discharge
■TYPICAL APPLICATION CIRCUIT
Output Capacitor
:
Ceramic Capacitor Compatible
Operating Ambient Temperature
:
-40ºC ~ 85ºC
Package
:
CL-2025, CL-2025-02
Environmentally Friendly
:
EU RoHS Compliant, Pb Free
■ TYPICAL PERFORMANCE
CHARACTERISTICS
XCL101C501BR-G
7 L1
CL
10μF
1 Lx
VSS 6
2 VOUT
NC 5
3 VBAT
CE 4
80
VCE
8 L2
VIN
Efficiency:EFFI(%)
VOUT
100
4.2V
3.6V
60
VIN= 3.0V
40
20
CIN
10μF
(TOP VIEW)
“L1 and Lx”, “L2 and VBAT” is connected by PCB pattern.
VOUT =5.0V
0
0.01
0.1
1
10
100
1000
Output Current:IOUT (mA)
1/25
XCL100/XCL101 Series
■BLOCK DIAGRAM
XCL101A/XCL101C Type
L1
L2
Inductor
LX
PFM C omparator U nit
CFB
RFB1
Parasitic Diode
Controller
VOUT
VOUT
Current Sense
RFB2
PFM
Comparator
FB
-
PFM C ontroller
+
Buffer
Driver
and
Inrush
Current
Protection
VSS
V OUT
V REF
VDD
CE and Bypass
Controller Logic
CE
VBAT - VOUT Detector
VBAT
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
XCL101B Type
L1
L2
Inductor
LX
PFM C omparator U nit
CFB
RFB1
Parasitic Diode
Contr oller
VOUT
VOUT
Cur rent Sense
RFB2
PFM
Compar ator
FB
+
PFM C ontroller
CL
Dis charge
Buffer
Dr iver
and
Inrush
Cur rent
Protection
VSS
V OUT
V REF
CE
CE and Bypass
Contr oller Logic
VDD
VBAT - VOUT Detector
VBAT
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
2/25
XCL100/XCL101
Series
■BLOCK DIAGRAM
XCL100A/XCL100C Type
L1
L2
Inductor
LX
PFM C omparator U nit
CFB
RFB1
Parasitic Diode
Contr oller
VOUT
VOUT
Cur rent Sense
RFB2
PFM
Compar ator
FB
-
Buffer
Dr iver
and
Inrush
Cur rent
Protection
PFM C ontroller
+
VSS
V OUT
V REF
CE
VDD
CE and Bypass
Contr oller Logic
VBAT - VOUT Detector
Hy ste re si s UVLO
Compa rator
VBAT
+
-
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
XCL100B Type
L1
L2
Inductor
LX
PFM C omparator U nit
CFB
RFB1
Parasitic Diode
Contr oller
VOUT
VOUT
Cur rent Sense
RFB2
PFM
Compar ator
FB
+
CL
Dis charge
Buffer
Dr iver
and
Inrush
Cur rent
Protection
PFM C ontroller
VSS
V OUT
V REF
CE
VDD
CE and Bypass
Contr oller Logic
VBAT - VOUT Detector
Hy ste re si s UVLO
Compa rator
VBAT
+
-
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
3/25
XCL100/XCL101 Series
■PRODUCTION CLASSIFICATION
●Ordering Information
XCL100①②③④⑤⑥-⑦(*1) PFM control, With UVLO function
DESIGNATOR
①
ITEM
Product Type
SYMBOL
A
Load Disconnection Without CL Auto Discharge
B
Load Disconnection With CL Auto Discharge
C
VBAT Bypass Without CL Auto Discharge
②③
Output Voltage
30 ~ 50
(*2)
UVLO Function
1
Packages (Order Unit)
ER-G(*3)
④
⑤⑥-⑦
DESCRIPTION
Output Voltage
e.g. VOUT=3.6V⇒②=3, ③=6
UVLO Function VUVLO_R=1.65V
CL-2025-02 (3,000pcs/Reel)
(*1) The
“-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
(*2) Please contact our sales representatives for UVLO release voltage other than those listed above.
It can be set from 1.65V to 2.2V in 0.05V increments.
(*3) ER-G is storage temperature range "-40℃ ~ 125 ℃".
XCL101①②③④⑤⑥-⑦(*1) PFM control, Without UVLO function
DESIGNATOR
①
ITEM
Product Type
SYMBOL
A
Load Disconnection Without CL Auto Discharge
B
Load Disconnection With CL Auto Discharge
C
VBAT Bypass Without CL Auto Discharge
②③
Output Voltage
18 ~ 50
④
UVLO Function
1
⑤⑥-⑦
(*1) The
Packages (Order Unit)
DESCRIPTION
Output Voltage
e.g. VOUT=3.6V⇒②=3, ③=6
No UVLO
BR-G(*2)
CL-2025 (3,000pcs/Reel)
ER-G(*3)
CL-2025-02 (3,000pcs/Reel)
“-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
(*2) BR-G is storage temperature range "-40℃ ~ 105 ℃".
(*3) ER-G is storage temperature range "-40℃ ~ 125 ℃".
4/25
XCL100/XCL101
Series
■PIN CONFIGURATION
7 L1
VSS 6
1 LX
NC 5
2 VOUT
* If the dissipation pad needs to be connected to other pins, it should be connected
CE 4
3 VBAT
* Please refer to pattern layout page for the connecting to PCB.
to the VSS pin.
8 L2
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
1
LX
Switching
2
VOUT
Output Voltage
3
VBAT
Power Input
4
CE
Chip Enable
5
NC
No Connection
6
VSS
Ground
7
L1
8
L2
Inductor Electrodes
■CE PIN FUNCTION
PIN NAME
SIGNAL
CE
STATUS
H
Operation
L
A,B Type : Stand-by
C Type : Bypass Mode
* Please do not leave the CE pin open.
■ ABSOLUTE MAXIMUM RATINGS
Ta=25ºC
PARAMETER
SYMBOL
RATINGS
UNITS
VBAT Pin Voltage
VBAT
-0.3 ~ 7.0
V
LX Pin Voltage
VLX
-0.3 ~ VOUT + 0.3 or 7.0 (*1)
V
VOUT Pin Voltage
VOUT
-0.3 ~ 7.0
V
CE Pin Voltage
VCE
-0.3 ~ 7.0
V
LX Pin Current
ILX
700
mA
Power Dissipation
Pd
1000 (40mm x 40mm Standard board) (*2)
mW
Operating Ambient Temperature
Topr
-40 ~+85
ºC
-40 ~ 105
ºC
-40 ~ 125
ºC
Storage
Temperature(*3)
CL-2025
CL-2025-02
Tstg
All voltages are described based on the GND.
(*1)
The maximum value should be either VOUT+0.3V or 7.0V in the lowest.
(*2)
The power dissipation figure shown is PCB mounted and is for reference only.
Please refer to PACKAGING INFORMATION for the mounting condition.
(*3)
Storage temperature, are divided by the product specification of the package.
5/25
XCL100/XCL101 Series
■ELECTRICAL CHARACTERISTICS
XCL101Axx1/ XCL101Bxx1
Ta=25 ºC
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
CIRCUIT
Input Voltage
VBAT
-
-
5.5
V
-
Output Voltage
VOUT(E)(*2)
V
①
Operation Start Voltage
VST1
IOUT=1mA
-
-
0.9
V
②
Operation Hold Voltage
VHLD
RL=1kΩ
-
0.7
-
V
②
Supply Current
Iq
μA
③
Input Pin Current
IBAT
VOUT=VOUT(T) (*1)+0.5V
-
0.25
1.0
μA
③
Stand-by Current
ISTB
VBAT=VLX=VOUT(T) (*1), VOUT=VCE=0V
-
0.1
1.0
μA
④
LX Leak Current
ILXL
VBAT=VLX=VOUT(T) (*1), VOUT=VCE=0V
-
0.1
1.0
μA
⑤
PFM Switching Current
IPFM
IOUT=3mA
295
350
405
mA
②
Maximum On Time
tONMAX
VPULL=1.5V, VOUT=VOUT(T) (*1)×0.98
3.1
4.6
6.0
μs
①
LX SW “Pch” ON
Resistance (*3)
RLXP
VBAT=VCE=VLX=VOUT(E) (*2)+ 0.5V,
IOUT=200mA
Ω
⑦
LX SW “Nch” ON
Resistance (*4)
RLXN
VBAT=VOUT(E) (*2)=3.3V, VOUT=1.7V
VPULL=1.5V, Voltage to start oscillation
while VOUT is decreasing
Oscillation stops, VBAT=VCE=1.5V
VOUT=VOUT(T) (*1) +0.5V
VBAT=VPULL=1.5V
VOUT=VOUT(T) (*1)×0.98
While VCE= 0.3→0.75V,
Voltage to start oscillation
VBAT=VPULL=1.5V
VOUT=VOUT(T) (*1)× 0.98
While VCE=0.75 → 0.3V,
Voltage to stop oscillation
-
0.6
-
Ω
⑧
0.75
-
5.5
V
①
VSS
-
0.3
V
①
CE “H” Voltage
VCEH
CE “L” Voltage
VCEL
CE “H” Current
ICEH
VBAT=VCE=VLX=VOUT=5.5V
-0.1
-
0.1
μA
①
CE “L” Current
ICEL
VBAT=VLX=VOUT=5.5V, VCE=0V
-0.1
-
0.1
μA
①
CL Discharge
Resistance
(B Type)
RDCHG
VBAT=VOUT=2.0V, VCE=0V
165
210
254
Ω
③
Inductance Value
L
Test Frequency=1MHz
-
4.7
-
μH
-
(Inductor) Rated Current
IDC
ΔT=+40℃
-
700
-
mA
-
Unless otherwise stated, VBAT= VCE= 1.5V
VOUT(T) =Nominal Output Voltage
VOUT(E) =Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output
voltage, including the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic
example.
(*3) L SW “Pch” ON resistance =(V -V
X
LX OUTpin measurement voltage) / 200mA
(*4) L SW “Nch” ONresistance measurement method is shown in the measurement circuit diagram.
X
(*1)
(*2)
6/25
XCL100/XCL101
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XCL101Cxx1
Ta=25 ºC
PARAMETER
SYMBOL
CONDITIONS
Input Voltage
VBAT
Output Voltage
VOUT(E)(*2)
Operation Start Voltage
VST1
IOUT=1mA
-
-
Operation Hold Voltage
VHLD
RL=1kΩ
-
0.7
Supply Current
Iq
Input Pin Current
IBAT
VBAT=VCE=1.5V, VOUT=VOUT(E)(*2)+0.5V
-
0.25
Bypass Mode Current
IBYP
VBAT=VLX=5.5V, VCE=0V
-
PFM Switching Current
IPFM
IOUT=3mA
Maximum On Time
tONMAX
VPULL=1.5V, VOUT=VOUT(T)(*1)×0.98
LX SW “Pch” ON
Resistance (*3)
RLXP
VBAT=VLX=VCE=VOUT(E)(*2)+ 0.5V,
IOUT=200mA
LX SW “Nch” ON
Resistance (*4)
RLXN
VBAT=VOUT(E)(*2)=3.3V, VOUT=1.7V
-
MIN.
TYP.
MAX.
UNITS
CIRCUIT
-
-
5.5
V
-
V
①
0.9
V
②
-
V
②
μA
③
1.0
μA
③
3.5
6.1
μA
⑥
295
350
405
mA
②
3.1
4.6
6.0
μs
①
Ω
⑦
VPULL=1.5V, Voltage to start oscillation
while VOUT is decreasing
Oscillation stops,
VOUT=VOUT(T)+0.5V (*1)
VBAT=VPULL=1.5V
VOUT=VOUT(T)(*1)×0.98
While VCE=0.3→0.75V,
Voltage to start oscillation
VBAT=VPULL=1.5V
VOUT=VOUT(T) (*1)× 0.98
While VCE=0.75 → 0.3V,
Voltage to stop oscillation
-
0.6
-
Ω
⑧
0.75
-
5.5
V
①
VSS
-
0.3
V
①
CE “H” Voltage
VCEH
CE “L” Voltage
VCEL
CE “H” Current
ICEH
VBAT=VCE=VLX=VOUT=5.5V
-0.1
-
0.1
μA
①
CE “L” Current
ICEL
VBAT=VLX=VOUT=5.5V, VCE=0V
-0.1
-
0.1
μA
①
Inductance Value
L
Test Frequency=1MHz
-
4.7
-
μH
-
(Inductor) Rated Current
IDC
ΔT=+40℃
-
700
-
mA
-
Unless otherwise stated, VBAT= VCE= 1.5V
VOUT(T) =Nominal Output Voltage
VOUT(E) =Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output
voltage, including the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic
example.
(*3) L SW “Pch” ON resistance =(V -V
X
LX OUTpin measurement voltage) / 200mA
(*4) L SW “Nch” ONresistance measurement method is shown in the measurement circuit diagram.
X
(*1)
(*2)
7/25
XCL100/XCL101 Series
■ELECTRICAL CHARACTERISTICS (Continued)
XCL100Axxx/ XCL100Bxxx
Ta=25℃
PARAMETER
SYMBOL
CONDITIONS
Input Voltage
VBAT
Output Voltage
VOUT(E) (*2)
Operation Start Voltage
VST
IOUT=1mA
Operation Hold Voltage
VHLD
RL=1kΩ
Supply Current2
Input Pin Current2
Stand-by Current
LX Leak Current
PFM Switching Current
Iq
Maximum ON Time
tONMAX
LX SW “Pch” ON
Resistance(*3)
RLXP
VBAT=VLX=VCE=VOUT(T)+0.5V (*1),
IOUT=200mA
LX SW “Nch” ON
Resistance (*4)
RLXN
VBAT=VCE=3.3V, VOUT=1.7V
MIN.
MAX.
UNITS
CIRCUIT
5.5
V
-
V
①
V
②
-
V
②
295
E4
E5
0.1
0.1
350
1.0
1.0
405
μA
μA
μA
μA
mA
③
③
④
⑤
②
3.1
4.6
6.0
μs
①
Ω
⑦
VPULL=1.5V, Voltage to start oscillation
while VOUT is decreasing
TYP.
E9
-
-
VDETECT
(E)
Oscillation stops,VOUT=VOUT(T)+0.5V (*1)
IBAT
VOUT=VOUT(T)+0.5V (*1)
ISTB
VBAT=VLX=VOUT(T) (*1), VOUT=VCE=0V
ILXL
VBAT=VLX=VOUT(T) (*1), VOUT=VCE=0V
IPFM
IOUT=3mA
VPULL=VRELEASE(T)+0.1V (*5),
VOUT=VOUT(T)×0.98 (*1)
-
(*7)
VRELEAS
E(E)
(*6)
E3
-
0.6
-
Ω
⑧
VCEH
VBAT=VPULL=VRELEASE(T)+0.1V (*5),
VOUT=VOUT(T)×0.98 (*1)
While VCE=0.3→0.75V,
Voltage to start oscillation
0.75
-
5.5
V
①
CE “L” Voltage
VCEL
VBAT=VPULL=VRELEASE(T)+0.1V (*5),
VOUT=VOUT(T)×0.98 (*1)
While VCE=0.75→0.3V,
Voltage to stop oscillation
VSS
-
0.3
V
①
CE “H” Current
CE “L” Current
CL Discharge Resistance
(B Type)
ICEH
VBAT=VCE=VLX=VOUT=5.5V
ICEL
VBAT= VLX=VOUT=5.5V, VCE=0V
-0.1
-0.1
-
0.1
0.1
μA
μA
①
①
VBAT=VOUT=2.0V, VCE=0V
165
210
254
Ω
③
CE “H” Voltage
UVLO Current
UVLO Release Voltage
RDCHG
IDQ
VRELEASE(E)
(*6)
UVLO Hysteresis Voltage
VHYS(E) (*8)
Inductance Value
(Inductor) Rated Current
IDC
L
VBAT=VCE=VDETECT(E) - 0.1V(*7),
IOUT=0mA
E6
μA
②
VPULL=VOUT=VOUT(T)×0.98 (*1) ,VBAT=VCE
Voltage to start oscillation while VBAT is
increasing
E7
V
①
VPULL=VOUT=VOUT(T)×0.98(*1), VBAT=VCE
VRELEASE(E) -Voltage to stop oscillation
while VBAT is decreasing (*6)
Test Frequency=1.0MHz
⊿T=+40℃
0.1
0.15
0.2
V
①
-
4.7
700
-
μH
mA
-
Unless otherwise stated, VBAT=VCE= VRELEASE(T)+0.1V (*5)
VOUT(T)=Nominal Output Voltage
VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output voltage, including
the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic example.
(*3)
LX SW “Pch” ON resistance=(VLX-VOUT pin measurement voltage) / 200mA
(*1)
(*2)
(*4)
The LX SW “Nch” ON resistance measurement method is shown in the measurement circuit diagram.
(*5)
VRELEASE(T)= Nominal UVLO release voltage
(*6)
VRELEASE(E)= Actual UVLO release voltage
(*7)
VDETECT(E)= VRELEASE(E) -VHYS(E)= Actual UVLO detect voltage
(*8)
VHYS(E)= Actual UVLO hysteresis voltage
8/25
XCL100/XCL101
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XCL100Cxxx
Ta=25℃
PARAMETER
SYMBOL
CONDITIONS
Input Voltage
VBAT
Output Voltage
VOUT(E) (*2)
Operation Start Voltage
VST
IOUT=1mA
Operation Hold Voltage
VHLD
RL=1kΩ
Supply Current2
Input Pin Current2
Bypass Mode Current
PFM Switching Current
Iq
Maximum ON Time
tONMAX
LX SW “Pch” ON
Resistance(*3)
RLXP
VBAT=VLX=VCE=VOUT(T)+0.5V (*1),
IOUT=200mA
LX SW “Nch” ON
Resistance (*4)
RLXN
VBAT=VCE=3.3V, VOUT=1.7V
MIN.
MAX.
UNITS
CIRCUIT
5.5
V
-
V
①
V
②
-
V
②
295
E4
E5
3.5
350
6.1
405
μA
μA
μA
mA
③
③
⑥
②
3.1
4.6
6.0
μs
①
Ω
⑦
VPULL=1.5V, Voltage to start oscillation
while VOUT is decreasing
E9
-
VOUT=VOUT(T)+0.5V (*1)
IBYP
VBAT=VLX=5.5V, VCE=0V
IPFM
IOUT=3mA
-
VDETECT
(E)
VPULL=VRELEASE(T)+0.1V (*5),
VOUT=VOUT(T)×0.98 (*1)
-
(*7)
Oscillation stops,VOUT=VOUT(T)+0.5V (*1)
IBAT
TYP.
VRELEAS
E(E)
(*6)
E3
-
0.6
-
Ω
⑧
VCEH
VBAT=VPULL=VRELEASE(T)+0.1V (*5),
VOUT=VOUT(T)×0.98 (*1)
While VCE=0.3→0.75V,
Voltage to start oscillation
0.75
-
5.5
V
①
CE “L” Voltage
VCEL
VBAT=VPULL=VRELEASE(T)+0.1V (*5),
VOUT=VOUT(T)×0.98 (*1)
While VCE=0.75→0.3V,
Voltage to stop oscillation
VSS
-
0.3
V
①
CE “H” Current
CE “L” Current
ICEH
VBAT=VCE=VLX=VOUT=5.5V
ICEL
VBAT= VLX=VOUT=5.5V, VCE=0V
-0.1
-0.1
-
0.1
0.1
μA
μA
①
①
UVLO Current
IDQ
VBAT=VCE=VDETECT(E) - 0.1V(*7),
IOUT=0mA
E6
μA
②
VPULL=VOUT=VOUT(T)×0.98 (*1) ,VBAT=VCE
Voltage to start oscillation while VBAT is
increasing
E7
V
①
CE “H” Voltage
UVLO Release Voltage
UVLO Hysteresis Voltage
Inductance Value
(Inductor) Rated Current
VRELEASE(E)
(*6)
VHYS(E)
L
IDC
(*8)
VPULL=VOUT=VOUT(T)×0.98(*1), VBAT=VCE
VRELEASE(E) -Voltage to stop oscillation
while VBAT is decreasing (*6)
Test Frequency=1.0MHz
⊿T=+40℃
0.1
0.15
0.2
V
①
-
4.7
700
-
μH
mA
-
Unless otherwise stated, VBAT=VCE= VRELEASE(T)+0.1V (*5)
VOUT(T)=Nominal Output Voltage
VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC. Therefore, the DC/DC circuit output voltage, including
the peripheral components, is boosted by the ripple voltage average value. Please refer to the characteristic example.
(*3)
LX SW “Pch” ON resistance=(VLX-VOUT pin measurement voltage) / 200mA
(*1)
(*2)
(*4)
The LX SW “Nch” ON resistance measurement method is shown in the measurement circuit diagram.
(*5)
VRELEASE(T)= Nominal UVLO release voltage
(*6)
VRELEASE(E)= Actual UVLO release voltage
(*7)
VDETECT(E)= VRELEASE(E) -VHYS(E)= Actual UVLO detect voltage
(*8)
VHYS(E)= Actual UVLO hysteresis voltage
9/25
XCL100/XCL101 Series
■ELECTRICAL CHARACTERISTICS (Continued)
SYMBOL
E1
E9
E2
E3
E4
PARAME
TER
Output Voltage
(XCL101)
Output Voltage
(XCL100)
Supply Current
LX SW “Pch” ON
RESISTANCE
Supply Current2
UNITS: V
UNITS: V
UNITS: V
UNITS: μA
UNITS: Ω
UNITS: μA
OUTPUT
VOLTAGE
MIN.
MAX.
MIN.
MAX.
1.8
1.764
1.836
-
-
1.9
1.862
1.938
-
-
2.0
1.960
2.040
-
-
2.1
2.058
2.142
-
-
2.2
2.156
2.244
-
-
2.3
2.254
2.346
-
-
2.4
2.352
2.448
-
-
2.5
2.450
2.550
-
-
2.6
2.548
2.652
-
-
2.7
2.646
2.754
-
-
2.8
2.744
2.856
-
-
2.9
2.842
2.958
-
-
3.0
2.940
3.060
2.940
3.060
3.1
3.038
3.162
3.038
3.162
3.2
3.136
3.264
3.136
3.264
3.3
3.234
3.366
3.234
3.366
3.4
3.332
3.468
3.332
3.468
3.5
3.430
3.570
3.430
3.570
3.6
3.528
3.672
3.528
3.672
3.7
3.626
3.774
3.626
3.774
3.8
3.724
3.876
3.724
3.876
3.9
3.822
3.978
3.822
3.978
4.0
3.920
4.080
3.920
4.080
4.1
4.018
4.182
4.018
4.182
4.2
4.116
4.284
4.116
4.284
4.3
4.214
4.386
4.214
4.386
4.4
4.312
4.488
4.312
4.488
4.5
4.410
4.590
4.410
4.590
4.6
4.508
4.692
4.508
4.692
4.7
4.606
4.794
4.606
4.794
4.8
4.704
4.896
4.704
4.896
4.9
4.802
4.998
4.802
4.998
5.0
4.900
5.100
4.900
5.100
10/25
TYP.
MAX.
TYP.
MAX.
TYP.
MAX.
6.1
9.4
0.84
1.08
6.8
9.7
6.2
9.7
0.75
0.97
6.9
9.8
6.3
10.0
0.65
0.85
7.0
10.0
6.4
10.2
0.61
0.78
7.1
10.1
6.5
10.4
0.57
0.74
7.2
10.2
6.7
10.7
0.53
0.72
7.3
10.3
XCL100/XCL101
Series
■ELECTRICAL CHARACTERISTICS (Continued)
SYMBOL
E5
E6
E7
E8
PARAMETER
Input Pin Current2
UVLO Current
UVLO RELEASE
VOLTAGE
UVLO Bypass
Current
UNITS:V
UNITS:μA
UNITS:μA
UNITS:V
UNITS:μA
UVLO
Release
Voltage
1.65
1.70
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
2.15
2.20
TYP.
MAX.
TYP.
MAX.
0.71
1.50
3.25
6.00
0.73
1.60
3.27
6.10
0.75
1.60
3.29
6.20
0.77
1.60
3.31
6.20
0.79
1.70
3.33
6.30
0.82
1.70
3.35
6.30
MIN.
MAX.
1.601
1.699
1.649
1.751
1.698
1.802
1.746
1.854
1.795
1.905
1.843
1.957
1.892
2.008
1.940
2.060
1.989
2.111
2.037
2.163
2.086
2.214
2.134
2.266
TYP.
MAX.
2.15
4.10
2.20
4.20
2.30
4.20
2.35
4.30
2.40
4.30
2.45
4.40
11/25
XCL100/XCL101 Series
■TEST CIRCUITS
CE
L2
VBAT
L2
CE
VBAT
A
NC
GND
VOUT
NC
CIN
Rpull
Lx
L1
CL
V
Waveform check point
L2
NC
VBAT
CE
VOUT
NC
L
GND
CL
Lx
L1
CIN
Waveform check point
A
V
A
L2
NC
GND
Lx
A
VBAT
VOUT
*External components
CIN:4.7μF(Ceramic)
CL:10μF(Ceramic)
L:4.7μH(Selected goods)
L1
Lx
A
VBAT
CE
VOUT
NC
A
Lx
L1
L2
GND
V
RL
CE
L1
CE
GND
*External components
CIN:4.7μF(Ceramic)
CL:10μF(Ceramic)
Rpull:100 ohm
Vpull
VOUT
A
L2
VBAT
VOUT
GND
L1
Lx
CIN
V
↓
*External components
CIN:4.7μF(Ceramic)
CE
L2
NC
GND
L1
L2
VBAT
CE
VOUT
NC
Lx
GND
A
VBAT
VOUT
L1
Lx
Rpull V1 CL
CIN
Vpull
Waveform check point
*External components
CIN:4.7μF(Ceramic)
CL:10μF(Ceramic)
Rpull:4.7 ohm
Use Test Circuit No.8 to adjust Vpull so that the LX pin voltage becomes 100mV when the Nch drive Tr is ON and then the
voltage at both ends of Rpull is measured to find the Lx SW "Nch" ON resistance.
RLXN=0.1V / {(V1 - 0.1V) / 4.7Ω)}
Note that V1 is the Rpull previous voltage when the Nch driver Tr is ON. Use an oscilloscope or other instrument to measure
the LX pin voltage and V1.
12/25
XCL100/XCL101
Series
■TYPICAL APPLICATION CIRCUIT
7 L1
VOUT
CL
10μF
1 Lx
VSS 6
2 VOUT
NC 5
3 VBAT
CE 4
VCE
8 L2
VIN
CIN
10μF
(TOP VIEW)
* The embedded coil is optimized for XCL100/XCL101 series. Please do not use for other purposes.
【Recommended External Components】
MANUFACTURE
TDK
CIN, CL
TAIYO YUDEN
PRODUCT NUMBER
VALUE
L×W (mm)
C1608JB1A106K
10μF/10V
1.60 × 0.80
C1608X5R1A106K
10μF/10V
1.60 × 0.80
C2012JB1A106K
10μF/10V
2.00 × 1.25
C2012X5R106K
10μF/10V
2.00 × 1.25
LMK107BBJ106MALT
10μF/10V
1.60 × 0.80
LMK212ABJ106KG
10μF/10V
2.00 × 1.25
LMK212BBJ226MG
22μF/10V
2.00 × 1.25
JMK212BBJ476MG
47μF/6.3V
2.00 × 1.25
13/25
XCL100/XCL101 Series
■OPERATION EXPLANATION
The XCL100/XCL101 Series consists of a standard voltage source, a PFM comparator, a Nch driver Tr, a Pch synchronous rectifier switch Tr,
a current sense circuit, a PFM control circuit and a CE control circuit, etc. (refer to the block diagram below.)
L1
L2
Inductor
LX
L1
LX
PFM C omparator U nit
CFB
PFM C omparator U nit
RFB1
Parasitic Diode
Controller
CFB
VOUT
RFB2
PFM
Comparator
FB
+
RFB1
Parasitic Diode
Controller
VOUT
Current Sense
PFM C ontroller
RFB2
PFM
Comparator
FB
VSS
VDD
VBAT
+
VOUT
PFM C ontroller
CL
Dis charge
Buffer
Driver
and
Inrush
Current
Protection
VSS
V OUT
V REF
VBAT - VOUT Detector
Hy ste re si s UVLO
Compa rator
+
V OUT
CE and Bypass
Controller Logic
VOUT
Current Sense
CL
Dis charge
Buffer
Driver
and
Inrush
Current
Protection
V REF
CE
L2
Inductor
CE
VDD
CE and Bypass
Controller Logic
VBAT - VOUT Detector
VBAT
-
< XCL101BType BLOCK DIAGRAM >
< XCL100B Type BLOCK DIAGRAM >
Current limit PFM control is used for the control method to make it difficult for the output voltage ripple to increase even when the switching
current is superimposed, so the product can be used within a wide voltage and current range. Further, because PFM control is used, it has
excellent transient response to support low capacity ceramic capacitors to realize a compact, high-performance boost DC/DC converter.
The synchronous driver and rectifier switch Tr efficiently sends the coil energy to the capacitor connected to the VOUT pin to achieve highly
efficient operation from low to high loads.
The electrical characteristics actual output voltage VOUT(E) is the PFM comparator threshold voltage shown in the block diagram. Therefore, the
booster circuit output voltage average value, including the peripheral components, depends on the ripple voltage, so this must be carefully
evaluated before being used in the actual product.
VBAT=VCE=2.0V、VOUT=3.3V、IOUT=20mA、L=4.7μH、CL=10μF、Ta=25℃
VOUT Voltage
Average
VBAT=VCE=2.0V、VOUT=3.3V、IOUT=70mA、L=4.7μH、CL=10μF、Ta=25℃
VLX
VLX
VOUT
VOUT
VLX:2V/div
VOUT Voltage
VOUT:50mV/div
Average
ILX:200mA/div
VOUT(E)
VOUT(E)
IPFM
ILX
2[μs/div]
ILX
2[μs/div]
< Reference Voltage Source (VREF)>
The reference voltage source (VREF voltage) provides the reference voltage to ensure stable output voltage of the DC/DC converter.
< PFM Control >
①The voltage from the output voltage divided by the division resistors RFB1 and RFB2 in the IC is used as feedback voltage (FB voltage), and the
PFM comparator is compared with the FB voltage and VREF. If the FB voltage is lower than VREF, the signal is sent to the buffer driver via the
PFM control circuit and the Nch driver Tr is turned ON. If the FB voltage is higher than VREF, the PFM comparator sends a signal that does not
turn ON the Nch driver Tr.
②The current sense circuit monitors the current flowing in the Nch driver Tr connected to the Lx pin when the Nch driver Tr is ON. When the
prescribed PFM switching current (IPFM) is reached, the signal is sent to the buffer driver via the PFM control circuit to turn OFF the Nch driver Tr
and turn ON the Pch synchronous rectifier switch Tr.
③The Pch synchronous rectifier switch Tr ON time (off time) is dynamically optimized internally. After the off time has passed, when the PFM
comparator confirms the VOUT voltage has exceeded the set voltage, a signal that does not allow the Nch driver Tr to be turned on is sent from
the PFM comparator to the PFM control circuit, but if the VOUT voltage remains lower than the set voltage, then Nch driver Tr ON is started.
The intervals of the above ①②③ linked operations are continuously adjusted in response to the load current to ensure the output voltage is
kept stable from low to high loads and that it is done with good efficiency.
14/25
XCL100/XCL101
Series
■OPERATION EXPLANATION (Continued)
The PFM switching current unit monitors the current flowing in the Nch driver Tr and functions to limit the current flowing in the Nch driver Tr,
but if the load current becomes much larger than the PFM switching energy, the VOUT voltage becomes lower and prevents the coil current in the
Nch driver Tr OFF period from lowering, which affects the internal circuit delay time and results in an excessive current that is larger than the
PFM switching current flowing in the Nch driver Tr and Pch synchronous rectifier switch Tr.
When "L" voltage is input to the CE pin, the A/B type enters into standby mode and the C type enters into bypass mode to stop the circuit required
for the boost operation. In the standby mode the load cut-off function operates and both the Nch driver Tr and Pch synchronous rectifier switch Tr
are turned OFF, which cuts off the current to the LX pin and VOUT pin and the parasitic diode control circuit connects the parasitic diode cathode of
the Pch synchronous rectifier switch Tr to the LX pin ①. In the bypass mode the Nch driver Tr is OFF, the Pch synchronous rectifier switch Tr is
ON when VLX > VOUT, and the parasitic diode control circuit connects the parasitic diode cathode of the Pch synchronous rectifier switch Tr to the
VOUT pin ②. Also, when VLX < VOUT, the Pch synchronous rectifier switch Tr is turned OFF and the parasitic diode cathode is connected to the VOUT
pin ②.
Note: Except for the moment when the VBAT voltage rises up under a start-up condition.
①
②
Parasitic Diode
Controller
LX Pin Side
Parasitic Diode
Controller
VOUT Pin Side
LX Pin Side
VOUT Pin Side
Buffer Driver
Buffer Driver
< VBAT-VOUT Voltage Detection Circuit>
The VBAT-VOUT voltage detection circuit compares the VBAT pin voltage with the VOUT pin voltage, and whichever is the highest is operated to
become the IC power supply (VDD). In addition, if, during normal operation, the input voltage becomes higher than the output voltage, the Nch
driver Tr is turned OFF and the Pch synchronous rectifier switch Tr is kept ON so that the input voltage passes through to the output voltage
(through mode). When the input voltage becomes lower than the output voltage, the circuit automatically returns to the normal boost operation.
This detection circuit does not operate when in the standby mode.
When the VBAT or VCE power supply is input, CL is charged via the stable current that results from the inrush current protection function (refer to
graphs below). Therefore, this function minimizes potential over current from the VBAT pin to the VOUT pin. Also, this current value depends on the
VBAT voltage. After CL is charged by the aforementioned stable current and VOUT reaches around the VBAT voltage level, the inrush current
protection function will be released after several hundred μs ~ several ms and the IC will then move to step-up mode, bypass mode or through
mode.
Inrush Current Protection Characteristics
600
Inrush Current Protection (mA)
300
550
250
500
200
450
400
150
350
100
300
50
0
0.5
250
1.0
1.5
2.0
2.5
200
3.0
3.0
Input Voltage: VBAT (V)
3.5
4.0
4.5
5.0
5.5
15/25
XCL100/XCL101 Series
■OPERATION EXPLANATION (Continued)
The UVLO function is selectable on the XCL100 series as an option. When the VBAT pin voltage falls below the UVLO detect voltage, the IC stops
switching or BYPASS operation and cuts off the current to the LX pin and VOUT pin (UVLO mode). In addition, when the VBAT pin voltage recovers to
above the UVLO release voltage, the IC begins operating again.
B types can discharge the electric charge at the output capacitor (CL) quickly during standby mode(CE=”L”) via the Nch FET located between
VOUT and GND.
Electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction during standby mode.
Discharge time of the output capacitor (CL) is set by the CL discharge resistance (RDCHG) and the output capacitor (CL). By setting time constant
of a CL discharge resistance value [RDCHG] and an output capacitor value (CL) as τ(τ=CL×RDCHG), discharge time can be the calculated by the
following formulas.
However, the CL discharge resistance [RDCHG] is depends on the VBAT or VOUT. We recommend that you fully check actual performance.
V=VOUT × e - t /τor t=τ
In(VOUT / V)
16/25
V
: Output voltage after discharge
VOUT
: Output voltage
t
: Discharge time
τ
: CL × RDCHG
CL
: Capacity value of the load capacitor (CL)
RDCHG
: CL Discharge resistance, it depends on the VBAT or VOUT
XCL100/XCL101
Series
■NOTE ON USE
1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC.
2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally connected
components, so refer to the specifications of each component and be careful when selecting the components. Be especially careful of the
characteristics of the capacitor used for the load capacity CL and use a capacitor with B characteristics (JIS Standard) or an X7R/X5R (EIA
Standard) ceramic capacitor.
3. Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could cause the IC
operation to become unstable, so reinforce the area around the GND pin of the IC in particular.
4. Mount the externally connected components in the vicinity of the IC. Also use short, thick wires to reduce the wire impedance.
5. An excessive current that is larger than the PFM switching current flowing in the Nch driver Tr and Pch synchronous rectifier switch Tr, which
could destroy the IC.
6. When in the bypass mode, the internal Pch synchronous rectifier switch Tr turns ON to allow current to flow to the Lx pin and VOUT pin. When
an excessive current comes from the VOUT pin when this bypass operates, it could destroy the Pch synchronous rectifier switch Tr.
7. The CE pin does not have an internal pull-up or pull-down, etc. Apply the prescribed voltage to the CE pin.
8. The embedded coil is optimized for XCL100/XCL101 series. Please do not use for other purposes.
9. At high temperatures, the product performance could vary causing the efficiency to decline. Evaluate this carefully before use if the product
will be used at high temperatures.
10. Please note that the leak current of the Pch synchronous rectifier switch Tr during high-temperature standby operation could cause the
output voltage to increase.
11. When the voltage difference between VIN and VOUT is small, switching energy increases and there is a possibility that the ripple voltage
will be too large. And when the ripple voltage becomes big by influence of a load current, please add the CL capacitor.
12. When the booster circuit is activated by a low input voltage, during the time until the output voltage reaches about 1.7V, the PFM switching
current function might not operate causing the coil current to be superimposed. (See the figure below.)
VBAT=VCE=0→0.9V、VOUT=1.8V、IOUT=1mA、L=4.7μH、CL=10μF、Ta=25℃
V OUT
V BAT =V CE
VBAT=VCE:1.0V/div
V LX
VOUT:1.0V/div
VLX:2.0V/div
ILX:200mA/div
ILX
200[μs/div]
V OUT
V BAT =V CE
VBAT=VCE:1.0V/div
V LX
Zoom
VOUT:1.0V/div
VLX:2.0V/div
ILX:200mA/div
ILX
50[μs/div]
VBAT=VCE=0→1.7V、VOUT=1.8V、IOUT=1mA、L=4.7μH、CL=10μF、Ta=25℃
V BAT =V CE
V LX
VBAT=VCE:1.0V/div
V OUT
VOUT:1.0V/div
VLX:2.0V/div
ILX
ILX:200mA/div
200[μs/div]
V BAT =V CE
V LX
V OUT
VBAT=VCE:1.0V/div
VOUT:1.0V/div
Zoom
VLX:2.0V/div
ILX
ILX:200mA/div
50[μs/div]
17/25
XCL100/XCL101 Series
■NOTE ON USE (Continued)
13. If the CL capacity or load current becomes excessively large, the output voltage start-up time, when the power is turned on, will increase, so
the coil current might be superimposed during the time it takes for the output voltage to become sufficiently higher than the VBAT voltage.
14. If the input voltage is higher than the output voltage, then the circuit automatically enters the through mode. When the input voltage
becomes close to the output voltage, there could be repeated switching between the boost mode and through mode causing the ripple
voltage to fluctuate. (Refer to the graphic below)
VBAT=VCE=3.316V,VOUT=3.412V,IOUT=3mA,L=4.7μH,CL=10μF,Ta=25℃
VOUT
VOUT:100mV/div
VBAT
VBAT:100mV/div
VLX
VLX:2.0V/div
200[μs/div]
15. If a different power supply is connected from an external source to the IC could be destroyed.
Refer to the table below for external voltage availability for each product type and operating conditions.
Series/
TYPE
Applied
Voltage
to the
VOUT pin
Applied
Voltage
to the
VOUT pin
VRELEASE(E)≦VBAT≦5.5V
(UVLO Release State)
0.9V≦VBAT<VRELEASE(E)
(UVLO Detect State)
CE="L"
CE="L"
CE="H"
Yes
Yes
No
(CL Discharge
Operation)
No
(CL Discharge
Operation)
Yes
Yes
XCL100A
Yes
XCL100B
No
(CL Discharge
Operation)
XCL100C
No
(Reverse Flow
toward the input)
CE="H"
Yes
0.9V≦VBAT≦5.5V
Series/
TYPE
CE="L"
XCL101A
Yes
XCL101B
No
(CL Discharge
Operation)
XCL101C
No
(Reverse Flow
toward the input)
VBAT<0.9V
CE="L"
CE="H"
No
No
VBAT<0.9V
CE="H"
CE="L"
CE="H"
Yes
No
No
16. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded.
17. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and postaging protection treatment when using Torex products in their systems.
18/25
XCL100/XCL101
Series
■NOTE ON USE (Continued)
18. With the A Type, when the VBAT or VCE power supply is input, if the VOUT pin voltage does not exceed VBAT -0.35V, which can happen due to
the load current being more than the inrush protection current, step-up mode or through mode operations won’t function correctly.
19. In the case of products with the UVLO function that do not have CL discharge, the output voltage may occasionally rise due to leakage current
from the Pch synchronous switch Tr when high-temperature UVLO mode operates.
20. The proper position of mounting is based on the coil terminal
●Instruction of pattern layouts
1. In order to stabilize VBAT voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VBAT and ground
pins.
2. Please mount each external component as close to the IC as possible.
3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
4. Make sure that the ground traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of
switching may result in instability of the IC.
5. Internal driver transistors bring on heat because of the transistor current and ON resistance of the driver transistors.
6. As precautions on mounting, please set the mounting position accuracy within 0.05 mm
●Recommended Pattern Layout
TOREX
XCL101
GND
CE
IC
LX
Lx
CIN
VIN
CL
GND
VOUT
■About the appearance (coil part)
(1) Coils are compliant with general surface mount type chip coil (inductor) specifications and may have scratches, flux contamination and the
like.
19/25
XCL100/XCL101 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
1) Output Voltage vs. Output Current
XCL101C501BR-G
XCL101C331BR-G
5.8
Ta=25℃
Output Voltage:V OUT(V)
Output Voltage:V OUT(V)
3.7
3.5
3.3
VIN=1.5V
3.1
1.8V
3.0V
Ta=25℃
5.4
5.0
VIN=3.0V
4.6
3.6V
4.2V
4.2
2.9
0.01
0.1
1
10
100
0.01
1000
0.1
1
10
100
1000
Output Current:IOUT (mA)
Output Current:IOUT (mA)
2) Efficiency vs. Output Current
XCL101C501BR-G
100
100
80
80
60
3.0V
1.8V
VIN= 1.5V
40
Efficiency:EFFI(%)
Efficiency:EFFI(%)
XCL101C331BR-G
4.2V
3.6V
60
VIN= 3.0V
40
20
20
Ta=25℃
Ta=25℃
0
0.01
0.1
1
10
100
0
0.01
1000
0.1
1
10
100
1000
Output Current:IOUT (mA)
Output Current:IOUT (mA)
3) Ripple Voltage vs. Output Current
XCL101C501BR-G
XCL101C331BR-G
Ta=25℃
160
120
Ripple Voltage:Vr(mV)
Ripple Voltage:Vr(mV)
200
VIN=1.5V
1.8V
3.0V
80
40
0
0.01
0.1
1
10
Output Current:IOUT (mA)
20/25
200
100
1000
160
Ta=25℃
VIN=3.0V
3.6V
4.2V
120
80
40
0
0.01
0.1
1
10
Output Current:IOUT (mA)
100
1000
XCL100/XCL101
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
4) Bypass Voltage vs. Output Current
XCL101C331BR-G
3.8
VIN=3.6V
CE=0V
-40℃
3.6
Ta=25℃
3.5
85℃
3.4
3.3
3.2
3.1
0
50
100
150
200
250
VIN=5.0V
CE=0V
5.1
Output Voltage : V OUT (V)
3.7
Output Voltage : V OUT (V)
XCL101C501BR-G
5.2
300
5.0
-40℃
Ta=25℃
4.9
85℃
4.8
4.7
4.6
4.5
0
50
Output Current: IOUT (mA)
100
150
200
250
300
Output Current: IOUT (mA)
5) Load Transient Response
XCL101C331BR-G
XCL101C331BR-G
IOUT= 1.0mA→50mA
IOUT= 50mA→1.0mA
VOUT
VOUT
IOUT =50mA
IOUT SW
IOUT SW
IOUT =50mA
IOUT =1.0mA
IOUT =1.0mA
VBAT=VCE=1.8V, VOUT=3.3V, Ta=25℃, CIN=4.7μF, CL=10μF
VBAT=VCE=1.8V, VOUT=3.3V, Ta=25℃, CIN=4.7μF, CL=10μF
VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs
VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs
XCL101C501BR-G
XCL101C501BR-G
IOUT= 1.0mA→50mA
IOUT= 1.0mA→50mA
VOUT
VOUT
IOUT =50mA
IOUT SW
IOUT =1.0mA
IOUT SW
IOUT =50mA
IOUT =1.0mA
VBAT=VCE=3.0V, VOUT=5.0V, Ta=25℃, CIN=4.7μF, CL=10μF
VBAT=VCE=3.0V, VOUT=5.0V, Ta=25℃, CIN=4.7μF, CL=10μF
VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs
VOUT:50mV/Div, IOUT SW:1.0V/Div, Time:20μs
21/25
XCL100/XCL101 Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
OUTLINE / LAND PATTERN
THERMAL CHARACTERISTICS
CL-2025
CL-2025 PKG
CL-2025 Power Dissipation
CL-2025-02
CL-2025-02 PKG
CL-2025-02 Power Dissipation
22/25
XCL100/XCL101
Series
■MARKING RULE
XCL101
① represents products series
MARK
PRODUCT SERIES
1
1
①
②
③
⑤
3
④
2
6
5
4
XCL101******-G
② represents integer portion of the output voltage
XCL101A*****
XCL101C*****
VOUT (V)
MARK
VOUT (V)
1.x
2.x
3.x
4.x
5.x
1
2
3
4
5
MARK
1.x
2.x
3.x
4.x
5.x
B
C
D
E
F
CL-2025/CL-2025-02
③ represents the decimal part of output voltage
VOUT(V)
MARK
PRODUCT SERIES
X.0
X.1
X.2
X.3
X.4
X.5
X.6
X.7
X.8
X.9
0
1
2
3
4
5
6
7
8
9
XCL101**0***-G
XCL101**1***-G
XCL101**2***-G
XCL101**3***-G
XCL101**4***-G
XCL101**5***-G
XCL101**6***-G
XCL101**7***-G
XCL101**8***-G
XCL101**9***-G
Example (mark②, ③)
XCL101A33***-G
②
③
3
3
MARK
XCL101C28***-G
②
③
C
8
XCL101A50***-G
②
③
5
0
④, ⑤ represents production lot number
01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
23/25
XCL100/XCL101 Series
■MARKING RULE
XCL100
① represents products series
MARK
PRODUCT SERIES
XCL100A**1/2/3/4/5/6/7/8/9/A/B/CE*-G
XCL100B**1/2/3/4/5/6/7/8/9/A/B/CE*-G
XCL100C**1/2/3/4/5/6/7/8/9/A/B/CE*-G
R
S
T
1
①
②
③
⑤
3
④
2
6
CL-2025-02
5
4
② represents output voltage
MARK
VOUT (V)
MARK
VOUT (V)
MARK
1
3.5
7
4.1
D
3.0
VOUT (V)
4.7
2
3.6
8
4.2
E
3.1
4.8
3
3.7
9
4.3
F
3.2
4.9
4
3.8
A
4.4
H
3.3
5.0
5
3.9
B
4.5
K
3.4
-
6
4.0
C
4.6
③ represents output voltage range and UVLO release voltage
MARK
Output Voltage
UVLO
Range
Release Voltage
0
3.0~3.4V
1
3.5~5.0V
2
3.0~3.4V
3
3.5~5.0V
4
3.0~3.4V
5
3.5~5.0V
6
3.0~3.4V
7
3.5~5.0V
8
3.0~3.4V
9
3.5~5.0V
A
3.0~3.4V
B
3.5~5.0V
C
3.0~3.4V
D
3.5~5.0V
E
3.0~3.4V
F
3.5~5.0V
H
3.0~3.4V
K
3.5~5.0V
L
3.0~3.4V
M
3.5~5.0V
N
3.0~3.4V
P
3.5~5.0V
R
3.0~3.4V
S
3.5~5.0V
1.65
XCL100***1**-G
1.70
XCL100***2**-G
1.75
XCL100***3**-G
1.80
XCL100***4**-G
1.85
XCL100***5**-G
1.90
XCL100***6**-G
1.95
XCL100***7**-G
2.00
XCL100***8**-G
2.05
XCL100***9**-G
2.10
XCL100***A**-G
2.20
XCL100***B**-G
2.15
XCL100***C**-G
④, ⑤ represents production lot number
01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
24/25
PRODUCT SERIES
XCL100/XCL101
Series
1.
The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2.
The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3.
Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4.
The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5.
Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6.
Our products are not designed to be Radiation-resistant.
7.
Please use the product listed in this datasheet within the specified ranges.
8.
We assume no responsibility for damage or loss due to abnormal use.
9.
All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
25/25