XCL208A203DR

XCL208/XCL209 Series ETR28003-006 400mA Inductor Built-in Step-Down “micro DC/DC” Converters ☆Green Operation Compatible ■GENERAL DESCRIPTION The XCL208/XCL209 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC in one tiny package (2.5mm×2.15mm, h=1.05mm). A stable power supply with an output current of 400mA is configured using only two capacitors connected externally. An internal coil simplifies the circuit and enables minimization of noise and other operational trouble due to the circuit wiring. A wide operating voltage range of 1.8V (2.0V) to 6.0V enables support for applications that require an alkaline battery (2-cell) or AC adapter (5V) power supply. An internally fixed output voltage (0.8V to 4.0V) or an externally set output voltage can be selected. The XCL208/XCL209 series uses synchronous rectification at an operating frequency of 3.0MHz. PWM control (XCL208) or automatic PWM/PFM switching control (XCL209) can be selected. The XCL208 series has a fixed frequency, enabling the suppression of output ripple. The XCL209 series achieves high efficiency while holding down output ripple across the full range of loads, from light to heavy, enabling the extension of battery operation time. Soft start and on/off functions with CL discharge are provided, and the IC can be put in the standby state by inputting a Low level signal into the CE pin. ■FEATURES ■APPLICATIONS Input Voltage ●Mobile phones, Smart phones ●Bluetooth Headsets ●Tablet PCs ●PND ●PC peripheral devices ●DSC, Camcorders ■TYPICAL APPLICATION CIRCUIT 2.0～6.0V (L2) (VIN) 400mA (VOUT) (PVss) (AVss) (CE) Protection Circuits : Control Methods : Operating Ambient Temperature : Package : Environmentally Friendly : CL 10μF CIN 4.7μF Fixed Output Voltage High Efficiency Output Current Oscillation Frequency CE Function : : : : : : : ■ TYPICAL PERFORMANCE CHARACTERISTICS (Lx) (L1) ●Efficiency vs. Output Current A/B Type XCL208x333DR/XCL209x333D 400mA 100 R1 (VIN) (L2) CIN 4.7μF R2 (PVss) (AVss) (CE) (Lx) (L1) XCL209(PWM/PFM) 80 CFB (FB) CL 10μF Efficiency:EFFI(%) 1.8～6.0V 60 VIN= 4.2V 40 XCL208(PWM) 5.0V 20 V OUT =3.3V 0 0.01 F Type 1.8V ~ 6.0V (Type F) 2.0V ~ 6.0V (Type A/B) 0.8V ~ 4.0V (±2.0%) 90% (VIN=4.2V, VOUT=3.3V) 400mA 3.0MHz (±15%) Active High Soft-start Circuit Built-in CL High Speed Auto Discharge Current Limiter Built-in (Constant Current & Latching) PWM (XCL208) PWM/PFM (XCL209) -40℃ ~ 85℃ USP-10B03 EU RoHS Compliant, Pb Free 0.1 1 10 100 1000 Output Current:IOUT (mA) 1/22 XCL208/XCL209 Series ■BLOCK DIAGRAM 1) A Type L1 2) B Type L2 VOUT L1 VOUT LX VIN PVSS AVSS L2 CE LX VIN AVSS PVSS CE 3) F Type L1 L2 FB LX VIN PVSS AVSS CE NOTE: The XCL208 offers a PWM control, a signal from CE Control Logic to PWM/PFM Selector is fixed to "L" level inside. The XCL209 control scheme is PWM/PFM automatic switching, a signal from CE Control Logic to PWM/PFM Selector is fixed to "H" level inside. The diodes placed inside are ESD protection diodes and parasitic diodes. 2/22 XCL208/XCL209 Series ■PRODUCT CLASSIFICATION XCL208①②③④⑤⑥ PWM XCL209①②③④⑤⑥ PWM/PFM Auto Switching DESIGNATOR ITEM SYMBOL DESCRIPTION 10 12 15 18 25 28 2L 30 33 08 VIN≧2.0V Fixed Output Voltage Standard soft-start , No CL auto discharge VIN≧2.0V Fixed Output Voltage CL auto discharge, High speed soft-start VIN≧1.8V Output Voltage External Setting CL auto discharge, High speed soft-start 1.0V 1.2V 1.5V 1.8V 2.5V 2.8V 2.85V 3.0V 3.3V External Setting 0.8V (XCL208F/XCL209F) Oscillation Frequency 3 3.0MHz Package (Order Unit) DR A Type ① B F Output Voltage (*1) ②③ ④ ⑤⑥ (*2) USP-10B03 (3,000psc/Reel)(*3) When other output voltages (semi-custom) are needed, please contact your local Torex sales office for more information. Output voltage range is 0.8V~4.0V. (*2) Halogen free and EU RoHS compliant. (*3) The reels are shipped in a moisture-proof packing (*1) ■PIN CONFIGURATION L1 VIN 8 NC CE 1 PVSS 7 2 LX 6 3 NC 9 10 AVSS 4 V OUT / FB 5 L2 (BOTTOM VIEW) 3/22 XCL208/XCL209 Series ■PIN ASSIGNMENT PIN NUMBER USP-10B03 PIN NAME FUNCTIONS PVSS LX NC FB VOUT AVSS CE NC VIN L1 L2 (Power) Ground Switching Output No Connection Output Voltage Sense Pin (Type F) Fixed Output Voltage Pin (Type A/B) (Analog) Ground Active High Enable No Connection Power Supply Input Inductor Electrodes Inductor Electrodes 1 2 3 4 5 6 7 8 9 10 ■FUNCTION PIN NAME SIGNAL CONDITIONS STATUS L AVSS≦VCE≦0.25V Stand-by H 0.65V≦VCE≦6V Active CE * When the CE pin is left open, the IC may operate unstable. Please do not leave the CE pin open. ■ABSOLUTE MAXIMUM RATINGS Ta=25℃ PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN -0.3 ~ 6.5 V Lx Pin Voltage VLx -0.3 ~ VIN+0.3≦6.5 V Output Voltage VOUT -0.3 ~ 6.5 V FB Pin Voltage VFB -0.3 ~ 6.5 V CE Input Voltage VCE -0.3 ~ 6.5 V Lx Pin Current ILX ±1500 Power Dissipation Pd Operating Ambient Temperature Topr -40 ~ 85 ℃ Storage Temperature Tstg -40 ~ 125 ℃ 500(40mm x 40mm Standard board) Each voltage rating uses the VSS pin as a reference. (*1) The power dissipation figure shown is PCB mounted and is for reference only. Please refer to PACKAGING INFORMATION for the mounting condition. 4/22 mA (*1) mW XCL208/XCL209 Series ■ELECTRICAL CHARACTERISTICS Ta=25℃ 1) XCL208Axx3DR/XCL209Axx3DR PARAMETER SYMBOL Output Voltage VOUT Operating Voltage Range VIN Maximum Output Current IOUTMAX UVLO Voltage VUVLO Supply Current (XCL208) CONDITIONS MIN. TYP. MAX. UNIT CIRCUIT V ① 2.0 - 6.0 V ① VIN=VOUT(T)+2.0V, VCE=1.0V (*8) 400 - - mA ① VCE =VIN, VOUT =0V, Voltage which Lx pin holding “L” level (*1),(*10) 1.00 1.40 1.78 V ③ - 46 65 - 21 35 μA ② - 0 1 μA ② 2.55 3.00 3.45 MHz ① mA ⑩ - 200 300 % ① VIN=VCE=5.0V, IOUT=30mA IDD VIN=VCE=5.0V, VOUT=VOUT(T)×1.1 Stand-by Current ISTB VIN=5.0V, VCE=0V, VOUT=VOUT(T)×1.1 Oscillation Frequency fOSC VIN=VOUT(T)+2.0V, VCE=1.0V, IOUT=100mA PFM Switching Current (*11) IPFM VIN=VOUT(T)+2.0V, VCE=VIN , IOUT=1mA PFM Duty Limit (*11) DTYLIMIT_PFM Maximum Duty Cycle DMAX VIN=VCE=5.0V, VOUT=VOUT(T)×0.9 100 - - % ③ Minimum Duty Cycle DMIN VIN=VCE=5.0V, VOUT=VOUT(T)×1.1 - - 0 % ③ Efficiency (*2) EFFI When connected to external components, VCE=VIN=VOUT(T)+1.2V, IOUT=100mA - - % ① LX SW "H" ON Resistance 1 RLxH1 VIN=VCE=5.0V, VOUT=0V, ILX=100mA (*3) - 0.35 0.55 Ω ④ LX SW "H" ON Resistance 2 RLxH2 VIN=VCE=3.6V, VOUT=0V, ILX=100mA (*3) - 0.42 0.67 Ω ④ LX SW "L" ON Resistance 1 RLxL1 VIN=VCE=5.0V (*4) - 0.45 0.65 Ω - LX SW "L" ON Resistance 2 RLxL2 VIN=VCE=3.6V (*4) - 0.52 0.77 Ω - LX SW "H" Leakage Current (*5) ILeakH VIN=VOUT=5.0V, VCE=0V, VLX=0V - 0.01 1.00 μA ⑤ LX SW "L" Leakage Current (*5) ILeakL VIN=VOUT=5.0V, VCE= 0V, VLX=5.0V - 0.01 1.00 μA ⑤ Current Limit (*9) ILIM VIN=VCE=5.0V, VOUT=VOUT(T)×0.9 (*7) 600 800 1000 mA ⑥ - ±100 - ppm/℃ ① 0.65 - 6.00 V ③ Supply Current (XCL209) VCE=VIN=, IOUT=1mA Output Voltage Temperature ΔVOUT/ Characteristics (VOUT･ΔTopr) CE "H" Voltage VCEH CE "L" Voltage VCEL VOUT=0V, Applied voltage to VCE, Voltage changes Lx to “L” level (*10) AVSS - 0.25 V ③ CE "H" Current ICEH VIN=VCE= 5.0V, VOUT=0V -0.1 - 0.1 μA ⑤ CE "L" Current ICEL VIN=5.0V, VCE=0V, VOUT=0V -0.1 - 0.1 μA ⑤ Soft-start Time tSS VCE=0V→VIN, IOUT=1mA 0.5 0.90 2.50 ms ① 1 - 20 ms ⑦ V ⑦ Latch Time tLAT IOUT=30mA, -40℃≦Topr≦85℃ VOUT=0V, Applied voltage to VCE, Voltage changes Lx to “H” level (*10) VIN=VCE=5.0V, VOUT=0.8×VOUT(T), Short Lx at 1Ω resistance (*6) Sweeping VOUT, VIN=VCE=5.0V, Short Protection Threshold Voltage VSHORT Short Lx at 1Ω resistance, VOUT voltage which Lx becomes “L” level within 1ms Inductance Value L Allowed Inductor Current IDC Test Frequency=1MHz - 1.5 - μH - ΔT=40℃ - 700 - mA - Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(T)=Nominal Voltage NOTE: (*1) Including hysteresis operating voltage range. (*2) EFFI={ (output voltage×output current) / (input voltage×input current) }×100 (*3) ON resistance (Ω)=(VIN - Lx pin measurement voltage) / 100mA (*4) Design value (*5) When temperature is high, a current of approximately 10μA (maximum) may leak. (*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating. (*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance. (*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. (*9) Current limit denotes the level of detection at peak of coil current. (*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V (*11) IPFM and DTY LIMIT_PFM are defined only for the XCL209 series. 5/22 XCL208/XCL209 Series ■ELECTRICAL CHARACTERISTICS (Continued) 2) XCL208Bxx3DR/XCL209Bxx3DR Ta=25℃ PARAMETER Output Voltage Operating Voltage Range SYMBOL VOUT VIN CONDITIONS VIN=VCE=5.0V, IOUT=30mA MIN. 2.0 TYP. - MAX. 6.0 UNIT V V CIRCUIT ① ① Maximum Output Current IOUTMAX VIN=VOUT(T)+2.0V, VCE=1.0V (*8) 400 - - mA ① UVLO Voltage VUVLO VCE=VIN, VOUT=0V, Voltage which Lx pin holding “L” level (*1),(*10) 1.00 1.40 1.78 V ③ - 46 21 0 65 35 1 μA ② μA ② 2.55 3.00 3.45 MHz ① mA ⑩ 100 - 200 - 300 0 % % % ① ③ ③ Supply Current (XCL208) Supply Current (XCL209) Stand-by Current IDD VIN=VCE=5.0V, VOUT=VOUT(T) ×1.1 ISTB VIN=5.0V, VCE=0V, VOUT=VOUT(T) ×1.1 Oscillation Frequency fOSC VIN=VOUT(T)+2.0V, VCE=1.0V, IOUT=100mA PFM Switching Current (*11) IPFM VIN=VOUT(T)+2.0V, VCE=VIN , IOUT=1mA PFM Duty Limit (*11) Maximum Duty Cycle Minimum Duty Cycle DTYLIMIT_PFM DMAX DMIN Efficiency (*2) EFFI VCE=VIN=VOUT(T)+1.2V, IOUT=100mA - - % ① LX SW "H" ON Resistance 1 LX SW "H" ON Resistance 2 LX SW "L" ON Resistance 1 LX SW "L" ON Resistance 2 RLxH1 RLxH2 RLxL1 RLxL2 VIN=VCE=5.0V, VOUT=0V, ILX=100mA (*3) VIN=VCE=3.6V, VOUT=0V, ILX=100mA (*3) VIN=VCE=5.0V (*4) VIN=VCE=3.6V (*4) - 0.35 0.42 0.45 0.52 0.55 0.67 0.65 0.77 Ω Ω Ω Ω ④ ④ - LX SW "H" Leakage Current (*5) ILeakH VIN=VOUT=5.0V, VCE=0V, VLX=0V - 0.01 1.00 μA ⑨ Current Limit (*9) ILIM 600 800 1000 mA ⑥ Output Voltage Temperature Characteristics ΔVOUT/ (VOUT･ΔTopr) - ±100 - ppm/℃ ① CE "H" Voltage VCEH 0.65 - 6.00 V ③ CE "L" Voltage VCEL CE "H" Current CE "L" Current Soft-start Time ICEH ICEL tSS Latch Time tLAT Short Protection Threshold Voltage VSHORT CL Discharge RDCHG Inductance Value Allowed Inductor Current L IDC VCE=VIN=, IOUT=1mA VIN=VCE=5.0V, VOUT=VOUT(T)×0.9 VIN=VCE=5.0V, VOUT=VOUT(T)×1.1 VIN=VCE=5.0V, VOUT=VOUT(T)×0.9 (*7) IOUT=30mA, -40℃≦Topr≦85℃, VOUT=0V, Applied voltage to VCE Voltage changes Lx to “H” level （*10） VOUT=0V, Applied voltage to VCE Voltage changes Lx to “L” level （*10） VIN=VCE=5.0V, VOUT=0V VIN=5.0V, VCE=0V, VOUT=0V VCE=0V→VIN, IOUT=1mA VIN=VCE=5.0V, VOUT=0.8×VOUT(T), Short Lx at 1Ω resistance (*6) Sweeping VOUT, VIN=VCE=5.0V, Short Lx at 1Ω resistance, VOUT voltage which Lx becomes “L” level within 1ms VIN=5.0V, LX=5.0V, VCE=0V, VOUT=Open Test Frequency=1MHz ΔT=40℃ AVSS 0.25 V ③ -0.1 -0.1 - 0.1 0.1 μA μA ms ⑤ ⑤ ① 1 - 20 ms ⑦ V ⑦ 200 300 450 Ω ⑧ - 1.5 700 - μH mA - Test conditions: Unless otherwise stated, VIN=5.0V, VOUT (T)=Nominal Voltage NOTE: (*1) Including hysteresis operating voltage range. (*2) EFFI={ ( output voltage×output current ) / ( input voltage×input current) }×100 (*3) ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA (*4) Design value (*5) When temperature is high, a current of approximately 10μA (maximum) may leak. (*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating. (*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance. (*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. (*9) Current limit denotes the level of detection at peak of coil current. (*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V (*11) IPFM and DTY LIMIT_PFM are defined only for the XCL209 series. 6/22 XCL208/XCL209 Series ■ELECTRICAL CHARACTERISTICS (Continued) Ta=25℃ 3) XCL208F083DR/XCL209F083DR PARAMETER FB Voltage SYMBOL VFB Operating Voltage Range VIN Maximum Output Current IOUTMAX UVLO Voltage Supply Current (XCL208) VUVLO CONDITIONS VIN=VCE=5.0V, VFB voltage which Decrease VFB from 0.9V, Lx becomes “H” (*10) level VIN=3.2V, VCE=1.0V (*8) VCE=VIN, VFB=0.4V, Voltage which Lx pin holding “L” level (*1), (*10) MIN. TYP. MAX. UNIT CIRCUIT 0.784 0.800 0.816 V ③ 1.8 - 6.0 V ① 400 - - mA ① 1.00 1.40 1.78 V ③ - 46 65 - 21 35 μA ② - 0 1.0 μA ③ 2.55 3.00 3.45 MHz ① mA ⑩ IDD VIN=VCE= 5.0V, VFB=0.88V Stand-by Current ISTB VIN=5.0V, VCE=0V, VFB=0.88V Oscillation Frequency fOSC VIN=3.2V, VCE=1.0V, IOUT=100mA PFM Switching Current (*11) IPFM VIN=3.2V, VCE= VIN, IOUT=1mA PFM Duty Limit (*11) DTYLIMIT_PFM VIN=VCE=2.2V, IOUT=1mA - 200 300 % ① Maximum Duty Cycle MAXDTY VIN=VCE=5.0V, VFB=0.72V 100 - - % ③ Minimum Duty Cycle MINDTY VIN=VCE=5.0V, VFB=0.88V - - 0 % ③ Efficiency (*2) EFFI VCE=VIN=2.4V, IOUT=100mA - - % ① LX SW "H" ON Resistance 1 RLxH1 VIN=VCE=5.0V, VFB=0.72V, ILX=100mA (*3) - 0.35 0.55 Ω ④ LX SW "H" ON Resistance 2 RLxH2 VIN=VCE=3.6V, VFB=0.72V, ILX=100mA (*3) - 0.42 0.67 Ω ④ LX SW "L" ON Resistance 1 RLxL1 VIN=VCE=5.0V (*4) - 0.45 0.65 Ω - LX SW "L" ON Resistance 2 RLxL2 VIN=VCE=3.6V (*4) - 0.52 0.77 Ω - LX SW "H" Leakage Current (*5) ILeakH VIN=VFB=5.0V, VCE=0V, LX=0V - 0.01 1.00 μA ⑨ Current Limit (*9) ILIM 600 800 1000 mA ⑥ Output Voltage Temperature ΔVOUT/ Characteristics (VOUT･ΔTopr) - ±100 - ppm/℃ ① CE "H" Voltage VCEH 0.65 - 6.00 V ③ CE "L" Voltage VCEL AVSS - 0.25 V ③ CE "H" Current ICEH VIN=VCE=5.0V, VFB=0.72V -0.1 - 0.1 μA ⑤ CE "L" Current ICEL -0.1 - 0.1 μA ⑤ Soft-start Time tSS VIN=5.0V, VCE=0V, VFB=0.72V When connected to external components, VCE=0V→VIN, IOUT=1mA - 0.25 0.40 ms ① Latch Time tLAT 1 - 20 ms ⑦ Short Protection Threshold Voltage VSHORT 0.150 0.200 0.250 V ⑦ Supply Current (XCL209) CL Discharge RDCHG Inductance Value L Allowed Inductor Current IDC VIN=VCE=5.0V, VFB=0.72V (*7) IOUT=30mA, -40℃≦Topr≦85℃, VFB=0.72V, Applied voltage to VCE, Voltage changes LX to “H” level (*10) VFB=0.72V, Applied voltage to VCE, Voltage changes LX to “L” level (*10) VIN=VCE=5.0V, VFB=0.64V, Short Lx at 1Ω resistance (*6) VIN=VCE=5.0V, VFB voltage which Decrease VFB from 0.4V, Lx becomes “L” (*10) level VIN=5.0V, LX=5.0V, VCE=0V, VFB=Open 200 300 450 Ω ⑧ Test Frequency=1MHz - 1.5 - μH - ΔT=40℃ - 700 - mA - VOUT(T)=Nominal Voltage Test conditions: Unless otherwise stated, VIN=5.0V, VOUT=1.2V, and the order of voltage application is VFB→VIN→VCE NOTE: (*1) Including hysteresis operating voltage range. (*2) EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100 (*3) ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA (*4) Design value (*5) When temperature is high, a current of approximately 10μA (maximum) may leak. (*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating. (*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance. (*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. (*9) Current limit denotes the level of detection at peak of coil current. (*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V (*11) IPFM and DTYLIMIT_PFM are defined only for the XCL209 series. 7/22 XCL208/XCL209 Series ■ELECTRICAL CHARACTERISTICS (Continued) PFM VOUT Duty VOUT (V) IPFM (mA) EFFI (%) VSHORT (ms) tss (ms) MIN. TYP. MAX. MIN. TYP. MAX. TYP. MIN. TYP. MAX. TYP. MAX. 1.00 2.0V 0.980 1.000 1.020 190 260 350 79 0.375 0.500 0.625 0.25 0.40 1.20 2.20 1.176 1.200 1.224 190 260 350 82 0.450 0.600 0.750 0.25 0.40 1.50 2.50 1.470 1.500 1.530 180 240 300 84 0.563 0.750 0.938 0.25 0.40 1.80 2.80 1.764 1.800 1.836 170 220 270 85 0.675 0.900 1.125 0.32 0.50 2.50 3.50 2.450 2.500 2.550 170 220 270 86 0.938 1.250 1.563 0.32 0.50 2.80 3.80 2.744 2.800 2.856 170 220 270 86 1.050 1.400 1.750 0.32 0.50 2.85 3.85 2.793 2.850 2.907 170 220 270 86 1.069 1.425 1.781 0.32 0.50 3.00 4.00 2.940 3.000 3.060 170 220 270 86 1.125 1.500 1.875 0.32 0.50 3.30 4.30 3.234 3.300 3.366 170 220 270 86 1.238 1.650 2.063 0.32 0.50 VIN (V) The output voltage can be set by adding external dividing resistors. The output voltage is determined by R1 and R2 in the equation below. The sum of R1 and R2 is normally kept 1MΩ or less. The output voltage range can be set from 0.9V to 6.0V based on the 0.8V ±2.0% reference voltage source. Note that when the input voltage (VIN) is less than or equal to the set output voltage, an output voltage (VOUT) higher than the input voltage (VIN) cannot be output. VOUT=0.8×(R1+R2)/R2 Adjust the value of the phase compensation speedup capacitor CFB so that fzfb=1/(2×π×CFB×R1) is 10kHz or less. It is optimum to adjust to a value from 1kHz to 20kH based on the components used and the board layout. [Calculation example] When R1=470kΩ, R2=150kΩ, VOUT=0.8×(470k+150k)/150k=3.3V e.g. Circuit (XCL208F/XCL209F Type) VOUT (V) R1 (kΩ) R2 (kΩ) CFB (pF) 0.9 100 820 150 1.2 150 300 100 1.5 130 150 220 1.8 300 240 150 2.5 510 240 100 3.0 330 120 150 3.3 470 150 100 4.0 120 30 470 8/22 400mA R1 1.8～6.0V (VIN) (L2) CFB (FB) CIN 4.7μF R2 (PVss) (AVss) (CE) (Lx) (L1) CL 10μF XCL208/XCL209 Series ■TEST CIRCUITS ① < Circuit No. > XCL208/XCL209 A/B Type ① < Circuit No. > XCL208/XCL209 F Type Wave Form Measure Point Lx L1 A CIN Wave Form Measure Point L2 VIN VOUT CE VSS V CL CIN 1μF VSS L1 L2 VIN Cfb V FB RL CL R2 R1 : 150kΩ R2 :　300kΩ Cfb :　120pF ③ < Circuit No. > Lx L2 R1 ※　External Components CIN : 4.7μF(ceramic) 　　CL : 10μF(ceramic) ② < Circuit No. > L1 Lx CE RL ※　External Components CIN : 4.7μF(ceramic) 　　CL : 10μF(ceramic) A L1 VIN A Wave Form Measure Point Lx L2 VIN CE VSS VOUT (FB) Rpulldown 200Ω CE 1μF ④ < Circuit No. > VSS VOUT (FB) ⑤ < Circuit No. > ILeakH A L1 Lx L2 L1 VIN CE 1μF VSS V VOUT (FB) ICEH 100mA Lx ILeakL VIN A CE 1μF L2 VSS ICEL VOUT (FB) ON resistance = (VIN-VLx)/100mA ⑥ < Circuit No. > ⑦ < Circuit No. > Wave Form Measure Point L1 Lx L1 L2 VIN 1μF V CE VSS Wave Form Measure Point L2 Ilat VIN ILIM L2OUT V (FB) ⑧ < Circuit No. > Lx 1μF CE VSS Rpulldown 1Ω VOUT (FB) ⑨ < Circuit No. > ILx A L1 Lx L1 L2 A VIN 1uF CE VSS VOUT (FB) CIN ⑩ < Circuit No. > XCL208/XCL209 A/B Type L1 A CIN Lx CL VOUT ※　External Components L : 1.5uH(Selected goods) CIN : 4.7μF(ceramic) 　　CL : 10μF(ceramic) VSS CE VSS VOUT (FB) Wave Form Measure Point L2 VIN CE L2 VIN ⑩ < Circuit No. > XCL208/XCL209 F Type L Wave Form Measure Point Lx V A RL L1 VIN Lx FB CE CIN ※　External Components CIN : 4.7μF(ceramic) 　　CL : 10μF(ceramic) Cfb L2 VSS R1 CL R2 V RL R1 : 150kΩ R2 :　300kΩ Cfb :　120pF 9/22 XCL208/XCL209 Series ■OPERATIONAL DESCRIPTION The XCL208/XCL209 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation circuit, output voltage adjustment resistors, P-ch MOSFET driver transistor, N-ch MOSFET switching transistor for the synchronous switch, current limiter circuit, UVLO circuit with control IC, and an inductor. (See the block diagram below.) Using the error amplifier, the voltage of the internal voltage reference source is compared with the feedback voltage from the VOUT pin through split resistors, R1 and R2. Phase compensation is performed on the resulting error amplifier output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to ensure stable output voltage. The current feedback circuit monitors the P-ch MOS driver transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple feedback signals. This enables a stable feedback loop even when a low ESR capacitor such as a ceramic capacitor is used ensuring stable output voltage. Type A L1 L2 VOUT LX VIN PVSS AVSS CE The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter. The ramp wave circuit determines switching frequency. The frequency is fixed internally 3.0MHz. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits. The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback (Type F: FB pin voltage) divided by the internal split resistors, R1 and R2. When a feed back voltage is lower than the reference voltage, the output voltage of the error amplifier is increased. The gain and frequency characteristics of the error amplifier output are fixed internally to deliver an optimized signal to the mixer. The current limiter circuit of the XCL208/XCL209 series monitors the current flowing through the P-ch MOS driver transistor connected to the Lx pin, and features a combination of the current limit mode and the operation suspension mode. ① When the driver current is greater than a current limit level, the current limit function operates to turn off the pulses from the Lx pin at any given timing. ② When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state. ③ At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over current state. ④ When the over current state is eliminated, the IC resumes its normal operation. The IC waits for the over current state to end by repeating the steps ① through ③. If an over current state continues for a latch time and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of the driver transistor, and goes into operation suspension state. Once the IC is in suspension state, operations can be resumed by either turning the IC off via the CE pin, or by restoring power to the VIN pin. The suspension state does not mean a complete shutdown, but a state in which pulse output is suspended; therefore, the internal circuitry remains in operation. The current limit of the XCL208/XCL209 series can be set at 800mA at typical. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, an input capacitor is placed as close to the IC as possible. Limit＜#ms ILx Limit＞#ms Current Limit Level 0mA VOUT VSS Lx VCE VIN 10/22 Restart XCL208/XCL209 Series ■OPERATIONAL DESCRIPTION(Continued) The short-circuit protection circuit monitors the internal R1 and R2 divider voltage (Type F: FB pin voltage). In case where output is accidentally shorted to the Ground and when the FB point voltage decreases less than half of the reference voltage (Vref) and a current more than the ILIM flows to the driver transistor, the short-circuit protection quickly operates to turn off and to latch the driver transistor. In the latch state, the operation can be resumed by either turning the IC off and on via the CE pin, or by restoring power supply to the VIN pin. Also, when sharp load transient happens, a voltage drop at the VOUT is propagated through CFB, as a result, short circuit protection may operate in the voltage higher than short-circuit protection voltage. When the VIN pin voltage becomes 1.4V (TYP.) or lower, the P-channel output driver transistor is forced OFF to prevent false pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 1.8V or higher, by releasing the UVLO state then the soft-start function initiates output startup operation. The soft-start function operates even when the VIN pin voltage falls momentarily below the UVLO operating voltage same as releasing the UVLO function. The UVLO circuit does not cause a complete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry remains in operation. In PFM control operation, until coil current reaches to IPFM, the IC keeps the P-ch MOSFET on. In this case, on-time (tON) that the P-ch MOSFET is kept on can be given by the following formula. tON = L×IPFM / (VIN－VOUT) → IPFM① In the PFM control operation, the maximum PFM Duty Limit is set to 200% (TYP.). Therefore, under the condition that the stepdown ratio is small, it’s possible for P-ch MOSFET to be turned off even when coil current doesn’t reach to IPFM. →IPFM② IPFM① IPFM② The XCL208B/XCL209B and the XCL208F/XCL209F can quickly discharge the electric charge at the output capacitor (CL) when a low signal to the CE pin which enables a whole IC circuit put into OFF state, is inputted via the N-ch transistor located between the LX pin and the VSS pin. When the IC is disabled, electric charge left at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction. Discharge time is set by the CL auto-discharge resistance (RDCHG) and the output capacitance (CL). By setting time constant as τ(τ=CL x RDCHG), discharge time of the output voltage is calculated by the following formula. Output Voltage Dischage Characteristics Rdischg = 300Ω（ TYP） V : Output voltage after discharge VOUT(T) : Output voltage t: Discharge time, τ: CL x RDCHG CL : Output capacitance (CL) RDCHG : CL auto-discharge resistance Output Voltage （ Relative Value） 100 = Setting Voltage Value V = VOUT(T) x e –t/τ or t=τln (VOUT(T) / V) Discharge Time t (ms) 11/22 XCL208/XCL209 Series ■OPERATIONAL DESCRIPTION(Continued) The operation of the XCL208/XCL209 series will enter into the stand-by mode when a low level signal is input to the CE pin. During the stand-by mode, the current consumption of the IC becomes 0μA (TYP.), with a state of high impedance at the Lx pin and VOUT pin. The IC starts its operation by inputting a high level signal to the CE pin. The input to the CE pin is a CMOS input and the sink current is 0μA (TYP.). (A) 使用例A V DD V IN (B) 使用例B V DD (A) V IN SW_CE R1 CE CE SW_CE OPERATIONAL STATES ON Stand-by OFF Active (B) SW_CE R2 < IC inside > IC内部 SW_CE OPERATIONAL STATES ON Active OFF Stand-by Soft-start time is internally set. Soft-start time is defined as the time to reach 90% of the output nominal voltage when the CE pin is turned on. tSS V CEH 0V 90% of setting voltage V OUT 0V 12/22 設定電圧の90% XCL208/XCL209 Series ■NOTE ON USE 1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 2. The XCL208/XCL209 series is designed for use with ceramic output capacitors. If, however, the potential difference is too large between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the resulting high switching energy and oscillation could occur on the output. In this case, increase 10μF to the output capacitance for adding insufficient capacitance. Also, if the output capacitance is too large, the output voltage is slowly rising and the IC may not operate. Adjust the output capacitance so that the output voltage can go up within the soft-start time. 3. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the design has been completed, verification with actual components should be done. 4. Depending on the input-output voltage differential, or load current, some pulses may be skipped as 1/2, 1/3 and the ripple voltage may increase. 5. When the difference between input and output is large in PWM control, very narrow pulses will be outputted, and there is the possibility that 0% duty cycles may be continued during some cycles. 6. When the difference between input and output is small, and the load current is heavy, very wide pulses will be outputted and there is the possibility that 100% duty cycles may be continued during some cycles. 7. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current of the coil increases when dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak current becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate the peak current according to the following formula: Ipk = (VIN - VOUT) x OnDuty / (2 x L x fOSC) + IOUT L: Coil Inductance Value fOSC: Oscillation Frequency 8. When the peak current which exceeds limit current flows within the specified time, the built-in P-ch driver transistor turns off. During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit current flows; therefore, care must be taken when selecting the rating for the external components such as a coil. 9. When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance. 10. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible. 11. Use of the IC at voltages below the minimum operating voltage range may lead to instability. 12. This IC should be used within the stated absolute maximum ratings of external components in order to prevent damage to the device. 13. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the leak current of the driver transistor. 14. The current limit is set to 1000mA (MAX.) at typical. However, the current of 1000mA or more may flow. In case that the current limit functions while the VOUT pin is shorted to the GND pin, when P-ch MOSFET is ON, the potential difference for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By contrast, when N-ch MOSFET is ON, there is almost no potential difference at both ends of the coil since the VOUT pin is shorted to the GND pin. Consequently, the time rate of coil current becomes quite small. According to the repetition of this operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the amount of current, which is supposed to be limited originally. Even in this case, however, after the over current state continues for several ms, the circuit will be latched. A coil should be used within the stated absolute maximum rating in order to prevent damage to the device. ①Current flows into P-ch MOSFET to reach the current limit (ILIM). ②The current of ILIM or more flows since the delay time of the circuit occurs during from the detection of the current limit to OFF of P-ch MOSFET. ③Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small. ④Lx oscillates very narrow pulses by the current limit for several ms. ⑤The circuit is latched, stopping its operation. ② ① Lx Delay ③ ④ ⑤ Limit ＞#ms ILIM ILx 13/22 XCL208/XCL209 Series ■NOTE ON USE (Continued) 15. In order to stabilize VIN voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN & VSS pins. 16. High step-down ratio and very light load may lead an intermittent oscillation when PWM mode. 17. For the XCL209, when PWM/PFM automatic switching goes into continuous mode, the IC may be in unstable operation for the range of MAXDUTY area with small input/output differential. Once the design has been completed, verification with actual components should be done. 18. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 19. Instructions of pattern layouts (1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN (No.8) and PVSS (No.1) pins. (2) Please mount each external component as close to the IC as possible. (3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. (4) Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. (5) Internal driver transistors bring on heat because of the output current and ON resistance of the driver transistors. (6) Please connect Lx (No.2) pin and L1 (No.9) pin on the PCB layout. (7) Please connect VOUT (No.4) pin and L2 (No.10) pin on the PCB layout. (Type A/B) （TOP VIEW） （BOTTOM VIEW） （PCB mounted TOP VIEW） XCL208/209 XCL208/209 VOUT GND VOUT GND CL CL LX CE LX CE IC IC CIN CIN GND VIN GND VIN TOREX TOREX USP-10B03 USP-10B03 （TOP VIEW） （BOTTOM VIEW） （PCB mounted TOP VIEW） XCL208/209 XCL208/209 VOUT GND CL CFB RFB1 CE VOUT GND CL CFB RFB1 CE RFB2 RFB2 IC IC LX GND VIN FB GND VIN TOREX TOREX USP-10B03 LX CIN CIN FB USP-10B03 : IC : Ceramic Cap : Chip Resistance 14/22 XCL208/XCL209 Series ■NOTE ON USE (Continued) 20. Typical application circuit < Typical application circuits Type F> VOUT RFB1 VIN L2 VOUT VIN CE VIN L1 LX VIN L2 FB AVSS PVSS VCE CFB CL CIN AVSS PVSS VCE VOUT CL CIN CE L1 RFB2 LX Example of external components Example of external components (VOUT=1.8V) CIN: 10V/4.7μF（LMK107BJ475KA TAIYO YUDEN） CIN: 10V/4.7μF（LMK107BJ475KA TAIYO YUDEN） CL: 10V/10μF（LMK107BBJ106MA TAIYO YUDEN） CL: 10V/10μF（LMK107BBJ106MA TAIYO YUDEN） RFB1: 300kΩ RFB2: 240kΩ CFB: 150pF（C1005CH1H151J TDK） NOTE: The integrated Inductor can be used only for this DC/DC converter. Please do not use this inductor for other reasons. Please use B, X5R, and X7R grades in temperature characteristics for the CIN and CL capacitors. These grade ceramic capacitors minimize capacitance-loss as a function of voltage stress. If necessary, increase capacitance by adding or replacing. Examples of external components CIN CL PART NUMBER MANUFACTURE RATED VOLTAGE / INDUCTANCE / FEATURES Size (L×W) LMK107BJ475KA TAIYO YUDEN 10V/4.7μF/X5R 1.6mm×0.8mm LMK212B7475KG TAIYO YUDEN 10V/4.7μF/X7R 2.0mm×1.25mm LMK107BBJ106MA TAIYO YUDEN 10V/10μF/X5R 1.6mm×0.8mm LMK212B7106MG TAIYO YUDEN 10V/4.7μF/X7R 2.0mm×1.25mm 15/22 XCL208/XCL209 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output Current (2) Output Voltage vs. Output Current XCL208B183DR/XCL209B183DR 100 XCL208B183DR/XCL209B183DR 2.1 XCL209(PWM/PFM) Output Voltage:V OUT(V) Efficiency:EFFI(%) 80 60 40 2.4V 　　　　3.6V V IN= 4.2V XCL208 (PWM) 20 2.0 XCL208/XCL209 V IN=4.2V,3.6V,2.4V 1.9 1.8 1.7 1.6 1.5 0 0.1 1 10 100 0.1 1000 1 (3) Ripple Voltage vs. Output Current 3.5 Oscillation Frequency : fosc(MHz) Ripple Voltage:Vr(mV) XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR 60 XCL208 V IN=2.4 40 XCL209 V IN=2.4V 3.6V,4.2V 3.6V,4.2 20 0 0.1 1 10 100 3.4 3.3 3.2 3.1 V IN=3.6V 3.0 2.9 2.8 2.7 2.6 2.5 1000 -50 -25 0 Output Current:IOUT (mA) 50 75 100 (6) Output Voltage vs. Ambient Temperature XCL209B183DR XCL208B183DR/XCL209B183DR 40 2.1 V IN=6.0V 35 Output Voltage : V OUT (V) 4.0V 30 25 20 15 2.0V 10 5 0 -50 25 Ambient Temperature: Ta (℃) (5) Supply Current vs. Ambient Temperature Supply Current : IDD (μA) 1000 (4) Oscillation Frequency vs. Ambient Temperature 80 2.0 1.9 V IN=3.6V 1.8 1.7 1.6 1.5 -25 0 25 50 Ambient Temperature: Ta (℃) 16/22 100 Output Current:IOUT (mA) Output Current:IOUT (mA) 100 10 75 100 -50 -25 0 25 50 Ambient Temperature: Ta (℃) 75 100 XCL208/XCL209 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) UVLO Voltage vs. Ambient Temperature XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR 1.8 1.0 CE=V IN 1.5 0.9 CE "H" Voltage : VCEH (V) UVLO Voltage : UVLO (V) (8) CE "H" Voltage vs. Ambient Temperature 1.2 0.9 0.6 0.3 0.8 V IN=5.0V 0.7 3.6V 0.6 0.5 0.4 0.3 2.4V 0.2 0.1 0.0 -50 -25 0 25 50 75 0.0 100 -50 -25 Ambient Temperature: Ta (℃) (9) CE "L" Voltage vs. Ambient Temperature 25 50 75 100 (10) Soft Start Time vs. Ambient Temperature XCL208B183DR/XCL209B183DR 1.0 0 Ambient Temperature: Ta (℃) XCL208B183DR/XCL209B183DR 5.0 0.8 Soft Start Time : tss (ms) CE "L" Voltage : VCEL (V) 0.9 V IN=5.0V 0.7 3.6V 0.6 0.5 0.4 0.3 2.4V 0.2 4.0 3.0 2.0 V IN=3.6V 1.0 0.1 0.0 0.0 -50 -25 0 25 50 75 100 -50 -25 Ambient Temperature: Ta (℃) 25 50 75 100 Ambient Temperature: Ta (℃) (11) "Pch / Nch" Driver on Resistance vs. Input Voltage (12) Rise Wave Form XCL208B333DR/XCL209B333DR XCL208B183DR/XCL209B183DR Lx SW ON Resistance:RLxH,RLxL (Ω) 0 1.0 VIN = 5.0V IOUT = 1.0mA 0.9 0.8 0.7 Nch on Resistance 0.6 0.5 2ch VOUT 0.4 0.3 Pch on Resistance 0.2 0.1 1ch 0.0 0 1 2 3 4 Input Voltage : V IN (V) 5 6 CE:0.0V⇒1.0V 1ch:1V/div 2ch:1V/div Time:100μs/div 17/22 XCL208/XCL209 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (13) Soft-Start Time vs. Ambient Temperature (14) CL Discharge Resistance vs. Ambient Temperature XCL208B333DR/XCL209B333DR XCL208B333DR/XCL209B333DR 600 400 CL Discharge Resistance: (Ω) Soft Start Time : tss (μs) 500 V IN=5.0V IOUT =1.0mA 300 200 100 0 -50 -25 0 25 50 Ambient Temperature: Ta (℃) (15) Load Transient Response 18/22 75 100 500 400 2.0V V IN=6.0V 300 200 100 -50 4.0V -25 0 25 50 Ambient Temperature: Ta (℃) 75 100 XCL208/XCL209 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (15) Load Transient Response (Continued) 19/22 XCL208/XCL209 Series ■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLINE / LAND PATTERN THERMAL CHARACTERISTICS USP-10B03 USP-10B03 PKG USP-10B03 Power Dissipation 20/22 XCL208/XCL209 Series ■MARKING RULE USP-10B03 8 2 7 ④ ② ⑤ ③ 3 ① 1 4 6 5 ① represents products series MARK PRODUCT SERIES 8 9 XCL208****** XCL209****** ② represents integer of output voltage and oscillation frequency MARK OUTPUT VOLTAGE(V) OSCILLATION FREQUENCY =3.0MHz 0.x 1.x 2.x 3.x 4.x (XCL20*F**3**(FB) (XCL20*A**3**) (XCL20*B**3**) F 0 1 2 3 4 A B C D E - ③ represents the decimal part of output voltage OUTPUT MARK PRODUCT SERIES VOLTAGE (V) X.0 X.1 X.2 X.3 X.4 X.5 X.6 X.7 X.8 X.9 0 1 2 3 4 5 6 7 8 9 OUTPUT VOLTAGE (V) MARK PRODUCT SERIES X.05 X.15 X.25 X.35 X.45 X.55 X.65 X.75 X.85 X.95 A B C D E F H K L M XCL20***A*** XCL20***B*** XCL20***C*** XCL20***D*** XCL20***E*** XCL20***F*** XCL20***H*** XCL20***K*** XCL20***L*** XCL20***M*** XCL20***0*** XCL20***1*** XCL20***2*** XCL20***3*** XCL20***4*** XCL20***5*** XCL20***6*** XCL20***7*** XCL20***8*** XCL20***9*** Example （Mark ②, ③） OSCILLATION FREQUENCY 3.0MHz XCL20*F08*** ② ③ MARK XCL20*A18*** ② ③ XCL20*B3D*** ② ③ F 1 D 8 8 D ④,⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded) *No character inversion used. 21/22 XCL208/XCL209 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 22/22