XCL208/XCL209 Series
ETR28003-006
400mA Inductor Built-in Step-Down “micro DC/DC” Converters
☆Green Operation Compatible
■GENERAL DESCRIPTION
The XCL208/XCL209 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC
in one tiny package (2.5mm×2.15mm, h=1.05mm). A stable power supply with an output current of 400mA is configured using only
two capacitors connected externally.
An internal coil simplifies the circuit and enables minimization of noise and other operational trouble due to the circuit wiring.
A wide operating voltage range of 1.8V (2.0V) to 6.0V enables support for applications that require an alkaline battery (2-cell) or
AC adapter (5V) power supply. An internally fixed output voltage (0.8V to 4.0V) or an externally set output voltage can be selected.
The XCL208/XCL209 series uses synchronous rectification at an operating frequency of 3.0MHz. PWM control (XCL208) or
automatic PWM/PFM switching control (XCL209) can be selected. The XCL208 series has a fixed frequency, enabling the
suppression of output ripple. The XCL209 series achieves high efficiency while holding down output ripple across the full range of
loads, from light to heavy, enabling the extension of battery operation time.
Soft start and on/off functions with CL discharge are provided, and the IC can be put in the standby state by inputting a Low level
signal into the CE pin.
■FEATURES
■APPLICATIONS
Input Voltage
●Mobile phones, Smart phones
●Bluetooth Headsets
●Tablet PCs
●PND
●PC peripheral devices
●DSC, Camcorders
■TYPICAL APPLICATION CIRCUIT
2.0～6.0V
(L2)
(VIN)
400mA
(VOUT)
(PVss)
(AVss)
(CE)
Protection Circuits
:
Control Methods
:
Operating Ambient Temperature :
Package
:
Environmentally Friendly
:
CL
10μF
CIN
4.7μF
Fixed Output Voltage
High Efficiency
Output Current
Oscillation Frequency
CE Function
:
:
:
:
:
:
:
■ TYPICAL PERFORMANCE
CHARACTERISTICS
(Lx)
(L1)
●Efficiency vs. Output Current
A/B Type
XCL208x333DR/XCL209x333D
400mA
100
R1
(VIN)
(L2)
CIN
4.7μF
R2
(PVss)
(AVss)
(CE)
(Lx)
(L1)
XCL209(PWM/PFM)
80
CFB
(FB)
CL
10μF
Efficiency:EFFI(%)
1.8～6.0V
60
VIN= 4.2V
40
XCL208(PWM)
5.0V
20
V OUT =3.3V
0
0.01
F Type
1.8V ~ 6.0V (Type F)
2.0V ~ 6.0V (Type A/B)
0.8V ~ 4.0V (±2.0%)
90% (VIN=4.2V, VOUT=3.3V)
400mA
3.0MHz (±15%)
Active High
Soft-start Circuit Built-in
CL High Speed Auto Discharge
Current Limiter Built-in
(Constant Current & Latching)
PWM (XCL208)
PWM/PFM (XCL209)
-40℃ ~ 85℃
USP-10B03
EU RoHS Compliant, Pb Free
0.1
1
10
100
1000
Output Current:IOUT (mA)
1/22
XCL208/XCL209 Series
■BLOCK DIAGRAM
1) A Type
L1
2) B Type
L2
VOUT
L1
VOUT
LX
VIN
PVSS
AVSS
L2
CE
LX
VIN
AVSS
PVSS
CE
3) F Type
L1
L2
FB
LX
VIN
PVSS
AVSS
CE
NOTE:
The XCL208 offers a PWM control, a signal from CE Control Logic to PWM/PFM Selector is fixed to "L" level inside. The XCL209 control scheme
is PWM/PFM automatic switching, a signal from CE Control Logic to PWM/PFM Selector is fixed to "H" level inside. The diodes placed inside are
ESD protection diodes and parasitic diodes.
2/22
XCL208/XCL209
Series
■PRODUCT CLASSIFICATION
XCL208①②③④⑤⑥ PWM
XCL209①②③④⑤⑥ PWM/PFM Auto Switching
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
10
12
15
18
25
28
2L
30
33
08
VIN≧2.0V Fixed Output Voltage
Standard soft-start , No CL auto discharge
VIN≧2.0V Fixed Output Voltage
CL auto discharge, High speed soft-start
VIN≧1.8V Output Voltage External Setting
CL auto discharge, High speed soft-start
1.0V
1.2V
1.5V
1.8V
2.5V
2.8V
2.85V
3.0V
3.3V
External Setting 0.8V (XCL208F/XCL209F)
Oscillation Frequency
3
3.0MHz
Package (Order Unit)
DR
A
Type
①
B
F
Output Voltage (*1)
②③
④
⑤⑥
(*2)
USP-10B03 (3,000psc/Reel)(*3)
When other output voltages (semi-custom) are needed, please contact your local Torex sales office for more information.
Output voltage range is 0.8V~4.0V.
(*2)
Halogen free and EU RoHS compliant.
(*3)
The reels are shipped in a moisture-proof packing
(*1)
■PIN CONFIGURATION
L1
VIN
8
NC
CE
1
PVSS
7
2
LX
6
3
NC
9
10
AVSS
4 V
OUT / FB
5
L2
(BOTTOM VIEW)
3/22
XCL208/XCL209 Series
■PIN ASSIGNMENT
PIN NUMBER
USP-10B03
PIN NAME
FUNCTIONS
PVSS
LX
NC
FB
VOUT
AVSS
CE
NC
VIN
L1
L2
(Power) Ground
Switching Output
No Connection
Output Voltage Sense Pin (Type F)
Fixed Output Voltage Pin (Type A/B)
(Analog) Ground
Active High Enable
No Connection
Power Supply Input
Inductor Electrodes
Inductor Electrodes
1
2
3
4
5
6
7
8
9
10
■FUNCTION
PIN NAME
SIGNAL
CONDITIONS
STATUS
L
AVSS≦VCE≦0.25V
Stand-by
H
0.65V≦VCE≦6V
Active
CE
* When the CE pin is left open, the IC may operate unstable.
Please do not leave the CE pin open.
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
VIN
-0.3 ~ 6.5
V
Lx Pin Voltage
VLx
-0.3 ~ VIN+0.3≦6.5
V
Output Voltage
VOUT
-0.3 ~ 6.5
V
FB Pin Voltage
VFB
-0.3 ~ 6.5
V
CE Input Voltage
VCE
-0.3 ~ 6.5
V
Lx Pin Current
ILX
±1500
Power Dissipation
Pd
Operating Ambient Temperature
Topr
-40 ~ 85
℃
Storage Temperature
Tstg
-40 ~ 125
℃
500(40mm x 40mm Standard board)
Each voltage rating uses the VSS pin as a reference.
(*1)
The power dissipation figure shown is PCB mounted and is for reference only.
Please refer to PACKAGING INFORMATION for the mounting condition.
4/22
mA
(*1)
mW
XCL208/XCL209
Series
■ELECTRICAL CHARACTERISTICS
Ta=25℃
1) XCL208Axx3DR/XCL209Axx3DR
PARAMETER
SYMBOL
Output Voltage
VOUT
Operating Voltage Range
VIN
Maximum Output Current
IOUTMAX
UVLO Voltage
VUVLO
Supply Current (XCL208)
CONDITIONS
MIN.
TYP.
MAX.
UNIT
CIRCUIT
V
①
2.0
-
6.0
V
①
VIN=VOUT(T)+2.0V, VCE=1.0V (*8)
400
-
-
mA
①
VCE =VIN, VOUT =0V, Voltage which Lx pin holding
“L” level (*1),(*10)
1.00
1.40
1.78
V
③
-
46
65
-
21
35
μA
②
-
0
1
μA
②
2.55
3.00
3.45
MHz
①
mA
⑩
-
200
300
%
①
VIN=VCE=5.0V, IOUT=30mA
IDD
VIN=VCE=5.0V, VOUT=VOUT(T)×1.1
Stand-by Current
ISTB
VIN=5.0V, VCE=0V, VOUT=VOUT(T)×1.1
Oscillation Frequency
fOSC
VIN=VOUT(T)+2.0V, VCE=1.0V, IOUT=100mA
PFM Switching Current (*11)
IPFM
VIN=VOUT(T)+2.0V, VCE=VIN , IOUT=1mA
PFM Duty Limit (*11)
DTYLIMIT_PFM
Maximum Duty Cycle
DMAX
VIN=VCE=5.0V, VOUT=VOUT(T)×0.9
100
-
-
%
③
Minimum Duty Cycle
DMIN
VIN=VCE=5.0V, VOUT=VOUT(T)×1.1
-
-
0
%
③
Efficiency (*2)
EFFI
When connected to external components,
VCE=VIN=VOUT(T)+1.2V, IOUT=100mA
-
-
%
①
LX SW "H" ON Resistance 1
RLxH1
VIN=VCE=5.0V, VOUT=0V, ILX=100mA (*3)
-
0.35
0.55
Ω
④
LX SW "H" ON Resistance 2
RLxH2
VIN=VCE=3.6V, VOUT=0V, ILX=100mA (*3)
-
0.42
0.67
Ω
④
LX SW "L" ON Resistance 1
RLxL1
VIN=VCE=5.0V (*4)
-
0.45
0.65
Ω
-
LX SW "L" ON Resistance 2
RLxL2
VIN=VCE=3.6V (*4)
-
0.52
0.77
Ω
-
LX SW "H" Leakage Current (*5)
ILeakH
VIN=VOUT=5.0V, VCE=0V, VLX=0V
-
0.01
1.00
μA
⑤
LX SW "L" Leakage Current (*5)
ILeakL
VIN=VOUT=5.0V, VCE= 0V, VLX=5.0V
-
0.01
1.00
μA
⑤
Current Limit (*9)
ILIM
VIN=VCE=5.0V, VOUT=VOUT(T)×0.9 (*7)
600
800
1000
mA
⑥
-
±100
-
ppm/℃
①
0.65
-
6.00
V
③
Supply Current (XCL209)
VCE=VIN=, IOUT=1mA
Output Voltage Temperature
ΔVOUT/
Characteristics
(VOUT･ΔTopr)
CE "H" Voltage
VCEH
CE "L" Voltage
VCEL
VOUT=0V, Applied voltage to VCE,
Voltage changes Lx to “L” level (*10)
AVSS
-
0.25
V
③
CE "H" Current
ICEH
VIN=VCE= 5.0V, VOUT=0V
-0.1
-
0.1
μA
⑤
CE "L" Current
ICEL
VIN=5.0V, VCE=0V, VOUT=0V
-0.1
-
0.1
μA
⑤
Soft-start Time
tSS
VCE=0V→VIN, IOUT=1mA
0.5
0.90
2.50
ms
①
1
-
20
ms
⑦
V
⑦
Latch Time
tLAT
IOUT=30mA,
-40℃≦Topr≦85℃
VOUT=0V, Applied voltage to VCE,
Voltage changes Lx to “H” level (*10)
VIN=VCE=5.0V, VOUT=0.8×VOUT(T),
Short Lx at 1Ω resistance (*6)
Sweeping VOUT, VIN=VCE=5.0V,
Short Protection Threshold Voltage
VSHORT
Short Lx at 1Ω resistance, VOUT voltage which
Lx becomes “L” level within 1ms
Inductance Value
L
Allowed Inductor Current
IDC
Test Frequency=1MHz
-
1.5
-
μH
-
ΔT=40℃
-
700
-
mA
-
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(T)=Nominal Voltage
NOTE:
(*1) Including hysteresis operating voltage range.
(*2)
EFFI={ (output voltage×output current) / (input voltage×input current) }×100
(*3) ON resistance (Ω)=(VIN - Lx pin measurement voltage) / 100mA
(*4)
Design value
(*5) When temperature is high, a current of approximately 10μA (maximum) may leak.
(*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating.
(*7)
When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
(*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*9)
Current limit denotes the level of detection at peak of coil current.
(*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
(*11) IPFM and DTY
LIMIT_PFM are defined only for the XCL209 series.
5/22
XCL208/XCL209 Series
■ELECTRICAL CHARACTERISTICS (Continued)
2) XCL208Bxx3DR/XCL209Bxx3DR
Ta=25℃
PARAMETER
Output Voltage
Operating Voltage Range
SYMBOL
VOUT
VIN
CONDITIONS
VIN=VCE=5.0V, IOUT=30mA
MIN.
2.0
TYP.
-
MAX.
6.0
UNIT
V
V
CIRCUIT
①
①
Maximum Output Current
IOUTMAX
VIN=VOUT(T)+2.0V, VCE=1.0V (*8)
400
-
-
mA
①
UVLO Voltage
VUVLO
VCE=VIN, VOUT=0V,
Voltage which Lx pin holding “L” level (*1),(*10)
1.00
1.40
1.78
V
③
-
46
21
0
65
35
1
μA
②
μA
②
2.55
3.00
3.45
MHz
①
mA
⑩
100
-
200
-
300
0
%
%
%
①
③
③
Supply Current (XCL208)
Supply Current (XCL209)
Stand-by Current
IDD
VIN=VCE=5.0V, VOUT=VOUT(T) ×1.1
ISTB
VIN=5.0V, VCE=0V, VOUT=VOUT(T) ×1.1
Oscillation Frequency
fOSC
VIN=VOUT(T)+2.0V, VCE=1.0V, IOUT=100mA
PFM Switching Current (*11)
IPFM
VIN=VOUT(T)+2.0V, VCE=VIN , IOUT=1mA
PFM Duty Limit (*11)
Maximum Duty Cycle
Minimum Duty Cycle
DTYLIMIT_PFM
DMAX
DMIN
Efficiency (*2)
EFFI
VCE=VIN=VOUT(T)+1.2V, IOUT=100mA
-
-
%
①
LX SW "H" ON Resistance 1
LX SW "H" ON Resistance 2
LX SW "L" ON Resistance 1
LX SW "L" ON Resistance 2
RLxH1
RLxH2
RLxL1
RLxL2
VIN=VCE=5.0V, VOUT=0V, ILX=100mA (*3)
VIN=VCE=3.6V, VOUT=0V, ILX=100mA (*3)
VIN=VCE=5.0V (*4)
VIN=VCE=3.6V (*4)
-
0.35
0.42
0.45
0.52
0.55
0.67
0.65
0.77
Ω
Ω
Ω
Ω
④
④
-
LX SW "H" Leakage Current (*5)
ILeakH
VIN=VOUT=5.0V, VCE=0V, VLX=0V
-
0.01
1.00
μA
⑨
Current Limit (*9)
ILIM
600
800
1000
mA
⑥
Output Voltage Temperature
Characteristics
ΔVOUT/
(VOUT･ΔTopr)
-
±100
-
ppm/℃
①
CE "H" Voltage
VCEH
0.65
-
6.00
V
③
CE "L" Voltage
VCEL
CE "H" Current
CE "L" Current
Soft-start Time
ICEH
ICEL
tSS
Latch Time
tLAT
Short Protection Threshold Voltage
VSHORT
CL Discharge
RDCHG
Inductance Value
Allowed Inductor Current
L
IDC
VCE=VIN=, IOUT=1mA
VIN=VCE=5.0V, VOUT=VOUT(T)×0.9
VIN=VCE=5.0V, VOUT=VOUT(T)×1.1
VIN=VCE=5.0V, VOUT=VOUT(T)×0.9 (*7)
IOUT=30mA, -40℃≦Topr≦85℃,
VOUT=0V, Applied voltage to VCE Voltage
changes Lx to “H” level （*10）
VOUT=0V, Applied voltage to VCE Voltage
changes Lx to “L” level （*10）
VIN=VCE=5.0V, VOUT=0V
VIN=5.0V, VCE=0V, VOUT=0V
VCE=0V→VIN, IOUT=1mA
VIN=VCE=5.0V, VOUT=0.8×VOUT(T),
Short Lx at 1Ω resistance (*6)
Sweeping VOUT, VIN=VCE=5.0V,
Short Lx at 1Ω resistance, VOUT voltage which
Lx becomes “L” level within 1ms
VIN=5.0V, LX=5.0V, VCE=0V, VOUT=Open
Test Frequency=1MHz
ΔT=40℃
AVSS
0.25
V
③
-0.1
-0.1
-
0.1
0.1
μA
μA
ms
⑤
⑤
①
1
-
20
ms
⑦
V
⑦
200
300
450
Ω
⑧
-
1.5
700
-
μH
mA
-
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT (T)=Nominal Voltage
NOTE:
(*1)
Including hysteresis operating voltage range.
(*2)
EFFI={ ( output voltage×output current ) / ( input voltage×input current) }×100
(*3)
ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
(*4)
Design value
(*5)
When temperature is high, a current of approximately 10μA (maximum) may leak.
(*6)
Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating.
(*7)
When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
(*8)
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*9) Current limit denotes the level of detection at peak of coil current.
(*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
(*11) IPFM and DTY
LIMIT_PFM are defined only for the XCL209 series.
6/22
XCL208/XCL209
Series
■ELECTRICAL CHARACTERISTICS (Continued)
Ta=25℃
3) XCL208F083DR/XCL209F083DR
PARAMETER
FB Voltage
SYMBOL
VFB
Operating Voltage Range
VIN
Maximum Output Current
IOUTMAX
UVLO Voltage
Supply Current (XCL208)
VUVLO
CONDITIONS
VIN=VCE=5.0V, VFB voltage which Decrease
VFB from 0.9V, Lx becomes “H” (*10) level
VIN=3.2V, VCE=1.0V
(*8)
VCE=VIN, VFB=0.4V,
Voltage which Lx pin holding “L” level (*1), (*10)
MIN.
TYP.
MAX.
UNIT
CIRCUIT
0.784
0.800
0.816
V
③
1.8
-
6.0
V
①
400
-
-
mA
①
1.00
1.40
1.78
V
③
-
46
65
-
21
35
μA
②
-
0
1.0
μA
③
2.55
3.00
3.45
MHz
①
mA
⑩
IDD
VIN=VCE= 5.0V, VFB=0.88V
Stand-by Current
ISTB
VIN=5.0V, VCE=0V, VFB=0.88V
Oscillation Frequency
fOSC
VIN=3.2V, VCE=1.0V, IOUT=100mA
PFM Switching Current (*11)
IPFM
VIN=3.2V, VCE= VIN, IOUT=1mA
PFM Duty Limit (*11)
DTYLIMIT_PFM
VIN=VCE=2.2V, IOUT=1mA
-
200
300
%
①
Maximum Duty Cycle
MAXDTY
VIN=VCE=5.0V, VFB=0.72V
100
-
-
%
③
Minimum Duty Cycle
MINDTY
VIN=VCE=5.0V, VFB=0.88V
-
-
0
%
③
Efficiency (*2)
EFFI
VCE=VIN=2.4V, IOUT=100mA
-
-
%
①
LX SW "H" ON Resistance 1
RLxH1
VIN=VCE=5.0V, VFB=0.72V, ILX=100mA (*3)
-
0.35
0.55
Ω
④
LX SW "H" ON Resistance 2
RLxH2
VIN=VCE=3.6V, VFB=0.72V, ILX=100mA (*3)
-
0.42
0.67
Ω
④
LX SW "L" ON Resistance 1
RLxL1
VIN=VCE=5.0V
(*4)
-
0.45
0.65
Ω
-
LX SW "L" ON Resistance 2
RLxL2
VIN=VCE=3.6V (*4)
-
0.52
0.77
Ω
-
LX SW "H" Leakage Current (*5)
ILeakH
VIN=VFB=5.0V, VCE=0V, LX=0V
-
0.01
1.00
μA
⑨
Current Limit (*9)
ILIM
600
800
1000
mA
⑥
Output Voltage Temperature
ΔVOUT/
Characteristics
(VOUT･ΔTopr)
-
±100
-
ppm/℃
①
CE "H" Voltage
VCEH
0.65
-
6.00
V
③
CE "L" Voltage
VCEL
AVSS
-
0.25
V
③
CE "H" Current
ICEH
VIN=VCE=5.0V, VFB=0.72V
-0.1
-
0.1
μA
⑤
CE "L" Current
ICEL
-0.1
-
0.1
μA
⑤
Soft-start Time
tSS
VIN=5.0V, VCE=0V, VFB=0.72V
When connected to external components,
VCE=0V→VIN, IOUT=1mA
-
0.25
0.40
ms
①
Latch Time
tLAT
1
-
20
ms
⑦
Short Protection Threshold Voltage
VSHORT
0.150
0.200
0.250
V
⑦
Supply Current (XCL209)
CL Discharge
RDCHG
Inductance Value
L
Allowed Inductor Current
IDC
VIN=VCE=5.0V, VFB=0.72V (*7)
IOUT=30mA, -40℃≦Topr≦85℃,
VFB=0.72V, Applied voltage to VCE,
Voltage changes LX to “H” level (*10)
VFB=0.72V, Applied voltage to VCE,
Voltage changes LX to “L” level (*10)
VIN=VCE=5.0V, VFB=0.64V,
Short Lx at 1Ω resistance (*6)
VIN=VCE=5.0V, VFB voltage which Decrease
VFB from 0.4V, Lx becomes “L” (*10) level
VIN=5.0V, LX=5.0V, VCE=0V, VFB=Open
200
300
450
Ω
⑧
Test Frequency=1MHz
-
1.5
-
μH
-
ΔT=40℃
-
700
-
mA
-
VOUT(T)=Nominal Voltage
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT=1.2V, and the order of voltage application is VFB→VIN→VCE
NOTE:
(*1) Including hysteresis operating voltage range.
(*2) EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
(*3) ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
(*4)
Design value
(*5)
When temperature is high, a current of approximately 10μA (maximum) may leak.
(*6)
Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating.
(*7)
When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
(*8)
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*9)
Current limit denotes the level of detection at peak of coil current.
(*10)
“H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
(*11)
IPFM and DTYLIMIT_PFM are defined only for the XCL209 series.
7/22
XCL208/XCL209 Series
■ELECTRICAL CHARACTERISTICS (Continued)
PFM
VOUT
Duty
VOUT (V)
IPFM (mA)
EFFI (%)
VSHORT (ms)
tss (ms)
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
TYP.
MIN.
TYP.
MAX.
TYP.
MAX.
1.00
2.0V
0.980
1.000
1.020
190
260
350
79
0.375
0.500
0.625
0.25
0.40
1.20
2.20
1.176
1.200
1.224
190
260
350
82
0.450
0.600
0.750
0.25
0.40
1.50
2.50
1.470
1.500
1.530
180
240
300
84
0.563
0.750
0.938
0.25
0.40
1.80
2.80
1.764
1.800
1.836
170
220
270
85
0.675
0.900
1.125
0.32
0.50
2.50
3.50
2.450
2.500
2.550
170
220
270
86
0.938
1.250
1.563
0.32
0.50
2.80
3.80
2.744
2.800
2.856
170
220
270
86
1.050
1.400
1.750
0.32
0.50
2.85
3.85
2.793
2.850
2.907
170
220
270
86
1.069
1.425
1.781
0.32
0.50
3.00
4.00
2.940
3.000
3.060
170
220
270
86
1.125
1.500
1.875
0.32
0.50
3.30
4.30
3.234
3.300
3.366
170
220
270
86
1.238
1.650
2.063
0.32
0.50
VIN (V)
The output voltage can be set by adding external dividing resistors. The output voltage is determined by R1 and R2 in the
equation below. The sum of R1 and R2 is normally kept 1MΩ or less. The output voltage range can be set from 0.9V to 6.0V
based on the 0.8V ±2.0% reference voltage source.
Note that when the input voltage (VIN) is less than or equal to the set output voltage, an output voltage (VOUT) higher than the
input voltage (VIN) cannot be output.
VOUT=0.8×(R1+R2)/R2
Adjust the value of the phase compensation speedup capacitor CFB so that fzfb=1/(2×π×CFB×R1) is 10kHz or less. It is
optimum to adjust to a value from 1kHz to 20kH based on the components used and the board layout.
[Calculation example]
When R1=470kΩ, R2=150kΩ, VOUT=0.8×(470k+150k)/150k=3.3V
e.g.
Circuit (XCL208F/XCL209F Type)
VOUT (V)
R1 (kΩ)
R2 (kΩ)
CFB (pF)
0.9
100
820
150
1.2
150
300
100
1.5
130
150
220
1.8
300
240
150
2.5
510
240
100
3.0
330
120
150
3.3
470
150
100
4.0
120
30
470
8/22
400mA
R1
1.8～6.0V
(VIN)
(L2)
CFB
(FB)
CIN
4.7μF
R2
(PVss)
(AVss)
(CE)
(Lx)
(L1)
CL
10μF
XCL208/XCL209
Series
■TEST CIRCUITS
①
< Circuit No. >
XCL208/XCL209 A/B Type
①
< Circuit No. >
XCL208/XCL209 F Type
Wave Form Measure Point
Lx
L1
A
CIN
Wave Form Measure Point
L2
VIN
VOUT
CE
VSS
V
CL
CIN
1μF
VSS
L1
L2
VIN
Cfb
V
FB
RL
CL
R2
R1 : 150kΩ
R2 : 300kΩ
Cfb : 120pF
③
< Circuit No. >
Lx
L2
R1
※ External Components
CIN : 4.7μF(ceramic)
CL : 10μF(ceramic)
②
< Circuit No. >
L1
Lx
CE
RL
※ External Components
CIN : 4.7μF(ceramic)
CL : 10μF(ceramic)
A
L1
VIN
A
Wave Form Measure Point
Lx
L2
VIN
CE
VSS
VOUT
(FB)
Rpulldown
200Ω
CE
1μF
④
< Circuit No. >
VSS
VOUT
(FB)
⑤
< Circuit No. >
ILeakH
A
L1
Lx
L2
L1
VIN
CE
1μF
VSS
V
VOUT
(FB)
ICEH
100mA
Lx
ILeakL
VIN
A CE
1μF
L2
VSS
ICEL
VOUT
(FB)
ON resistance = (VIN-VLx)/100mA
⑥
< Circuit No. >
⑦
< Circuit No. >
Wave Form Measure Point
L1
Lx
L1
L2
VIN
1μF
V
CE
VSS
Wave Form Measure Point
L2
Ilat
VIN
ILIM
L2OUT
V
(FB)
⑧
< Circuit No. >
Lx
1μF
CE
VSS
Rpulldown
1Ω
VOUT
(FB)
⑨
< Circuit No. >
ILx
A
L1
Lx
L1
L2
A
VIN
1uF
CE
VSS
VOUT
(FB)
CIN
⑩
< Circuit No. >
XCL208/XCL209 A/B Type
L1
A
CIN
Lx
CL
VOUT
※ External Components
L : 1.5uH(Selected goods)
CIN : 4.7μF(ceramic)
CL : 10μF(ceramic)
VSS
CE
VSS
VOUT
(FB)
Wave Form Measure Point
L2
VIN
CE
L2
VIN
⑩
< Circuit No. >
XCL208/XCL209 F Type
L
Wave Form Measure Point
Lx
V
A
RL
L1
VIN
Lx
FB
CE
CIN
※ External Components
CIN : 4.7μF(ceramic)
CL : 10μF(ceramic)
Cfb
L2
VSS
R1
CL
R2
V
RL
R1 : 150kΩ
R2 : 300kΩ
Cfb : 120pF
9/22
XCL208/XCL209 Series
■OPERATIONAL DESCRIPTION
The XCL208/XCL209 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator,
phase compensation circuit, output voltage adjustment resistors, P-ch MOSFET driver transistor, N-ch MOSFET switching
transistor for the synchronous switch, current limiter circuit, UVLO circuit with control IC, and an inductor. (See the block
diagram below.) Using the error amplifier, the voltage of the internal voltage reference source is compared with the feedback
voltage from the VOUT pin through split resistors, R1 and R2. Phase compensation is performed on the resulting error amplifier
output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator
compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and
delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle.
This process is continuously performed to ensure stable output voltage. The current feedback circuit monitors the P-ch MOS
driver transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple
feedback signals. This enables a stable feedback loop even when a low ESR capacitor such as a ceramic capacitor is used
ensuring stable output voltage.
Type A
L1
L2
VOUT
LX
VIN
PVSS
AVSS
CE
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
The ramp wave circuit determines switching frequency. The frequency is fixed internally 3.0MHz. Clock pulses generated in
this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits.
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback (Type
F: FB pin voltage) divided by the internal split resistors, R1 and R2. When a feed back voltage is lower than the reference voltage,
the output voltage of the error amplifier is increased. The gain and frequency characteristics of the error amplifier output are fixed
internally to deliver an optimized signal to the mixer.
The current limiter circuit of the XCL208/XCL209 series monitors the current flowing through the P-ch MOS driver transistor
connected to the Lx pin, and features a combination of the current limit mode and the operation suspension mode.
① When the driver current is greater than a current limit level, the current limit function operates to turn off the pulses from the
Lx pin at any given timing.
② When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state.
③ At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over
current state.
④ When the over current state is eliminated, the IC resumes its normal operation.
The IC waits for the over current state to end by repeating the steps ① through ③. If an over current state continues for a latch
time and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of the driver
transistor, and goes into operation suspension state. Once the IC is in suspension state, operations can be resumed by either turning
the IC off via the CE pin, or by restoring power to the VIN pin. The suspension state does not mean a complete shutdown, but a state
in which pulse output is suspended; therefore, the internal circuitry remains in operation. The current limit of the XCL208/XCL209
series can be set at 800mA at typical. Depending on the state of the PC Board, latch time may become longer and latch operation
may not work. In order to avoid the effect of noise, an input capacitor is placed as close to the IC as possible.
Limit＜#ms
ILx
Limit＞#ms
Current Limit Level
0mA
VOUT
VSS
Lx
VCE
VIN
10/22
Restart
XCL208/XCL209
Series
■OPERATIONAL DESCRIPTION(Continued)
The short-circuit protection circuit monitors the internal R1 and R2 divider voltage (Type F: FB pin voltage). In case where
output is accidentally shorted to the Ground and when the FB point voltage decreases less than half of the reference voltage
(Vref) and a current more than the ILIM flows to the driver transistor, the short-circuit protection quickly operates to turn off
and to latch the driver transistor. In the latch state, the operation can be resumed by either turning the IC off and on via the
CE pin, or by restoring power supply to the VIN pin.
Also, when sharp load transient happens, a voltage drop at the VOUT is propagated through CFB, as a result, short circuit
protection may operate in the voltage higher than short-circuit protection voltage.
When the VIN pin voltage becomes 1.4V (TYP.) or lower, the P-channel output driver transistor is forced OFF to prevent false
pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 1.8V or higher, by releasing
the UVLO state then the soft-start function initiates output startup operation. The soft-start function operates even when the VIN
pin voltage falls momentarily below the UVLO operating voltage same as releasing the UVLO function. The UVLO circuit does
not cause a complete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry remains in
operation.
In PFM control operation, until coil current reaches to IPFM, the IC keeps the P-ch MOSFET on.
In this case, on-time (tON) that the P-ch MOSFET is kept on can be given by the following formula.
tON = L×IPFM / (VIN－VOUT) → IPFM①
In the PFM control operation, the maximum PFM Duty Limit is set to 200% (TYP.). Therefore, under the condition that the stepdown ratio is small, it’s possible for P-ch MOSFET to be turned off even when coil current doesn’t reach to IPFM. →IPFM②
IPFM①
IPFM②
The XCL208B/XCL209B and the XCL208F/XCL209F can quickly discharge the electric charge at the output capacitor (CL)
when a low signal to the CE pin which enables a whole IC circuit put into OFF state, is inputted via the N-ch transistor
located between the LX pin and the VSS pin. When the IC is disabled, electric charge left at the output capacitor (CL) is
quickly discharged so that it may avoid application malfunction. Discharge time is set by the CL auto-discharge resistance
(RDCHG) and the output capacitance (CL). By setting time constant as τ(τ=CL x RDCHG), discharge time of the output voltage
is calculated by the following formula.
Output Voltage Dischage Characteristics
Rdischg = 300Ω（ TYP）
V : Output voltage after discharge
VOUT(T) : Output voltage
t: Discharge time,
τ: CL x RDCHG
CL : Output capacitance (CL)
RDCHG : CL auto-discharge resistance
Output Voltage （ Relative Value）
100 = Setting Voltage Value
V = VOUT(T) x e –t/τ or t=τln (VOUT(T) / V)
Discharge Time t (ms)
11/22
XCL208/XCL209 Series
■OPERATIONAL DESCRIPTION(Continued)
The operation of the XCL208/XCL209 series will enter into the stand-by mode when a low level signal is input to the CE pin.
During the stand-by mode, the current consumption of the IC becomes 0μA (TYP.), with a state of high impedance at the Lx pin
and VOUT pin. The IC starts its operation by inputting a high level signal to the CE pin. The input to the CE pin is a CMOS input
and the sink current is 0μA (TYP.).
(A)
使用例A
V DD
V IN
(B)
使用例B
V DD
(A)
V IN
SW_CE
R1
CE
CE
SW_CE
OPERATIONAL STATES
ON
Stand-by
OFF
Active
(B)
SW_CE
R2
< IC inside >
IC内部
SW_CE
OPERATIONAL STATES
ON
Active
OFF
Stand-by
Soft-start time is internally set. Soft-start time is defined as the time to reach 90% of the output nominal voltage when the CE
pin is turned on.
tSS
V CEH
0V
90% of setting voltage
V OUT
0V
12/22
設定電圧の90%
XCL208/XCL209
Series
■NOTE ON USE
1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
2. The XCL208/XCL209 series is designed for use with ceramic output capacitors. If, however, the potential difference is too
large between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the resulting high switching
energy and oscillation could occur on the output. In this case, increase 10μF to the output capacitance for adding
insufficient capacitance. Also, if the output capacitance is too large, the output voltage is slowly rising and the IC may not
operate. Adjust the output capacitance so that the output voltage can go up within the soft-start time.
3. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by
external component selection, such as the coil inductance, capacitance values, and board layout of external components.
Once the design has been completed, verification with actual components should be done.
4. Depending on the input-output voltage differential, or load current, some pulses may be skipped as 1/2, 1/3 and the ripple voltage
may increase.
5. When the difference between input and output is large in PWM control, very narrow pulses will be outputted, and there is the
possibility that 0% duty cycles may be continued during some cycles.
6. When the difference between input and output is small, and the load current is heavy, very wide pulses will be outputted and
there is the possibility that 100% duty cycles may be continued during some cycles.
7. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current of the coil increases
when dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak current
becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate the
peak current according to the following formula:
Ipk = (VIN - VOUT) x OnDuty / (2 x L x fOSC) + IOUT
L: Coil Inductance Value
fOSC: Oscillation Frequency
8. When the peak current which exceeds limit current flows within the specified time, the built-in P-ch driver transistor turns off.
During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit current
flows; therefore, care must be taken when selecting the rating for the external components such as a coil.
9. When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
10. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid
the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible.
11. Use of the IC at voltages below the minimum operating voltage range may lead to instability.
12. This IC should be used within the stated absolute maximum ratings of external components in order to prevent damage to
the device.
13. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the
leak current of the driver transistor.
14. The current limit is set to 1000mA (MAX.) at typical. However, the current of 1000mA or more may flow.
In case that the current limit functions while the VOUT pin is shorted to the GND pin, when P-ch MOSFET is ON, the
potential difference for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large.
By contrast, when N-ch MOSFET is ON, there is almost no potential difference at both ends of the coil since the VOUT pin is
shorted to the GND pin. Consequently, the time rate of coil current becomes quite small. According to the repetition of this
operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the amount
of current, which is supposed to be limited originally. Even in this case, however, after the over current state continues for
several ms, the circuit will be latched. A coil should be used within the stated absolute maximum rating in order to prevent
damage to the device.
①Current flows into P-ch MOSFET to reach the current limit (ILIM).
②The current of ILIM or more flows since the delay time of the circuit occurs during from the detection of the current limit to OFF of P-ch MOSFET.
③Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small.
④Lx oscillates very narrow pulses by the current limit for several ms.
⑤The circuit is latched, stopping its operation.
②
①
Lx
Delay
③
④
⑤
Limit ＞#ms
ILIM
ILx
13/22
XCL208/XCL209 Series
■NOTE ON USE (Continued)
15. In order to stabilize VIN voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be connected as
close as possible to the VIN & VSS pins.
16. High step-down ratio and very light load may lead an intermittent oscillation when PWM mode.
17. For the XCL209, when PWM/PFM automatic switching goes into continuous mode, the IC may be in unstable operation for
the range of MAXDUTY area with small input/output differential. Once the design has been completed, verification with actual
components should be done.
18. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their
systems.
19. Instructions of pattern layouts
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to
the VIN (No.8) and PVSS (No.1) pins.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
(4) Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground
currents at the time of switching may result in instability of the IC.
(5) Internal driver transistors bring on heat because of the output current and ON resistance of the driver transistors.
(6) Please connect Lx (No.2) pin and L1 (No.9) pin on the PCB layout.
(7) Please connect VOUT (No.4) pin and L2 (No.10) pin on the PCB layout. (Type A/B)
（TOP VIEW）
（BOTTOM VIEW）
（PCB mounted TOP VIEW）
XCL208/209
XCL208/209
VOUT
GND
VOUT
GND
CL
CL
LX
CE
LX
CE
IC
IC
CIN
CIN
GND
VIN
GND
VIN
TOREX
TOREX
USP-10B03
USP-10B03
（TOP VIEW）
（BOTTOM VIEW）
（PCB mounted TOP VIEW）
XCL208/209
XCL208/209
VOUT
GND
CL
CFB
RFB1
CE
VOUT
GND
CL
CFB
RFB1
CE
RFB2
RFB2
IC
IC
LX
GND
VIN
FB
GND
VIN
TOREX
TOREX
USP-10B03
LX
CIN
CIN
FB
USP-10B03
: IC
: Ceramic Cap
: Chip Resistance
14/22
XCL208/XCL209
Series
■NOTE ON USE (Continued)
20. Typical application circuit
< Typical application circuits
Type F>
VOUT
RFB1
VIN
L2 VOUT
VIN
CE
VIN
L1
LX
VIN
L2
FB
AVSS
PVSS
VCE
CFB
CL
CIN
AVSS
PVSS
VCE
VOUT
CL
CIN
CE
L1
RFB2
LX
Example of external components
Example of external components (VOUT=1.8V)
CIN: 10V/4.7μF（LMK107BJ475KA TAIYO YUDEN）
CIN: 10V/4.7μF（LMK107BJ475KA
TAIYO YUDEN）
CL: 10V/10μF（LMK107BBJ106MA TAIYO YUDEN）
CL: 10V/10μF（LMK107BBJ106MA
TAIYO YUDEN）
RFB1: 300kΩ
RFB2: 240kΩ
CFB: 150pF（C1005CH1H151J TDK）
NOTE:
The integrated Inductor can be used only for this DC/DC converter. Please do not use this inductor for other reasons.
Please use B, X5R, and X7R grades in temperature characteristics for the CIN and CL capacitors.
These grade ceramic capacitors minimize capacitance-loss as a function of voltage stress.
If necessary, increase capacitance by adding or replacing.
Examples of external components
CIN
CL
PART NUMBER
MANUFACTURE
RATED VOLTAGE / INDUCTANCE /
FEATURES
Size (L×W)
LMK107BJ475KA
TAIYO YUDEN
10V/4.7μF/X5R
1.6mm×0.8mm
LMK212B7475KG
TAIYO YUDEN
10V/4.7μF/X7R
2.0mm×1.25mm
LMK107BBJ106MA
TAIYO YUDEN
10V/10μF/X5R
1.6mm×0.8mm
LMK212B7106MG
TAIYO YUDEN
10V/4.7μF/X7R
2.0mm×1.25mm
15/22
XCL208/XCL209 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
(2) Output Voltage vs. Output Current
XCL208B183DR/XCL209B183DR
100
XCL208B183DR/XCL209B183DR
2.1
XCL209(PWM/PFM)
Output Voltage:V OUT(V)
Efficiency:EFFI(%)
80
60
40
2.4V
3.6V
V IN= 4.2V
XCL208
(PWM)
20
2.0
XCL208/XCL209
V IN=4.2V,3.6V,2.4V
1.9
1.8
1.7
1.6
1.5
0
0.1
1
10
100
0.1
1000
1
(3) Ripple Voltage vs. Output Current
3.5
Oscillation Frequency : fosc(MHz)
Ripple Voltage:Vr(mV)
XCL208B183DR/XCL209B183DR
XCL208B183DR/XCL209B183DR
60
XCL208
V IN=2.4
40
XCL209
V IN=2.4V
3.6V,4.2V
3.6V,4.2
20
0
0.1
1
10
100
3.4
3.3
3.2
3.1
V IN=3.6V
3.0
2.9
2.8
2.7
2.6
2.5
1000
-50
-25
0
Output Current:IOUT (mA)
50
75
100
(6) Output Voltage vs. Ambient Temperature
XCL209B183DR
XCL208B183DR/XCL209B183DR
40
2.1
V IN=6.0V
35
Output Voltage : V OUT (V)
4.0V
30
25
20
15
2.0V
10
5
0
-50
25
Ambient Temperature: Ta (℃)
(5) Supply Current vs. Ambient Temperature
Supply Current : IDD (μA)
1000
(4) Oscillation Frequency vs. Ambient Temperature
80
2.0
1.9
V IN=3.6V
1.8
1.7
1.6
1.5
-25
0
25
50
Ambient Temperature: Ta (℃)
16/22
100
Output Current:IOUT (mA)
Output Current:IOUT (mA)
100
10
75
100
-50
-25
0
25
50
Ambient Temperature: Ta (℃)
75
100
XCL208/XCL209
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) UVLO Voltage vs. Ambient Temperature
XCL208B183DR/XCL209B183DR
XCL208B183DR/XCL209B183DR
1.8
1.0
CE=V IN
1.5
0.9
CE "H" Voltage : VCEH (V)
UVLO Voltage : UVLO (V)
(8) CE "H" Voltage vs. Ambient Temperature
1.2
0.9
0.6
0.3
0.8
V IN=5.0V
0.7
3.6V
0.6
0.5
0.4
0.3
2.4V
0.2
0.1
0.0
-50
-25
0
25
50
75
0.0
100
-50
-25
Ambient Temperature: Ta (℃)
(9) CE "L" Voltage vs. Ambient Temperature
25
50
75
100
(10) Soft Start Time vs. Ambient Temperature
XCL208B183DR/XCL209B183DR
1.0
0
Ambient Temperature: Ta (℃)
XCL208B183DR/XCL209B183DR
5.0
0.8
Soft Start Time : tss (ms)
CE "L" Voltage : VCEL (V)
0.9
V IN=5.0V
0.7
3.6V
0.6
0.5
0.4
0.3
2.4V
0.2
4.0
3.0
2.0
V IN=3.6V
1.0
0.1
0.0
0.0
-50
-25
0
25
50
75
100
-50
-25
Ambient Temperature: Ta (℃)
25
50
75
100
Ambient Temperature: Ta (℃)
(11) "Pch / Nch" Driver on Resistance vs. Input Voltage
(12) Rise Wave Form
XCL208B333DR/XCL209B333DR
XCL208B183DR/XCL209B183DR
Lx SW ON Resistance:RLxH,RLxL (Ω)
0
1.0
VIN = 5.0V
IOUT = 1.0mA
0.9
0.8
0.7
Nch on Resistance
0.6
0.5
2ch
VOUT
0.4
0.3
Pch on Resistance
0.2
0.1
1ch
0.0
0
1
2
3
4
Input Voltage : V IN (V)
5
6
CE:0.0V⇒1.0V
1ch:1V/div
2ch:1V/div
Time:100μs/div
17/22
XCL208/XCL209 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(13) Soft-Start Time vs. Ambient Temperature
(14) CL Discharge Resistance vs. Ambient Temperature
XCL208B333DR/XCL209B333DR
XCL208B333DR/XCL209B333DR
600
400
CL Discharge Resistance: (Ω)
Soft Start Time : tss (μs)
500
V IN=5.0V
IOUT =1.0mA
300
200
100
0
-50
-25
0
25
50
Ambient Temperature: Ta (℃)
(15) Load Transient Response
18/22
75
100
500
400
2.0V
V IN=6.0V
300
200
100
-50
4.0V
-25
0
25
50
Ambient Temperature: Ta (℃)
75
100
XCL208/XCL209
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
19/22
XCL208/XCL209 Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
OUTLINE / LAND PATTERN
THERMAL CHARACTERISTICS
USP-10B03
USP-10B03 PKG
USP-10B03 Power Dissipation
20/22
XCL208/XCL209
Series
■MARKING RULE
USP-10B03
8
2
7
④
②
⑤
③
3
①
1
4
6
5
① represents products series
MARK
PRODUCT SERIES
8
9
XCL208******
XCL209******
② represents integer of output voltage and oscillation frequency
MARK
OUTPUT
VOLTAGE(V)
OSCILLATION FREQUENCY =3.0MHz
0.x
1.x
2.x
3.x
4.x
(XCL20*F**3**(FB)
(XCL20*A**3**)
(XCL20*B**3**)
F
0
1
2
3
4
A
B
C
D
E
-
③ represents the decimal part of output voltage
OUTPUT
MARK
PRODUCT SERIES
VOLTAGE (V)
X.0
X.1
X.2
X.3
X.4
X.5
X.6
X.7
X.8
X.9
0
1
2
3
4
5
6
7
8
9
OUTPUT
VOLTAGE (V)
MARK
PRODUCT SERIES
X.05
X.15
X.25
X.35
X.45
X.55
X.65
X.75
X.85
X.95
A
B
C
D
E
F
H
K
L
M
XCL20***A***
XCL20***B***
XCL20***C***
XCL20***D***
XCL20***E***
XCL20***F***
XCL20***H***
XCL20***K***
XCL20***L***
XCL20***M***
XCL20***0***
XCL20***1***
XCL20***2***
XCL20***3***
XCL20***4***
XCL20***5***
XCL20***6***
XCL20***7***
XCL20***8***
XCL20***9***
Example （Mark ②, ③）
OSCILLATION
FREQUENCY
3.0MHz
XCL20*F08***
②
③
MARK
XCL20*A18***
②
③
XCL20*B3D***
②
③
F
1
D
8
8
D
④,⑤ represents production lot number
01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order.
(G, I, J, O, Q, W excluded)
*No character inversion used.
21/22
XCL208/XCL209 Series
1.
The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2.
The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or completeness
of the information contained in this datasheet nor grant any license to any intellectual property rights
of ours or any third party concerning with the information in this datasheet.
3.
Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4.
The product is neither intended nor warranted for use in equipment of systems which require extremely
high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human
life, bodily injury, serious property damage including but not limited to devices or equipment used in 1)
nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other
transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5.
Although we make continuous efforts to improve the quality and reliability of our products; nevertheless
Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or
property damage resulting from such failure, customers are required to incorporate adequate safety
measures in their designs, such as system fail safes, redundancy and fire prevention features.
6.
Our products are not designed to be Radiation-resistant.
7.
Please use the product listed in this datasheet within the specified ranges.
8.
We assume no responsibility for damage or loss due to abnormal use.
9.
All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
22/22
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