XCL301A331ER-G

XCL301Series ETR28015-003 Inductor Built-in Inverting “micro DC/DC” Converters ☆Green Operation Compatible ■GENERAL DESCRIPTION The XCL301 series is a inverting micro DC/DC converter which integrates a P-channel FET, an inductor and a control IC in one tiny package (2.5mm×2.0mm, h=1.00mm max). A wide operating voltage range of 2.7V to 5.5V enables support for applications that require an internally -3.3V fixed output voltage. The XCL301 series uses automatic PFM/fixed off time PWM. In automatic PFM/fixed off time PWM control, the IC operates by PFM control when the load is light to achieve high efficiency over the full load range from light to heavy. The device provides a stable inverting power supply to be configured using only a SBD and two capacitors connected externally. During stand-by, all circuits are shutdown to reduce current consumption to as low as 0.1μA or less. With the built-in UVLO function, the internal P-channel MOS driver transistor is forced OFF when input voltage becomes 2.2V or lower. The XCL301 integrate CL High Speed discharge function which enables the electric charge at the output capacitor CL to be discharged via the internal discharge. ■APPLICATIONS ● ■FEATURES Negative power supply for AMP Input Voltage Range : 2.7V ~ 5.5V Output Voltage : -3.3V ● Negative power supply for LCD ● Negative power supply for CCD Output Current : -50mA@VOUT=-3.3V, VIN=3.3V (TYP) ● General purpose Negative power supply Internal Driver : 1.3Ω (Pch Driver Tr) Quiescent Current : 40μA (TYP.) Control Methods : PFM / Fixed off time PWM Auto Transient Response : -50mV Output Voltage accuracy ±2.0% (VIN=3.3V,VOUT=-3.3V,IOUT=1mA→50mA) PFM switch Current : 550mA Function : Current Limit Soft-Start CL High Speed Discharge UVLO CL High Speed Discharge Operating Ambient Temperature : -40 ~ +85℃ Packages : CL-2025-02 Environmentally Friendly : EU RoHS Compliant, Pb Free ■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE CHARACTERISTICS ●Efficiency-Output Voltage 7 L1 VIN 6 1 Lx SD CL 10μF GND 5 2 VOUT 3 CIN 10μF CE 4 NC L2 8 1/18 XCL301 Series ■BLOCK DIAGRAM L1 L2 Inductor Vref Error　Amp PWM Comparator R3 Logic Buffer Drive R4 Current Feedback VOUT CL Discharge LX Current Limit UVLO VIN R1 GND Vreｆ for U.V.L.O. Internal ON/OFF Controller CE R2 * Diodes inside the circuit are an ESD protection diode and a parasitic diode. ■PRODUCT CLASSIFICATION ●Ordering Information XCL301①②③④⑤⑥-⑦ DESIGNATOR ① ②③ ④ ⑤⑥-⑦ (*1) (*1) ITEM SYMBOL Product Type Output Voltage PFM Switch Current Packages (Order Unit) A 33 1 ER-G DESCRIPTION Refer to Selection Guide Output Voltage = -3.3V only 550mA (TYP.) CL-2025-02 (3,000pcs/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. ●Selection Guide OUTPUT TYPE VOLTAGE A 2/18 -3.3V Fixed CL DISCHARGE UVLO CHIP ENABLE Yes Yes Yes XC9140 (Design Target) XCL301 Series ■PIN CONFIGURATION L1 7 VIN 6 1 Lx GND 5 2 VOUT CE　 4 3 NC * The dissipation pad should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the GND (No. 5) pin. NC (No.3) doesn’t connect to IC chip. 8 L2 (BOTTOM VIEW) ■PIN ASSIGNMENT PIN NUMBER CL-2025-02 PIN NAME FUNCTIONS 1 2 3 4 5 6 7 8 LX VOUT NC CE GND VIN L1 L2 Switching Output Output Voltage No Connection Chip Enable Ground Power Input Inductor Electrodes Inductor Electrodes ■ FUNCTION PIN NAME SIGNAL STATUS CE H L Operation Standby * Please do not leave the CE pin open. ■ABSOLUTE MAXIMUM RATINGS Ta=25˚C SYMBOL RATINGS UNITS VIN Pin Voltage LX Pin Voltage PARAMETER VIN VLX -0.3 ~ +6.0 VIN-13.0 ~ VIN+0.3 or +6.0 (*1) V V VOUT Pin Voltage CE Pin Voltage LX Pin Current VOUT VCE ILX VIN-22.0 ~ VIN+0.3 or +6.0 (*1) -0.3 ~ +6.0 1500 V V mA Power Dissipation Pd 1000(40mm x 40mm Standard board) (*2) mW Operating Ambient Temperature Storage Temperature Topr Tstg -40 ~ +85 -55 ~ +125 ˚C ˚C * All voltages are described based on the GND pin. (*1) (*2) The maximum value should be either VIN +0.3V or +6.0V in the lowest. The power dissipation figure shown is PCB mounted and is for reference only. The mounting condition is please refer to PACKAGING INFORMATION. 3/18 XCL301 Series ■ELECTRICAL CHARACTERISTICS XCL301A33AER-G Ta=25˚C MIN. TYP. MAX. UNITS CIRCUIT - 2.700 - 5.500 V - The voltage which LX starts oscillation while VOUT is increasing. -3.366 -3.300 -3.234 V ① VIN=VCE,VOUT=0V, Voltage which Lx pin holding “L” level (*6) 1.75 2.20 - V ① VUVLOR VIN=VCE,VOUT=0V, Voltage which Lx pin holding “H” level (*6) - 2.35 2.69 V ① UVLO Hysteresis Width VUVLOH VUVLOH=VUVLOH - VUVLOD 0.02 0.15 0.25 V ① Supply Current IDD VIN=VCE =5.5V, VOUT=VOUT(T)×1.1V (*3) - 40 80 μA ② Stand-by Current ISTB VIN=5.5V, VCE=0V - 0 1.0 μA ③ PFM Switch Current IPFM When connected to external components, IOUT=1mA 280 550 800 mA ④ ILIMSS Switch Current ILIMSS When connected to external components, IOUT=1mA 150 400 700 mA ④ Maximum ON Time tONMAX VIN=VCE=3.7V, VOUT=VOUT(T)×0.9V (*3) 1.1 1.7 2.3 μs ① Minimum OFF Time tOFFMIN VIN=VCE=3.7V, VOUT=VOUT(T)×0.9V (*3) 0.2 0.3 0.4 μs ① Efficiency (*4) EFFI When connected to external components, IOUT =10mA - 63 - % ④ RLXH ILX=100mA 0.8 1.3 1.95 Ω ⑤ ILEAKL VIN=5.5V, VCE=0V, VLX=0V - 0.01 1.00 μA ⑥ 550 900 1300 mA ④ - ±100 - ppm / oC ④ 180 300 480 Ω ⑥ 1.2 - 5.5 V ① GND - 0.4 V ① PARAMETER SYMBOL Input Voltage VIN Output Voltage (*1) VOUT(E) (*2) UVLO Detection Voltage VUVLOD UVLO Release Voltage LX SW "High" ON Resistance (*5) LX SW "Low" Leakage Current Maximum Current Limit Output Voltage Temperature Characteristics CL Auto-Discharge Resistance ILIM CONDITIONS When connected to external components VOUT / (VOUT・topr) IOUT=10mA, -40℃< Topr < 85℃ RDCHG VIN=3.7V, VCE=0V, VOUT =-1V VIN=5.5V, VOUT=VOUT(T)×0.9V (*3) , Applied voltage to VCE, voltage changes LX to "H" level (*6) VIN=5.5V, VOUT=VOUT(T)×0.9V (*3) , Applied voltage to VCE, voltage changes LX to "L" level (*6) CE "High" Voltage VCEH CE "Low" Voltage VCEL CE "High" Current ICEPH VIN=VCE=5.5V -0.1 - 0.1 μA ⑥ CE "Low" Current ICEPL VIN=5.5V, VCE=0V -0.1 - 0.1 μA ⑥ Inductance Value L Test Frequency=1MHz - 4.7 - μH - Inductor Rated Current IDC ∆T=+40℃ - 700 - mA - Measurement conditions: Unless otherwise stated, VIN=VCE=3.7V (*1) VOUT pin voltage measured when LX pin oscillation starts. (*2) VOUT (E) is Effective Output Voltage (*3) VOUT (T) is nominal output voltage (-3.3V) (*4) EFFI= {(Output Voltage) × (Output Current)} / {(Input Voltage) × (Input Current)} ×100 (*5) On resistance = (Voltage measured at VIN pin – Voltage measured at LX pin) / 100mA (*6) "H" = VIN～VIN -1.2V, "L" = +0.1V～-0.1V 4/18 XC9140 (Design Target) XCL301 Series ■ TEST CIRCUITS < Test Circuit No.① > < Test Circuit No.② > TEST CIRCUITS Wave Form Measu re Poin t 22μF L2 L1 L2 L1 CE LX CE LX VIN VOUT VIN VOUT 22μF 47Ω 0.1μF GND < Test Circuit No.③ > 22μF A A 0.1μF GND < Test Circuit No.④ > L2 L1 CE LX VIN VOUT Wave Form Measu re Poin t 22μF GND A < Test Circuit No.⑤ > L2 L1 CE LX VIN VOUT 10μF GND 47Ω < Test Circuit No.⑥ > V Wave Form Measu re Poin t 22μF L2 L1 CE LX VIN VOUT GND A 22μF L2 L1 CE LX VIN VOUT GND A A 0.1μF IS 5/18 XCL301 Series ■TYPICAL APPLICATION CIRCUIT 7 L1 VIN 6 1 Lx SD CL 10μF×2 GND 5 2 VOUT 3 CIN 10μF CE 4 NC L2 8 【Typical Examples】 MANUFACTURE PRODUCT NUMBER VALUE CIN TAIYO YUDEN LMK105CBJ106MVLF 10μF/10V CL TAIYO YUDEN LMK105CBJ106MVLF×2 10μF/10V SD PANJIT SBA240CH 2A/40V * Take capacitance loss, withstand voltage, and other conditions into consideration when selecting components. * Recommend 20uF for CL Value. * If a tantalum or electrolytic capacitor is used for the load capacitance CL, ripple voltage will increase, and there is a possibility that operation will become unstable. Test fully using the actual device. 6/18 XC9140 (Design Target) XCL301 Series ■OPERATIONAL EXPLANATION The XCL301 series consists of a reference voltage source, error amplifier, PWM comparator, output voltage adjustment resistance, P-ch MOS driver transistor, current limiting circuit, UVLO circuit, and other components. The internal reference voltage and the feedback voltage from the VOUT pin that passes through R3 and R4 are compared by the error amplifier and a signal that determines the on time for switching during PWM operation is generated. A current feedback circuit detects the current of the P-ch MOS driver transistor at each switching and generates a current feedback signal. The PWM comparator compares the signal generated by the error amplifier and the current feedback signal, sends the output to the buffer drive circuit, and this is output from the LX pin as the on time of switching. The off time of PWM operation is fixed inside the IC, and the P-ch MOS driver transistor is turned on after the fixed time elapses. This operation is performed continuously to stabilize the output voltage. L1 L2 Inductor Vref Error　Amp PWM Comparator R3 Logic Buffer Drive R4 Current Feedback VOUT CL Discharge Current Limit UVLO VIN R1 GND LX Vreｆ for U.V.L.O. Internal ON/OFF Controller CE R2 XCL301 Series Reference voltage that acts as the reference used to stabilize the output voltage of this IC. The error amplifier is designed to monitor the output voltage. The voltage divided by the internal R3 and R4 resistances is fed back and compared to the reference voltage. In response to feedback of a voltage higher than the reference voltage, the output voltage of the error amplifier increases. The frequency characteristics of the error amplifier are optimized internally. Detects the current of the P-ch MOS driver transistor at each switching and generates a current feedback signal. The signal generated by the error amplifier and the current feedback signal are compared, and when the signal generated by the error amplifier is lower, a signal that turns the driver transistor off is output. Outputs the signal that drives the P-ch MOS driver transistor. 7/18 XCL301 Series ■OPERATIONAL EXPLANATION (Continued) The current limiting circuit of the XCL301 series monitors the current that flows through the P-ch MOS driver transistor that is connected to the LX pin and limits the current. (1) If the driver current is higher than a specific current, the current limiting function activates and turns off the pulse that is output from the LX pin at any selected timing. (2) The driver transistor remains off until the inductor current becomes 0A. (3) The P-ch MOS driver transistor turns on at the timing of the next pulse, however, if there is over-current at this time, the P-ch MOS driver transistor turns off immediately. (4) When the over-current state no longer exists, normal operation takes place. While repeating (1) to (3), the IC waits for the over-current state to stop. Current Limit LEVEL ILX 0mA LX CE GND VIN GND To prevent incorrect pulse output due to instable operation of the internal circuitry when the VIN pin voltage drops below 2.2V (TYP.), the driver transistor is forcibly turned off. When the VIN pin voltage rises higher than 2.35V (TYP.), switching operation is performed. When the UVLO function is canceled, the soft-start function activates and output start operation begins. Soft-start also operates if the VIN pin momentarily drops below the UVLO operation voltage. The UVLO function only stops pulse output; it does not shut down the IC and thus the internal circuitry continues to operate. During PFM operation, the P-ch MOS driver transistor is on until the current flowing through the inductor reaches a specific value (IPFM). This P-ch MOS driver transistor on time (tON) is determined by the following equation: tON = L × IPFM / VIN 8/18 XC9140 (Design Target) XCL301 Series ■OPERATIONAL EXPLANATION (Continued) < CL Auto Discharge > The XCL301 series allows high-speed discharge of the output capacitor (CL) through the IC internal CL discharge resistance when an L level signal is input into the CE pin (when the IC is in the standby state). This makes it possible to prevent application malfunctioning due to a charge remaining on CL when the IC is stopped. The discharge time is determined by the CL discharge resistance and CL. ln ((VIN-V) /(VIN-VOUT(T))) t = -τ V: Output voltage after discharge VOUT (T): Nominal output voltage t: Unit: mm Discharge time τ : CL×RDCHG CL: Capacitance of output capacitor RDCHG: CL auto-discharge resistance The XCL301 series can be put in the shutdown state by L level input to the CE pin. In the shutdown state, the supply current of the IC is 0μA (TYP.). Operation is started by inputting H level to the CE pin. The CE pin input is CMOS input and the sink current is 0μA (TYP.). The rise time is determined by the input voltage, output voltage, output capacitance, and soft-start current limit (ILIMSS). (1) When the CE pin is turned on, the driver transistor turns on. (2) When the driver current exceeds the soft-start current limit value, the driver transistor is turned off. (3) The driver transistor remains off until the inductor current becomes 0A. (4) When the inductor current becomes 0A, the driver transistor is turned on again. (5) If the output voltage is larger than setting voltage, the operations of (2) to (5) are repeated. (6) When the output voltage becomes smaller than setting voltage, operation starts in PFM/fixed off-time PWM control. Current Limit LEVEL in Start-up ILX 0mA LX GND VOUT 100% of set ting voltage VIN GND CE GND 9/18 XCL301 Series ■NOTE ON USE 1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC. 2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally connected components, so refer to the specifications of each component and be careful when selecting the components. Be especially careful of the characteristics of the capacitor used for the load capacity CL and use a capacitor with B characteristics (JIS Standard) or an X7R/X5R (EIA Standard) ceramic capacitor. 3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. 4. Mount the externally connected components in the vicinity of the IC. Also use short, thick wires to reduce the wire impedance. 5. When the input voltage is high or the ambient temperature is low temperature, there is a case that the coil current at the time of rise is superimposed and the inrush current becomes larger than 700 mA Please test fully using the actual device before use. (See the figure below) VIN=5.5V, VOUT=-3.3V, IOUT=10mA, Ta=-40℃ ZOOM CE[10V/div] LX[10V/div] VOUT[2V/div] ILX[500mA/div] 100[us/div] 10[us/div] 6. Ripple voltage will be if both the input voltage is high and the ambient temperature is low. Once the design has been completed, verification with actual components should be done. (Please refer to below) VIN=5.5V, VOUT=-3.3V, IOUT=50mA, Ta=-40℃ Lx [10V/div] VOUT [100mV/div] 7. Use of the IC at voltages below the recommended voltage range may lead to instability. 8. In case load current (resistance load) is large when rising, output voltage may not reach the setting voltage. Once the design has been completed, verification with actual components should be done. 9. CL discharge function may end even if more than 10% output voltage remains at the following conditions: CE pin=L with lower than 3V input voltage, or input voltage is lower than UVLO detection voltage. (*1) 10. CL discharge function may not work under any of the following conditions: When the voltage at the CE pin is turned Low level, following a situation when the output voltage never reached less than -3V despite the voltage at the CE pin was turned high level. With the CE pin connected to VIN, when the VIN voltage drops below the UVLO detect voltage, following a situation when the output voltage never reached less than -3V despite the input voltage rise above the UVLO release voltage. (*1) (*１) "H"=1.2V~5.5V, "L"=GND~0.4V 10/18 XC9140 (Design Target) XCL301 Series ■NOTE ON USE (Continued) 11. If the output is short-circuited, the IC internal power dissipation may exceed the power dissipation specified in the data sheet even if the inductor current does not reach the maximum current limit. 12. When the input voltage is high or the ambient temperature is low, the coil current may be superimposed and the maximum current limit value may exceed 1300 mA. This may cause the possibility of exceeding the rated current of the IC, coil and schottky diode in some cases. Please test fully using the actual device before use. 13. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 14. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 15. Please use within the power dissipation range below. Please also note that the power dissipation may be changed by test conditions, the power dissipation figure shown is PCB mounted. 16. The proper position of mounting is based on the coil terminal ( Power dissipation vs. Operating Temp Package Body Temp vs. Operating Temp The power loss of micro DC/DC according to the following formula: Power loss = VOUT×IOUT× ((100/EFFI) – 1) (W) VOUT: Output Voltage (V) IOUT: Output Current (A) EFFI: Conversion Efficiency (%) 11/18 XCL301 Series ■NOTES ON LAYOUT 1. In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN & GND pins. 2. Please mount each external component as close to the IC as possible. 3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. 4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. 5. This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-ch MOS driver transistors. 6. As precautions on mounting, please set the mounting position accuracy within 0.05 mm. ●Recommended Pattern Layout Top view Bottom view ■ABOUT THE APPEARANCE (1) Coils are compliant with general surface mount type chip coil (inductor) specifications and may have scratches, flux contamination and the like. 12/18 XC9140 (Design Target) XCL301 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output Current (2) Output Voltage vs. Output Current XCL301A331 C IN =10μF(LMK105CBJ106MVLF),C L=10μF×2(LMK105CBJ 106MVLF) SBD:SBA240CH 80 C IN =10μF(LMK105CBJ106MVLF),C L=10μF×2(LMK105CBJ 106MVLF) SBD:SBA240CH -3.5 VIN =2.7V,3.6V,5.0V Output Voltage : VOUT (V) Ef f iciency : EFFI (%) XCL301A331 60 VIN =5.0V 40 VIN =3.6V VIN =2.7V -3.4 -3.3 20 -3.2 0 -3.1 0.1 1 10 100 0.1 1 Output Current : I OUT (mA) (4) Output Voltage Vs. Ambient Temperature XCL301A331 -5.0 Output Voltage : VOUT (V) Ripple Voltage : Vr (mV) XCL301A331 C IN =10μF(LMK105CBJ106MVLF),C L =10μF×2(LMK105CBJ 106MVLF) SBD:SBA240CH 250 200 150 VIN =5.0V 100 VIN =2.7V 100 Output Current : I OUT (mA) (3) Ripple Voltage vs. Output Current 300 10 VIN =3.6V VIN =2.7V,5.5V -4.0 -3.0 -2.0 50 -1.0 0 0.1 1 10 -50 100 -25 0 25 50 75 (5) Supply Current vs. Ambient Temperature (6) Standby Current vs. Ambient Temperature XCL301A331 XCL301A331 VIN =VCE,VOUT=VOUT(T) ×1.1 100 VCE=0V 5.0 VIN =3.7V VＩＮ=2.7V,3.7V,5.5V Standby Current: I STB (μA) Supply Current : I DD (μA) 100 Ambient Temperature: Ta(℃ ) Output Current : I OUT (mA) 80 60 40 20 4.0 3.0 2.0 1.0 0 0.0 -50 -25 0 25 50 Ambient Temperature: Ta(℃ ) 75 100 -50 -25 0 25 50 75 100 Ambient Temperature: Ta(℃ ) 13/18 XCL301 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) UVLO Release Voltage vs. Ambient Temperature (8) PFM Switching Current vs. Ambient Temperature XCL301A331 XCL301A331 VIN =VCE,VOUT=0V C IN =10μF(LMK105CBJ106MVLF),CL =10μF×2(LMK105CBJ 106MVLF) SBD:SBA240CH 1,000 VRELEASE(T) =2.35V PFM Switching Current: I PFM (mA) UVLO Release Voltage: VRELEASE (V) 2.70 2.50 2.30 2.10 1.90 VIN =5.5V VIN =3.7V 800 VIN =2.5V 600 400 200 0 -50 -25 0 25 50 75 100 -50 -25 0 (9) Minimum OFF Time vs. Ambient Temperature 75 100 XCL301A331 1.0 5.0 VIN =2.7V,3.6V,4.2V VIN =2.7V,3.7V,5.5V Maximum ON Time: t ONMAX (μS) Minimum OFF Time: t OFFMIN (μS) 50 (10) Maximum ON Time vs. Ambient Temperature XCL301A331 0.8 0.6 0.4 0.2 0.0 4.0 3.0 2.0 1.0 0.0 -50 -25 0 25 50 75 100 -50 -25 Ambient Temperature: Ta(℃ ) 0 25 50 100 (12) Lx SW "Low" Leakage Current vs. Ambient Temperature XCL301A331 XCL301A331 VCE=0V,VLX=0V VIN =VCE,VOUT=0V,ILX=100mA 2.5 75 Ambient Temperature: Ta(℃ ) (11) Lx SW "Hign" ON Resistance vs. Ambient Temperature 3.0 VIN =3.7V LX Leak Current : I LXL (μA) LX SW “Pch” ON Resistance: R LXP (Ω) 25 Ambient Temperature: Ta (℃ ) Ambient Temperature: Ta(℃ ) 2.0 1.5 1.0 0.5 VIN =5.5V 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 Ambient Temperature: Ta(℃ ) 14/18 75 100 0.0 -50 -25 0 25 50 Ambient Temperature: Ta (℃ ) 75 100 XC9140 (Design Target) XCL301 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (13) CE "High" Voltage vs. Ambient Temperature (14) CE "Low" Voltage vs. Ambient Temperature XCL301A331 XCL301A331 2.0 2.0 VIN =2.7V,5.5V CE “Low” Voltage: VCEL (V) CE “High” Voltage: VCEH (V) VIN =2.7V,5.5V 1.5 1.0 0.5 0.0 1.0 0.5 0.0 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃ ) -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃ ) (15) CL Discharge vs. Ambient Temperature (16) Rising Output Voltage XCL301A331 XCL301A331 VIN =VCE=0→3.7V,IOUT=100uA VCE=0V,VOUT=-1.0V 600 CL Auto-Discharge Resistance: (Ω) 1.5 VIN =5.5V 500 VIN VIN =2.5V 400 VLX 300 200 100 VOUT 0 -50 -25 0 25 50 75 Ambient Temperature: Ta (℃ ) 100 VOUT:2V/div,VIN :5V/div,VLX :5V/di v,Time:200μs/di v C IN =10μF(LMK105CBJ106MVLF),C L=10μF×2(LMK105CBJ 106MVLF) SBD:SBA240CH (17) Load Transient Response XCL301A331 VIN =3.7V, IOUT=-1mA→-50mA VOUT VLX Iout VOUT:100mV/div,IOUT :50mA/di v,VL X: 5V/ div,Time:100μs/di v C IN =10μF(LMK105CBJ106MVLF),CL=10μF×2(LMK105CBJ 106MVLF) SBD:SBA240CH 15/18 XCL301 Series ■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLINE / LAND PATTERN CL-2025-02 CL-2025-02 PKG 16/18 THERMAL CHARACTERISTICS Standard Board CL-2025-02 Power Dissipation XC9140 (Design Target) XCL301 Series ■MARKING RULE ●CL-2025-02 ① Represents products series 1 ① ② ③ ⑤ 3 ④ 2 6 5 4 MARK PRODUCT SERIES 9 XCL301******-G ② Represents integer of the output voltage MARK Product Type Output Voltage (V) 3 A -3.x PFM Switch PRODUCT Current (mA) SERIES 550 (TYP) XCL301A3*1ER-G ③ Represents the decimal part of output voltage MARK 3 Output Voltage （V) -x.3 PRODUCT SERIES XCL301**3*ER-G ④, ⑤ represents production lot number 01～09、0A～0Z、11～9Z、A1～A9、AA～AZ、B1～ZZ in order. (G, I, J, O, Q, W excluded) Note: No character inversion used. 17/18 XCL301 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 18/18