XP232P0501TR-G
ETR11039-001
P-channel MOSFET -30V, -0.45A
■FEATURES
On-State Resistance
Driving voltage
Environmentally Friendly
■APPLICATIONS
: RDS(on)=1.25Ω@VGS =-4.5V
: -2.5V
: EU RoHS Compliant, Pb Free
■EQUIVALENT CIRCUIT
●Switching
■PIN CONFIGURATION
●SOT-23(TO-236)
Drain
Source
Gate
■ PRODUCT NAME
PRODUCT NAME
PACKAGE
ORDER UNIT
XP232P0501TR-G *
SOT-23(TO-236)
3,000 pcs/ Reel
* The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
Drain-Source Voltage
VDSS
-30
V
Gate-Source Voltage
VGSS
±8
V
ID
-0.45
A
IDP
-0.9
A
Drain Current (DC)
Drain Current(Pulse) (*1)
Channel Power Dissipation
(*2)
Pd
0.4
W
Junction Temperature
TJ
150
℃
Storage Temperature
Tstg
-55~150
℃
PW≦10μs,duty cycle≦1%
(*1)
(*2)
When implemented on a PCB defined by JESD51-7
1/6
XP232P0501TR-G
■ELECTRICAL CHARACTERISTICS
Ta=25℃
PARAMETER
Drain-Source Breakdown Voltage
Drain-Source Leakage Current
Gate-Source Leakage Current
SYMBOL
UNITS
-
-
V
IDSS
VDS= -30V, VGS= 0V
-
-
-1
μA
IGSS
VGS= ±8V, VDS= 0V
RDS(on)
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Turn-on Delay Time
td(on)
Diode Forward Voltage
MAX.
-30
Drain-Source On Resistance
Fall Time
TYP.
ID= -250μA, Vgs= 0V
VGS(off)
Turn-off Delay Time
MIN.
V(BR)DSS
Gate Threshold Voltage
Rise Time
TEST CONDITIONS
tr
td(off)
-
-
±10
μA
-0.4
-0.7
-1.1
V
VGS= -4.5V, ID= -200mA
-
0.95
1.25
Ω
VGS= -2.5V, ID= -200mA
-
1.45
2.15
Ω
-
56
-
pF
-
10
-
pF
-
6
-
pF
ID= -250uA, VDS= VGS
VDS= -10V, VGS= 0V
f=1MHz
VDD= -10V, ID= -200mA
VGS= -4.5V
tf
VSD
IS= -200mA, VGS= 0V
-
15
-
ns
-
20
-
ns
-
80
-
ns
-
45
-
ns
-
-0.8
-1.2
V
■NOTES ON USE
1. Please use this IC within the absolute maximum ratings.
Even within the ratings, in case of high load use continuously such as high temperature, high voltage, high current and thermal
stress may
cause reliability degradation of the IC.
2. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their
systems.
2/6
XP232P0501TR-G
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Drain Current vs. Drain-Source Voltage
(2) Drain Current vs. Gate-Source Voltage
1
-0.9
Ta=25℃
VDS=-10V
-2.5V
Ta=125℃
-3.5V
Drain Current : ID (A)
Drain Current: ID (A)
-4.5V
-0.6
-2.0V
-0.3
VGS=-1.5V
0.1
25℃
0.01
-25℃
0.001
0
0.0
-0.5
-1.0
-1.5
0
-2.0
(3) Drain-Source On-State Resistance vs. Gate-Source Voltage
-3
-4
(4) Drain-Source On-State Resistance vs. Ambient Temperature
4
Drain-Source On Resistance: RDS(on) (Ω)
5
Drain-Source On Resistance: RDS(on) (Ω)
-2
Gate-Source Voltage: VGS (V)
Drain-Source Voltage: VDS (V)
Ta=25℃
4
3
2
ID=-200mA
1
0
0
-1
-2
-3
-4
3
VGS=-2.5V
2
1
-4.5V
ID=-200mA
0
-50
-5
0
50
100
150
Ambient Temperature: Ta (℃)
Gate-Source Voltage: VGS (V)
(5) Drain-Source On-State Resistance vs. Drain Current
(6) Source Current vs. Diode Forward Voltage
1
5
Ta=25℃
Ta=125℃
4
Source Current: IS (A)
Drain-Source On Resistance: RDS(on) (Ω)
-1
3
-2.5V
2
VGS=-4.5V
1
0.1
25℃
0.01
-25℃
0.001
0
0.0
-0.3
-0.6
Drain Current: ID (A)
-0.9
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
Diode Forward Voltage: VSD (V)
3/6
XP232P0501TR-G
■TYPICAL PERFORMANCE CHARACTERISTICS
(7) Ciss, Coss, Crss vs. Drain-Source Voltage
(8) Area of Safe Operation
- 1
1000
100
Ciss
Coss
10
1
-5
-10
-15
-20
-25
Drain-Source Voltage: VDS (V)
4/6
1ms
- 0.1
10ms
DC Operation
100ms
Ta=25℃
Single pulse
Mounted on a FR4 board
(8700mm2 x 1.6mm)
Crss
0
100µs
RDS(on)
(VGS=-10V)
Limit
Drain Current: ID (A)
Capacitance: Ciss, Coss, Crss (pF)
f=1MHz, Ta=25℃
-30
- 0.01
- 0.1
-1
1s
- 10
Drain-Source Voltage: VDS (V)
- 100
XP232P0501TR-G
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
OUTLINE / LAND PATTERN
SOT-23(TO-236)
SOT-23(TO-236) PKG
THERMAL CHARACTERISTICS
JESD51-7 Board
SOT-23(TO-236)PowerDissipation
■MARKING RULE
●SOT-23(TO-236)
SOT-23(TO-236)
①,②,③represents product series
3
MARK
①
3
②
2
③
P
PRODUCT SERIES
XP232P0501**-G
①
1
②
③
④
⑤
2
④,⑤ represents production lot number
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to AZ, B1 to ZZ repeated
(G,I,J,O,Q,W excluded)
*No character inversion used
5/6
XP232P0501TR-G
1.
The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2.
The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3.
Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4.
The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5.
Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6.
Our products are not designed to be Radiation-resistant.
7.
Please use the product listed in this datasheet within the specified ranges.
8.
We assume no responsibility for damage or loss due to abnormal use.
9.
All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
6/6
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