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2SA2058_06

2SA2058_06

  • 厂商:

    TOSHIBA(东芝)

  • 封装:

  • 描述:

    2SA2058_06 - High-Speed Switching Applications DC-DC Converter Applications Strobe Applications - To...

  • 数据手册
  • 价格&库存
2SA2058_06 数据手册
2SA2058 TOSHIBA Transistor Silicon PNP Epitaxial Type 2SA2058 High-Speed Switching Applications DC-DC Converter Applications Strobe Applications • • • High DC current gain: hFE = 200 to 500 (IC = −0.2 A) Low collector-emitter saturation voltage: VCE (sat) = −0.19 V (max) High-speed switching: tf = 25 ns (typ.) Unit: mm Absolute Maximum Ratings (Ta = 25°C) Characteristics Collector-base voltage Collector-emitter voltage Emitter-base voltage Collector current Base current Collector power dissipation Junction temperature Storage temperature range DC t = 10 s DC Pulse Symbol VCBO VCEO VEBO IC ICP IB PC (Note) Tj Tstg Rating −20 −10 −7 −1.5 −2.5 −150 500 750 150 −55 to 150 Unit V V V A mA mW °C °C JEDEC JEITA TOSHIBA ― ― 2-3S1C Weight: 0.01 g (typ.) Note 1: Mounted on an FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 1 2006-11-09 2SA2058 Electrical Characteristics (Ta = 25°C) Characteristics Collector cut-off current Emitter cut-off current Collector-emitter breakdown voltage DC current gain Collector-emitter saturation voltage Base-emitter saturation voltage Collector output capacitance Rise time Switching time Storage time Fall time Symbol ICBO IEBO V (BR) CEO hFE (1) hFE (2) VCE (sat) VBE (sat) Cob tr tstg tf Test Condition VCB = −20 V, IE = 0 VEB = −7 V, IC = 0 IC = −10 mA, IB = 0 VCE = −2 V, IC = −0.2 A VCE = −2 V, IC = −0.6 A IC = −0.6 A, IB = −20 mA IC = −0.6 A, IB = −20 mA VCB = −10 V, IE = 0, f = 1 MHz See Figure 1 circuit diagram. VCC ∼ −6 V, RL = 10 Ω − −IB1 = IB2 = −20 mA Min ⎯ ⎯ −10 200 125 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Typ. ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 12 50 115 25 Max −100 −100 ⎯ 500 ⎯ −0.19 −1.10 ⎯ ⎯ ⎯ ⎯ ns V V pF Unit nA nA V Marking 20 μs IB2 IB1 Input IB1 VCC Part No. (or abbreviation code) Output W Lot code (year) Dot: even year No dot: odd year M Lot code (month) IB2 Duty cycle < 1% Figure 1 Switching Time Test Circuit & Timing Chart RL 2 2006-11-09 2SA2058 IC – VCE −2.4 −80 −60 −40 Common emitter Ta = 25°C Single nonrepetitive pulse −20 10000 Common emitter VCE = −2 V Single nonrepetitive pulse hFE – IC −2.0 (A) DC current gain hFE Collector current IC −1.6 1000 25 Ta = 100°C −1.2 −10 −8 −6 −4 IB = −2 mA −55 100 −0.8 −0.4 10 −0.001 0 0 −0.2 −0.4 −0.6 −0.8 −1.0 −1.2 −0.01 −0.1 −1 Collector-emitter voltage VCE (V) Collector current IC (A) VCE (sat) – IC −1 Common emitter Single nonrepetitive pulse −0.1 Ta = 100°C 25 −0.01 −10 Common emitter IC/IB = 30 IC/IB = 30 VBE (sat) – IC Collector-emitter saturation voltage VCE (sat) (V) Base-emitter saturation voltage VBE (sat) (V) Single nonrepetitive pulse −1 −55 Ta = 100°C 25 −0.1 −55 −0.001 −0.001 −0.01 −0.1 −1 −0.01 −0.001 −0.01 −0.1 −1 Collector current IC (A) Collector current IC (A) IC – VBE −2.0 Common emitter VCE = −2 V −1.6 Single nonrepetitive pulse −1.2 Collector current IC (A) −0.8 Ta = 100°C −0.4 25 −55 0 0 −0.4 −0.8 −1.2 −1.6 Base-emitter voltage VBE (V) 3 2006-11-09 2SA2058 rth – tw 1000 Transient thermal resistance rth (°C/W) 100 10 Curves should be applied in thermal limited area. Single nonrepetitive pulse area: 645 mm2) 1 0.001 0.01 0.1 1 10 100 1000 Ta = 25°C Mounted on an FR4 board (glass epoxy, 1.6 mm thick, Cu Pulse width tw (s) Safe Operating Area −10 IC max (pulsed) ♦ 10 ms♦ 1 ms♦ (A) IC max (continuous) −1 DC operation * (Ta = 25°C) ♦: Single nonrepetitive pulse Ta = 25°C −0.1 Note that the curves for 100 ms*, 10 s* and DC operation* will be different when the devices aren’t mounted on an FR4 board (glass epoxy, 1.6 mm thick, Cu area: 645 mm2). These characteristic curves must be derated linearly with increase in temperature. −0.01 −0.1 −1 100 ms♦* 10 s♦* Collector current IC −10 VCEO max −100 Collector-emitter voltage VCE (V) 4 2006-11-09 2SA2058 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 5 2006-11-09
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