2SK2967

2SK2967

  • 厂商:

    TOSHIBA(东芝)

  • 封装:

  • 描述:

    2SK2967 - Silicon N Channel MOS Type DC−DC Converter, Relay Drive and Motor Drive Applications...

  • 详情介绍
  • 数据手册
  • 价格&库存
2SK2967 数据手册
2SK2967 TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π−MOSV) 2SK2967 DC−DC Converter, Relay Drive and Motor Drive Applications Low drain−source ON resistance High forward transfer admittance : RDS (ON) = 48 mΩ (typ.) : |Yfs| = 30 S (typ.) Unit: mm Low leakage current : IDSS = 100 μA (max) (VDS = 250 V) Enhancement mode : Vth = 1.5~3.5 V (VDS = 10 V, ID = 1 mA) Absolute Maximum Ratings (Ta = 25°C) Characteristics Drain−source voltage Drain−gate voltage (RGS = 20 kΩ) Gate−source voltage Drain current DC (Note 1) Symbol VDSS VDGR VGSS ID IDP PD EAS IAR EAR Tch Tstg Rating 250 250 ±20 30 120 150 925 30 15 150 −55~150 Unit V V V A A W mJ A mJ °C °C 1. GATE 2. DRAIN (HEAT SINK) 3. SOURCE Pulse (Note 1) Drain power dissipation (Tc = 25°C) Single pulse avalanche energy (Note 2) Avalanche current Repetitive avalanche energy (Note 3) Channel temperature Storage temperature range JEDEC JEITA TOSHIBA ― ― 2-16C1B Weight: 4.6 g (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Thermal resistance, channel to case Thermal resistance, channel to ambient Symbol Rth (ch−c) Rth (ch−a) Max 0.833 50 Unit °C / W °C / W Note 1: Ensure that the channel temperature does not exceed 150°C. Note 2: VDD = 50 V, Tch = 25°C (initial), L = 1.74 mH, IAR = 30 A, RG = 25 Ω Note 3: Repetitive rating: pulse width limited by maximum channel temperature. This transistor is an electrostatic-sensitive device. Please handle with caution. 1 2006-11-21 2SK2967 Electrical Characteristics (Ta = 25°C) Characteristics Gate leakage current Drain cut−off current Drain−source breakdown voltage Gate threshold voltage Drain−source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Symbol IGSS IDSS V (BR) DSS Vth RDS (ON) |Yfs| Ciss Crss Coss tr VDS = 10 V, VGS = 0 V, f = 1 MHz Test Condition VGS = ±16 V, VDS = 0 V VDS = 250 V, VGS = 0 V ID = 10 mA, VGS = 0 V VDS = 10 V, ID = 1 mA VGS = 10 V, ID = 15 A VDS = 10 V, ID = 15 A Min — — 250 1.5 — 15 — — — — Typ. — — — — 48 30 5400 580 1900 20 Max ±10 100 — 3.5 68 — — — — — pF Unit μA μA V V mΩ S Turn−on time Switching time Fall time ton — 50 — ns tf — 35 — Turn−off time Total gate charge (gate−source plus gate−drain) Gate−source charge Gate−drain (“miller”) Charge toff Qg Qgs Qgd VDD ≈ 200 V, VGS = 10 V, ID = 30 A — — — — 200 132 80 52 — — — — nC Source−Drain Ratings and Characteristics (Ta = 25°C) Characteristics Continuous drain reverse current (Note 1) Pulse drain reverse current (Note 1) Forward voltage (diode) Reverse recovery time Reverse recovery charge Symbol IDR IDRP VDSF trr Qrr Test Condition — — IDR = 30 A, VGS = 0 V IDR = 30 A, VGS = 0 V dIDR / dt = 100 A / μs Min — — — — — Typ. — — — 270 3.0 Max 30 120 −2.0 — — Unit A A V ns μC Marking TOSHIBA K2967 Part No. (or abbreviation code) Lot No. A line indicates lead (Pb)-free package or lead (Pb)-free finish. 2 2006-11-21 2SK2967 3 2006-11-21 2SK2967 4 2006-11-21 2SK2967 RG = 25 Ω VDD = 50 V, L = 1.74 mH EAS = B VDSS 1 ⎛ ⎞ ⋅ L ⋅ I2 ⋅ ⎜ ⎟ B VDSS − VDD ⎠ 2 ⎝ 5 2006-11-21 2SK2967 RESTRICTIONS ON PRODUCT USE • The information contained herein is subject to change without notice. 20070701-EN • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2006-11-21
2SK2967
物料型号: - 型号:2SK2967 - 制造商:TOSHIBA

器件简介: - 2SK2967是一款由TOSHIBA生产的N沟道MOS型场效应晶体管,适用于DC-DC转换器、继电器驱动和电机驱动等应用。

引脚分配: - 1. GATE(栅极) - 2. DRAIN(漏极,通常连接至散热器) - 3. SOURCE(源极)

参数特性: - 漏源导通电阻低:RDS(ON) = 48 mΩ(典型值) - 前向传输导纳高:|Yfs| = 30 S(典型值) - 低漏电流:IDSS = 100 μA(最大值,VDS = 250 V) - 增强模式:Vth = 1.5~3.5 V(VDS = 10 V, ID = 1 mA)

功能详解: - 2SK2967具有低漏源导通电阻、高前向传输导纳和低漏电流的特点,适合用于需要高效率和低功耗的应用场合。

应用信息: - 主要应用于DC-DC转换器、继电器驱动和电机驱动等领域。

封装信息: - JEDEC JEITA TOSHIBA 2-16C1B - 重量:4.6 g(典型值)

注意事项: - 持续在重负载下使用(例如高温/电流/电压应用和温度显著变化等)可能会导致产品可靠性显著下降,即使操作条件在绝对最大额定值内。建议在设计时参考TOSHIBA半导体可靠性手册和个别可靠性数据(例如可靠性测试报告和估计的失效率等)来设计适当的可靠性。

热特性: - 通道到外壳的热阻:Rth(ch-c) = 0.833°C/W - 通道到环境的热阻:Rth(ch-a) = 50°C/W
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