MP4005
TOSHIBA Power Transistor Module Silicon NPN&PNP Epitaxial Type (Four Darlington Power Transistors in One)
MP4005
High Power Switching Applications Hammer Drive, Pulse Motor Drive and Inductive Load Switching
Industrial Applications Unit: mm
• • • •
Small package by full molding (SIP 10 pins) High collector power dissipation (4-device operation) : PT = 4 W (Ta = 25°C) High collector current: IC (DC) = ±4 A (max) High DC current gain: hFE = 2000 (min) (VCE = ±2 V, IC = ±1 A)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Collector-base voltage Collector-emitter voltage Emitter-base voltage Collector current Continuous base current Collector power dissipation (1-device operation) Collector power dissipation (4-device operation) Junction temperature Storage temperature range DC Pulse Symbol VCBO VCEO VEBO IC ICP IB PC Rating NPN 100 80 5 4 6 0.4 2.0 PNP −100 −80 −5 −4 −6 −0.4 Unit V V V A A W
JEDEC JEITA TOSHIBA
― ― 2-25A1B
Weight: 2.1 g (typ.)
PT Tj Tstg
4.0 150 −55 to 150
W °C °C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
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MP4005
Array Configuration
R1 R2 10
6
8
7 3
9 5
2
4
R1 R2
1
R1 ≈ 4.5 kΩ
R2 ≈ 300 Ω
Thermal Characteristics
Characteristics Thermal resistance from junction to ambient (4-device operation, Ta = 25°C) Maximum lead temperature for soldering purposes (3.2 mm from case for 10 s) TL 260 °C Symbol Max Unit
ΣRth (j-a)
31.3
°C/W
Electrical Characteristics (Ta = 25°C) (NPN transistor)
Characteristics Collector cut-off current Collector cut-off current Emitter cut-off current Collector-base breakdown voltage Collector-emitter breakdown voltage DC current gain Collector-emitter Base-emitter Symbol ICBO ICEO IEBO V (BR) CBO V (BR) CEO hFE (1) hFE (2) VCE (sat) VBE (sat) fT Cob ton Input Switching time 20 μ s Storage time tstg IB1 IB2 Test Condition VCB = 100 V, IE = 0 A VCE = 80 V, IB = 0 A VEB = 5 V, IC = 0 A IC = 1 mA, IE = 0 A IC = 10 mA, IB = 0 A VCE = 2 V, IC = 1 A VCE = 2 V, IC = 3 A IC = 3 A , IB = 6 m A IC = 3 A , IB = 6 m A VCE = 2 V, IC = 0.5 A VCB = 10 V, IE = 0 A, f = 1 MHz Output 10 Ω Min ― ― 0.5 100 80 2000 1000 ― ― ― ― ― Typ. ― ― ― ― ― ― ― ― ― 60 30 0.2 Max 20 20 2.5 ― ― ― ― 1.5 2.0 ― ― ― Unit μA μA mA V V ―
Saturation voltage
V MHz pF
Transition frequency Collector output capacitance Turn-on time
IB1 IB2
―
1.5
―
μs
VCC = 30 V ― 0.6 ―
Fall time
tf IB1 = −IB2 = 6 mA, duty cycle ≤ 1%
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Electrical Characteristics (Ta = 25°C) (PNP transistor)
Characteristics Collector cut-off current Collector cut-off current Emitter cut-off current Collector-base breakdown voltage Collector-emitter breakdown voltage DC current gain Collector-emitter Base-emitter Symbol ICBO ICEO IEBO V (BR) CBO V (BR) CEO hFE (1) hFE (2) VCE (sat) VBE (sat) fT Cob ton IB1 Test Condition VCB = −100 V, IE = 0 A VCE = −80 V, IB = 0 A VEB = −5 V, IC = 0 A IC = −1 mA, IE = 0 A IC = −10 mA, IB = 0 A VCE = −2 V, IC = −1 A VCE = −2 V, IC = −3 A IC = −3 A, IB = −6 mA IC = −3 A, IB = −6 mA VCE = −2 V, IC = −0.5 A VCB = −10 V, IE = 0 A, f = 1 MHz Min ― ― −0.5 −100 −80 2000 1000 ― ― ― ― ― Typ. ― ― ― ― ― ― ― ― ― 40 55 0.15 Max −20 −20 −2.5 ― ― ― ― −1.5 −2.0 ― ― ― Unit μA μA mA V V ―
Saturation voltage
V MHz pF
Transition frequency Collector output capacitance Turn-on time
IB2
Input 20 μs
IB2 IB1
Output 10 Ω
Switching time
Storage time
tstg
―
0.80
―
μs
VCC = −30 V Fall time tf −IB1 = IB2 = 6 mA, duty cycle ≤ 1% ― 0.40 ―
Marking
MP4005
JAPAN
Part No. (or abbreviation code) Lot No. A line indicates lead (Pb)-free package or lead (Pb)-free finish.
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(NPN transistor)
IC – VCE
6 Common 5 emitter Ta = 25°C 5 1 0.5 6 Common emitter 5 VCE = 2 V
IC – VBE
(A)
Collector current IC
3
Collector current IC
4
(A)
0.3
4
0.23
3
2
IB = 0.2 mA
2 Ta = 100°C 1 25 −55
1 0 1 2 3 4 5 6 7
0 0
0 0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
Collector-emitter voltage
VCE (V)
Base-emitter voltage
VBE (V)
hFE – IC
20000 10000 VCE = 2 V 2.4 Common emitter
VCE – IB
VCE (V)
2.0 5 1.6 3 1.2 1 0.8 0.3 0.4 Common emitter Ta = 25°C 0 0.1 0.3 1 3 10 30 100 300 2 4 IC = 6 A
DC current gain hFE
5000 3000 Ta = 100°C
25 1000 500 300 0.05 0.1 0.3
−55
0.5
1
3
5
10
Collector current IC
(A)
Collector-emitter voltage
Base current IB (mA)
VCE (sat) – IC
10 10 Common emitter 5 3 IC/IB = 500
VBE (sat) – IC
Base-emitter saturation voltage VBE (sat) (V)
Common emitter 5 3 Ta = −55°C 25 1 100 IC/IB = 500
Collector-emitter saturation voltage VCE (sat) (V)
1 25 0.5 0.3 0.1
Ta = −55°C
100
0.5 0.3 0.1
0.3
0.5
1
3
5
10
0.3
0.5
1
3
5
10
Collector current IC
(A)
Collector current IC
(A)
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(PNP transistor)
IC – VCE
−6 Common −5 emitter Ta = 25°C −0.5 −0.4 −1.5 −1.0 −6 −0.7 Common emitter −5 VCE = −2 V
IC – VBE
(A)
(A) Collector current IC
−4 −3
Collector current IC
−4
−3
−0.3
−2
IB = −0.2 mA
−2
Ta = 100°C
−1 0 −1 −2 −3 −4 −5 −6 −7
−1
25
−55
0 0
0 0
−0.4
−0.8
−1.2
−1.6
−2.0
−2.4
−2.8
Collector-emitter voltage
VCE (V)
Base-emitter voltage
VBE (V)
hFE – IC
20000 −2.4 Common emitter 10000 VCE = −2 V
VCE – IB
VCE (V)
−2.0
DC current gain hFE
5000 3000 Ta = 100°C 25 −55 1000 500 300 −0.05 −0.1 −0.3 −0.5 −1 −3 −5 −10
−1.6 −4 −1.2 −1 −0.8 −0.3 −0.4 −2 −3
−5
IC = −6 A
Collector-emitter voltage
Common emitter 0 −0.1 Ta = 25°C −0.3 −1 −3 −10 −30 −100 −300
Collector current IC
(A)
)
Base current IB (mA)
VCE (sat) – IC
−10
−10 IC/IB = 500
VBE (sat) – IC
Common emitter
Collector-emitter saturation voltage VCE (sat) (V)
Base-emitter saturation voltage VBE (sat) (V)
Common emitter −5 −3
−5 −3 Ta = −55°C 25 −1 100
IC/IB = 500
−1 25 −0.5 −0.3 −0.1
Ta = −55°C
100
−0.5 −0.3 −0.1
−0.3 −0.5
−1
−3
−5
−10
−0.3 −0.5
−1
−3
−5
−10
Collector current IC
(A)
Collector current IC
(A)
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rth – tw
300
Transient thermal resistance rth (°C/W)
Curves should be applied in thermal 100 limited area. (Single nonrepetitive pulse) The figure shows thermal resistance per device versus pulse width. (1)
(4)
30
(3) (2)
10
3 NPN 1 PNP
0.3 0.001
-No heat sink/Attached on a circuit board(1) 1-device operation (2) 2-device operation (3) 3-device operation Circuit board (4) 4-device operation 0.1 1 10 100 1000
0.01
Pulse width
tw (s)
Safe Operating Area
10 5 3 10 ms 1 ms 100 μs IC max (pulsed)* −10 −5 −3
Safe Operating Area
IC max (pulsed)*
10 ms 1 ms
100 μs
(A)
(A) Collector current IC
VCEO max
1 0.5 0.3
−1 −0.5 −0.3
Collector current IC
0.1 0.05 0.03 *: Single nonrepetitive pulse Ta = 25°C 0.01 0.5 Curves must be derated linearly with increase in temperature. 1 3 10
−0.1 −0.05 −0.03 *: Single nonrepetitive pulse Ta = 25°C −0.01 −0.5 Curves must be derated linearly with increase in temperature. −1 −3 −10
VCEO max
30
100
300
−30
−100
−300
Collector-emitter voltage VCE (V)
Collector-emitter voltage VCE (V)
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ΔTj – PT
Junction temperature increase ΔTj (°C)
(1) 120 (2) (3) (4)
PT – Ta
(1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 4-device operation Attached on a circuit board (4) (3) (2) 2 (1) Circuit board
80
Total power dissipation
PT (W)
Circuit board Attached on a circuit board (1) 1-device operation (2) 2-device operation (3) 3-device operation (4) 4-device operation 1 2 3 4 5
6
4
40
0 0
0 0
40
80
120
160
200
Total power dissipation
PT
(W)
Ambient temperature Ta (°C)
Switching
30 IB1 = −IB2 = −6mA Duty cycle ≤ 1% Input 20 μs IB1
(NPN)
30 Output RL −IB1 = IB2 = 6mA Duty cycle ≤ 1% IB2 IB1 10
Switching
IB2 Input
(PNP)
Output RL
Switching time (μs)
IB1
IB2
VCC = 30 V
Switching time (μs)
10
IB2
IB1
3 tstg 1
3 tstg
20 μs
VCC = −30 V
1
0.3
tf ton 0.3 1 3 10 30 100
0.3
tf ton
0.1 0.1
)
0.1 −0.1
−0.3
−1
−3
−10
−30
−100
Collector current IC
(A)
Collector current IC
(A)
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MP4005
RESTRICTIONS ON PRODUCT USE
• The information contained herein is subject to change without notice.
20070701-EN
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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