SSM3J35MFV
TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type
SSM3J35MFV
○ High-Speed Switching Applications
○ Analog Switch Applications
1.2±0.05
: Ron = 11 Ω (max) (@VGS = -2.5 V)
: Ron =
8 Ω (max) (@VGS = -4.0 V)
1
2
3
Symbol
Rating
Unit
Drain–source voltage
VDSS
-20
V
Gate–source voltage
VGSS
±10
V
ID
-100
IDP
-200
DC
Drain current
Pulse
Drain power dissipation
mA
PD (Note 1)
150
mW
0.5±0.05
Absolute Maximum Ratings (Ta = 25˚C)
Characteristic
VESM
1: Gate
2: Source
3: Drain
JEDEC
―
―
Channel temperature
Tch
150
°C
JEITA
Storage temperature
Tstg
−55 to 150
°C
TOSHIBA
0.32±0.05
: Ron = 22 Ω (max) (@VGS = -1.5 V)
0.8±0.05
0.13±0.05
Low ON-resistance : Ron = 44 Ω (max) (@VGS = -1.2 V)
1.2±0.05
0.4
•
0.8±0.05
1.2 V drive
0.4
•
0.22±0.05
Unit: mm
2-1L1B
Note: Using continuously under heavy loads (e.g. the application of high
Weight: 1.5 mg (typ.)
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Note 1: Mounted on an FR4 board (25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.585 mm2)
Marking
Equivalent Circuit (top view)
3
3
PZ
1
2
1
2
Start of commercial production
2008-01
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SSM3J35MFV
Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
IGSS
VGS = ±10 V, VDS = 0 V
―
―
±10
μA
V (BR) DSS
ID = -0.1 mA, VGS = 0 V
-20
―
―
V
IDSS
VDS = -20 V, VGS = 0 V
―
―
-1
μA
Gate threshold voltage
Vth
VDS = -3 V, ID = -1 mA
-0.4
―
-1.0
V
Forward transfer admittance
|Yfs|
VDS = -3 V, ID = -50 mA
(Note 2)
77
―
―
mS
ID = -50 mA, VGS = -4 V
(Note 2)
―
4.3
8
ID = -50 mA, VGS = -2.5 V
(Note 2)
―
5.6
11
ID = -5 mA, VGS = -1.5 V
(Note 2)
―
8.2
22
ID = -2 mA, VGS = -1.2 V
(Note 2)
―
11
44
―
12.2
―
―
6.5
―
―
10.4
―
Gate leakage current
Drain–source breakdown voltage
Drain cutoff current
Drain–source ON-resistance
RDS (ON)
Input capacitance
Ciss
Reverse transfer capacitance
Crss
Output capacitance
Coss
VDS = -3 V, VGS = 0 V, f = 1 MHz
Turn-on time
ton
VDD = -3 V, ID = -50 mA,
―
175
―
Turn-off time
toff
VGS = 0 to -2.5 V
―
251
―
―
0.83
1.2
Switching time
Drain–source forward voltage
VDSF
ID = 100 mA, VGS = 0 V
(Note 2)
Ω
pF
ns
V
Note 2: Pulse test
Switching Time Test Circuit
(a) Test Circuit
(b) VIN
0V
10%
OUT
0
IN
90%
-2.5 V
50Ω
-2.5 V
10 μs
RL
VDD
(c) VOUT
VDD = -3 V
Duty ≤ 1%
VIN: tr, tf < 5 ns
(Zout = 50 Ω)
Common Source
Ta = 25°C
VDS (ON)
90%
10%
VDD
tr
ton
tf
toff
Usage Considerations
Let Vth be the voltage applied between gate and source that causes the drain current (ID) to be low (-1 mA for the
SSM3J35MFV). Then, for normal switching operation, VGS(on) must be higher than Vth, and VGS(off) must be lower than
Vth. This relationship can be expressed as: VGS(off) < Vth < VGS(on).
Take this into consideration when using the device.
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
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SSM3J35MFV
ID – VDS
-250
Common Source
Common Source
VDS = -3 V
Ta = 25°C
-4 V
(mA)
-100
(mA)
-200
-2.5 V
-150
Drain current ID
Drain current ID
ID – VGS
-1000
-1.8 V
-100
-1.5 V
-50
VGS=-1.2 V
-1.5
-1
-0.5
Drain–source voltage VDS
25°C
-25°C
-1
-0.1
-0.01
0
0
0
Ta = 100°C
-10
-2
(V)
-1
-3
Gate–source voltage VGS
RDS (ON) – VGS
(V)
RDS (ON) – VGS
20
15
Common Source
Common Source
ID = -5 mA
ID = -50 mA
Drain–source ON-resistance
RDS (ON) (Ω)
Drain–source ON-resistance
RDS (ON) (Ω)
-2
15
10
25°C
Ta=100°C
5
10
25°C
Ta=100°C
5
-25°C
-25°C
0
0
-2
-4
-6
-8
Gate–source voltage VGS
0
-10
0
(V)
-2
-4
-10
-8
Gate–source voltage VGS
(V)
RDS (ON) – Ta
RDS (ON) – ID
20
20
Common Source
Common Source
Ta = 25°C
Drain–source ON-resistance
RDS (ON) (Ω)
Drain–source ON-resistance
RDS (ON) (Ω)
-6
15
VGS = -1.2 V
10
-1.5 V
-2.5 V
5
-4 V
0
-1
-10
Drain current ID
-100
-1.5 V, -5 mA
10
(mA)
-2.5 V, -50 mA
-4 V, -50 mA
5
0
-50
-1000
VGS =−1.2 V, ID=-2 mA
15
0
50
100
150
Ambient temperature Ta (°C)
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SSM3J35MFV
Vth – Ta
|Yfs| – ID
(mS)
-1
ID = -1 mA
VDS = -3 V
-0.8
Forward transfer admittance |Yfs|
Gate threshold voltage Vth (V)
Common Source
-0.6
-0.4
-0.2
0
-50
0
100
50
150
1000
100
10
Common Source
VDS = -3 V
Ta = 25°C
1
-1
-10
Ambient temperature Ta (°C)
Drain current ID
IDR – VDS
-1000
-100
(mA)
C – VDS
1000
100
VGS = 0 V
100
D
G
Capacitance C (pF)
Drain reverse current IDR
(mA)
Common Source
IDR
10
S
25°C
1
Ta=100°C
0.1
-25°C
0.2
0.4
0.6
0.8
1
Drain–source voltage VDS
1.2
Ciss
Coss
Crss
1
-0.1
0.01
0
10
1.4
(V)
Common Source
VGS = 0 V
f = 1 MHz
Ta = 25°C
-1
-10
Drain–source voltage VDS
t – ID
PD – Ta
Common Source
VDD = -3 V
VGS = 0 to -2.5 V
Ta = 25°C
toff
Switching time t
1000
tf
100
ton
tr
10
-0.1
(V)
250
Drain Power Dissipation PD (mW)
(ns)
10000
-100
Mounted on FR4 board
(25.4 mm × 25.4 mm × 1.6 mm , Cu Pad: 0.585 mm2)
200
150
100
50
0
-1
-10
Drain current ID
-100
-1000
0
20
40
60
80
100
120
140
160
Ambient temperature Ta (°C)
(mA)
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SSM3J35MFV
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
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any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
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• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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