SSM3K37CT,L3F

SSM3K37CT TOSHIBA Field Effect Transistor Silicon N Channel MOS Type SSM3K37CT ○ High Speed Switching Applications ○ Analog Switch Applications • 1.5Vdrive • Low ON-resistance Unit : mm RDS(ON) = 5.60 Ω (max) (@VGS = 1.5 V) RDS(ON) = 4.05 Ω (max) (@VGS = 1.8 V) RDS(ON) = 3.02 Ω (max) (@VGS = 2.5 V) RDS(ON) = 2.20 Ω (max) (@VGS = 4.5 V) Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Drain-Source voltage VDSS 20 V Gate-Source voltage VGSS ± 10 V DC ID 200 Pulse IDP 400 Drain current Power dissipation 100 mW Channel temperature Tch 150 °C Storage temperature range Tstg −55 to 150 °C Note: PD(Note1) mA CST3 Using continuously under heavy loads (e.g. the application of JEDEC ― high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the JEITA ― reliability significantly even if the operating conditions (i.e. TOSHIBA 2-1J1B operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Weight: 0.75mg(typ.) Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Mounted on FR4 board 2 (10 mm × 10 mm × 1.0 mm, Cu Pad: 100 mm ) Marking(top view) Polarity mark SU Pin Condition (top view) Equivalent Circuit Polarity mark (on the top) 3 1 1 3 2 2 1. Gate 2. Source 3. Drain *Electrodes: On the bottom Start of commercial production 2010-11 1 2014-03-01 SSM3K37CT Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit V (BR) DSS ID = 1 mA, VGS = 0 V 20 ⎯ ⎯ V (BR) DSX ID = 1 mA, VGS = -10 V 12 ⎯ ⎯ Drain cut-off current IDSS VDS = 20 V, VGS = 0 V ⎯ ⎯ 1 μA Gate leakage current IGSS VGS = ±10 V, VDS = 0 V ⎯ ⎯ ±1 μA Drain-source breakdown voltage V Gate threshold voltage Vth VDS = 3 V, ID = 1 mA 0.35 ⎯ 1.0 V Forward transfer admittance |Yfs| VDS = 3 V, ID = 100 mA (Note2) 0.14 0.28 ⎯ S ID = 100 mA, VGS = 4.5 V (Note2) ⎯ 1.65 2.20 ID = 50 mA, VGS = 2.5 V (Note2) ⎯ 2.16 3.02 ID = 20 mA, VGS = 1.8 V (Note2) ⎯ 2.66 4.05 ID = 10 mA, VGS = 1.5 V (Note2) ⎯ 3.07 5.60 ⎯ 12 ⎯ ⎯ 5.5 ⎯ ⎯ 4.1 ⎯ Drain-source ON-resistance RDS (ON) Input capacitance Ciss Output capacitance Coss Reverse transfer capacitance Crss Switching time VDS = 10 V, VGS = 0 V, f = 1 MHz Turn-on time ton VDD = 10 V, ID = 100 mA ⎯ 18 ⎯ Turn-off time toff VGS = 0 to 2.5 V, RG = 50 Ω ⎯ 36 ⎯ ID = -200 mA, VGS = 0 V ⎯ -0.89 -1.2 Drain-Source forward voltage VDSF (Note2) Ω pF ns V Note2: Pulse test Switching Time Test Circuit (b) VIN (a) Test Circuit 2.5 V OUT 0V 10 μs RG IN VDD = 10 V RG = 50Ω Duty ≤ 1% VIN : tr, tf < 5 ns Common source Ta = 25°C 2.5 V 0V (c) VOUT VDD 90% 10% VDD 90% 10% VDS (ON) tr ton tf toff Precaution Let Vth be the voltage applied between gate and source that causes the drain current (ID) to be low (1mA for the SSM3K37CT). Then, for normal switching operation, VGS(on) must be higher than Vth, and VGS(off) must be lower than Vth. This relationship can be expressed as: VGS(off) < Vth < VGS(on). Take this into consideration when using the device. Handling Precaution When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that come into direct contact with devices should be made of antistatic materials. Thermal resistance Rth (ch-a) and power dissipation PD vary depending on board material, board area, board thickness and pad area. When using this device, please take heat dissipation into consideration 2 2014-03-01 SSM3K37CT ID – VDS 2.5 V 10 V 1.8 V 200 1.5 V VGS = 1.2 V 100 0 0 0.2 0.4 0.6 Drain-source voltage 0.8 VDS 100 10 Drain current Drain current 300 (mA) 4.5 V ID 400 ID – VGS 1000 Common source Ta = 25 °C Pulse test ID (mA) 500 Ta = 100 °C 1 − 25 °C 25 °C 0.1 Common source VDS = 3 V Pulse test 0.01 0 1.0 1.0 (V) Gate-source voltage RDS (ON) – VGS Drain-source ON-resistance RDS (ON) (Ω) Drain-source ON-resistance RDS (ON) (Ω) 4 25 °C Ta = 100 °C 2 − 25 °C 1 0 4 2 6 Gate-source voltage 8 VGS 4 1.5 V 1.8 V 3 2.5V 2 VGS = 4.5Ｖ 1 0 (V) 100 200 300 Drain current RDS (ON) – Ta ID 400 500 (mA) Vth – Ta 1.0 Common source Vth (V) ID = 10 mA / VGS = 1.5 V 20 mA / 1.8 V 4 50 mA / 2.5 V Gate threshold voltage Drain-source ON-resistance RDS (ON) (Ω) (V) Common source Ta = 25°C Pulse test 5 0 10 5 3 2 100 mA / 4.5 V 1 Common source Pulse test 0 −50 VGS 6 ID = 100 mA Common source Pulse test 5 0 3.0 RDS (ON) – ID 6 3 2.0 0 50 Ambient temperature 100 Ta VDS = 3 V ID = 1 mA 0.5 0 −50 150 (°C) 0 50 Ambient temperature 3 100 Ta 150 (°C) 2014-03-01 IDR – VDS |Yfs| – ID 1000 1000 IDR 300 (mA) Common source VDS = 3 V Ta = 25°C Pulse test Drain reverse current Forward transfer admittance ⎪Yfs⎪ (mS) SSM3K37CT 100 30 10 100 10 1 Drain current ID 100 25 °C 10 1 −25 °C S –0.5 –1.0 Drain-source voltage (mA) C – VDS VDS (ns) (pF) 50 tf C t 100 Ciss Switching time Capacitance (V) Common source VDD = 10 V VGS = 0 to2.5 V Ta = 25 °C RG = 50Ω toff 30 –1.5 t – ID 1000 100 IDR G 0.1 0 1000 Common source VGS = 0 V Pulse test D Ta =100 °C 10 Coss 5 3 Common source Crss Ta = 25°C f = 1 MHz VGS = 0 V 1 0.1 1 10 Drain-source voltage tr 1 100 VDS ton 10 (V) 1 10 Drain current 100 ID 1000 (mA) PD – Ta 250 Power dissipation PD (mW) Mounted FR4 board (10 mm × 10 mm × 1.0ｍｍ 2 Cu Pad: 100 mm ) 200 150 100 50 0 0 20 40 60 80 100 Ambient temperature Ta 120 140 160 (°C) 4 2014-03-01 SSM3K37CT RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 5 2014-03-01