SSM4K27CT
TOSHIBA Field Effect Transistor
Silicon N Channel MOS Type (U-MOSⅢ)
SSM4K27CT
○ Switching Applications
•
Small package
•
Low on-resistance:
Unit: mm
RDS(ON) = 205 mΩ (max) (@VGS = 4.0 V)
RDS(ON) = 260 mΩ (max) (@VGS = 2.5 V)
RDS(ON) = 390 mΩ (max) (@VGS = 1.8 V)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Drain-Source voltage
VDSS
20
V
Gate-Source voltage
VGSS
±12
V
DC
ID
0.5
Pulse
IDP
1.0
PD (Note 1)
400
mW
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55 to 150
°C
Drain current
Power dissipation
A
JEDEC
⎯
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
JEITA
⎯
temperature, etc.) may cause this product to decrease in the
TOSHIBA
2-1M1A
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
Weight: 1.1 mg (typ.)
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Mounted on FR4 board.
2
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm )
Marking (top view)
1
3
3
4
2
2
1
Polarity marking
1
2
3
4
SA
4
Electrode Layout (bottom view)
Equivalent Circuit (top view)
4
3
1
2
Gate
Source
Drain
Drain
Handling Precaution
When handling individual devices (which are not yet mounted on a circuit board), ensure that the environment
is protected against static electricity. Operators should wear anti-static clothing, and containers and other
objects that come into direct contact with devices should be made of anti-static materials.
Start of commercial production
2005-02
1
2014-03-01
SSM4K27CT
Electrical Characteristics (Ta=25°C)
Characteristics
Symbol
Gate leakage current
Min.
Typ.
Max.
Unit
VGS = ±12 V, VDS = 0
−
−
±1
μA
V (BR) DSS
ID = 1 mA, VGS = 0
20
−
−
V (BR) DSX
ID = 1 mA, VGS = -12 V
10
−
−
IDSS
VDS = 20 V, VGS = 0
−
−
10
μA
Vth
VDS = 3 V, ID = 1 mA
0.5
−
1.1
V
⏐Yfs⏐
VDS = 3 V, ID = 0.25 A
(Note2)
0.8
1.6
−
S
ID = 0.25 A, VGS = 4 V
(Note2)
⎯
175
205
ID = 0.25 A, VGS = 2.5 V
(Note2)
⎯
200
260
ID = 0.10 A, VGS = 1.8 V
(Note2)
⎯
250
390
IGSS
Drain-Source breakdown voltage
Drain cut-off current
Gate threshold voltage
Forward transfer admittance
Drain-Source on-resistance
RDS (ON)
Test Condition
V
mΩ
Input capacitance
Ciss
VDS = 10 V, VGS = 0, f = 1 MHz
−
174
−
pF
Reverse transfer capacitance
Crss
VDS = 10 V, VGS = 0, f = 1 MHz
−
25
−
pF
Output capacitance
Coss
VDS = 10 V, VGS = 0, f = 1 MHz
−
31
−
pF
ton
VDD = 10 V, ID = 0.25 A,
−
10
−
toff
VGS = 0 to 2.5 V, RG = 4.7 Ω
−
12
−
Turn-on time
Switching time
Turn-off time
ns
Note2: Pulse test
Switching Time Test Circuit
(a) Test Circuit
2.5 V
(b) VIN
in
out
0V
(c) VOUT
RG
0
10 μs
2.5 V
VDD
10%
VDD
VDS (ON)
VDD = 10 V
RG = 4.7 Ω
Duty ≤ 1%
VIN: tr, tf < 5 ns
Common Source
Ta = 25°C
90%
90%
10%
tr
ton
tf
toff
Precaution
Vth can be expressed as the voltage between the gate and source when the low operating current value is ID =
1 mA for this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off)
requires a lower voltage than Vth. (The relationship can be established as follows: VGS (off) < Vth < VGS (on).)
Be sure to take this into consideration when using the device.
2
2014-03-01
SSM4K27CT
ID – VDS
600
ID – VGS
10000
Common Source
Ta = 25°C
Pulse test
4V
VDS = 3 V
Drain current
Drain current
1.8V
400
VGS = 1.2 V
200
0
0.2
0.4
0.6
0.8
Ta = 85°C
10
25°C
1
−25°C
VDS
0.01
0
1.0
(V)
0.4
0.8
0.6
1.0
400
300
25°C
Ta = 85°C
−25°C
1.2
1.4
1.6
VGS (V)
RDS (ON) – ID
300
VGS = 1.8 V
Drain – Source on-resistance
RDS (ON) (mΩ)
ID = 0.25 A
Common Source
Pulse test
200
0.2
Gate - Source voltage
RDS (ON) – VGS
500
Drain – Source on-resistance
RDS (ON) (mΩ)
100
0.1
Drain - Source voltage
100
Pulse test
ID
2.5V
0
Common Source
1000
(mA)
(mA)
800
ID
1000
250
2.5V
200
4V
150
100
Common Source
50
Ta = 25°C
Pulse test
0
0
2
4
6
Gate - Source voltage
8
10
0
12
0
0.2
VGS (V)
0.4
0.6
Drain current
ID
RDS (ON) – Ta
Vth (V)
Common Source
Pulse test
400
ID = 0.1A / VGS = 1.8 V
300
200
Gate threshold voltage
Drain – Source on-resistance
RDS (ON) (mΩ)
(A)
1.2
Common Source
0
−50
1.0
Vth – Ta
500
100
0.8
0.25 A / 4 V
0.25 A / 2.5 V
0
50
Ambient temperature
100
Ta
(°C)
ID = 1mA
0.8
0.6
0.4
0.2
0
150
VDS = 3V
1.0
−25
0
25
50
75
Ambient temperature
3
100
Ta
125
150
(°C)
2014-03-01
|Yfs| – ID
30
C – VDS
500
300
10
3
(pF)
1
C
Ciss
100
30
Capacitance
Forward transfer admittance
⎪Yfs ⎪
(S)
SSM4K27CT
0.3
0.1
Common Source
VDS = 3V
10
Common Source
Ta = 25°C
f = 1 MHz
VGS = 0 V
3
Ta = 25°C
0.03
Coss
Crss
Pulse test
0.01
1
10
100
Drain current
1000
ID
1
0.1
10000
1
(mA)
Dynamic Input Characteristic
(ns)
7
t
6
VDD = 10 V
5
Switching time
(V)
VGS
Common Source
VDD = 10 V
VGS = 0 ∼ 2.5V
Ta = 25°C
RG = 4.7 Ω
8
4
3
2
Common Source
ID = 0.5 A
Ta = 25°C
1
0
1
2
3
Total gate charge
4
Qg
100
toff
tf
10
ton
tr
5
1
0.01
(nC)
0.1
1
Drain current
IDR – VDS
1.0
(A)
Power dissipation PD (W)
IDR
Drain reverse current
Mounted on FR4 board
Ta = 25°C
Pulse test
D
0.6
IDR
G
S
0.4
0.2
0
-0.2
10
(A)
PD – Ta
Common Source
0.8
ID
1.2
VGS = 0V
0
(V)
1000
9
0
100
VDS
t – ID
10
Gate-Source voltage
10
Drain – Source voltage
-0.4
-0.6
Drain-Source voltage
-0.8
VDS
-1.0
0.8
0.6
0.4
0.2
0
0
-1.2
(V)
(25.4 mm × 25.4 mm × 1.6 mm,
2
Cu Pad: 645 mm )
1.0
50
Ambient temperature Ta
4
150
100
(°C)
2014-03-01
SSM4K27CT
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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